JP2009065211A - Display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To exfoliate protective members sandwiched between a device substrate and a contact layer and a sealing substrate from the device substrate to allow a terminal section to be exposed for electrical connection with an external one with a simple procedure in an upper surface light-emitting type organic EL display unit. <P>SOLUTION: The terminal section 11 is covered with a masking tape (protective member 60) before a device side base substrate and a sealing side base substrate are laminated with an adhesion layer 30. Next, the laminated device side base substrate and sealing side base substrate is parted to each device substrate 10 and sealing substrate 20. Thereafter, each free area (tab for sticking) of the substrate 10 and substrate 20 are removed by bending them along with each scribe groove. At the same moment, the masking tape (protective member 60) is exfoliated from the substrate 10 to allow the section 11 to be exposed as a result. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a display device manufacturing method and a display device having a structure in which an element substrate having a light emitting element and a sealing substrate are bonded to each other through an adhesive layer, and particularly, organic light emission using an organic light emitting element with top emission. The present invention relates to a method for manufacturing a display device suitable for a display and a display device.

  In recent years, organic light-emitting displays using organic light-emitting elements have attracted attention as display devices that replace liquid crystal displays. Organic light-emitting displays are self-luminous, have a wide viewing angle and low power consumption, and are considered to be sufficiently responsive to high-definition high-speed video signals. Development is underway for practical application.

  In the production process of an organic light emitting display, for example, after forming an organic light emitting element on an element substrate, the back side of the element substrate is sealed to block the organic light emitting element from the atmosphere. Organic light-emitting devices are extremely sensitive to moisture, and when exposed to the atmosphere, moisture is sucked in, and areas that do not emit light (dark spots) may be generated, resulting in deterioration of brightness or life, so sealing is an indispensable technology for organic light-emitting displays. is there.

  Conventionally, light generated by an organic light emitting element is extracted from the element substrate side, an adhesive such as an ultraviolet curable resin is applied to the peripheral edge of the back surface of the element substrate, and an air blocking cover is bonded together Has been done. In this conventional method, since the adhesive is applied only to the peripheral portion of the panel, the terminal portion for electrical connection with the outside of the organic light emitting element is covered with the adhesive when the adhesive is applied. It is relatively easy to prevent it from being broken, and no problem with taking out the terminal portion has occurred.

Conventionally, in the liquid crystal display device, in order to prevent the width of the seal portion formed on the terminal portion from being partially thinned or thickened due to the shape of the wiring pattern of the terminal portion, There has been proposed a configuration in which a barrier pattern made of an insulating layer is provided along the side of the seal portion so that the width of the seal portion is constant (see, for example, Patent Document 1).
JP 2002-244148 A

  However, in the case of a top emission / complete solid sealing structure in which the element substrate and the sealing substrate are bonded over the entire surface through an adhesive layer, and light generated by the organic light emitting element is extracted from the sealing substrate side. In order to protect the terminal portion from adhesion of the adhesive, it is necessary to protect the terminal portion with a protective member such as a protective tape before bonding with the adhesive layer. Therefore, after bonding, the protective member is sandwiched between the element substrate, the adhesive layer, and the sealing substrate. Thus, the method of peeling off the protective member buried in the adhesive layer from the element substrate and taking out the terminal portion has not been developed conventionally.

  In particular, in order to realize a so-called multi-cavity manufacturing process in which a large substrate is divided to produce a plurality of display devices in consideration of mass productivity, establishment of a method for taking out terminal portions is unavoidable.

  The present invention has been made in view of such problems, and its purpose is to peel off the protective member sandwiched between the element substrate, the adhesive layer, and the sealing substrate from the element substrate by a simple procedure, and to connect the terminal portion. The present invention provides a method for manufacturing a display device and a display device that can take out the battery.

  A method for manufacturing a display device according to the present invention includes an element substrate having a plurality of light emitting elements and terminal portions for electrical connection to the outside of the light emitting elements, and a sealing disposed opposite to the light emitting element side of the element substrate. Manufacturing a display device including a substrate, a step of covering the terminal portion with a protective member, and a step of providing an adhesive layer so as to cover the light emitting element and the protective member between the element substrate and the sealing substrate, And removing a part of the element substrate and the sealing substrate bonded together through the adhesive layer to remove the protective member together with the removed portion to expose the terminal portion.

  A display device according to the present invention includes an element substrate having a plurality of light emitting elements and terminal portions for electrical connection with the outside of the light emitting elements, and a sealing substrate disposed opposite to the light emitting element side of the element substrate. The light-emitting element is used to extract light generated from the light-emitting element from the side of the sealing substrate, the terminal portion is covered with a protective member, and the adhesive layer covers the light-emitting element and the protective member between the element substrate and the sealing substrate. Then, by removing a part of the element substrate and the sealing substrate bonded together through the adhesive layer, the protective member is removed together with the removed portion to expose the terminal portion.

  In the method for manufacturing a display device and the display device according to the present invention, the terminal portion is covered with a protective member, and an adhesive layer is provided between the element substrate and the sealing substrate so as to cover the light emitting element and the protective member, and then bonded. By removing a part of the element substrate and the sealing substrate bonded through the layers, the protective member is removed together with the removed portion, and the terminal portion is taken out.

  As described above, according to the method for manufacturing a display device or the display device of the present invention, the terminal portion provided on the element substrate is covered with a protective member such as a masking tape, and the element substrate and the sealing substrate are bonded together with an adhesive layer. After that, when removing part of the element substrate and the sealing substrate, the protective member is also peeled off at the same time, so that the surface of the terminal portion can be easily exposed by a simple procedure. Therefore, it can be suitably used for manufacturing an organic light emitting display using a top emission type organic light emitting element.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows a schematic structure of a display device according to an embodiment of the present invention. This display device is an ultra-thin organic light emitting display used for PDA (Personal Digital Assistants) or a mobile phone, for example. For example, the element substrate 10 and the sealing substrate 20 are arranged to face each other, for example, from a thermosetting resin. The whole surface is bonded through an adhesive layer 30. One side of the element substrate 10 is provided with a terminal portion 11 for electrical connection with the outside of the organic light emitting element as a signal input and power supply port to the organic light emitting element described later. The terminal portion 11 is formed of, for example, titanium (Ti) -aluminum (Al), and the surface thereof is not covered with the adhesive layer 30 and the sealing substrate 20 and is exposed.

  As will be described later, in this display device, the terminal portion 11 is covered with a protective member such as a masking tape, and an adhesive layer 30 is provided between the element substrate 10 and the sealing substrate 20. Further, by removing a part of the element substrate 10 and the sealing substrate 20, the protective member is removed together with the removed portion, and the terminal portion 11 is exposed.

  FIG. 2 shows an example of a cross-sectional configuration of the display device. The element substrate 10 is made of, for example, an insulating material such as glass, and includes an organic light emitting element 10R that generates red light, an organic light emitting element 10G that generates green light, and an organic light emitting element 10B that generates blue light. Are arranged in a matrix as a whole in order.

  In the organic light emitting devices 10R, 10G, and 10B, for example, a first electrode 12 as an anode, an organic layer 13 including a light emitting layer, and a second electrode 14 as a cathode are laminated in this order from the element substrate 11 side. Yes.

  The first electrode 12 also functions as a reflective layer, and is made of, for example, a metal or alloy such as platinum (Pt), gold (Au), chromium (Cr), or tungsten (W).

  The configuration of the organic layer 13 differs depending on the emission color of the organic light emitting element. The organic light emitting devices 10R and 10B have a structure in which a hole transport layer, a light emitting layer, and an electron transport layer are laminated in this order from the first electrode 12 side. The light emitting layer has a structure in which the first electrode 12 is laminated in this order. The hole transport layer is for increasing the efficiency of hole injection into the light emitting layer. In the light emitting layer, recombination of electrons and holes occurs when an electric field is applied to generate light. The electron transport layer is for increasing the efficiency of electron injection into the light emitting layer.

As a constituent material of the hole transport layer of the organic light emitting device 10R, for example, bis [(N-naphthyl) -N-phenyl] benzidine (α-NPD) can be mentioned, and as a constituent material of the light emitting layer of the organic light emitting device 10R. Is, for example, 2,5-bis [4- [N- (4-methoxyphenyl) -N-phenylamino]] styrylbenzene-1,4-dicarbonitrile (BSB). Examples of the constituent material of the electron transport layer include 8-quinolinol aluminum complex (Alq ₃ ).

As a constituent material of the hole transport layer of the organic light emitting device 10B, for example, α-NPD can be mentioned, and as a constituent material of the light emitting layer of the organic light emitting device 10B, for example, 4,4-bis (2,2-diphenyl). Binin) biphenyl (DPVBi) is exemplified, and the constituent material of the electron transport layer of the organic light emitting device 10B includes, for example, Alq ₃ .

As a material of the hole transport layer of the organic light emitting element 10G, for example, include alpha-NPD, as the material of the light-emitting layer of the organic light emitting element 10G, for example, coumarin 6 to Alq _3; a (C6 Coumarin6) What mixed 1 volume% is mentioned.

  The second electrode 14 is composed of a semi-transmissive electrode, and light generated in the light emitting layer is extracted from the second electrode 14 side. The second electrode 14 is made of, for example, a metal or alloy such as silver (Ag), aluminum (Al), magnesium (Mg), calcium (Ca), or sodium (Na).

  The sealing substrate 20 is located on the side of the organic light emitting elements 10R, 10G, and 10B of the element substrate 10, and seals the organic light emitting elements 10R, 10G, and 10B together with the adhesive layer 30. The sealing substrate 20 is made of a material such as glass that is transparent to the light generated by the organic light emitting elements 10R, 10G, and 10B. For example, a color filter 21 (21R, 21G, 21B) is provided on the sealing substrate 20, and the light generated in the organic light emitting elements 10R, 10G, 10B is taken out, and the organic light emitting elements 10R, 10G, 10B and The external light reflected in the wiring between them is absorbed and the contrast is improved.

  This display device can be manufactured, for example, as follows.

  3 to 11 show the manufacturing method of this display device in the order of steps. First, as shown in FIG. 3, for example, the element-side base substrate 40 including a plurality of the element substrates 10 described above is formed. On the element side base substrate 40, as shown by the dotted lines in FIG. 3, for example, a region to be a total of 12 element substrates 10 in 4 rows and 3 columns is laid out. An element-side empty area 41 is provided between them. This element-side empty area 41 becomes a margin for removing a protective member to be described later.

  The element-side base substrate 40 includes, for example, the organic light emitting elements 10R, 10G, and 10B (not shown in FIG. 3; see FIG. 2) and the organic light emitting elements 10R, 10G, and 10B for each element substrate 10. The terminal part 11 for electrical connection with the outside is formed. As a method for forming the organic light emitting elements 10R, 10G, and 10B, for example, a plurality of first electrodes 12 made of the above-described material are formed in parallel, and hole injection made of the above-described material is formed on the anode 12. After the organic layer 13 is formed by sequentially forming a layer, a hole transport layer, a light emitting layer, and an electron transport layer, a plurality of second electrodes 14 made of the above-described materials are arranged in a direction perpendicular to the first electrode 12. Are formed in parallel. The terminal portion 11 is formed by PVD (Physical Vapor Deposition) using, for example, Ti—Al.

  After forming the element side base substrate 40, as shown in FIG. 4, for example, the sealing side base substrate 50 including a plurality of the sealing substrates 20 described above is formed. As shown by the dotted lines in FIG. 4, for example, a region to be a total of 12 sealing substrates 20 in 4 rows and 3 columns is laid out on the sealing side base substrate 50. A sealing-side empty area 51 is provided between the substrates 20. The sealing-side vacant area 51 is a margin for removing a protective member to be described later.

  In addition, on the sealing-side base substrate 50, for example, the color filter 21 (not shown in FIG. 4, refer to FIG. 2) is formed for each sealing substrate 20.

  After the element-side base substrate 40 and the sealing-side base substrate 50 are formed, the terminal portions 11 of the element substrates 20 of the element-side base substrate 40 are covered with a protective member 60 as shown in FIG. As this protective member 60, it is preferable to use a heat-resistant masking tape such as Kapton tape commercially available from Sumitomo 3M. This is because, when the adhesive layer 30 is cured, for example, it is necessary to heat the adhesive layer 30 at a predetermined temperature for a predetermined time, and thus the protective member 60 needs to be able to withstand this heating.

  Moreover, it is more preferable if the protection member 60 has conductivity. This is because it is possible to prevent adverse effects due to static electricity on TFTs (Thin Film Transistors) (not shown) provided attached to the organic light emitting elements 10R, 10G, and 10B.

  The thickness of the protective member 60 is preferably 10 μm or more and 60 μm or less, for example. It is practically difficult to use the protective member 60 having a thickness of less than 10 μm. Further, if the thickness of the protective member 60 is larger than 60 μm, the thickness of the adhesive layer 30 is increased accordingly, so the viewing angle is narrowed. This is because it becomes difficult to take advantage of the characteristics of the organic light emitting display with a wide viewing angle.

  After covering the terminal portion 11 with the protective member 60, as shown in FIG. 6, the adhesive layer 30 is provided over the entire surface between the element side base substrate 40 and the sealing side base substrate 50, The sealing-side base substrate 50 is bonded through the adhesive layer 30. Thus, the adhesive layer 30 is provided between the element substrates 10 and the corresponding sealing substrates 20 so as to cover the organic light emitting elements 10R, 10G, and 10B (see FIG. 2) and the protective member 60. The substrate 10 and the corresponding sealing substrate 20 are bonded together via the adhesive layer 30.

  After the element side base substrate 40 and the sealing side base substrate 50 are bonded together, the terminal portion 11 is taken out in parallel with the division of the element side base substrate 40 and the sealing side base substrate 50 as follows. Do.

  First, as shown in FIG. 7, the sealing side base substrate 50 is set on the glass scriber table with the sealing side base substrate 50 facing upward, and the sealing side base substrate 50 is sealed along the four sides of the sealing substrate 20. Scribe grooves 52A, 52B, 52C, 52D, 52E, 52F, 52G, 52H, 52I, 52J, and 52K are provided.

  Next, it is set on a glass breaker, impact is applied along the sealing-side scribe grooves 52A to 52K shown in FIG. 7, and the sealing-side scribe grooves 52A to 52K are grown in the shape of cracks. Break the base substrate 50 side.

  Subsequently, as shown in FIG. 8, the element side base substrate 40 is turned over so as to be on the upper side, set on the table of the glass scriber, and on the element side base substrate 40 along the four sides of the element substrate 10. Element side scribe grooves 42A, 42B, 42C, 42D, 42E, 42F, 42G, 42H, 42I, 42J, 42K are provided.

  Next, the element-side base substrate 40 is set in a glass breaker and applied with an impact along the element-side scribe grooves 42A to 42K shown in FIG. 8 to grow the element-side scribe grooves 42A to 42K in cracks. Break the side. Note that scribing and breaking may be performed first on the element side base substrate 40 side.

  Next, as shown in FIG. 9, the element side scribe grooves 42A, 42B, 42C, 42D, 42E, 42F, 42H, 42J and the sealing side scribe grooves 52A, 52B, 52C, 52D, 52E, 52F, 52H, The element side base substrate 40 and the sealing side base substrate 50 are divided along the line 52I. This division can be performed manually, for example. At this time, the element-side scribe grooves 42G, 42I, and 42K and the sealing-side scribe grooves 52G, 52I, and 52K are not divided.

  As a result, as shown in FIG. 10, a display device in which the element substrate 10 and the sealing substrate 20 are bonded together through the adhesive layer 30 is obtained. In this display device, the protection member 60 is sandwiched between the element substrate 10, the sealing substrate 20, and the adhesive layer 30 and is buried in the adhesive layer 30. The display device is also accompanied by the element-side empty area 41 and the sealing-side empty area 51 via the element-side scribe grooves 42G, 42I, and 42K and the sealing-side scribe grooves 52G, 52I, and 52K that are not divided. It has become a state.

  Subsequently, as shown in FIG. 11, the element side vacant region 41 and the sealing side vacant region 51 of the element substrate 10 and the sealing substrate 20 are separated from the element side scribe grooves 42G, 42I, 42K and the sealing side scribe groove 52G. , 52I, and 52K. Thereby, the protection member 60 is peeled off from the element substrate 10 together with the removed element-side empty area 41 and the sealing-side empty area 51, and the terminal portion 11 can be exposed.

  In the bending / removing operation, for example, a bending jig 70 as shown in FIG. 12 is preferably used in order to apply a force equally to the element-side empty area 41 and the sealing-side empty area 51. . The bending jig 70 includes, for example, a sandwiching portion 71 that sandwiches the element-side empty region 41 and the sealing-side empty region 51 with a hinge 70a interposed therebetween, and a grip portion 72 that is gripped by an operator. As shown in FIG. 13, the operator holds the bending jig 70 in one hand, sandwiches the element-side empty area 41 and the sealing-side empty area 51 with the bending jig 70, and the other side of the display device. The element side empty area 41 and the sealing side empty area 51 can be bent by pinching the end with one hand. The bending jig 70 is made of aluminum or the like for weight reduction, but only the sandwiching portion 71 that sandwiches the element-side empty area 41 and the sealing-side empty area 51 prevents the display device from being damaged. Therefore, it is preferable to use a resin. The bending jig 70 is for manually performing the bending operation, but it goes without saying that the bending operation can be automated.

  The width of the element-side empty area 41 is preferably 1 mm or more, for example. This is because the width needs to be 1 mm or more as a realistic value that can be sandwiched by using the bending jig 70 or the like. Although the upper limit of the width varies depending on the size of the display device, for example, it is preferably 35 mm or less, and more preferably 30 mm or less. This is because if it exceeds 35 mm, more parts are wasted and the production efficiency is reduced. Moreover, if it is 30 mm or less, even if it is a display apparatus for large screens, it can respond almost.

  The width of the sealing-side empty area 51 is a value obtained by adding the width of the protective member 60 to the width of the element-side empty area 41.

  Thus, the display device shown in FIGS. 1 and 2 is completed.

  In this display device, for example, when a predetermined voltage is applied between the first electrode 12 and the second electrode 14, current is injected into the light emitting layer of the organic layer 13, and holes and electrons are recombined. As a result, light emission occurs. This light is extracted from the sealing substrate 20 side. Here, after the terminal portion 11 is covered with the protective member 60, in the process of removing a part of the element substrate 10 and the sealing substrate 20 bonded together by the adhesive layer 30, the protective member 60 is removed together with a portion to be removed. The surface is exposed by removing. Therefore, the electrical connection of the terminal part 11 can be performed easily, and the characteristics of the organic light emitting element having the top emission / completely solid sealed structure are improved.

  As described above, in the present embodiment, the terminal portion 11 provided on the element substrate 10 is covered with the protective member 60 such as a masking tape, and the element substrate 10 and the sealing substrate 20 are bonded together with the adhesive layer 30. Since the protective member 60 is also removed at the same time when removing 10 and a part of the sealing substrate 20, the surface of the terminal portion 11 can be easily exposed.

  While the present invention has been described with reference to the embodiment, the present invention is not limited to the above embodiment, and various modifications can be made. For example, in the above embodiment, the present invention is applied to a so-called multi-chamfer process, and the element side base substrate 40 including a plurality of element substrates 10 and the sealing side base substrate 50 including a plurality of sealing substrates 20 are provided. The case where the terminal portion 11 is taken out in parallel with the division of the element side base substrate 40 and the sealing side base substrate 50 after forming and bonding them through the adhesive layer 30 has been described. Is not necessarily limited to a multi-chamfer manufacturing process. For example, when the element substrate 10 and the sealing substrate 20 are large in size, the scribing grooves 42A, 42B, 42C, 42D, 42E, 42F, 42H, 42J, 52A, 52B, 52C, 52D, 52E, 52F are used. , 52H, and 52I are formed, and only the scribe grooves 42G, 42I, 42K, 52G, 52I, and 52K for removing the protective member 60 are provided, and the portion of the element substrate 10 and the sealing substrate 20 outside the protective member 60 is provided. May be removed by folding along the scribing grooves 42G to 42K and 52G to 52K for removing the protective member 60.

1 is a perspective view illustrating a schematic configuration of a display device according to an embodiment of the present invention. It is sectional drawing for demonstrating the element structure of the display apparatus shown in FIG. It is a block diagram of the element side base substrate used for the manufacturing process of the display apparatus shown in FIG. Similarly, it is a block diagram of the sealing side base substrate. It is a top view for demonstrating the manufacturing process of the display apparatus shown in FIG. It is a figure for demonstrating the manufacturing process following the process of FIG. It is a figure for demonstrating the manufacturing process following the process of FIG. It is a figure for demonstrating the manufacturing process following the process of FIG. It is a figure for demonstrating the manufacturing process following the process of FIG. It is a figure for demonstrating the manufacturing process following the process of FIG. It is a figure for demonstrating the manufacturing process following the process of FIG. It is a perspective view of the jig | tool used for the process of FIG. It is a figure for demonstrating the usage method of the jig | tool shown in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Element substrate, 11 ... Terminal part, 20 ... Sealing substrate, 30 ... Adhesive layer, 40 ... Element side base substrate, 50 ... Sealing side base substrate

Claims (2)

An element substrate having a plurality of light emitting elements;
A sealing substrate that is disposed opposite to the light emitting element side of the element substrate and is provided with a color filter on the element substrate side, and light generated by the light emitting element is taken out through the color filter;
A single adhesive layer provided on the entire surface between the element substrate and the sealing substrate;
A display device comprising: a terminal portion provided on one side of the element substrate, exposed from the sealing substrate and the adhesive layer, and provided for electrical connection to the outside of the light emitting element. The light emitting element has a configuration in which a first electrode, an organic layer including a light emitting layer, and a second electrode are stacked in order from the element substrate side, and light generated in the light emitting layer is emitted from the second electrode. The display device according to claim 1, wherein the display device is an organic light emitting element that is taken out from a side.

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