JP2004111175A - Method for manufacturing display device - Google Patents

Method for manufacturing display device Download PDF

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Publication number
JP2004111175A
JP2004111175A JP2002271027A JP2002271027A JP2004111175A JP 2004111175 A JP2004111175 A JP 2004111175A JP 2002271027 A JP2002271027 A JP 2002271027A JP 2002271027 A JP2002271027 A JP 2002271027A JP 2004111175 A JP2004111175 A JP 2004111175A
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Japan
Prior art keywords
sealing resin
sealing
display device
substrate
electrode
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JP2002271027A
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JP4165161B2 (en
JP2004111175A5 (en
Inventor
Yuichi Iwase
岩瀬　祐一
Hitoshi Tamaki
玉城　仁
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Sony Corp
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Sony Corp
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a display device having high reliability and a high yield by preventing an uncured sealing resin from being diffused in a direction of an external electrode and assuring conduction between the electrode and an external terminal. <P>SOLUTION: In a method for manufacturing the display device, the device has a light emitting element and a drive electrode for driving the element, a panel base plate 1 has a light emitting region L and the external electrode 4 formed of the element and the drive electrode, and a sealing base plate 3 is adhered to the plate 1 via a sealing resin 2. The method includes a step of forming a protective film 11 with which the electrode 4 is covered before the plate 3 is adhered after the electrode 4 is formed on the plate 1, and a step of exposing the electrode 4 by removing the resin 2 adhered to the film 11 together with the film 11 after the plate 1 and the plate 3 are laminated via the resin 2. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、表示装置の製造方法に関し、詳しくは有機エレクトロルミネッセンス表示装置の製造方法に関する。
【０００２】
【従来の技術】
フラットパネルディスプレイと呼ばれる平面型の表示装置の一つに、発光素子に有機エレクトロルミネッセンス（以下、有機ＥＬという）素子を用いた有機ＥＬ表示装置がある。この有機ＥＬ表示装置は、自発光型であるため、視野角が広いという特徴を有している。また、有機ＥＬ表示装置は、必要な画素のみを発光させるため、バックライト型の表示装置である液晶表示装置と比較すると消費電力が少ないという利点がある。
【０００３】
一般的な有機ＥＬ素子の構成は有機材料を陽極と陰極とで挟んだ構造を有している。その発光のメカニズムは、有機材料からなる有機層に陽極から正孔を注入し、陰極から電子を注入して、これら注入した正孔と電子とを再結合させて発光させるものである。現在、有機ＥＬ素子は、１０Ｖ以下の駆動電圧で数百ｃｄ／ｍ２　〜で数万ｃｄ／ｍ２　の輝度を得ることができている。また、有機材料を適宜選択することにより、マルチカラー表示もしくはフルカラー表示の表示装置を構成することも可能となっている。
【０００４】
有機ＥＬ素子は以下のような問題も有している。それは有機層に水分や酸素が侵入することによって、有機層が結晶化し、ダークスポットと呼ばれる非発光点が発生することである。このダークスポットは時間の経過とともに成長し、有機ＥＬ素子の寿命を短くする一因となっている。この問題を解決する構成として、図４に示すような構成の有機ＥＬ表示装置が開示されている。図４に示すように、有機ＥＬ素子が形成されているパネル基板１には、その表示領域上に封止樹脂２を介して封止基板３が貼り付けられている。この封止樹脂２には紫外線硬化型樹脂もしくは熱硬化型樹脂が用いられ、一般的には上記封止基板３を貼り付けた後に硬化されている。上記封止樹脂２は発光領域（表示領域ともいう）上に形成され、その発光領域の周辺には外部電極４および外部端子５が配置されている。これら外部電極４および外部端子５に駆動電圧を印加することで、有機ＥＬ素子は駆動される（例えば、下記特許文献１〜３）。
【０００５】
【特許文献１】
特開平５−１８２７５９号公報（第３−５頁、第４図）
【特許文献１】
特開平１１−２９７４７６号公報（第４−７頁、第２図）
【特許文献１】
特開２００２−２１６９５０号公報（第３−７頁、図１）
【０００６】
【発明が解決しようとする課題】
しかしながら、前記図５によって説明した従来の有機ＥＬ表示装置では、有機ＥＬ素子を封止する封止樹脂が、硬化しないうちに外部電極側に流出し、外部電極を汚染することがある。このような汚染が生じた場合には、外部電極と外部端子との接触が不完全となり、外部電極と外部端子との導通を確保することが困難となり、その結果、有機ＥＬ素子を駆動できなくなる。
【０００７】
また、有機ＥＬ表示装置の製造工程では、生産性を高めるために、図５の（ａ）に示すように、一枚のパネル基板１から複数の有機ＥＬ表示装置６を生産する多面取り（多数個取り）の生産を行うことが多い。この場合、例えばパネル基板１に形成された複数の発光領域（表示領域ともいう）のそれぞれに対応させて、封止樹脂２を塗布した後、図５の（ｂ）に示すように、パネル基板１と同様に封止基板３も大型のものを用いて、１枚の封止基板３を各発光領域上の封止樹脂２の上面に貼り合わせ、各封止樹脂２を硬化させる。その後、各発光領域間に位置する封止基板３の不要部分を除去している。このような、いわゆる多面取りを行う場合には、パネル基板１と封止基板３とを各封止樹脂２を介して貼り合わせるため、パネル基板１と封止基板３との間で封止樹脂２に対して毛細管現象が生じ、例えば図５の（ｃ）に示すように、未硬化な封止樹脂２が外部電極４側にまで流れ出て、外部電極４を覆ってしまうという問題が発生する可能性が高くなる。このことは、外部電極４と外部端子５（前記図５参照）との接続がとれなくなるという重大な欠陥を招くことになる。
【０００８】
本発明は、かかる点を鑑みてなされたものであり、有機ＥＬ素子を封止樹脂により封止する際に封止樹脂の外部電極側への拡散を防止し、歩留まりの良い安定した生産が可能な表示装置およびその製造方法を提供するものである。
【０００９】
【課題を解決するための手段】
本発明は、上記課題を解決するためになされた表示装置の製造方法である。
【００１０】
本発明の表示装置の製造方法は、発光素子および該発光素子を駆動する駆動電極が設けられ、前記発光素子と前記駆動電極とによって発光領域と電極領域とが形成されたパネル基板と、封止基板とを封止樹脂を介して貼り合わせる表示装置の製造方法であって、前記パネル基板に外部電極を形成した後で前記封止基板を貼り合わせる前に、前記外部電極を被覆する保護膜を形成する工程と、前記パネル基板と前記封止基板とを前記封止樹脂を介して貼り合わせた後に前記保護膜とともに前記保護膜に付着した前記封止樹脂を除去して前記外部電極を露出させる工程とを備えた製造方法である。
【００１１】
上記表示装置の製造方法では、パネル基板に外部電極を形成した後で封止基板を貼り合わせる前に、外部電極を被覆する保護膜を形成する工程を備えたことから、パネル基板と封止基板とを封止樹脂を介して貼り合わせた際に、未硬化な封止樹脂が毛細管現象によってパネル基板と封止基板との間を発光領域の外側の電極領域方向に流れ出しても、電極領域は保護膜に被覆されているので、電極領域に形成される外部電極が直接封止樹脂に被覆されない。すなわち、基板電極は保護膜によって封止樹脂による汚染を受けない。そして、パネル基板と封止基板とを封止樹脂を介して貼り合わせた後に保護膜とともに保護膜に付着した封止樹脂を除去する工程を備えていることから、封止樹脂を用いてパネル基板と封止基板と貼り合わせる封止工程を行っても外部電極が露出された状態となる。したがって、本発明の製造方法により製造された表示装置では、外部電極と外部電極との接続が確実に行えるようになる。
【００１２】
【発明の実施の形態】
本発明の表示装置の製造方法に係る一実施の形態を、図１によって説明する。図１および図２では、一例として、一枚のパネル基板から複数の有機ＥＬ表示装置を製造する多面取り（多数個取り）の製造方法を示す。図１（ａ）はパネル基板と保護膜とを示す平面図であり、図１（ｂ）はパネル基板と封止基板との貼り合わせ状態を説明する図面であり、図１（ｃ）は封止樹脂を介して封止基板が貼り合わされた状態を示すレイアウト図であり、図２は単個に切り出された有機ＥＬ表示装置を示す平面図および側面図である。
【００１３】
図１（ａ）に示すように、パネル基板１には、有機材料を陽極と陰極とで挟んだ構造からなる発光領域Ｌと、この発光領域Ｌの周辺に上記陽極および陰極が延長されてなる外部電極４が形成されている。そして上記外部電極４が形成されている外部電極領域Ｅを覆う保護膜１１を形成する。上記保護膜１１には、例えば樹脂製の粘着テープを用いることができる。樹脂製の粘着テープとしては、例えばポリイミド製粘着テープ、ポリエチレンテレフタレート製粘着テープ等を用いることができる。
【００１４】
次いで、図１（ｂ）に示すように、パネル基板１と同様に封止基板３も大型のものを用意した後、パネル基板１に形成された各発光領域Ｌを覆う適量の封止樹脂２を未硬化な状態で、例えばディスペンサを用いて各発光領域Ｌ上に塗布する。次いで、各封止樹脂２を介してパネル基板１に封止基板３を接着する。その後、各発光領域間に位置する封止基板３の不要部分を除去する。このような、いわゆる多面取りを行う場合には、パネル基板１と封止基板３とを各封止樹脂２を介して貼り合わせるため、パネル基板１と封止基板３との間で封止樹脂２の毛細管現象が生じ、例えば図１（ｃ）に示すように、未硬化の封止樹脂２が発光領域Ｌより外側方向、すなわち外部電極４方向に拡散しようとする。そして拡散した封止樹脂２は、パネル基板１に形成された外部電極領域Ｅを被覆する保護膜１１上にも広がる。なお、（Ｃ）図では図面をわかり易くするために封止基板３の図示は省略した。
【００１５】
その後、各発光領域Ｌ内に留まっている封止樹脂２を、例えば封止樹脂２が紫外線硬化型樹脂であれば紫外線を照射して硬化させ、例えば封止樹脂２が熱硬化型樹脂であれば加熱によって硬化させる。さらに、各発光領域Ｌ間に位置する不要な封止基板３を除去する。そして、上記保護膜１１を剥離するとともに、この保護膜１１上に拡散された封止樹脂２も同時に剥離する。その結果、図２（ａ）の平面図および（ｂ）の側面図に示すように、外部電極領域の外部電極４が露出される。したがって、発光領域Ｌ（斜線で示す領域）を封止樹脂２によって封止することができるとともに外部電極４と外部端子５（２点鎖線部分）との接続が確保できる。
【００１６】
このようにして、１枚のパネル基板１から、封止樹脂２を介して貼り合わされたパネル基板１と封止基板３からなる複数の有機ＥＬ表示装置６を同時に形成することができる。
【００１７】
上記表示装置の製造方法では、パネル基板１に外部電極４を形成した後で封止基板３を貼り合わせる前に、外部電極４を被覆する保護膜１１を形成する工程を備えたことから、パネル基板１と封止基板３とを封止樹脂２を介して貼り合わせた際に、未硬化な封止樹脂２が毛細管現象によってパネル基板１と封止基板３との間を発光領域Ｌの外側の電極領域方向に流れ出しても、電極領域は保護膜１１に被覆されているので、電極領域に形成される外部電極４が直接封止樹脂２に被覆されない。すなわち、外部電極４は保護膜１１によって封止樹脂２による汚染を受けない。そして、パネル基板１と封止基板３とを封止樹脂２を介して貼り合わせた後に保護膜１１とともに保護膜１１に付着した封止樹脂２を除去する工程を備えていることから、封止樹脂２を用いてパネル基板１と封止基板３と貼り合わせる封止工程を行っても外部電極４が露出された状態となる。
【００１８】
したがって、封止樹脂２が電極領域の外部電極４等を汚染するものを防ぐことができるので、電気的導通を確保することができずに有機ＥＬ表示装置を駆動できないという重大な欠陥を招くことがなくなる。すなわち、外部電極と外部端子との電気的導通を確保した信頼性の高い有機ＥＬ表示装置を製造することができる。したがって、本発明の製造方法により製造された表示装置６では、外部電極４と外部端子との接続が確実に行えるようになる。
【００１９】
また、１枚の基板から複数の表示装置を製造する、いわゆる多面取り（多数個取り）を行う場合には、毛細管現象により封止樹脂２の拡散が生じ易くなるが、保護膜１１によって封止樹脂２の拡散しても外部電極４を汚染することがないので、有機ＥＬ表示装置の高品質化が図れるとともに、歩留りの向上も図れる。したがって、本発明の表示装置およびその製造方法は、多面取りを行う場合には、非常に有効ものとなる。
【００２０】
なお、上記実施の形態では、多面取りを行う事例により説明したが、１枚のパネル基板に一つの表示装置を形成する場合であっても、多面取りの場合と同様に、本発明の表示装置およびその製造方法を適用することができる。
【００２１】
次に、通常の多数個取りを行う場合について、図３によって説明する。
【００２２】
図３（ａ）の平面図およびＡ−Ａ線断面図に示すように、通常、多面取りを行う場合には、外部電極が形成される外部電極領域Ｅは発光領域Ｌに対して一方向にのみ形成されることが多い。この場合には、図示されているように各行に配列されている複数の有機ＥＬ表示装置の外部電極４が形成される外部電極領域Ｅを、行ごとに１本の保護膜１１（樹脂製粘着テープ）により連続して被覆することができる。そして、封止樹脂を介して封止基板を貼り付け、封止基板の不要な部分を除去した後、保護膜１１を剥離するには、図３（ｂ）に示すように、例えばローラー２１に保護膜１１の端部を貼り付けた後、ローラー２１を矢印ア方向に転がすことによりパネル基板１より各保護膜１１を剥離する。したがって、保護膜１１には、この剥離作業によって外部電極領域Ｅに形成された外部電極４を剥離するような強い粘着力は必要としない。この保護膜１１は、外部電極４と保護膜１１との間に封止樹脂が入り込まないようにする粘着力があり、かつ保護膜１１を剥離するときに外部電極４を剥離しないような粘着力を有するものであればよい。なお、外部電極４上に保護膜１１の粘着物質が付着している場合には、洗浄工程を行うことによってその粘着物質を除去すればよい。
【００２３】
上記外部電極４上の封止樹脂２を除去した結果、図３（ｃ）の封止樹脂および外部電極を示す平面図および側面図に示すように、各有機ＥＬ表示装置の発光流量Ｌは封止樹脂２によって被覆された状態で外部電極領域Ｅ（外部電極４）が露出される。
【００２４】
【発明の効果】
以上、説明したように本発明の表示装置の製造方法によれば、封止樹脂によりパネル基板と封止基板とを貼り合わせる前にパネル基板の外部電極を被覆する保護膜を形成するので、保護膜によって未硬化な封止樹脂による外部電極への汚染を防止することができる。したがって、電極領域の外部電極と外部端子との導通を確保した、信頼性の高い、高品質な表示装置を高歩留りに製造することができる。また、多面取り（多数個取り）を行う場合には、本発明の製造方法が未硬化な封止樹脂の外部電極への汚染を確実に阻止することができるので、非常に有効ものとなる。
【図面の簡単な説明】
【図１】本発明の表示装置に係る一実施の形態を示す図面であり、（ａ）はパネル基板と保護膜とを示す平面図であり、（ｂ）はパネル基板と封止基板との貼り合わせ状態を説明する図面であり、（ｃ）は封止樹脂を介して封止基板が貼り合わされた状態を示すレイアウト図である。
【図２】単個に切り出された有機ＥＬ表示装置を示す平面図である。
【図３】多数個取りの場合の保護膜の貼付方法および剥離方法を説明する図面である。
【図４】従来の有機ＥＬ表示装置の構成例を示す図面であり、（ａ）は平面レイアウト図であり、（ｂ）は側面図である。
【図５】従来の多面取りを行う場合の有機ＥＬ表示装置およびその製造方法の概略を示す図面であり、（ａ）はパネル基板上への配置を示す平面レイアウト図であり、（ｂ）は封止樹脂を介して封止基板を貼り付ける封止工程を説明する断面図であり、（ｃ）は封止樹脂の状態を説明する平面レイアウト図である。
【符号の説明】
１…パネル基板、２…封止樹脂、２…封止基板、４…外部電極、１１…保護膜[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a display device, and more particularly, to a method for manufacturing an organic electroluminescent display device.
[0002]
[Prior art]
As one of flat panel display devices called a flat panel display, there is an organic EL display device using an organic electroluminescence (hereinafter, referred to as an organic EL) element as a light-emitting element. Since this organic EL display device is a self-luminous type, it has a feature that a viewing angle is wide. Further, the organic EL display device has an advantage that power consumption is smaller than that of a liquid crystal display device which is a backlight type display device because only necessary pixels emit light.
[0003]
A general configuration of an organic EL element has a structure in which an organic material is sandwiched between an anode and a cathode. The light emission mechanism is such that holes are injected from an anode into an organic layer made of an organic material, electrons are injected from a cathode, and the injected holes and electrons are recombined to emit light. At present, the organic EL element can obtain a luminance of several hundreds cd / m 2 to several tens of thousands cd / m 2 at a driving voltage of 10 V or less. Further, by appropriately selecting an organic material, a display device of multi-color display or full-color display can be formed.
[0004]
Organic EL elements also have the following problems. That is, when moisture or oxygen enters the organic layer, the organic layer is crystallized, and a non-light emitting point called a dark spot is generated. The dark spot grows with the passage of time, which contributes to shortening the life of the organic EL element. As a configuration for solving this problem, an organic EL display device having a configuration as shown in FIG. 4 is disclosed. As shown in FIG. 4, a sealing substrate 3 is adhered to a panel substrate 1 on which an organic EL element is formed via a sealing resin 2 on a display area thereof. As the sealing resin 2, an ultraviolet curable resin or a thermosetting resin is used, and is generally cured after the sealing substrate 3 is attached. The sealing resin 2 is formed on a light emitting area (also referred to as a display area), and external electrodes 4 and external terminals 5 are arranged around the light emitting area. The organic EL element is driven by applying a drive voltage to the external electrode 4 and the external terminal 5 (for example, Patent Documents 1 to 3 described below).
[0005]
[Patent Document 1]
JP-A-5-182759 (page 3-5, FIG. 4)
[Patent Document 1]
JP-A-11-297476 (page 4-7, FIG. 2)
[Patent Document 1]
JP-A-2002-216950 (page 3-7, FIG. 1)
[0006]
[Problems to be solved by the invention]
However, in the conventional organic EL display device described with reference to FIG. 5, the sealing resin for sealing the organic EL element may flow out to the external electrode side before being cured, and may contaminate the external electrode. When such contamination occurs, the contact between the external electrode and the external terminal becomes incomplete, and it becomes difficult to secure conduction between the external electrode and the external terminal. As a result, the organic EL element cannot be driven. .
[0007]
In the manufacturing process of the organic EL display device, as shown in FIG. 5A, in order to increase the productivity, a plurality of organic EL display devices 6 are produced from a single panel substrate 1 (many multiple processes). In many cases, individual production is performed. In this case, for example, after applying a sealing resin 2 corresponding to each of a plurality of light emitting regions (also referred to as display regions) formed on the panel substrate 1, as shown in FIG. As in the case of 1, a large sealing substrate 3 is used, and one sealing substrate 3 is bonded to the upper surface of the sealing resin 2 on each light emitting region, and each sealing resin 2 is cured. After that, unnecessary portions of the sealing substrate 3 located between the light emitting regions are removed. In the case of performing such a so-called multi-paneling, the panel substrate 1 and the sealing substrate 3 are bonded to each other with the sealing resin 2 interposed therebetween. 5, there occurs a problem that the uncured sealing resin 2 flows out to the external electrode 4 side and covers the external electrode 4 as shown in, for example, FIG. The likelihood increases. This leads to a serious defect that the connection between the external electrode 4 and the external terminal 5 (see FIG. 5) cannot be established.
[0008]
The present invention has been made in view of the above point, and prevents the sealing resin from diffusing to the external electrode side when the organic EL element is sealed with the sealing resin, thereby enabling stable production with a good yield. And a method of manufacturing the same.
[0009]
[Means for Solving the Problems]
The present invention is a method for manufacturing a display device which has been made to solve the above problems.
[0010]
A method for manufacturing a display device according to the present invention includes a panel substrate provided with a light emitting element and a driving electrode for driving the light emitting element, wherein a light emitting region and an electrode region are formed by the light emitting element and the driving electrode; A method for manufacturing a display device in which a substrate and a sealing resin are bonded via a sealing resin, wherein after forming an external electrode on the panel substrate and before bonding the sealing substrate, a protective film covering the external electrode is formed. Forming and, after bonding the panel substrate and the sealing substrate via the sealing resin, removing the sealing resin attached to the protective film together with the protective film to expose the external electrodes. And a manufacturing method.
[0011]
Since the method for manufacturing a display device includes a step of forming a protective film covering the external electrodes after forming the external electrodes on the panel substrate and before bonding the sealing substrate, the panel substrate and the sealing substrate When the uncured sealing resin flows between the panel substrate and the sealing substrate in the direction of the electrode region outside the light emitting region due to a capillary phenomenon when bonded together with the sealing resin, the electrode region is Since it is covered with the protective film, the external electrode formed in the electrode region is not directly covered with the sealing resin. That is, the substrate electrode is not contaminated by the sealing resin by the protective film. Then, after the panel substrate and the sealing substrate are bonded together via the sealing resin, a step of removing the sealing resin attached to the protection film together with the protection film is provided. The external electrodes are exposed even when a sealing step of bonding the substrate and the sealing substrate is performed. Therefore, in the display device manufactured by the manufacturing method of the present invention, connection between the external electrodes can be reliably performed.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
One embodiment of a method for manufacturing a display device according to the present invention will be described with reference to FIG. 1 and 2 show, as an example, a method of manufacturing a plurality of organic EL display devices from a single panel substrate (multi-cavity production). FIG. 1A is a plan view showing a panel substrate and a protective film, FIG. 1B is a diagram for explaining a state of bonding the panel substrate and a sealing substrate, and FIG. FIG. 2 is a layout diagram showing a state in which a sealing substrate is bonded via a sealing resin, and FIG. 2 is a plan view and a side view showing an organic EL display device cut out into a single unit.
[0013]
As shown in FIG. 1A, a light emitting region L having a structure in which an organic material is sandwiched between an anode and a cathode, and the anode and the cathode are extended around the light emitting region L on the panel substrate 1. External electrodes 4 are formed. Then, a protective film 11 covering the external electrode region E where the external electrodes 4 are formed is formed. For the protective film 11, for example, an adhesive tape made of resin can be used. As the resin adhesive tape, for example, a polyimide adhesive tape, a polyethylene terephthalate adhesive tape, or the like can be used.
[0014]
Next, as shown in FIG. 1B, after a large sealing substrate 3 is prepared similarly to the panel substrate 1, an appropriate amount of the sealing resin 2 covering each light emitting region L formed on the panel substrate 1 is prepared. Is applied on each light emitting region L in an uncured state using, for example, a dispenser. Next, the sealing substrate 3 is bonded to the panel substrate 1 via each sealing resin 2. After that, unnecessary portions of the sealing substrate 3 located between the light emitting regions are removed. In the case of performing such a so-called multi-paneling, the panel substrate 1 and the sealing substrate 3 are bonded to each other with the sealing resin 2 interposed therebetween. 2, the uncured sealing resin 2 tends to diffuse outward from the light-emitting region L, that is, toward the external electrode 4, as shown in FIG. 1C, for example. Then, the diffused sealing resin 2 spreads over the protective film 11 covering the external electrode region E formed on the panel substrate 1. It should be noted that the illustration of the sealing substrate 3 is omitted in FIG.
[0015]
Thereafter, the sealing resin 2 remaining in each light emitting region L is cured by irradiating ultraviolet rays if the sealing resin 2 is an ultraviolet curing resin, for example, if the sealing resin 2 is a thermosetting resin. It is cured by heating. Further, unnecessary sealing substrates 3 located between the light emitting regions L are removed. Then, the protective film 11 is peeled off, and the sealing resin 2 diffused on the protective film 11 is also peeled off at the same time. As a result, as shown in the plan view of FIG. 2A and the side view of FIG. 2B, the external electrode 4 in the external electrode region is exposed. Therefore, the light emitting region L (the region indicated by oblique lines) can be sealed with the sealing resin 2 and the connection between the external electrode 4 and the external terminal 5 (the portion indicated by the two-dot chain line) can be secured.
[0016]
In this way, a plurality of organic EL display devices 6 including the panel substrate 1 and the sealing substrate 3 bonded together via the sealing resin 2 can be simultaneously formed from one panel substrate 1.
[0017]
The method for manufacturing the display device includes the step of forming the protective film 11 covering the external electrodes 4 after the external electrodes 4 are formed on the panel substrate 1 and before the sealing substrate 3 is bonded. When the substrate 1 and the sealing substrate 3 are bonded via the sealing resin 2, the uncured sealing resin 2 causes the gap between the panel substrate 1 and the sealing substrate 3 outside the light emitting region L by a capillary phenomenon. However, since the electrode region is covered with the protective film 11, the external electrode 4 formed in the electrode region is not directly covered with the sealing resin 2. That is, the external electrodes 4 are not contaminated by the sealing resin 2 by the protective film 11. Since the panel substrate 1 and the sealing substrate 3 are bonded together with the sealing resin 2 interposed therebetween, a step of removing the sealing resin 2 attached to the protection film 11 together with the protection film 11 is provided. Even when a sealing step of bonding the panel substrate 1 and the sealing substrate 3 using the resin 2 is performed, the external electrodes 4 are exposed.
[0018]
Therefore, it is possible to prevent the sealing resin 2 from contaminating the external electrodes 4 and the like in the electrode region, so that a serious defect that the organic EL display device cannot be driven without securing electrical conduction is caused. Disappears. That is, a highly reliable organic EL display device that ensures electrical continuity between the external electrodes and the external terminals can be manufactured. Therefore, in the display device 6 manufactured by the manufacturing method of the present invention, the connection between the external electrode 4 and the external terminal can be reliably performed.
[0019]
Further, when a plurality of display devices are manufactured from one substrate, that is, in the case of so-called multi-cavity (multi-cavity), diffusion of the sealing resin 2 is likely to occur due to a capillary phenomenon. Even if the resin 2 is diffused, the external electrode 4 is not contaminated, so that the quality of the organic EL display device can be improved and the yield can be improved. Therefore, the display device and the method of manufacturing the same according to the present invention are very effective in the case of performing multiple-panning.
[0020]
Note that, in the above-described embodiment, an example in which multiple display is performed is described. However, even when one display device is formed on one panel substrate, the display device of the present invention can be used similarly to the case of multiple display. And its manufacturing method can be applied.
[0021]
Next, the case of performing normal multi-cavity production will be described with reference to FIG.
[0022]
As shown in the plan view of FIG. 3A and the cross-sectional view taken along the line AA, usually, in the case of performing multi-cavity, the external electrode region E where the external electrode is formed is in one direction with respect to the light emitting region L. Often formed only. In this case, the external electrode region E where the external electrodes 4 of the plurality of organic EL display devices arranged in each row are formed as shown in FIG. Tape). Then, after the sealing substrate is attached via the sealing resin and unnecessary portions of the sealing substrate are removed, and the protective film 11 is peeled off, for example, as shown in FIG. After sticking the end of the protective film 11, each protective film 11 is peeled off from the panel substrate 1 by rolling the roller 21 in the direction of arrow A. Therefore, the protective film 11 does not need a strong adhesive force for peeling the external electrode 4 formed in the external electrode region E by this peeling operation. The protective film 11 has an adhesive force for preventing the sealing resin from entering between the external electrode 4 and the protective film 11 and an adhesive force for preventing the external electrode 4 from peeling when the protective film 11 is peeled off. What is necessary is just to have. When the adhesive substance of the protective film 11 has adhered to the external electrode 4, the adhesive substance may be removed by performing a cleaning step.
[0023]
As a result of removing the sealing resin 2 on the external electrodes 4, as shown in the plan view and the side view showing the sealing resin and the external electrodes in FIG. The external electrode region E (external electrode 4) is exposed in a state where the external electrode region E is covered with the stopper resin 2.
[0024]
【The invention's effect】
As described above, according to the method for manufacturing a display device of the present invention, since the protective film that covers the external electrodes of the panel substrate is formed before the panel substrate and the sealing substrate are bonded with the sealing resin, The film prevents the uncured sealing resin from contaminating the external electrodes. Therefore, it is possible to manufacture a highly reliable and high quality display device with high yield, in which conduction between the external electrode and the external terminal in the electrode region is secured. In addition, in the case of performing multi-cavity (multi-cavity), the manufacturing method of the present invention is very effective because the uncured sealing resin can reliably prevent contamination of the external electrodes with the uncured sealing resin.
[Brief description of the drawings]
FIGS. 1A and 1B are drawings showing one embodiment of a display device of the present invention, in which FIG. 1A is a plan view showing a panel substrate and a protective film, and FIG. It is a drawing explaining a pasting state, and (c) is a layout figure showing the state where a sealing substrate was pasted via a sealing resin.
FIG. 2 is a plan view showing an organic EL display device cut out individually.
FIG. 3 is a diagram illustrating a method of attaching and removing a protective film in the case of multi-cavity production.
4A and 4B are diagrams illustrating a configuration example of a conventional organic EL display device, wherein FIG. 4A is a plan layout view and FIG. 4B is a side view.
5A and 5B are diagrams schematically illustrating an organic EL display device and a method of manufacturing the same in a conventional multi-panel layout, in which FIG. 5A is a plan layout diagram illustrating an arrangement on a panel substrate, and FIG. It is sectional drawing explaining the sealing process which sticks a sealing substrate via a sealing resin, and (c) is a plane layout drawing explaining the state of a sealing resin.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Panel board, 2 ... Sealing resin, 2 ... Sealing substrate, 4 ... External electrode, 11 ... Protective film

Claims (1)

発光素子および該発光素子を駆動する駆動電極が設けられ、前記発光素子と前記駆動電極とによって発光領域と外部電極とが形成されたパネル基板と、封止基板とを封止樹脂を介して貼り合わせる表示装置の製造方法であって、
前記パネル基板に前記外部電極を形成した後で前記封止基板を貼り合わせる前に、前記外部電極を被覆する保護膜を形成する工程と、
前記パネル基板と前記封止基板とを前記封止樹脂を介して貼り合わせた後に前記保護膜とともに前記保護膜に付着した前記封止樹脂を除去して前記外部電極を露出させる工程と
を備えたことを特徴とする表示装置の製造方法。A light emitting element and a driving electrode for driving the light emitting element are provided, and a panel substrate on which a light emitting region and an external electrode are formed by the light emitting element and the driving electrode is bonded to a sealing substrate with a sealing resin interposed therebetween. A method for manufacturing a display device to be combined,
Before bonding the sealing substrate after forming the external electrodes on the panel substrate, forming a protective film covering the external electrodes;
Removing the sealing resin attached to the protective film together with the protective film after bonding the panel substrate and the sealing substrate via the sealing resin to expose the external electrodes. A method for manufacturing a display device, comprising:
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234332A (en) * 2006-02-28 2007-09-13 Tohoku Pioneer Corp Method of manufacturing self-luminous panel and self-luminous panel
JP2008010221A (en) * 2006-06-28 2008-01-17 Dainippon Screen Mfg Co Ltd Tape peeling device, application system, and tape peeling method
KR101311850B1 (en) * 2011-12-09 2013-09-27 주식회사 탑 엔지니어링 Sealing apparatus for manufacturing flat panel display
JP2013225279A (en) * 2012-04-19 2013-10-31 Samsung Electro-Mechanics Co Ltd Touch panel and method for manufacturing the same
US8698978B2 (en) 2004-06-11 2014-04-15 Mflex Uk Limited Electroluminescent displays
US8698979B2 (en) 2004-06-11 2014-04-15 Mflex Uk Limited Electroluminescent displays
JP2021057198A (en) * 2019-09-30 2021-04-08 シチズンファインデバイス株式会社 Method for manufacturing organic el element

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8698978B2 (en) 2004-06-11 2014-04-15 Mflex Uk Limited Electroluminescent displays
US8698979B2 (en) 2004-06-11 2014-04-15 Mflex Uk Limited Electroluminescent displays
JP2007234332A (en) * 2006-02-28 2007-09-13 Tohoku Pioneer Corp Method of manufacturing self-luminous panel and self-luminous panel
JP2008010221A (en) * 2006-06-28 2008-01-17 Dainippon Screen Mfg Co Ltd Tape peeling device, application system, and tape peeling method
KR101311850B1 (en) * 2011-12-09 2013-09-27 주식회사 탑 엔지니어링 Sealing apparatus for manufacturing flat panel display
JP2013225279A (en) * 2012-04-19 2013-10-31 Samsung Electro-Mechanics Co Ltd Touch panel and method for manufacturing the same
JP2021057198A (en) * 2019-09-30 2021-04-08 シチズンファインデバイス株式会社 Method for manufacturing organic el element
JP7324676B2 (en) 2019-09-30 2023-08-10 シチズンファインデバイス株式会社 Method for manufacturing organic EL element

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