KR100661161B1 - Organic electro luminescent emitting device and the method for manufacturing the same - Google Patents

Abstract

An OLED and a manufacturing method thereof are provided to reduce power consumption and a driving voltage by reducing resistance of an electric wire by depositing a low-resistive material on a second wire pattern. A substrate(300) is divided into a light emitting portion and a pad portion. First electrodes(310) are arranged in one direction on the light emitting portion of the substrate. An insulation layer pattern(340) is formed in a lattice shape on the first electrode and the substrate, so that plural pixel openings are defined on the first electrode. A barrier rib layer(360) is formed on the insulation layer pattern, which orthogonally crosses the first electrode. An organic film layer is formed on temperature pixel opening. A second electrode(380) is arranged to be normal to the first electrode on the light emitting portion. A first electric wire pattern(320) is formed to be connected to the first electrode on the pad portion. A second electric wire pattern(390) is simultaneously deposited with the second electrode on the pad portion. A barrier film(365) is formed between the second electric wire patterns.

Description

Organic electroluminescent device and its manufacturing method {Organic electro luminescent emitting device and the method for manufacturing the same}

1 is a view showing a part of an organic EL device according to the prior art.

2 is a view showing a part of an organic EL device according to the present invention.

3 to 9 are diagrams for explaining a method of manufacturing an organic EL device according to a first embodiment of the present invention.

10 to 13 illustrate a method of manufacturing an organic EL device according to a second embodiment of the present invention.

14 to 20 are views illustrating a method of manufacturing an organic electroluminescent device according to a third embodiment of the present invention.

21 to 26 illustrate a method of manufacturing an organic EL device according to a fourth embodiment of the present invention.

The present invention relates to an organic electroluminescent device, and more particularly, to an organic electroluminescent device capable of lowering the resistance of a wiring pattern and a method of manufacturing the same.

In general, an organic electroluminescent device (OLED) is one of the flat panel display devices, and is formed through an organic thin film layer, which is an organic electroluminescent layer, between an anode layer and a cathode layer on a wafer. It forms a very thin matrix.

The organic EL device can be driven at a low voltage, and has advantages such as thinness. In addition, it is possible to solve the drawbacks that have been conventionally pointed out as problems with LCDs such as narrow viewing angles and slow response speeds, and compared with other types of displays, in particular, equal to or less than other displays such as 'TFT LCD' in the medium and below. In addition to having the above image quality, it is attracting attention as a next-generation flat panel display from the simple manufacturing process.

1 is a view showing a part of an organic EL device according to the prior art.

Referring to FIG. 1, in a conventional organic electroluminescent device, a plurality of organic light emitting devices are arranged in parallel in a stripe shape on a light emitting portion A of a substrate 100 divided into a light emitting portion A and a pad portion B. FIG. The first electrode 110 is formed. In addition, on the first electrode 110, a plurality of second electrodes 120 arranged perpendicularly to the first electrode 110 are formed. As such, the pixel 130 of the organic light emitting diode is defined at a portion where the first electrode 110 and the second electrode 120 perpendicular to each other meet each other. An organic thin film layer 140 including an organic light emitting layer is formed between the first electrode 110 and the second electrode 120 on the pixel 130.

A plurality of wiring patterns 150 and 160 connected to the first electrode 110 and the second electrode 120 are formed on the pad part B of the substrate 100. The plurality of wiring patterns 150 and 160 are typically formed together with the first electrode 110, and may be made of a transparent conductive material such as indium tin oxide (ITO) like the first electrode 110. . In addition, when an auxiliary electrode (not shown) made of chromium or the like is formed on the predetermined region of the first electrode 110 to further lower its resistance, the wiring patterns 150 and 160 may be formed of the first electrode (not shown). 110 and the auxiliary electrode, and accordingly, ITO and chromium (Cr) may be sequentially stacked. Although not shown in the drawing, the pad is electrically connected to the first electrode 110, the second electrode 120, and the wiring patterns 150 and 160 on the pad portion B of the organic electroluminescent device thus formed. A tape carrier package (TCP) for driving an organic electroluminescent device by applying an electrical signal to the unit B is mounted.

However, as the resistance of the pad portion B wiring patterns 150 and 160 is lower, the voltage drop due to the wiring during the driving of the organic light emitting diode is reduced, and thus a device having a low driving voltage and power consumption can be manufactured. Accordingly, a method of lowering the resistance of the wiring patterns 150 and 160 is required.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide an organic electroluminescent device and a method of manufacturing the same, which can improve electrical characteristics of a device by configuring a low resistance wiring to reduce power consumption and driving voltage.

In order to achieve the above technical problem, the organic electroluminescent device according to the present invention, the substrate is divided into a light emitting portion and a pad portion; A first electrode arranged in one direction on the substrate of the light emitting part; An insulating layer pattern formed in a lattice form on the first electrode and the substrate to define a plurality of pixel openings on the first electrode; A barrier layer formed on the insulating layer pattern orthogonal to the first electrode; An organic thin film layer formed on the pixel opening; A second electrode formed on the organic thin film layer to be orthogonal to the first electrode; A first wiring pattern formed on the pad unit to be connected to the first electrode; A second wiring pattern formed on the substrate of the pad part to be connected to the second electrode and including a second electrode forming material; And a barrier film formed between the second wiring patterns.

In the present invention, the barrier layer may include a layer formed between the first wiring pattern and the second wiring pattern, respectively.

The barrier film formed between the second wiring patterns is preferably connected to the barrier layer.

The first wiring pattern may include a single layer structure of ITO or IZO or a lamination structure of ITO / chromium (Cr) or IZO / chromium (Cr).

The material for forming the second electrode preferably includes a metal material including aluminum (Al), copper (Cu), or silver (Ag) or an alloy thereof.

The second wiring pattern may include a laminated structure of ITO or IZO and a material for forming a second electrode.

The second wiring pattern may preferably include a laminated structure of ITO / chromium (Cr) or IZO / chromium (Cr) and a material for forming a second electrode.

The second wiring pattern may have a single layer structure of the material for forming the second electrode.

In order to achieve the above technical problem, a method of manufacturing an organic electroluminescent device according to a first embodiment of the present invention, the first electrode arranged in either direction on the light emitting portion of the substrate divided into a light emitting portion and a pad portion Forming; Forming a first wiring pattern on the pad portion of the substrate while forming the first electrode, the first wiring pattern comprising a first electrode forming material; Forming a second wiring pattern including a first electrode forming material on a pad portion of the substrate while forming the first electrode; Forming an insulating layer pattern on the first electrode and the substrate in a lattice form to define a plurality of pixel openings on the first electrode; Forming a barrier layer on the insulating layer pattern orthogonal to the first electrode; Forming a barrier film between the second wiring patterns while forming the barrier layer; Forming an organic thin film layer on the pixel opening; And forming a second electrode formation material on the second wiring pattern while forming a second electrode orthogonal to the first electrode on the organic thin film layer.

In order to achieve the above technical problem, a method of manufacturing an organic EL device according to a second embodiment of the present invention, the first electrode arranged in one direction on the light emitting portion of the substrate divided into a light emitting portion and a pad portion Forming; Forming a first wiring pattern on the pad portion of the substrate while forming the first electrode, the first wiring pattern comprising a first electrode forming material; Forming a second wiring pattern including a first electrode forming material on a pad portion of the substrate while forming the first electrode; Forming an insulating layer pattern on the first electrode and the substrate in a lattice form to define a plurality of pixel openings on the first electrode; Forming a barrier layer on the insulating layer pattern orthogonal to the first electrode; Forming a barrier layer between the first wiring pattern and the second wiring pattern while forming the barrier layer; Forming an organic thin film layer on the pixel opening; And forming a second electrode forming material on the first wiring pattern and the second wiring pattern while forming a second electrode orthogonal to the first electrode on the organic thin film layer.

In the present invention, the barrier film between the second wiring patterns is preferably connected to the barrier layer.

The first wiring pattern may be formed of a single layer structure of ITO or IZO or a stacked structure of ITO / chromium (Cr) or IZO / chromium (Cr).

The second electrode forming material preferably includes an electrode forming metal material or an alloy thereof including aluminum (Al), copper (Cu) or silver (Ag).

The second wiring pattern may include a stacked structure of ITO or IZO and a material for forming a second electrode.

The second wiring pattern may include a stacked structure of ITO / chromium (Cr) or IZO / chromium (Cr) and a material for forming a second electrode.

In order to achieve the above technical problem, a method of manufacturing an organic electroluminescent device according to a third embodiment of the present invention, the first electrode arranged in one direction on the light emitting portion of the substrate divided into a light emitting portion and a pad portion Forming;

Forming a first wiring pattern on the pad portion of the substrate while forming the first electrode, the first wiring pattern comprising a first electrode forming material; Forming an insulating layer pattern on the first electrode and the substrate in a lattice form to define a plurality of pixel openings on the first electrode; Forming a barrier layer on the insulating layer pattern orthogonal to the first electrode; Forming a barrier layer by expanding the pad part while forming the barrier layer; Forming an organic thin film layer on the pixel opening; Forming a mask layer pattern blocking the first wiring pattern; Forming a second wiring pattern by expanding and depositing a second electrode formation material between the barrier layers while forming a second electrode orthogonal to a first electrode on the organic thin film layer using the mask layer pattern. It features.

In order to achieve the above technical problem, the organic electroluminescent device manufacturing method according to the fourth embodiment of the present invention, the first electrode arranged in either direction on the light emitting portion of the substrate divided into a light emitting portion and a pad portion Forming; Forming an insulating layer pattern on the first electrode and the substrate in a lattice form to define a plurality of pixel openings on the first electrode; Forming a barrier layer on the insulating layer pattern orthogonal to the first electrode; Forming a barrier layer by expanding the pad part while forming the barrier layer; Forming an organic thin film layer on the pixel opening; Forming a first wiring pattern and a second wiring pattern by expanding and depositing a second electrode forming material between the barrier layers while forming a second electrode orthogonal to the first electrode on the organic thin film layer. do.

In the present invention, it is preferable that the second wiring pattern is connected to the second electrode, and the barrier film between the second wiring patterns is connected to the barrier layer.

The second electrode forming material may include an electrode forming metal material or alloy thereof including aluminum (Al), copper (Cu), or silver (Ag).

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Like parts are designated by like reference numerals throughout the specification.

2 is a view showing a part of an organic EL device according to the present invention. 3 to 9 are diagrams for explaining a method of manufacturing an organic EL device according to an embodiment of the present invention. In particular, FIG. 9 is a view showing a portion taken along the line II ′ of FIG. 8.

Referring to FIG. 2, the organic electroluminescent device according to the present invention includes any one of a substrate 300 divided into a light emitting portion A and a pad portion B, and a substrate 300 of the light emitting portion A. FIG. A first electrode 310 arranged in a direction and an insulating layer pattern 340 formed in a lattice form on the first electrode 310 and the substrate to define a plurality of pixel openings on the first electrode 310. And the partition layer 360 formed on the insulating layer pattern 340 orthogonal to the first electrode 310, the organic thin film layer (not shown) formed on the pixel opening, and the light emitting portion A. The second electrode 380 is arranged on the substrate 300 to be orthogonal to the first electrode 310, and is formed on the substrate 300 of the pad part B so as to be connected to the first electrode 310. The first wiring pattern 320 and the substrate 300 of the pad portion B are simultaneously deposited with the same material as the second electrode 380 and electrically connected to each other. The second comprises a wiring pattern 390 and second wiring pattern 390, the barrier film 365 formed between. The barrier layer 365 is connected to the barrier layer 360 formed on the light emitting portion A of the substrate 300.

In addition, although not shown in the drawings, the barrier layer 365 may further include a structure that is formed between the first wiring pattern 320 and the second wiring pattern 330, respectively.

Hereinafter, a method of manufacturing an organic EL device according to a first embodiment of the present invention will be described with reference to FIGS. 3 to 9.

First, referring to FIG. 3, a first electrode 310 is formed on the substrate 300 including the light emitting portion A and the pad portion B in parallel in one direction. Wiring patterns, for example, the first wiring pattern 320 and the second wiring pattern 330, for connecting to an external driving circuit to the pad portion A of the substrate 300 while forming the first electrode 310. To form. Here, the first wiring pattern 320 is connected to the first electrode 310, and the second wiring pattern 330 is connected to the second electrode formed thereafter.

The substrate 300 generally uses glass, and the first electrode 310 may be formed of a transparent conductive material including indium tin oxide (ITO) or indium zinc oxide (IZO). The first and second wiring patterns 320 and 330 may be formed together with the first electrode 310, and may be made of a transparent conductive material such as ITO, like the first electrode 310. In addition, an auxiliary material made of a material having low resistance and specific resistance, for example, chromium (Cr) or molybdenum (Mo), to selectively lower the resistance of the first electrode 310 on a predetermined region of the first electrode 310. In the case of forming an electrode (not shown), the first and second wiring patterns 320 and 330 are formed together with the first electrode 310 and the auxiliary electrode, and thus, ITO and chromium (Cr) or IZO. And chromium may be formed in a stacked structure.

Referring next to FIG. 4, an insulating layer pattern 340 defining a pixel opening 350 on the first electrode 310 by showing a lattice shape on the first electrode 310 of the substrate 300 in plan view. ). Here, the pixel opening 350 formed by the insulating layer pattern 340 defines the pixel formation region.

Next, referring to FIG. 5, after the negative type photosensitive film is laminated on the entire surface of the substrate 300 including the insulating layer pattern 340, the barrier layer 360 having a reverse slope may be exposed and developed. ). The partition layer 360 is arranged parallel to the first electrode 310 at regular intervals orthogonal to each other, and has an overhang structure so that the second electrode formed in a subsequent process does not short-circuit with an adjacent component.

As such, the barrier layer 365 is formed between the second wiring patterns 330 while the barrier layer 360 is formed on the entire surface of the substrate 300. In this case, the barrier layer 365 is preferably connected to the barrier layer 360. The barrier layer 365 is positioned between the second wiring patterns 330 formed on the pad part B to separate the second wiring patterns 330. In this case, the barrier film 365 may be formed of the same material as the barrier layer 360, for example, a negative photosensitive film.

Next, referring to FIG. 6, an organic thin film layer 370 including an organic emission layer or the like is formed on the pixel opening which is a pixel formation region. The organic thin film layer 370 has a structure in which a hole injection layer, a hole transport layer, an organic electroluminescent layer, and an electron transport layer are stacked on the pixel opening formed as the insulating layer pattern 340 on the first electrode 310, although not shown in the drawing. It can be formed as.

Next, referring to FIG. 7, a mask film pattern 375 is formed to block an area where the first wiring pattern 320 is formed on the pad part B. Referring to FIG. The mask layer pattern 375 may block the first wiring pattern (not shown) when the second electrode is deposited in a subsequent process.

8 and 9, a second electrode 380 orthogonal to the first electrode 310 is formed on the organic thin film layer 370. The second electrode 380 may be formed of an electrode forming metal material including aluminum (Al), copper (Cu), or silver (Ag) or an alloy thereof.

In this case, the second electrode 380 is formed on the organic thin film layer 370, and the second electrode forming material is extended and deposited on the pad portion B of the substrate 300. The second electrode forming material may be formed of an electrode forming metal material including aluminum (Al), copper (Cu) or silver (Ag) or an alloy thereof.

Then, the second wiring pattern 390 is formed of a structure in which a material for forming a second electrode is stacked on ITO or IZO, or on a structure in which ITO / Cr or IZO / Cr are sequentially stacked. The material for forming the second electrode may be formed of a deposited structure.

 As such, the material for forming the second electrode, for example, aluminum (Al) on the second wiring pattern 330 formed of the structures 330a and 330b in which ITO and chromium (Cr) or IZO and chromium are sequentially stacked. ), The resistance of the deposition region is about 8-10 times lower than that of the prior art, and the power consumption and driving voltage are lowered when the organic electroluminescent device is driven by connecting to an external driving circuit. Can be improved.

10 to 13 illustrate a method of manufacturing an organic EL device according to a second embodiment of the present invention. In particular, FIG. 13 is a view showing a portion cut out along the V-V 'axis.

First, as shown in FIGS. 3 and 4, the first electrode 310, the first wiring pattern 320, and the second wiring on the substrate 300 including the light emitting portion A and the pad portion B. Pattern 330 is formed. Next, a lattice-shaped insulating layer pattern 340 defining the pixel opening 350 is formed on the first electrode 310 of the substrate 300.

Next, referring to FIG. 10, after the photosensitive film is laminated on the entire surface of the substrate 300, the partition wall layer 360 having a reverse slope is formed by performing exposure and development. The partition layer 360 is arranged in parallel with a predetermined interval orthogonal to the first electrode 310 and has an overhang structure.

The barrier layer 365 is formed between the first wiring pattern 320 and the second wiring pattern 330 while forming the barrier layer 360. The barrier layer 365 prevents a short circuit between the first wiring pattern 320 and the second wiring pattern 330 when the material for forming the second electrode is subsequently deposited. In this case, the barrier layer 365 between the second wiring patterns 330 is preferably connected to the barrier layer 360. In addition, the barrier layer 365 between the first wiring patterns 320 may be connected to the barrier layer 360.

Next, referring to FIG. 11, an organic thin film layer 370 including an organic light emitting layer or the like is formed on the pixel opening.

Next, referring to FIGS. 12 and 13, a second electrode 380 orthogonal to the first electrode 310 is formed on the organic thin film layer 370. While forming the second electrode 380 on the organic thin film layer 370, the second electrode forming material is expanded and deposited on the pad portion B of the substrate 300 to form the second electrode on the pad portion B. The first wiring pattern 395 and the second wiring pattern 390 on which the forming materials are stacked are formed. The first wiring pattern 395 may include structures 320a and 320b in which ITO and chromium (Cr) or IZO and chromium are sequentially stacked. In this case, the material for forming the second electrode includes aluminum (Al), copper (Cu), or silver (Ag). In addition, the first wiring pattern 395 and the second wiring pattern 390 are separated by a barrier film 365 that is formed in advance, so that the first wiring pattern 395 and the second wiring pattern 390 can be deposited without using a mask when depositing the material for forming the second electrode. have.

 As described above, the first wiring pattern 395 and the second wiring formed of a structure in which a material for forming a second electrode is deposited on a wiring pattern in which ITO and chromium (Cr) or IZO and chromium are sequentially stacked. The pattern 390 may have a lower resistance, thereby connecting to an external driving circuit, thereby lowering power consumption and driving voltage when driving the organic light emitting diode, thereby improving electrical characteristics of the device.

14 to 20 are views illustrating a method of manufacturing an organic electroluminescent device according to a third embodiment of the present invention. In particular, FIG. 20 is a view illustrating a portion taken along the line X-X 'of FIG. 19.

First, referring to FIG. 14, a first electrode 410 is formed on the substrate 400 including the light emitting portion A and the pad portion B in parallel in one direction. While forming the first electrode 410, a wiring pattern, for example, a first wiring pattern 420, is formed on the pad portion B of the substrate 400 to be connected to an external driving circuit. The first wiring pattern 420 is connected to the first electrode 410.

The first electrode 410 may be formed of a transparent conductive material including ITO or IZO. The first wiring pattern 420 is formed together with the first electrode 410, and may be made of a transparent conductive material such as ITO, like the first electrode 410. In addition, an auxiliary material made of a material having low resistance and specific resistance, for example, chromium (Cr) or molybdenum (Mo), to selectively lower the resistance of the first electrode 410 on a predetermined region of the first electrode 410. An electrode (not shown) may be formed. In this case, the first wiring pattern 420 may be formed together with the first electrode 410 and the auxiliary electrode, and thus may also have a structure in which ITO and chromium (Cr) or IZO and chromium are sequentially stacked. Can be.

Meanwhile, in the pad part B, except for the region where the first wiring pattern 420 is formed, for example, the region where the second wiring pattern to be connected to the second electrode is to be formed is an electrode material for forming the second electrode. It can be formed together during deposition. This will be described later.

Next, referring to FIG. 15, a pixel opening on the first electrode 410 may be formed on the first electrode 410 disposed on the light emitting portion A of the substrate 400 in a planar view. An insulating layer pattern 440 defining 450 is formed. The pixel opening 450 formed in the insulating layer pattern 440 defines the pixel formation region.

Next, referring to FIG. 16, after the photosensitive film is stacked on the entire surface of the substrate 400 including the insulating layer pattern 440, the partition layer 460 having the reverse slope is formed by performing exposure and development. The partition layer 460 is arranged to be parallel to the first electrode 410 at regular intervals orthogonal to each other, and has an overhang structure so that the second electrode formed in a subsequent process is not short-circuited with adjacent components.

At this time, the barrier layer 465 is formed by extending the pad portion B while forming the barrier layer 460. In this case, the barrier layer 465 is preferably connected to the barrier layer 460. The barrier layer 465 is disposed between the second wiring patterns to be formed later, and serves to separate the second wiring patterns. In this case, the barrier layer 465 may be formed of the same material as the barrier layer 460, for example, a negative photosensitive layer.

Next, referring to FIG. 17, an organic thin film layer 470 including an organic emission layer and the like is formed on the pixel opening. The organic thin film layer 470 has a structure in which a hole injection layer, a hole transport layer, an organic electroluminescent layer, and an electron transport layer are stacked on the opening formed as the insulating layer pattern 440 on the first electrode 410, although not shown in the drawing. It can be formed as.

Next, referring to FIG. 18, a mask film pattern 480 is formed to block an area where the first wiring pattern 420 is formed on the pad part B. Referring to FIG. The mask layer pattern 480 blocks the first wiring pattern 420 when the material for forming the second electrode is deposited in a subsequent process.

Next, referring to FIGS. 19 and 20, a second electrode 490 orthogonal to the first electrode 410 is formed on the organic thin film layer 470. The second electrode 490 is a metal material including aluminum (Al), copper (Cu), or silver (Ag), and may be formed of a single layer or a plurality of layers having two or more layers.

While forming the second electrode 490 on the organic thin film layer 470, the second electrode pattern is formed by expanding and depositing the second electrode forming material onto the pad portion B of the substrate 400. Form 500. The material for forming the second electrode may include aluminum (Al), copper (Cu), or silver (Ag). At this time, the second wiring pattern 490b is separated by the barrier film 465 formed in advance.

 As such, when the second wiring pattern 500 is expanded and deposited with a material for forming a second electrode, for example, aluminum (Al), the second wiring pattern is formed by sequentially stacking ITO and chromium (Cr) or IZO and chromium. The resistance may be lower for the deposition region than in the case of the structure. Accordingly, when the organic electroluminescent device is driven by connecting to an external driving circuit, power consumption and driving voltage are lowered, thereby improving the electrical characteristics of the device. In addition, by forming a single layer including the material for forming the second electrode, defects are less likely to occur than those formed by sequentially stacking ITO and chromium (Cr) or IZO and chromium, thereby improving device reliability. Can be.

21 to 26 illustrate a method of manufacturing an organic EL device according to a fourth embodiment of the present invention. In particular, FIG. 26 is a view showing a portion cut out along the line Y-Y '.

Referring to FIG. 21, a first electrode 410 is formed on the substrate 400 including the light emitting portion A and the pad portion B in parallel in one direction. The first electrode 410 may be formed of a transparent conductive material including ITO or IZO.

Meanwhile, an area in which the wiring pattern, for example, the first wiring pattern connected to the first electrode and the second wiring pattern connected to the second electrode, is to be formed in the pad part B, is then deposited with the electrode material for forming the second electrode. Can be formed together. This will be described later.

Next, referring to FIG. 22, a lattice-shaped insulating layer pattern 440 defining the pixel opening 450 is formed on the first electrode 410 disposed on the light emitting portion A of the substrate 400. .

Next, referring to FIG. 23, after the photoresist layer is stacked on the entire surface of the substrate 400 including the insulating layer pattern 440, the barrier layer 460 having the reverse slope is formed by performing exposure and development. The partition layer 460 is arranged parallel to the first electrode 410 at regular intervals orthogonal to each other, and has an overhang structure so that the second electrode formed in a subsequent process is not short-circuited with adjacent components.

The barrier layer 465 is formed by extending the pad portion B while forming the barrier layer 460. The barrier layer 465 serves to prevent a short circuit between wiring patterns when the material for forming the second electrode is subsequently deposited.

Next, referring to FIG. 24, an organic thin film layer 470 including an organic emission layer and the like is formed on the pixel opening. The organic thin film layer 470 has a structure in which a hole injection layer, a hole transport layer, an organic electroluminescent layer, and an electron transport layer are stacked on the opening formed as the insulating layer pattern 440 on the first electrode 410, although not shown in the drawing. It can be formed as.

Next, referring to FIGS. 25 and 26, a second electrode 490 orthogonal to the first electrode 410 is formed on the organic thin film layer 470. The second electrode 490 is a metal material including aluminum (Al), copper (Cu), or silver (Ag), and may be formed of a single layer or a plurality of layers having two or more layers.

While forming the second electrode 490 on the organic thin film layer 470, the second electrode forming material is extended and deposited by the pad portion B of the substrate 400 to form a first wiring pattern on the pad portion B. 500 and the second wiring pattern 510 are formed. The material for forming the second electrode may include aluminum (Al), copper (Cu), or silver (Ag). In this case, the first wiring pattern 500 and the second wiring pattern 510 are separated by a barrier film 465 that is formed in advance, so that the first wiring pattern 500 and the second wiring pattern 510 can be deposited without using a mask when depositing the material for forming the second electrode. have. In addition, the second wiring pattern 510 is connected to the second electrode 490, and the barrier layer 465 between the second wiring pattern 510 is preferably connected to the barrier layer 460.

As such, when the first wiring pattern 500 and the second wiring pattern 510 are expanded and deposited with a material for forming a second electrode, for example, aluminum (Al), the first wiring pattern 500 and the second wiring pattern 500 are formed. The resistance of the deposition region may be lower than that when the 510 is formed of a structure in which ITO and chromium (Cr) or IZO and chromium are sequentially stacked.

Accordingly, when the organic electroluminescent device is driven by connecting to an external driving circuit, power consumption and driving voltage are lowered, thereby improving the electrical characteristics of the device. In addition, by forming a single layer including the material for forming the second electrode, defects are less likely to occur than those formed by sequentially stacking ITO and chromium (Cr) or IZO and chromium, thereby improving device reliability. Can be.

As described above, according to the organic electroluminescent device and the manufacturing method thereof according to the present invention, the second wiring pattern connected to the second electrode is separated on the pad portion of the substrate by a barrier film, and the second wiring pattern is separated on the second wiring pattern. By depositing a low-resistance material, low-resistance wires can be constructed, resulting in lower power consumption and driving voltage, thereby improving electrical characteristics.

In addition, the second wiring pattern connected to the second electrode may be separated on the pad portion of the substrate by the barrier layer, and the second wiring pattern may be formed only of a material having a low resistance, thereby forming a wiring having low resistance, thereby reducing power consumption and power consumption. As the driving voltage is lowered, the electrical characteristics can be improved.

Claims (19)

A substrate divided into a light emitting part and a pad part; A positive electrode arranged in one direction on the substrate of the light emitting unit; An insulating layer pattern formed in a lattice form on the positive electrode and the substrate of the light emitting unit, except for the pad portion, to define a plurality of pixel openings on the positive electrode of the light emitting unit; A barrier layer formed on the insulating layer pattern orthogonal to the positive electrode; An organic thin film layer formed on the pixel opening; A negative electrode formed on the organic thin film layer to be orthogonal to the positive electrode; A first wiring pattern formed on the substrate of the pad part to be connected to the positive electrode; A second wiring pattern formed on the substrate of the pad part to be connected to the negative electrode and including a material for forming a negative electrode; And And a barrier film formed between the second wiring patterns. The method of claim 1, And the barrier film is formed between the first wiring pattern and the second wiring pattern, respectively. The method of claim 2, The barrier film formed between the second wiring pattern is connected to the partition layer. The method of claim 1, The first wiring pattern includes a single layer structure of ITO or IZO or a lamination structure of ITO / chromium (Cr) or IZO / chromium (Cr). The method of claim 1, The material for forming a negative electrode may include any one metal material selected from the group consisting of aluminum (Al), copper (Cu), or silver (Ag) or two or more alloys. The method of claim 5, The second wiring pattern is, With ITO or IZO, An organic electroluminescent device comprising a laminated structure of any one metal material or two or more alloys selected from the group consisting of aluminum (Al), copper (Cu) or silver (Ag). The method of claim 5, The second wiring pattern is, ITO / Chrome (Cr) or IZO / Chrome (Cr), An organic electroluminescent device comprising a laminated structure of any one metal material or two or more alloys selected from the group consisting of aluminum (Al), copper (Cu) or silver (Ag). The method of claim 5, The second wiring pattern is, An organic electroluminescent device comprising a single layer structure of any one metal material or two or more alloys selected from the group consisting of aluminum (Al), copper (Cu) or silver (Ag). Forming a positive electrode arranged in one direction on a light emitting part of the substrate divided into a light emitting part and a pad part; Forming a first wiring pattern on the pad portion of the substrate while forming the positive electrode, the first wiring pattern comprising a positive electrode forming material; Forming a second wiring pattern including a positive electrode forming material on a pad of the substrate while forming the positive electrode; Forming an insulating layer pattern in a lattice form on the positive electrode of the light emitting unit and the substrate to define a plurality of pixel openings on the positive electrode of the light emitting unit; Forming a barrier layer on the insulating layer pattern orthogonal to the positive electrode; Forming a barrier layer between the second wiring patterns while forming the barrier layer; Forming an organic thin film layer on the pixel opening; Forming a negative electrode orthogonal to the positive electrode on the organic thin film layer, and depositing a material for forming a negative electrode on the second wiring pattern. Forming a positive electrode arranged in one direction on a light emitting part of the substrate divided into a light emitting part and a pad part; Forming a first wiring pattern on the pad portion of the substrate while forming the positive electrode, the first wiring pattern comprising a positive electrode forming material; Forming a second wiring pattern including a positive electrode forming material on a pad of the substrate while forming the positive electrode; Forming an insulating layer pattern in a lattice form on the positive electrode of the light emitting unit and the substrate to define a plurality of pixel openings on the positive electrode of the light emitting unit; Forming a barrier layer on the insulating layer pattern orthogonal to the positive electrode; Forming a barrier layer between the first wiring pattern and the second wiring pattern while forming the barrier layer; Forming an organic thin film layer on the pixel opening; Forming a negative electrode orthogonal to the positive electrode on the organic thin film layer, and depositing a material for forming a negative electrode on the first wiring pattern and the second wiring pattern. The method of claim 9 or 10, The barrier film between the second wiring patterns is connected to the barrier layer. The method of claim 9, The first wiring pattern includes a single layer structure of ITO or IZO or a lamination structure of ITO / chromium (Cr) or IZO / chromium (Cr). The method of claim 9 or 10, The negative electrode forming material is any one of a metal material selected from the group consisting of aluminum (Al), copper (Cu) or silver (Ag) or a method of manufacturing an organic electroluminescent device, characterized in that it comprises two or more alloys. The method according to claim 9 or 10, The positive electrode forming material is ITO or IZO manufacturing method of an organic EL device. 15. The method of claim 14, further comprising depositing chromium on the second wiring pattern between the second wiring pattern forming step and the insulating layer pattern forming step. Forming a positive electrode arranged in one direction on a light emitting part of the substrate divided into a light emitting part and a pad part; Forming a first wiring pattern on the pad portion of the substrate while forming the positive electrode, the first wiring pattern comprising a positive electrode forming material; Forming an insulating layer pattern in a lattice form on the positive electrode of the light emitting unit and the substrate to define a plurality of pixel openings on the positive electrode of the light emitting unit; Forming a barrier layer on the insulating layer pattern orthogonal to the positive electrode; Forming a barrier layer by expanding the pad part while forming the barrier layer; Forming an organic thin film layer on the pixel opening; Forming a mask layer pattern blocking the first wiring pattern; Forming a second wiring pattern by expanding and depositing a negative electrode forming material between the barrier layers while forming a negative electrode orthogonal to the positive electrode on the organic thin film layer using the mask layer pattern. . Forming a positive electrode arranged in one direction on a light emitting part of the substrate divided into a light emitting part and a pad part; Forming an insulating layer pattern in a lattice form on the positive electrode of the light emitting unit and the substrate to define a plurality of pixel openings on the positive electrode of the light emitting unit; Forming a barrier layer on the insulating layer pattern orthogonal to the positive electrode; Forming a barrier layer by expanding the pad part while forming the barrier layer; Forming an organic thin film layer on the pixel opening; Forming a first wiring pattern and a second wiring pattern by expanding and depositing a negative electrode forming material between the barrier layers while forming a negative electrode orthogonal to the positive electrode on the organic thin film layer. The method according to claim 16 or 17, And the second wiring pattern is connected to the negative electrode, and the barrier film between the second wiring patterns is connected to the barrier layer. The method according to claim 16 or 17, The negative electrode forming material is any one of a metal material selected from the group consisting of aluminum (Al), copper (Cu) or silver (Ag) or a method of manufacturing an organic electroluminescent device, characterized in that it comprises two or more alloys.

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