JP2001223079A - Organic el display element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To aim at a reduction of power consumption by lowering wiring resistance, while raising a flexibility of design. SOLUTION: On the substrate 3 which has a light permeability and an insulation characteristic, an anode 4 of a transparent electric conduction film which has a lead part 4a at one part of each segment a-g corresponding to forms of display segments 2A, 2B, is formed. On the anode 4, the display segments 2A, 2B are formed and an insulation layer 5 which has an opening in one part of the lead part 4a, is formed. On the insulated layer 5, an organic layer 6 which consists of organic compound material is formed at a part except for the part of the lead part 4a exposed from the insulated layer 5. On the organic layer 6, a cathode 7 of a metal film is formed at a part except for the part of the lead part 4a exposed from the organic layer 6. On a substrate 11 which has an insulation characteristic, circuit pattern 12 is formed for every segment a-g in which the display segments 2A and 2B are common. The substrate 3 and the substrate 11 are sealed up at a perimeter portion by a sealing agent 14, sp that the lead part 4a of the anode 4 and the wiring pattern 12 can be connected through a connection part 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic electroluminescent display device (hereinafter referred to as an organic EL device) which is laminated so that a thin film of an organic compound material is sandwiched between a pair of electrodes (anode and cathode) at least one of which is a transparent electrode. Display element).

[0002]

2. Description of the Related Art An organic EL display device has a laminated structure in which a thin film containing a fluorescent organic compound is sandwiched between an anode and a cathode forming a pair of electrodes, and holes and electrons are injected into the thin film. The exciton is generated by the recombination, and light is emitted when this exciton is deactivated (fluorescence / phosphorescence).
Is a display element that performs display by utilizing the above.

FIG. 6A is a plan view showing an example of a wiring structure in a conventional organic EL display element of this kind, and FIG.
FIG. 7 is a partially enlarged sectional view of FIG.

[0006] As shown in FIG. 6A, an organic EL display element 31 has a fixed display segment 32 (32A, 32A, 32 g) composed of seven segments a to g of two-digit date characters for displaying alphanumeric characters.
32B).

As shown in FIGS. 6A and 6B, the organic E
The L display element 31 is based on a glass substrate 33 having insulation and transparency. On this glass substrate 33, ITO (Ind) which is a composite oxide of indium oxide and tin is used.
The transparent conductive film made of ium Tin Oxide) is used to fix the segments a, b, c, d, e, and the fixed display segments 32A and 32B.
Films are formed on the glass substrate 33 corresponding to the shapes of f and g,
An anode 34 is formed.

In each anode 34, a wiring pattern 35 is individually drawn out for each of the segments a to g of the fixed display segments 32A and 32B of each digit, and for example, as shown in segments a and a, segments b and b, In the state where the same segments are connected together, they are drawn out to the connection terminal portion 36 at the end of the glass substrate 33 (the right end in FIG. 6A).

On the anode 34, an opening is formed to form the segments a to g of the fixed display segments 32A and 32B of each digit, and an insulating layer 37 is formed so as to cover other portions.

On the insulating layer 37, an organic layer 38 including a light emitting layer made of a thin film of an organic compound material is laminated. On the organic layer 37, the fixed display segments 32A of each digit,
A metal thin film of, for example, Al is formed in a rectangular shape so as to cover 32 </ b> B to form the cathode 39.

In the organic EL display element 31 configured as described above, a selection signal is input to the cathode 39 and the digit of the fixed display segment 32 is selected.
The display signal is input to the fourth segments a to g. For example, in FIG. 6A, the fixed display segment 32B of the right digit
In the case where the number 1 is displayed, a selection signal is input to the cathode 39 of the fixed display segment 32B of the right digit,
A display signal is input to the segments a and b of the anode 34. Light emission at this time is observed from outside the glass substrate 33 via the anode 34 made of a transparent conductive film.

[0010]

As described above, FIG.
In the conventional wiring structure as shown in FIGS. 3A and 3B, since the display is directly observed through the glass substrate 33, the anode 34 of each fixed display segment 32A, 32B, the wiring pattern 35 and the connection terminal portion 36 are formed. A transparent conductive film made of ITO is used as the material, and the wiring patterns 35 and the connection terminal portions 36 are formed as thin films on the same plane as the glass substrate 33 on which the fixed display segments 32A and 32B are formed.

Therefore, in the conventional organic EL display element 31 shown in FIG. 6, the connection of the wiring pattern 35 drawn from the anode 34 (including the cathode 39) to the connection terminal portion 36 at the end of the glass substrate 33 is fixed. 32A, 3
The wiring is performed on the same plane as the glass substrate 33 on which the 2B is formed, and wiring is performed on the same plane on one glass substrate 33. Therefore, wiring is performed avoiding the segments a to g of the fixed display segments 32A and 32B. The pattern 35 must be routed, and the light emitting region and the different wiring pattern cannot cross each other. As a result, the number of segments and the number of digits of the fixed display segments 32 formed on the same glass substrate 33, the width and length of the wiring, and the like are limited, and there is a problem that there is no freedom in design.

The fixed display segment 32 shown in FIG.
Is composed of a day character segment. For example, when the segment becomes fine like an alphanumeric segment and its wiring pattern becomes fine, FIG.
In the conventional wiring structure as shown in FIG. 1, since ITO having a large specific resistance is used as the material of the wiring pattern 35, the overall wiring resistance is increased, and the current-driven organic EL is used.
However, there is a problem that power consumption increases.

Therefore, the present invention has been made in view of the above-mentioned problems, and the degree of freedom in designing a wiring is increased.
It is an object of the present invention to provide an organic EL display element that can reduce power consumption by reducing wiring resistance.

[0014]

In order to achieve the above object, a first aspect of the present invention is a first aspect of the present invention, which has a light transmitting and insulating property.
A first electrode comprising a substrate, a transparent electrode formed on the first substrate having a lead-out portion in a part of each of the display segments according to the shape of the display segment, and forming the display segment. An insulating layer having an opening in a part of the lead portion and formed on the first electrode; and a light emitting layer formed on the insulating layer except for the lead portion exposed from the insulating layer. An organic layer made of an organic compound material including: a second electrode made of a metal electrode formed on the organic layer except for the lead-out portion exposed from the organic layer; and a second substrate having an insulating property. A wiring pattern formed on the second substrate for each common segment of the segments, and a connecting portion made of a conductive material connecting between the corresponding wiring pattern and the lead-out portion of the first electrode When Characterized by comprising.

According to a second aspect of the present invention, the first substrate having an insulating property and a lead-out portion in each segment of the display segment according to the shape of the display segment.
A first electrode formed of a metal electrode formed on a substrate, an insulating layer formed on the first electrode, forming the display segment, having an opening in a part of the lead-out portion, and the insulating layer An organic layer made of an organic compound material including a light emitting layer formed on the insulating layer except for the derived portion exposed from the organic layer; and formed on the organic layer except for the derived portion exposed from the organic layer. Of a transparent electrode
An electrode, a light-transmitting and insulating second substrate, a wiring pattern formed of a transparent conductive film formed on the second substrate for each common segment of the segments, and the corresponding wiring pattern. A connection portion made of a conductive material for connecting the first electrode to the lead-out portion.

According to a third aspect of the present invention, in the organic EL display element of the first aspect, the wiring pattern is made of a transparent conductive film or a metal film.

[0017]

1 (a) to 1 (e) are views showing a first embodiment of an organic EL display device according to the present invention.
FIG. 2 is an explanatory view of a manufacturing process procedure, and FIG.
It is an A line expanded sectional view.

The organic EL display device according to the present invention has a substrate (second substrate) on which a wiring pattern is formed separately from a substrate (first substrate) on which display segments (which may include a part of wiring) are formed. And connecting between each display segment and the wiring pattern via a connecting portion made of a conductive material, and sealing the outer peripheral portion between both substrates with a sealing material to complete the display. .

Hereinafter, a specific configuration of the organic EL display element according to the first embodiment will be described along a procedure of a manufacturing process with reference to FIGS.

As shown in FIG. 1, an organic EL display element 1
(1A) is a two-digit fixed display segment 2 in the form of a date character.
(2A, 2B). Each fixed display segment 2
A and 2B are composed of seven segments a, b, c, d, e, f and g for displaying alphanumeric characters.

As shown in FIGS. 1 and 2, the organic EL display element 1A is based on a light-transmitting and insulating substrate (first substrate) 3 such as glass. First, an anode 4 as a first electrode is formed on a substrate 3 by PVD (Pysical Vapor Deposition) such as a resistance heating evaporation method, an electron beam evaporation method, and a sputtering method.
), A fixed display segment 2 is formed by etching using a photolithography method.
A pattern is formed according to the shape of each of the segments a to g of A and 2B.

That is, as shown in FIG. 1A, the segments a to g of the fixed display segments 2A and 2B of the respective digits.
And lead-out portions (wirings for signal supply) 4a (4aa, 4ab, 4ac) for making connections between the wirings 12 (12a) formed on a substrate (second substrate) 11 to be described later. The anode 4 is patterned.

In the example of FIG. 1A, the segments a, d,
g has a derived portion 4aa on the right side of the segment b, c has a derived portion 4ab on the right side from the lower portion thereof, and has a derived portion 4ac on the right side of the upper portion of the segments e and f,
Segment a to fixed display segment 2A, 2B of each digit
The anode 4 corresponding to the shape of g is patterned.

As a material of the anode 4, a conductive material (a material having a large work function) having a higher resistivity than a material of a cathode 7 as a second electrode described later is used. Specifically, IT
IDIXO which is a transparent conductive film made of O or ZnO or an amorphous transparent conductive film (trade name: Idemitsu transparent transparent conductive material, Idem
itsu Indium X-Metal Oxide, a composite oxide of indium oxide and zinc oxide) and the like can be used.

The anode 4 of each fixed display segment 2A, 2B
When the lead portion 4a is formed, as shown in FIG. 1B, each segment a of the fixed display segments 2A and 2B
~ G with an opening to form
An insulating layer 5 is formed so as to have an opening (a circular opening in the example of FIG. 1B) in a part of aa to 4ac and cover the other part. The insulating layer 5 is made of, for example, photosensitive polyimide, SiO
₂ , made of a material such as SiN. The insulating layer 5 is formed by coating the above-mentioned material with a thickness of, for example, about 1 μm by using a method such as a spin coating method, a vapor deposition method, or a sputtering method.
The film is formed so as to cover the entire edge portion of ａｃ4ac.

After that, after the substrate 3 is treated with, for example, O ₂ plasma or the like, the lead portion 4aa exposed from the insulating layer 5
Except for 4ac, a thin organic layer 6 is formed by vapor deposition from above the exposed portion of the anode 4 by, for example, a mask vapor deposition method. The organic layer 6 is formed as a single layer or a multilayer including at least a light emitting layer. When the organic layer 6 is configured as a multilayer, there is a combination of a light emitting layer and a charge transport layer (a hole transport layer, a hole injection transport layer, an electron injection layer, an electron injection transport layer, etc.). For example, a TPD organic film as a hole injection / transport layer formed on the anode 4, an Alq organic film as a light emitting layer formed on the TPD organic film, and an electron formed on the Alq organic film There is a three-layer structure of LiF as an injection layer.

It is sufficient that the organic layer 6 is formed at least in a region covering the segments a to g of the fixed display segments 2A and 2B, and it is not necessary to form the pattern particularly in the shape of the segments a to g. Absent.

Next, as shown by the broken lines in FIG. 1C, the organic layers laminated on the anode 4 except for the exposed portions 4aa to 4ac of the segments a to g of the fixed display segments 2A and 2B are exposed. A cathode 7 as a second electrode is formed on the layer 6 for each of the fixed display segments 2A and 2B. FIG.
The cathode 7 in the example of (c) includes the fixed display segments 2A and 2A.
It is formed in a rectangular shape for each B. The cathode 7 is made of a material having a small work function, for example, a simple metal such as Al, Li, Na, Mg, Ca, or a compound thereof, or Al: Li, Al: A.
g, Ag: Various alloys such as Mg are used. The cathode 7 is
The organic layer 6 is formed on the organic layer 6 so as to sandwich the organic layer 6 with the anode 4. As a result, an element is formed on the substrate 3, and the portion of the organic layer 6 sandwiched between the pair of electrodes 4 of the anode 4 and the cathode 7 becomes a light emitting area of the fixed display segments 2A and 2B of each digit.

The electrical isolation between the anode 4 and the cathode 7 may be made by any method such as a normal mask vapor deposition method or a previously formed insulating rib.

Separately from the above processing, a wiring pattern 12 is formed on a substrate (second substrate) 11 made of glass, resin, or the like having an insulating property by a mask vapor deposition method, a photolithography method, a printing method, or the like. As a material of the wiring pattern 12, a transparent conductive film such as ITO or a metal such as Al, Au, Cu, Ag, or Ni can be used. For example, Al can be used when the wiring pattern 12 is formed as a thin film by a photolithography method, and A is used when the wiring pattern 12 is formed as a thick film by a printing method.
g paste can be used.

The wiring pattern 12 in the example of FIG.
Are seven anode wirings 12a connected to the common anode 4 of each of the segments a to g of the fixed display segments 2A and 2B of the substrate 3, and the cathodes of the fixed display segments 2A and 2B of each digit of the substrate 3. 7, two cathode wires 12b connected to the wires 7, and seven anode connection terminal portions 12c and two cathode wires formed at the end of the substrate 11 so as to be connected to the ends of the wires 12a and 12b. It is composed of a total of nine connection terminal portions 12 d of connection terminal portions. Further, the terminal portion 12aa of the anode wiring 12a at a position corresponding to the lead portion 4a of each of the segments a to g of the fixed display segments 2A and 2B of the substrate 3 is formed to have a slightly larger area than the lead portion 4a. FIG.
In the example of (d), it is formed in a circular shape having a larger diameter than the lead-out portion 4a.

Next, as shown in FIG. 2, a columnar (for example, columnar) connecting portion (bump) 13 is formed on the terminal portion 12aa of each anode wiring 12a by a printing method or the like. Connecting part 1
Reference numeral 3 is made of a conductive material in which a metal such as Ag, Au, or C is dispersed in an organic material, and is formed at a height of about 5 μm to 1 mm.

After the above processing, as shown in FIG. 2, the connecting portions 13 on the terminal portions 12aa of the anode wirings 12a of the substrate 11 are fixed to the fixed display segments 2A, 2B of the substrate 3.
In order to prevent the element surface from being exposed to the air in a state where it is positioned so as to be located at the leading portions 4aa to 4ac of the respective segments a to g, a dry atmosphere (for example, dry nitrogen or dry air) from which moisture has been sufficiently removed. 2), the outer peripheral portions of the substrate 3 and the substrate 11 are sealed and sealed with a sealing material 14 such as an epoxy resin to form an envelope 15 in which elements are protected. As a result, the fixed display segments 2A, 2A of the substrate 3
The anodes 4 of the segments a to g of B are connected to the corresponding anode wirings 12a of the substrate 11 via the connection portions 13, and the cathodes 7 of the fixed display segments 2A and 2B of each digit are connected to the substrate 11. The wiring is connected to each cathode wiring 12b. Although not shown, the connection terminals 12c and 12d of the substrate 11 wired and connected as described above are connected to a driver IC (a constant current drive circuit or the like). Thus, the manufacturing process of the organic EL display element 1A is completed.

Next, FIGS. 3A to 3E are views showing a second embodiment of the organic EL display device according to the present invention, and are explanatory views of a manufacturing process procedure, and FIG. 4 is a view showing FIG. BB in
It is a line expanded sectional view.

Hereinafter, a specific configuration of the organic EL display device according to the second embodiment will be described along the procedure of the manufacturing process with reference to FIGS. Note that the same components as those of the organic EL display element of the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 3 (a), first, an anode 4 as a first electrode is formed on a substrate 3 by PVD by each of the segments a to g of the fixed display segments 2A and 2B of each digit.
Lead-out portion 4a for making a connection between the substrate and a wiring 12a for each anode formed on a substrate (second substrate) 11, which will be described later.
The anode 4 is patterned so as to have (4aa, 4ab, 4ac). At this time, the anode connection terminal portion 12c of the wiring pattern 12 is formed using the same material and method as the anode 4.
Are also formed on the substrate 3 together.

When the anode 4, the lead portions 4aa to 4ac, and the connection terminals 12c and 12d of the wiring pattern 12 of the fixed display segments 2A and 2B are formed, the fixed display segments 2A are formed as shown in FIG. , 2B, and has an opening in a part of each of the lead-out portions 4aa to 4ac and covers the other portions (excluding the connection terminal portions 12c and 12d). 5 is formed.

Thereafter, the substrate 3 is treated with, for example, O ₂ plasma or the like, and the lead portions 4aa to 4aa exposed from the insulating layer 5 are processed.
excluding the ac and the connection terminal portions 12c and 12d,
A thin organic layer 6 is formed by vapor deposition with a predetermined thickness by, for example, a mask vapor deposition method from above the exposed portion.

Next, as shown by the broken lines in FIG. 3C, the organic layers stacked on the anode 4 except for the exposed portions 4aa to 4ac of the segments a to g of the fixed display segments 2A and 2B. A cathode 7 as a second electrode is formed on the layer 6 for each of the fixed display segments 2A and 2B. At this time, each of the cathodes 7, 2
The cathode wiring 12b and the cathode connection terminal 12d are formed together.

The above-described anode connection terminal portion 12c
Can be formed by the same material and method as the cathode 7 when forming the cathode 7.

Separately from the above processing, a wiring pattern 12 is formed on a substrate (second substrate) 11 made of glass, resin, or the like having an insulating property by a mask evaporation method, a photolithography method, a printing method, or the like. The wiring pattern 12 formed on the substrate 11
As shown in FIG. 3D, the common anode 4 of the segments a to g of the fixed display segments 2A and 2B of the substrate 3 is
Anode wires 12a (terminal portions 12)
aa). Then, a columnar connecting portion (bump) 13 is formed on the terminal portion 12aa of each anode wiring 12a by a printing method or the like.

After the above-described processing, the connection terminal portions 12c of the substrate 11 and the connecting portions 13 on the anode wires 12a are connected to the leading portions 4aa of the fixed display segments 2A and 2B of the substrate 3 from the respective segments a to g. In order to prevent the element surface from being exposed to the atmosphere, the outer periphery of the substrate 3 and the substrate 11 in a dry atmosphere (for example, dry nitrogen or dry air) from which moisture has been sufficiently removed to prevent the element surface from being exposed to the air. The portion is sealed and sealed with a sealing material 14 such as an epoxy resin to form an envelope 15 in which the element is protected. Thus, the anodes 4 of the segments a to g of the fixed display segments 2 </ b> A and 2 </ b> B of the substrate 3 are connected to the corresponding anode wirings 12 a of the substrate 11 via the connection portions 13. And
Although not shown, the substrate 11 wired and connected as described above
Are connected to a driver IC (constant current drive circuit or the like). As described above, the organic EL
The manufacturing process of the display element 1B is completed.

As described above, the organic EL display element 1 of this embodiment
A and 1B are a substrate 3 on which an element having the fixed display segment 2 (2A, 2B) (including the cathode wiring 12b in the configuration of FIGS. 3 and 4) and a substrate 11 on which the wiring pattern 12 is formed. Are separated to form a multilayer substrate structure, and the connection between the electrodes (anode 4 and / or cathode 7) of each fixed display segment 2 and the wiring pattern 12 is performed via a connection portion 13 made of a conductive material. is there.

Therefore, since the element and the wiring pattern can be formed on separate substrates, it is possible to cope with wiring of a fine pattern, a continuous pattern, and a special pattern, and it is possible to design more freely than the conventional wiring structure shown in FIG. The degree improves.

In particular, it is possible to easily cope with wiring of a special pattern, which is difficult to realize with the conventional wiring structure. For example, when a frame portion and a number (or a character) are separately displayed in a display segment of a framed number (or a character with a frame), wiring of the frame portion and wiring of a number (or a character) can be easily performed.

In this example, the display is observed from outside the substrate 3 on which the fixed display segment 2 is formed, and the display is not observed from outside the substrate 11 on which the wiring pattern 12 is formed. ITO as 12 materials
However, the present invention is not limited to such a transparent conductive film, and a metal material such as Al can be used.

In forming the envelope 15 for protecting the element, since the substrate 11 on which the wiring pattern 12 is formed constitutes a part of the envelope 15, a sealing member (made of metal, resin, or the like) is used. There is no need to provide a separate sealing cap)
The number of components can be reduced, and the configuration can be simplified.

As shown in FIG. 5A, not only the element 1 but also components such as a driver IC 21 and a switch 22 which are element driving circuits can be mounted together on one substrate 3. . Further, by the configuration in which the substrate 3 on which the element 1 is formed and the substrate 11 on which the wiring pattern 12 is formed are separated, a plurality of elements 1 are formed on the substrate 3 as shown in FIG. It is also possible to form a wiring pattern of each element 1 on the side, and connect the wiring between each element and the wiring pattern by a connecting portion made of a conductive material. Thereby, CIG (chip-in-glass) and COG
(Chip on glass) can be easily manufactured.

In particular, according to the organic EL display element 1A of the first embodiment shown in FIGS. 1 and 2, the wiring pattern 12 (wiring 12) is formed on a substrate 11 other than the substrate 3 on which the element is formed.
Since only a and 12b and the connection terminal portions 12c and 12d) are formed, elements can be formed on the substrate 3 by thin-film printing, and the wiring pattern 12 can be formed on the substrate 11 by thick-film printing.

In the above embodiment, the anode 4 formed on the substrate 3 is a transparent electrode. However, the anode 4 and the cathode 7 may be reversed. That is, the electrode formed on the side of the insulating substrate 3 is the cathode 7 made of a metal electrode, and the electrode formed on the side of the second substrate 11 having the light transmitting and insulating properties is the anode 4 made of the transparent conductive film. . In this case, the display is observed from outside the substrate 11 and the wiring pattern 12 is formed of a transparent conductive film such as ITO. Is formed thick, wiring resistance is low and power consumption can be reduced.

In the above embodiment, the lead portion 4a for each of the segments a to g and the terminal portion 1 of the wiring pattern 12 are provided.
A connecting portion 13 for conducting connection between the first substrate 3 and the second substrate 11a is formed on both sides of the first substrate 3 and the second substrate by printing or the like. 13 may be obtained.

In the above-described embodiment, the structure in which the two substrates 3 and 11 including the substrate 3 on which the fixed display segment 2 is formed and the substrate 11 on which the wiring pattern 12 is formed has been described. A multilayer substrate structure in which a plurality of substrates on which a wiring pattern is formed may be further stacked. In this case, the wiring pattern from the lower substrate is pulled out to the surface of the upper substrate via through holes and the end face of the substrate, and thereafter, through the connecting portion by the same configuration as in each of the above-described embodiments. The wiring patterns can be connected between the upper and lower substrates.

[0053]

As is clear from the above description, according to the organic EL display element of the present invention, the element and the wiring pattern can be formed on separate substrates, so that a fine pattern, a continuous pattern and a special pattern can be formed. Wiring can be supported, and the degree of freedom in design is improved as compared with the conventional wiring structure. In particular, it is possible to easily cope with wiring of a special pattern, which is difficult to realize with a conventional wiring structure.

According to the organic EL display device of the first aspect, the display is observed from the outside of the first substrate on which the display segments are formed, and the display is observed from the outside of the second substrate on which the wiring pattern is formed. Since it is not performed, the conventional I
It is not limited to a transparent conductive film such as TO, and a metal material such as Al can be used as a material for the wiring pattern.

Further, since the first substrate on which the elements are formed and the second substrate on which the wiring pattern is formed are separated, a plurality of elements are formed on the first substrate side, and each element is formed on the second substrate side. If a wiring pattern is formed and each element and the wiring pattern are connected to each other by a connecting portion made of a conductive material, CIG (chip-in-glass) or COG (chip-on-glass) can be easily manufactured. It is possible.

According to the organic EL display element of the second aspect, the display is observed from the outside of the second substrate on which the wiring pattern is formed, and the wiring pattern is formed of a transparent conductive film such as ITO. If the width of the wiring pattern made of a transparent conductive film such as ITO is made large, wiring resistance is low and power consumption can be reduced.

[Brief description of the drawings]

FIGS. 1A to 1E are diagrams showing a first embodiment of an organic EL display device according to the present invention, and are explanatory views of a manufacturing process procedure.

FIG. 2 is an enlarged sectional view taken along line AA in FIG. 1 (e).

FIGS. 3A to 3E are views showing a second embodiment of the organic EL display device according to the present invention, and are explanatory views of a manufacturing process procedure.

FIG. 4 is an enlarged sectional view taken along line BB in FIG. 3 (e).

FIGS. 5A and 5B are simplified diagrams showing application examples of the organic EL display device according to the present invention.

6A is a plan view showing an example of a wiring structure in a conventional organic EL display element. FIG. 6B is a partially enlarged sectional view of FIG.

[Explanation of symbols]

1 (1A, 1B): Organic EL display element, 2 (2A, 2)
B) ... fixed display segment (display segment), a to g
... Segment, 3 ... Substrate (first substrate), 4 ... Anode (first
Electrodes), 5: insulating layer, 6: organic layer, 7: cathode (second electrode), 11: substrate (second substrate), 12: wiring pattern,
12a: Anode wiring, 12aa: Terminal section, 12b: Cathode wiring, 12c: Anode connection terminal section, 12d: Cathode connection terminal section, 13: Connection section, 14: Sealing material, 15: Envelope.

Claims (3)

[Claims] A first substrate having a light-transmitting property and an insulating property; and a lead-out portion formed on a part of each of the display segments according to a shape of the display segment. A first electrode formed of a transparent electrode, the insulating layer formed on the first electrode having an opening in a part of the lead-out portion, the lead-out portion being exposed from the insulating layer. An organic layer made of an organic compound material including a light emitting layer formed on the insulating layer except for a portion, and a metal electrode formed on the organic layer except for the lead-out portion exposed from the organic layer. A second electrode having an insulating property; a second substrate having an insulating property; a wiring pattern formed on the second substrate for each common segment of the segments; and a corresponding one of the wiring pattern and the first electrode. Derived The organic EL display device is characterized in that a connecting portion made of a conductive material for connecting a minute. 2. A display device comprising: a first substrate having an insulating property; and a metal electrode formed on the first substrate having a lead-out portion in each part of the display segment according to the shape of the display segment. A first electrode that forms the display segment, an insulating layer formed on the first electrode with an opening in a part of the lead portion, and the lead portion exposed from the insulating layer, An organic layer formed of an organic compound material including a light emitting layer formed on the insulating layer; and a second electrode formed of a transparent electrode formed on the organic layer except for the lead-out portion exposed from the organic layer. A second substrate having a light-transmitting property and an insulating property; a wiring pattern formed of a transparent conductive film formed on the second substrate for each common segment of the segments; The organic EL display device is characterized in that a connecting portion made of a conductive material for connecting between the derived portions of the first electrode. 3. The organic EL display device according to claim 1, wherein the wiring pattern is made of a transparent conductive film or a metal film.