JP2012003988A - Method of manufacturing organic electroluminescent panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform a sealing without damaging a workpiece or increasing the number of process steps.SOLUTION: The method includes the steps of: forming an organic layer 38 including a luminescent layer 40 on a circuit layer 34; forming a second electrode 50 on the organic layer 38 avoiding a part thereof located over a terminal 32; gluing a second substrate 54 on a first substrate 10 with an adhesive agent 52 to cover the terminal 32 and the second electrode 50; and removing a part of the second substrate 54 opposed to the terminal 32 by cutting the second substrate 54. In the step of forming the organic layer 38, the organic layer 38 is formed so that at least one layer of the organic layer 38 is put on the terminal 32. In the step of gluing the second substrate 54, the adhesive agent 52 is placed on at least one layer of the organic layer 38 over the terminal 32. In the step of removing the part of the second substrate 54, at least one layer of the organic layer 38 lying over the terminal 32 is removed by the adhesion of the adhesive agent 52 together with the part of the second substrate 54 to be removed.

Description

  The present invention relates to a method for manufacturing an organic electroluminescence panel.

  Conventionally, as a sealing method of an organic electroluminescence panel, hollow sealing in which a device substrate on which an organic electroluminescence element is formed is sealed with a sealing glass and a sealing agent has been used, and between the device substrate and the sealing substrate. Space existed. In such a method, it is necessary to process the sealing glass to secure a place for disposing the desiccant. Further, when a force is applied to the sealing glass, it bends and comes into contact with the surface of the organic electroluminescence element, causing black spot defects.

  In order to solve these problems, a flat plate sealing process (solid sealing) in which the space between the device substrate and the sealing glass is filled with an adhesive sheet has been studied. In the flat plate sealing process, although there is a problem with the material of the adhesive sheet, in terms of the process, in order to ensure the reliability of the organic electroluminescence panel, the device substrate should be covered as much as possible, and connected to the external circuit. The problem is how to form the.

  Patent Documents 1 and 2 disclose a method of forming a power supply opening that exposes a terminal part by irradiating a part or all of the sealing film with laser light and removing the sealing film on the terminal part. Is disclosed.

JP 2006-66364 A JP 2006-185593 A

  However, the above method has a problem that the terminal part is easily damaged by the laser, and the process for exposing the terminal part increases.

  An object of this invention is to provide the manufacturing method of the organic electroluminescent panel which can perform sealing, without giving a damage and without increasing a process.

  (1) An organic electroluminescence panel manufacturing method according to the present invention includes a step of preparing a first substrate on which a circuit layer including a terminal and a first electrode is formed, and light emission made of an organic material on the circuit layer. Forming an organic layer including at least the light-emitting layer among a layer, an electron transport layer, a hole transport layer, an electron injection layer, and a hole injection layer; A step of forming an electrode, a step of attaching a second substrate to the first substrate via an adhesive so as to cover the terminal and the second electrode, cutting the second substrate, and Removing a portion of the substrate facing the terminal, and forming the organic layer, forming at least one layer of the organic layer on the terminal and attaching the second substrate In the process, the adhesive is The organic layer is disposed on the at least one layer of the organic layer, and the organic layer on the terminal is bonded with the adhesive together with the portion to be removed in the step of removing the portion of the second substrate. The at least one layer is removed. According to the present invention, sealing is performed after covering the terminal with the organic layer, and then the organic layer is peeled off from the terminal via the adhesive when part of the second substrate is removed, which causes damage. Therefore, sealing can be performed without increasing the number of steps.

  (2) In the method of manufacturing an organic electroluminescence panel described in (1), before the step of attaching the second substrate, on the at least one layer of the organic layer on the second electrode and the terminal. A step of forming an inorganic layer, and a step of attaching the second substrate, the adhesive being disposed on the inorganic layer, and removing the portion of the second substrate. The inorganic layer interposed between the at least one layer of the organic layer and the adhesive may also be removed.

  (3) In the manufacturing method of the organic electroluminescence panel described in (2), the organic layer and the inorganic layer may be formed by vapor deposition or sputtering.

  (4) In the method of manufacturing an organic electroluminescence panel according to any one of (1) to (3), the adhesive is supplied to the first substrate or the second substrate by screen printing or dispensing. It may be characterized by.

  (5) In the method of manufacturing an organic electroluminescence panel according to (1), in the step of preparing the first substrate, a first mother substrate to be cut into a plurality of the first substrates is prepared, One mother board is formed by forming a plurality of the circuit layers corresponding to each of a plurality of areas to be a plurality of the first boards, and cutting the plurality of second boards in the step of attaching the second board. Attaching a second mother substrate to the first mother substrate, cutting the first mother substrate into a plurality of the first substrates, cutting the second mother substrate into a plurality of the second substrates; May be further included.

  (6) In the manufacturing method of the organic electroluminescent panel described in (5), an adhesive sheet may be used as the adhesive.

  (7) In the method of manufacturing an organic electroluminescence panel according to (6), the plurality of circuit layers are arranged in a plurality of rows and a plurality of columns, and the adhesive sheet is arranged in any one row or one row. The second mother substrate may be attached to the first mother substrate with a plurality of the adhesive sheets.

  (8) In the manufacturing method of the organic electroluminescence panel described in (6), the adhesive sheet is prepared by being attached to a roll sheet, and the adhesive sheet is prepared from the roll sheet by using the first mother substrate or the second substrate. It is good also as supplying to a mother board.

  (9) In the method of manufacturing an organic electroluminescence panel described in any one of (1) to (8), the step of attaching the second substrate to the first substrate may be performed in the atmosphere, an inert gas atmosphere, or It is good also as performing in a vacuum.

It is a figure explaining the 1st board | substrate used with the manufacturing method of the organic electroluminescent panel which concerns on embodiment of this invention. It is a figure explaining the 1st board | substrate used with the manufacturing method of the organic electroluminescent panel which concerns on embodiment of this invention. It is a top view explaining the sticking process of the manufacturing method of the organic electroluminescent panel which concerns on embodiment of this invention. It is sectional drawing explaining the affixing process of the manufacturing method of the organic electroluminescent panel which concerns on embodiment of this invention. It is a figure explaining the process of the cutting | disconnection and peeling of the manufacturing method of the organic electroluminescent panel which concerns on embodiment of this invention. It is sectional drawing which shows the organic electroluminescent panel manufactured by the method which concerns on embodiment of this invention. It is a figure for demonstrating the position of an adhesive agent. It is a figure explaining the modification 1 of embodiment of this invention. It is a figure explaining the modification 2 of embodiment of this invention. It is a figure explaining the modification 3 of embodiment of this invention. It is a figure explaining the modification 3 of embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1-5 is a figure explaining the manufacturing method of the organic electroluminescent panel which concerns on embodiment of this invention.

  In the present embodiment, a first substrate 10 made of a glass substrate or the like is prepared. An undercoat 12 is formed on the first substrate 10 as a barrier against impurities from the first substrate 10, and a semiconductor layer 14 is formed thereon. A gate insulating film 16 is formed so as to cover the semiconductor layer 14. A gate electrode 18 is formed on the gate insulating film 16, and an interlayer insulating film 20 is formed to cover the gate electrode 18. A first electrode 22 is formed on the interlayer insulating film 20. The first electrode 22 penetrates the interlayer insulating film 20 and is electrically connected to one of the source electrode 24 and the drain electrode 26 on the semiconductor layer 14. The other of the source electrode 24 and the drain electrode 26 penetrates through the interlayer insulating film 20 and is electrically connected to a power supply wiring 28 formed thereon. An insulating layer 30 is formed on the interlayer insulating film 20, the first electrode 22, and the power supply wiring 28. The insulating layer 30 is formed so as to open a part of the first electrode 22. A bank surrounding a part of the first electrode 22 is formed by the insulating layer 30.

  FIG. 1 is a cross-sectional view showing the first substrate 10 and the structure thereon, and FIG. 2 is a cross-sectional view of another part of the structure shown in FIG. As shown in FIG. 2, terminals 32 are provided on the first substrate 10. The terminal 32 is, for example, a part of a conductor that extends continuously and integrally from the gate electrode 18, and is formed on the gate insulating film 16. The insulating layer 30 is formed so that a part of the terminal 32 is exposed.

  The terminal 32 and the first electrode 22 described above are part of the circuit layer 34. The circuit layer 34 includes a thin film transistor including the semiconductor layer 14, the source electrode 24, the drain electrode 26, and the gate electrode 18.

  In the present embodiment, a multi-panel manufacturing method is assumed. Therefore, in the step of preparing the first substrate 10, the first mother substrate 36 to be cut out into the plurality of first substrates 10 is prepared. In the first mother substrate 36, a plurality of circuit layers 34 (see FIG. 3) are formed corresponding to the regions to be formed into the plurality of first substrates 10, respectively. One circuit layer 34 is formed on one first substrate 10. The plurality of circuit layers 34 are arranged in a plurality of rows and a plurality of columns (see FIG. 3).

  As shown in FIG. 1, an organic layer 38 is formed on the circuit layer 34. The organic layer 38 includes at least the light emitting layer 40, and may further include at least one of an electron transport layer 42, a hole transport layer 44, an electron injection layer 46, and a hole injection layer 48. At least one layer constituting the organic layer 38 is made of an organic material. The organic layer 38 is formed by vapor deposition or sputtering.

  The electron injection layer 46 is formed, for example, by vacuum deposition of LiF with a thickness of 0.5 nm. The role of the electron injection layer 46 is to facilitate injection of electrons from the cathode. An electron transport layer 42 is formed on the electron injection layer 46. The electron transport layer 42 is formed, for example, by forming tris (8-quinolinol) aluminum (hereinafter abbreviated as Alq) to a thickness of 20 nm by vacuum deposition. The role of the electron transport layer 42 is to efficiently transport electrons to the light emitting layer 40 with a small resistance. A light emitting layer 40 is formed thereon. In the light emitting layer 40, EL light emission is caused by recombination of electrons and holes. The light emitting layer 40 is formed, for example, by forming a co-deposited film of Alq and quinacridone (abbreviated as Qc) to a thickness of 20 nm. The ratio of the deposition rate of Alq and Qc is 40: 1. A hole transport layer 44 is formed on the light emitting layer 40. The hole transport layer 44 has a role of efficiently transporting holes supplied from the anode to the light emitting layer 40 with a small resistance. The hole transport layer 44 is formed by depositing α-NPD to a thickness of 50 nm by vapor deposition. A hole injection layer 48 is formed on the hole transport layer 44. The hole injection layer 48 facilitates injection of holes from the anode. The hole injection layer 48 is formed by depositing copper phthalocyanine to a thickness of 50 nm by vapor deposition.

  In the present embodiment, at least one layer of the organic layer 38 (for example, the light emitting layer 40) is formed so as to be placed on the terminal 32. That is, the terminal 32 is covered with at least one layer of the organic layer 38.

  Next, as shown in FIG. 1, the second electrode 50 is formed on the organic layer 38. The second electrode 50 is formed from a transparent electrode material such as ITO (Indium Tin Oxide). The second electrode 50 is formed so as to be placed on the insulating layer 30 serving as a bank. However, the second electrode 50 is formed avoiding the upper side of the terminal 32 (see FIG. 2).

  As shown in FIGS. 3 and 4, the second substrate 54 is attached to the first substrate 10 with, for example, an epoxy adhesive 52 so as to cover the terminals 32 and the second electrode 50. FIG. 3 is a plan view showing the second substrate 54 attached to the first substrate 10, and FIG. 4 is a cross-sectional view of the first substrate 10 and the second substrate 54 attached. By attaching the second substrate 54, the organic layer 38 can be sealed to prevent deterioration due to moisture.

  In the present embodiment, since a multi-panel manufacturing method is assumed, a second mother substrate 56 to be cut into a plurality of second substrates 54 is prepared. Then, the second mother substrate 56 is attached to the first mother substrate 36.

  The adhesive 52 is supplied to the first substrate 10 or the second substrate 54 by screen printing or dispensing, and then the second substrate 54 is attached to the first substrate 10. The adhesive 52 is provided on the second electrode 50 in the display area, and is provided on the insulating layer 30 on the outer side (frame area). The adhesive 52 is also disposed on at least one layer of the organic layer 38 above the terminal 32. That is, the adhesive 52 is interposed between the adhesive 52 and the terminal 32. Therefore, the terminal 32 does not adhere to the adhesive 52. Note that the step of attaching the second substrate 54 to the first substrate 10 is performed in the air, in an inert gas atmosphere, or in a vacuum.

  Next, as shown in FIG. 5, the second substrate 54 is cut to remove a portion of the second substrate 54 that faces the terminal 32. Then, together with the portion to be removed, the organic layer 38 on the terminal 32 is removed by adhesion of the adhesive 52. Since the organic layer 38 is formed by sputtering or vapor deposition, it is not firmly integrated and can be easily peeled off. Even if a part of the organic layer 38 remains on the terminal 32, it can be removed by dipping in a solvent. Then, the terminal 32 is exposed by removing the organic layer 38. The terminal 32 is for electrical connection with an external circuit (not shown).

  According to this embodiment, sealing is performed after the terminal 32 is covered with the organic layer 38, and then the organic layer 38 is peeled off from the terminal 32 via the adhesive 52 when part of the second substrate 54 is removed. To do. Therefore, sealing can be performed without increasing the number of processes without causing damage.

  Further, the first mother substrate 36 is cut into a plurality of first substrates 10, and the second mother substrate 56 is cut into a plurality of second substrates 54. These cuttings may be performed simultaneously with the cutting for removing the portion of the second substrate 54 facing the terminals 32. Either cutting can be done by scribing.

  FIG. 6 is a cross-sectional view showing an organic electroluminescence panel manufactured by a method according to an embodiment of the present invention. The organic electroluminescence panel has a first substrate 10 and a second substrate 54. A circuit layer 34 (see FIG. 1) is formed on the first substrate 10, and a layer of adhesive 52 is disposed so as to cover the circuit layer 34. The first substrate 10 and the second substrate 54 are bonded by the adhesive 52. The circuit layer 34 includes terminals 32. The terminal 32 has a portion exposed from both the adhesive 52 and the second substrate 54.

  FIG. 7 is a view for explaining the position of the adhesive 52. In the organic electroluminescence panel, even if the cut surface of the layer made of the adhesive 52 deviates from the cut surfaces of the first substrate 10 and the second substrate 54 as shown in FIG. If so, there is no problem as a product. Specifically, the cut surface of the adhesive 52 is located so as to enter the inside from the cut surface for removing the portion on the terminal 32 of the second substrate 54. On the other hand, the cut surface of the adhesive 52 is positioned so as to protrude outward from a cut surface formed by cutting the first mother substrate 36 and the second mother substrate 56 into the first substrate 10 and the second substrate 54. Yes.

[Modification 1]
FIG. 8 is a diagram illustrating a first modification of the embodiment of the present invention. In this modification, an adhesive sheet 152 is used as an adhesive. The adhesive sheet 152 has a strip shape that covers the circuit layers 34 arranged in one row or row among the plurality of circuit layers 34 (see FIG. 3). The second mother substrate 56 is attached to the first mother substrate 36 with a plurality of adhesive sheets 152. The other contents correspond to the contents described in the above embodiment.

[Modification 2]
FIG. 9 is a diagram illustrating a second modification of the embodiment of the present invention. In this modification, the adhesive sheet 252 is prepared by sticking to the roll sheet 258. The adhesive sheet 252 is supplied from the roll sheet 258 to the first mother substrate 36 or the second mother substrate 56. The other contents correspond to the contents described in the above embodiment.

[Modification 3]
10 and 11 are diagrams for explaining a third modification of the embodiment of the present invention. In this modification, before the step of attaching the second substrate 54 shown in FIG. 3 to the first substrate 10, an inorganic layer 360 (for example, SiN) is formed on the organic layer 38 on the second electrode 50 and the terminal 32. Form. The inorganic layer 360 is formed by vapor deposition or sputtering.

  Next, the adhesive 52 (see FIG. 4) is also disposed on the inorganic layer 360 in the step of attaching the second substrate 54 (see FIG. 4). Then, in the step of removing a part of the second substrate 54, the inorganic layer 360 interposed between the organic layer 38 to be removed and the adhesive 52 is also removed. The other contents correspond to the contents described in the above embodiment.

  The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the configuration described in the embodiment can be replaced with substantially the same configuration, a configuration that exhibits the same operational effects, or a configuration that can achieve the same purpose.

  10 First substrate, 12 Undercoat, 14 Semiconductor layer, 16 Gate insulating film, 18 Gate electrode, 20 Interlayer insulating film, 22 First electrode, 24 Source electrode, 26 Drain electrode, 28 Power supply wiring, 30 Insulating layer, 32 Terminal, 34 Circuit layer, 36 First mother substrate, 38 Organic layer, 40 Light emitting layer, 42 Electron transport layer, 44 Hole transport layer, 46 Electron injection layer, 48 Hole injection layer, 50 Second electrode, 52 Adhesive , 54 Second substrate, 56 Second mother substrate, 152 Adhesive sheet, 252 Adhesive sheet, 258 Roll sheet, 360 Inorganic layer.

Claims (9)

Preparing a first substrate on which a circuit layer including a terminal and a first electrode is formed;
Forming an organic layer including at least the light emitting layer among a light emitting layer, an electron transport layer, a hole transport layer, an electron injection layer, and a hole injection layer each made of an organic material on the circuit layer;
Forming a second electrode on the organic layer, avoiding the top of the terminal;
A step of attaching a second substrate to the first substrate via an adhesive so as to cover the terminal and the second electrode;
Cutting the second substrate to remove a portion of the second substrate facing the terminal;
Including
In the step of forming the organic layer, at least one layer of the organic layer is formed so as to be placed on the terminal,
In the step of attaching the second substrate, the adhesive is also disposed on the at least one layer of the organic layer above the terminals,
In the step of removing the portion of the second substrate, the at least one layer of the organic layer on the terminal is removed together with the portion to be removed by adhesion of the adhesive. Panel manufacturing method. In the manufacturing method of the organic electroluminescent panel described in Claim 1,
Before the step of attaching the second substrate, further comprising the step of forming an inorganic layer on the at least one layer of the organic layer on the second electrode and the terminal,
In the step of attaching the second substrate, the adhesive is also disposed on the inorganic layer,
The method for producing an organic electroluminescence panel, wherein the inorganic layer interposed between the at least one layer of the organic layer to be removed and the adhesive is also removed in the step of removing the portion of the second substrate. . In the manufacturing method of the organic electroluminescent panel described in Claim 2,
The method for producing an organic electroluminescence panel, wherein the organic layer and the inorganic layer are formed by vapor deposition or sputtering. In the manufacturing method of the organic electroluminescent panel as described in any one of Claim 1 to 3,
A method for manufacturing an organic electroluminescence panel, comprising supplying the adhesive to the first substrate or the second substrate by screen printing or dispensing. In the manufacturing method of the organic electroluminescent panel described in Claim 1,
Preparing a first mother substrate to be cut into a plurality of the first substrates in the step of preparing the first substrate;
The first mother substrate is formed with a plurality of the circuit layers corresponding to the regions to be a plurality of the first substrates,
In the step of attaching the second substrate, a second mother substrate to be cut into a plurality of the second substrates is attached to the first mother substrate,
Cutting the first mother substrate into a plurality of the first substrates;
Cutting the second mother substrate into a plurality of the second substrates;
The manufacturing method of the organic electroluminescent panel characterized by further including these. In the manufacturing method of the organic electroluminescent panel described in Claim 5,
The manufacturing method of the organic electroluminescent panel characterized by using an adhesive sheet as said adhesive agent. In the manufacturing method of the organic electroluminescent panel described in Claim 6,
The plurality of circuit layers are arranged in a plurality of rows and a plurality of columns,
The adhesive sheet has a strip shape covering the circuit layer arranged in any one row or row,
A method of manufacturing an organic electroluminescence panel, wherein the second mother substrate is bonded to the first mother substrate with a plurality of the adhesive sheets. In the manufacturing method of the organic electroluminescent panel described in Claim 6,
Prepare the adhesive sheet by affixing it to a roll sheet,
A method for producing an organic electroluminescence panel, comprising: supplying the adhesive sheet from the roll sheet to the first mother substrate or the second mother substrate. In the manufacturing method of the organic electroluminescent panel of any one of Claim 1 to 8,
A method of manufacturing an organic electroluminescence panel, wherein the step of attaching the second substrate to the first substrate is performed in the air, an inert gas atmosphere, or a vacuum.

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