TW201444106A - Electric device and method of manufacturing the same - Google Patents

Abstract

A method of manufacturing an electric device includes overlapping a sheet on which an adhesive material is arranged over a first substrate, transferring the adhesive material from the sheet to the first substrate, overlapping a second substrate over the adhesive material and the first substrate, and bonding the first substrate and the second substrate by the adhesive material.

Description

Electrical device and method of manufacturing the same

The present invention relates to an electrical device and a method of manufacturing the electrical device.

The present application claims priority based on Japanese Patent Application No. 2013-007774, filed on Jan.

In the gap between the photoelectrode substrate and the counter electrode substrate constituting the dye-sensitized solar cell, an adhesive material (sealing material) is disposed so as to surround the edges of the bonded two substrates, and is sealed in an inner region surrounded by the adhesive material. Electrolyte (Patent Documents 1 and 2). If the sealing material is damaged or deteriorated, the electrolyte leaks from the inside and the battery performance is remarkably lowered, so durability is required for the sealing material. Therefore, many attempts have been made to improve the chemical composition of the sealing material.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-40288

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-251518

Further, in the manufacture of an electric device such as a dye-sensitized solar cell, a resin is disposed in a gap between the two substrates for the purpose of bonding the first substrate (for example, the negative electrode substrate) and the second substrate (for example, the counter electrode substrate). The method of manufacturing the material is as follows: the uncured liquid resin is ejected from the surface of the first substrate from the dispenser, and the first substrate and the second substrate are caused After the opposite phases are overlapped, the above resin is cured. In the case of this method, the liquid resin to be discharged flows to an unintended position when the first substrate and the second substrate overlap. When the viscosity of the resin is increased in order to prevent this, when the resin is ejected from the dispenser, a discharge error may occur due to clogging of the dispenser, or deterioration of manufacturing efficiency may occur due to a decrease in the ejection speed. . Further, when the electrolyte is brought into contact with the liquid resin, the resin or the additive contained in the resin is eluted into the electrolyte, or the electrolyte in the vicinity of the resin reacts with the resin when the liquid resin is cured, thereby causing deterioration of the electrolyte. Produces a flaw in its performance degradation.

As a method of avoiding such problems, a method of preparing a film-like sealing material in which a thermoplastic resin film is cut into a desired shape is prepared, and the cut film is sandwiched in a gap between two substrates in the manufacture of an electric device. After the sealing material is heated, heating is performed to thereby bring the two substrates together. However, the thermoplastic resin film cut like a frame is easily deformed, and is also easily affected by static electricity, moisture, or the like, so that it is difficult to carry it, and it is difficult to accurately arrange it in the intended position in the gap between the two substrates. Therefore, the above method can be applied when a small number of electric devices are assembled in a laboratory, but the conventional method is not suitable when the electric device is mass-produced by a roll-to-roll method.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method of manufacturing an electrical device in which a bonding material is disposed in a gap between a first substrate and a second substrate without causing a positional deviation, and the two substrates are connected. Electrical device manufactured by the method.

[1] A method of manufacturing an electrical device, comprising the steps of: superposing a sheet on which an adhesive material is disposed on a first substrate, and transferring the adhesive material from the sheet to the first substrate, and a second substrate The first substrate and the second substrate are bonded to each other by the bonding material and the first substrate.

[2] The method for producing an electric device according to the above [1], wherein the first substrate, the sheet on which the adhesive material is disposed, and the second substrate are wound from a roll, and are continuously used by a roll-to-roll method. The bonding material is bonded to the first substrate and the second substrate.

[3] The method of manufacturing an electric device according to the above [1] or [2] wherein the above-mentioned adhesive material is patterned in advance on the sheet.

[4] The method of manufacturing an electric device according to any one of [1] to [3] wherein the adhesive material is an integral material and a conductive member are integrated into a material, and the manufacturing method is The first substrate and the second substrate are bonded together using the insulating adhesive material, and the first substrate and the second substrate are electrically connected by the conductive member.

[5] The method for producing an electric device according to any one of [1] to [3] wherein the adhesive material is a conductive adhesive material, and in the manufacturing method, the conductive adhesive material is bonded to the above The first substrate and the second substrate are electrically connected to the first substrate at the same time.

[6] The method for producing an electric device according to any one of [1] to [3] wherein, as the bonding material, an insulating bonding material and a conductive bonding material are used, respectively, in the manufacturing method, The insulating material is bonded to the first substrate and the second substrate, and the first substrate and the second substrate are electrically connected by the conductive bonding material.

The manufacturing method of the electric device according to any one of the above [1], wherein the adhesive material includes an insulating adhesive material and a conductive adhesive material, and the first insulating material is bonded to the first material. The substrate and the second substrate are electrically connected to the first substrate and the second substrate by the conductive bonding material.

[7] The method for producing an electric device according to any one of [2] to [6] wherein the electric device is a dye-sensitized solar cell, and in the manufacturing method, the porous film constituting the photoelectrode is disposed. The first substrate rolled up from the roll is superposed on the first substrate including the porous film, and the transfer material is transferred onto the first substrate, Next, the material surrounds the porous film, and the electrolyte is supplied to the inside of the frame formed of the adhesive material, and the second substrate constituting the counter electrode is superposed on the first substrate, and the first substrate is bonded to the first substrate. And the second substrate, and the electrolyte is sealed by the above-mentioned bonding material.

[8] The method for producing an electric device according to any one of the above [2], wherein the electric device is a dye-sensitized solar cell, and in the manufacturing method, the porous material constituting the photoelectrode is disposed in advance. The first substrate of the plasma film is taken up from the roll, and the sheet on which the adhesive material is placed in advance is superposed on the first substrate including the porous film, and the adhesive material is transferred onto the first substrate. The porous film is surrounded by the bonding material, and the electrolyte is supplied to the inside of the frame formed of the bonding material, and the second substrate constituting the counter electrode is superposed on the first substrate, and the bonding material is bonded to the bonding material. The first substrate and the second substrate are sealed, and the electrolyte is sealed by the bonding material.

[9] The method for producing an electric device according to any one of [1] to [8] wherein the adhesive material disposed on the sheet material is an incompletely hardened resin, and in the manufacturing method, The transfer is performed by bringing at least a part of the above-mentioned adhesive material into contact with the first substrate.

The method of manufacturing an electric device according to any one of the above [1] to [8] wherein at least a part of the adhesive material disposed on the sheet material is an incompletely cured state, in the manufacturing method. The transfer is performed by bringing the bonding material into contact with the first substrate.

[10] The method for producing an electric device according to any one of [1] to [8] wherein the material to be disposed on the sheet material is a thermoplastic resin, and in the manufacturing method, the material of the bonding material is At least a portion of the first substrate is contacted to perform the transfer.

The method of manufacturing an electric device according to any one of the above [1] to [8] wherein at least a part of the adhesive material disposed on the sheet material is a thermoplastic resin, and in the manufacturing method, The material is brought into contact with the first substrate to perform the above transfer.

[11] The method for producing an electric device according to any one of the above [1], wherein at least a part of the adhesive material is a thermosetting resin or a thermoplastic resin, and in the manufacturing method, the second The substrate is superposed on the bonding material and the first substrate, and the bonding material is heated to bond the first substrate and the second substrate.

The method of manufacturing an electric device according to any one of the above [1] to [10] wherein At least a part of the material is a thermosetting resin or a thermoplastic resin. In the manufacturing method, the second substrate is superposed on the bonding material and the first substrate, and the bonding material is heated to form the first substrate. It is then bonded to the second substrate.

[12] An electric device manufactured by the production method according to any one of [1] to [11] above.

According to the method of manufacturing an electric device of the present invention, since the material to be transferred to the first substrate is supported by the sheet, the material can be easily conveyed, and the bonding material can be easily placed at a specific position on the first substrate with high precision. Therefore, it is possible to manufacture an electric device in which the first substrate and the second substrate are formed with higher precision than conventionally. Further, the method of manufacturing an electric device according to the present invention is easily applied to a roll-to-roll method, and by using this method, the mass production efficiency of the electric device can be dramatically improved.

1‧‧‧First substrate

1a‧‧‧Transparent conductive film

1b‧‧‧Substrate

2‧‧‧Sheet with attached material

2a‧‧‧Next material (sealing material)

2b‧‧‧ release sheet

3‧‧‧second substrate

3a‧‧‧ Conductive layer

3b‧‧‧Substrate

4‧‧‧Electrical devices (dye sensitized solar cells)

5‧‧‧Porous membrane

6‧‧‧Electrolyte (electrolyte)

7‧‧‧Electrical components

11‧‧‧First roll

12‧‧‧second roll

13‧‧‧third roll

14‧‧‧fourth roller

15‧‧‧ fifth roller

16‧‧‧6th roller

17‧‧‧ seventh roll

18‧‧‧ eighth roller

19‧‧‧9th roller

20‧‧‧Solid drop device

21‧‧‧Laminating machine

22‧‧‧Feed institutions

23‧‧‧UV irradiation device

24‧‧‧Roller coater

25‧‧‧ Pressing machine

26‧‧‧Connecting components

30‧‧‧Integrated material

40A, 40B, 40C, 40D‧‧‧ dye-sensitized solar cells

C1~C13‧‧‧ unit battery

S1, S2‧‧‧ cuts

Fig. 1 is a schematic view showing a schematic configuration of an example of a manufacturing apparatus applicable to a method of manufacturing an electric device according to the present invention.

Fig. 2 is a schematic cross-sectional view showing an example of an adhesive material applicable to a method of manufacturing an electric device according to the present invention.

Fig. 3 is a schematic view showing a schematic configuration of an example of a manufacturing apparatus applicable to a method of manufacturing an electric device according to the present invention.

Fig. 4 is a schematic cross-sectional view showing an electric device (dye sensitized solar cell) according to a fourth embodiment of the present invention.

Fig. 5 is a schematic cross-sectional view showing an electric device (dye sensitized solar cell) according to a fifth embodiment of the present invention.

Fig. 6 is a schematic cross-sectional view showing an electric device (dye sensitized solar cell) according to a sixth embodiment of the present invention.

Figure 7 is a view showing a mode of an electric device (dye sensitized solar cell) according to a seventh embodiment of the present invention. Profile view.

Hereinafter, the present invention will be described with reference to the drawings based on preferred embodiments, but the present invention is not limited to the above embodiments.

"Manufacturing method of electrical devices"

<First Embodiment>

As a method of manufacturing an electric device according to a first embodiment of the present invention, a method of manufacturing a dye-sensitized solar cell will be described with reference to FIG.

The first substrate 1 (negative electrode substrate 1) which is unwound from the first roll 11 is wound up in the horizontal direction via the second roll 12, and the sheet 2 with the adhesive material which is unwound from the third roll 13 is passed through The four rolls 14 are advanced in parallel with the negative electrode substrate 1 so as to be superposed on the negative electrode substrate 1.

At this time, the first substrate 1 is unwound from the first roller 11, and a transparent conductive film such as an ITO film is formed by a sputtering apparatus or the like (not shown), and the transparent conductive film is further formed by a film forming apparatus (not shown). The upper film is made of a porous film made of an oxide semiconductor or the like. Then, the sensitizing dye is dyed to the porous film by a dyeing device (not shown). The negative electrode substrate 1 obtained in this manner is superposed on the sheet 2 with the adhesive material attached thereto.

Moreover, as a modification of the embodiment described herein, the negative electrode substrate 1 in which the ITO film, the porous film, and the sensitizing dye are disposed on the substrate in advance may be wound from the first roll 11.

The base material constituting the negative electrode substrate 1 is not particularly limited, and for example, a known transparent resin sheet (resin film) having flexibility can be used. Preferably, a transparent conductive film is formed on the surface of the resin sheet. The method of forming the porous film on the transparent conductive film of the resin sheet is not particularly limited, and for example, a known method capable of forming a film at normal temperature, such as an aerosol deposition method (AD method), can be applied.

The sheet 2 with the adhesive material has a configuration in which the subsequent material 2a is disposed on the release sheet 2b in a desired pattern. The method of arranging the subsequent material 2a on the release sheet 2b is only There is no particular limitation on the method of arranging the pattern of the subsequent material 2a on the release sheet. For example, a method of printing a release sheet 2a on a release sheet or a method of laminating an adhesive resin in a pattern onto a release sheet may be mentioned. Next, the material 2a is preferably a thermoplastic resin or a thermosetting resin, and more preferably a thermosetting resin (B-stage thermosetting resin) in a hardened state (incompletely cured state). Examples of the thermoplastic resin include a polystyrene resin and a polyolefin resin. Examples of the thermosetting resin include an epoxy resin and a phenol resin. Further, the material 2a may be a photocurable resin in an incompletely cured state. Examples of the photocurable resin include an acrylic resin, a methacrylic resin, a vinyl resin, a polyoxyxylene resin, and an epoxy resin.

In the sheet 2 with the adhesive material attached to the third roll 13, the material 2a is then protected by the release sheet 2b, so that deterioration of the material 2a is suppressed. In the case where the subsequent material 2a is the photocurable resin, the release sheet 2b is preferably a light-shielding sheet.

The sheet 2 with the adhesive material taken up from the third roll 13 is placed on the negative electrode substrate 1 to transfer the adhesive material 2a to the negative electrode substrate 1, and only the release sheet 2b is detached from the negative electrode substrate 1. Thereafter, the release sheet 2b is wound up to the fifth roll 15 and recovered.

The method of transferring the bonding material 2a to the negative electrode substrate 1 is not particularly limited as long as it is a method in which the pattern of the bonding material 2a is not cracked. For example, a method of pressing the bonding material 2a against the negative electrode substrate 1 with a light pressure which does not largely deform or hardly deform the shape of the material 2a, thereby attaching the bonding material 2a to the negative electrode substrate, may be mentioned. 1, and the adhesive material 2a is detached from the release sheet 2b. Such a transfer method can be more easily realized if the material 2a is a B-stage thermosetting resin.

Moreover, when the adhesive material 2a is a thermoplastic resin, the adhesive material 2a is pressed against the negative electrode substrate 1, and the adhesive material 2a is heated to impart adhesiveness, whereby the transferable sheet 2b can be transferred. This bonding material 2a.

It is depicted in the pattern diagram of FIG. 1 in the following manner, that is, the self-release sheet The bonding material 2a after the 2b detachment is separately present immediately before being attached to the negative electrode substrate 1. The state A in which the material 2a alone exists may be present as described above, and the state B in which the bonding material 2a adheres to either the release sheet 2b or the negative electrode substrate 1 may be used as described above. Which of the states A and B is set can be set by, for example, adjusting the distance between the fourth roller 14 and the negative substrate 1. In order to transfer the pattern of the adhesive material 2a in the sheet 2 with the adhesive material to the negative electrode substrate 1 with high precision, the system state B is usually preferable.

The specific pattern in which the bonding material 2a is formed in the sheet 2 with the adhesive material is transferred to the negative electrode substrate 1, so that almost the same pattern is formed on the negative electrode substrate 1. In the transfer step, in the case where the above state B is employed, the material 2a is always supported by the release sheet 2b or the negative electrode substrate 1, and there is no case where the subsequent material 2a is separately processed. Therefore, the pattern does not crack and the positional deviation is prevented, so that the bonding material 2a can be reliably disposed at a specific position of the negative electrode substrate 1. Moreover, by appropriately setting the transfer conditions, it is possible to prevent the indentation and to arrange the bonding material 2a at a specific position of the negative electrode substrate 1 with almost no deformation (height) or width of the bonding material 2a. Further, by narrowing the distance (repetition distance) between the bonding materials 2a patterned on the release sheet 2b, the pattern of the bonding material 2a transferred to the negative electrode substrate 1 can be refined (fine) .

The method of producing the sheet 2 with the adhesive material prepared in advance is not particularly limited, and examples thereof include a method of spraying or applying a thermoplastic resin or a thermosetting resin onto the release sheet 2b using a dispenser or the like. A specific pattern is formed in advance. In order to achieve the purpose of easily transferring the adhesive material 2a to the negative electrode substrate 1, it is preferred that the thermosetting resin is in an incompletely cured state (B-staged) by a usual method. When the thermosetting resin is B-staged in advance, even if the electrolytic solution is in contact with the thermosetting resin, the electrolyte solution can be prevented from deteriorating by the chemical component constituting the thermosetting resin.

Further, when the adhesive material 2a is a thermoplastic resin, since the contact with the electrolytic solution is a cured thermoplastic resin, it is possible to prevent the components of the thermoplastic resin from being eluted to the electrolytic solution. The case where the electrolyte is deteriorated. However, when the second substrate is superposed as described below and the first substrate and the second substrate are heated by heating the thermoplastic resin, there is a possibility that the components of the thermoplastic resin are eluted into the electrolytic solution depending on the degree of heating. Therefore, the material 2a is more preferably a thermosetting resin.

The porous film on the negative electrode substrate 1 is preferably disposed at a specific interval or a specific repeating pattern (patterned arrangement) so as to correspond to the pattern in which the bonding material 2a is formed in the sheet 2 with the adhesive material. On the above substrate. By adjusting the pattern of the negative electrode substrate 1 in advance with the pattern of the sheet 2 with the adhesive material, the parallel advance speed of the negative electrode substrate 1 and the sheet 2 with the adhesive material is adjusted so as to overlap each other, thereby continuously The same pattern is disposed on the negative electrode substrate 1 with the subsequent material 2a. According to this method, even if the parallel advancement speed is increased, the relative speed of the negative electrode substrate 1 and the sheet 2 with the adhesive material can be set to zero, so that the positional arrangement of the material 2a can be more reliably prevented. shift.

On the other hand, in the conventional method of ejecting the bonding material 2a from the dispenser to the negative electrode substrate 1, the negative electrode substrate 1 can be linearly wound in the direction (MD (Machine Direction)) in which the negative electrode substrate 1 is wound and flows. When the material 2a is pulled, but in the TD (Transverse Direction) direction perpendicular to the MD direction, if the dispenser is not moved in parallel with the negative electrode substrate 1, it is difficult to linearly pull the subsequent material 2a. In general, in the roll-to-roll mode, it is not practical to advance the dispenser in parallel with the substrate from which the roller is unwound.

The adhesive material 2a after transfer is preferably disposed so as to surround the porous film formed on the negative electrode substrate 1. Here, the expression "envelope" may be in a state in which both the MD direction and the TD direction of the porous film are surrounded by the bonding material 2a, or in the MD direction and the TD direction in the bonding material 2a. The status of either. When the adhesive material 2a surrounds both the MD direction and the TD direction of the porous film, a frame made of the adhesive material 2a is formed on the negative electrode substrate 1. When the bonding material 2a sandwiches only the MD direction and the TD direction of the porous film, the edge formed by the bonding material 2a is used. A wall in the MD direction or the TD direction is formed on the negative electrode substrate 1. Thereafter, the electrolyte (electrolyte) is continuously supplied to the porous film by the solution dropping device 20 and in a region surrounded by the bonding material 2a (inside of the frame).

Then, the second substrate 3 (positive electrode substrate 3) wound from the sixth roller 16 is advanced in parallel with the negative electrode substrate 1 on which the bonding material 2a is placed via the seventh roller 17, and is superposed on the bonding material 2a and the negative electrode substrate 1. At this time, the positive electrode substrate 3 and the negative electrode substrate 1 are not in contact, and the gap between the two substrates can be controlled according to the thickness of the bonding material 2a or the thickness of the electrolyte. Thereafter, the bonding material 2a is heated by a bonding machine 21 having a heating roller, and the negative electrode substrate 1 and the positive electrode substrate 3 are joined by the bonding material 2a, and the electrolyte is sealed between the substrates. Next, the material 2a can be read as the sealing material 2a. Next, the negative electrode substrate 1 and the positive electrode substrate 3 which are bonded together are disposed to face each other, and function as a photoelectrode and a counter electrode, respectively.

Further, in the case where the adhesive material 2a sandwiches only the MD direction or the TD direction of the porous film, a wall formed of the adhesive material 2a in the MD direction or the TD direction is formed on the negative electrode substrate 1. In the case where the wall is not formed (the TD direction or the MD direction), the sealing portion can be formed by local heating such as laser irradiation or ultrasonic welding. Specifically, as an example of the ultrasonic welding, a method in which the bonding machine 21 is passed and the MD 2 direction or the TD direction of the negative electrode substrate 1 and the positive electrode substrate 3 are followed by the bonding material 2a is used, and the method is not formed. Next, in the direction of the wall of the material 2a (TD direction or MD direction), the negative electrode substrate 1 and the positive electrode substrate 3 are welded by ultrasonic vibration, thereby forming a sealed portion.

Further, the formation of the sealing portion by local heating such as laser irradiation or ultrasonic welding can be used not only for the direction in which the wall of the bonding material 2a is not formed but also for the direction in which the wall of the bonding material 2a is formed. .

In the case where a photocurable resin is used as the bonding material 2a, the bonding machine 21 may be provided with a heating roller or may not include a heating roller.

The positive electrode substrate 3 supplied from the sixth roller 16 is applicable to the roller to the roller. The conductive body having a flexible shape is not particularly limited, and examples thereof include a resin film obtained by forming a platinum film or a transparent conductive film on the surface, and a metal plate (metal sheet).

Finally, the dye-sensitized solar cell 4 obtained by sealing the electrolyte is collected by a feed mechanism 22 (roller feeding device) having a roll and an eighth roll 18 wound up to the ninth roll 19. The roll-shaped dye-sensitized solar cell 4 produced is cut into an appropriate size for use or purpose. A dye-sensitized solar cell having a configuration in which a plurality of unit cells are connected in parallel or in series is obtained by cutting a desired cut into a roll-shaped dye-sensitized solar cell. The method of cutting the above-mentioned cut marks is not particularly limited, and examples thereof include a method of irradiating a portion to be electrically disconnected and irradiating a laser.

In the case where the thermosetting resin is used as the bonding material 2a, the negative electrode substrate 1 and the positive electrode substrate 3 are bonded to each other via the bonding material 21, and then heated by an oven or the like not shown in FIG. The device is thermally hardened. The heat hardening may be carried out by incorporating the heating device in the roll-to-roll mode, or may be carried out together with the roll of the dye-sensitized solar cell 4 wound up using the ninth roll 19 into the heating device.

In the case where the photocurable resin is used as the bonding material 2a, the negative electrode substrate 1 and the positive electrode substrate 3 are bonded to each other via the bonding material 21, and then the light irradiation device is not described in FIG. Light hardening. The light curing device may be incorporated into the bonding machine 21, or may be separately incorporated between the self-bonding machine 21 to the ninth roller 19.

In the method of manufacturing an electric device according to the first embodiment of the present invention described above, an example in which a negative electrode substrate is used as the first substrate 1 and a positive electrode substrate is used as the second substrate has been described. In the case where one substrate 1 and the negative electrode substrate are used as the second substrate, a roll-shaped dye-sensitized solar cell can be manufactured by the same method.

Further, in the method of manufacturing an electric device according to the first embodiment of the present invention, an example in which at least a part of the bonding material is brought into contact with the first substrate to transfer the bonding material from the sheet has been described, but The transfer is performed by bringing at least a portion of the bonding material into contact with the second substrate.

Further, in the method of manufacturing an electric device according to the first embodiment of the present invention, the first substrate and the second substrate are formed by superposing a second substrate on the bonding material and the first substrate and heating the bonding material. Although the example of the bonding is described, the first substrate may be superposed on the bonding material and the second substrate.

Further, in the method of manufacturing an electric device according to the present invention, as a method of sealing the electrolyte by a material, for example, a method may be employed in which a sheet of a bonding material is placed in advance on a first substrate constituting the counter electrode. Then, a material is transferred to the first substrate to form a frame, and an electrolyte is supplied to the inside of the frame formed of the adhesive material, and a porous film constituting the photoelectrode is disposed on the second substrate wound from the roll, and the porous film is provided. The second substrate of the plasma film is superposed on the first substrate, and the first substrate and the second substrate are bonded together by the bonding material. In this case, as the second substrate, a second substrate in which a porous film constituting the photoelectrode is disposed in advance may be used.

<Second embodiment>

Hereinafter, a second embodiment which is an application example of the first embodiment will be described.

In the first embodiment, the adhesive material 2a constituting the sheet 2 with the adhesive material is used as a thermosetting resin, a thermoplastic resin, or a photocurable property which can function as a sealing material after curing (followed). Resin. In the second embodiment, as the bonding material 2a constituting the sheet 2 with the adhesive material, in addition to the thermosetting resin, the thermoplastic resin, or the photocurable resin constituting the sealing material, another bonding material having conductivity is used in combination. (conductive member). The conductive adhesive material can function as a wiring that follows the negative electrode substrate 1 and the positive electrode substrate 3 and electrically connects the two substrates.

In the release sheet 2b constituting the sheet 2 with the adhesive material of the second embodiment, a conductive adhesive material is placed at a position corresponding to a portion where electrical conduction between the substrates is obtained, and the electrolyte is sealed. An insulating material that functions as a sealing material is disposed at a position corresponding to the region, and the bonding material is transferred from the bonding material 2 to the negative electrode. Substrate 1 or positive electrode substrate 3. The method of transferring the conductive bonding material may be carried out by the same method as the bonding material of the first embodiment.

The conductive adhesive material is, for example, a known one in which an appropriate amount of silver powder, nickel powder, gold plating powder (gold powder), palladium powder, carbon powder, or the like is kneaded in an epoxy-based adhesive or a polyoxynylene-based adhesive. Conductive resin. The conductive resin is preferably a thermosetting resin (conductive thermosetting resin). It is more preferable that the above-mentioned conductive thermosetting resin is B-staged. The conductive thermosetting resin is transferred and disposed in the gap between the negative electrode substrate 1 and the positive electrode substrate 3 by the same method as the bonding material of the first embodiment, and the conductive thermosetting resin is pressurized by a heating roller. And heating, whereby the negative electrode substrate 1 and the positive electrode substrate 3 are connected to each other to obtain conduction between the two substrates.

As a modification of the second embodiment of the present invention, an example in which the bonding material 2a constituting the sheet 2 with the adhesive material is composed only of the above-mentioned conductive thermosetting resin, and the sealing material is not used. A thermosetting resin that functions as a function. In this case, the conductive member made of the conductive thermosetting resin not only conducts the negative electrode substrate 1 and the positive electrode substrate 3, but also functions to bond the two substrates together.

Further, in this modification, the sealing material for sealing the electrolyte may be separately disposed by a conventionally known method, and the sealing material may be separately disposed by the first embodiment of the present invention. When the electrical device to be manufactured is a device that does not require an electrolyte, the sealing material may not be disposed.

<Third embodiment>

Hereinafter, a third embodiment which is an application example of the first embodiment will be described.

In the first embodiment, the adhesive material 2a constituting the sheet 2 with the adhesive material is used as a thermosetting resin, a thermoplastic resin, or a photocurable property which can function as a sealing material after curing (followed). Resin. In the third embodiment, as the adhesive material, a one-piece backing material in which an insulating adhesive material and a conductive member are integrated is used.

The body-type adhesive material 30 of the present embodiment includes the conductive member 26 and an insulating material 2a as a sealing material, and is integrated.

Fig. 2 is a schematic cross-sectional view showing an example of a body type bonding material 30 of the present embodiment. The body type bonding material 30 of the present embodiment is disposed on the release sheet 2b so as to have a desired linear pattern. Fig. 2 is a schematic cross-sectional view showing a state in which the integral bonding material 30 is cut in a plane perpendicular to the longitudinal direction of the linear pattern.

Further, when the integrated backing material 30 is disposed in a rectangular pattern as viewed in the thickness direction of the release sheet 2b, the direction along the long side thereof is the longitudinal direction. Similarly, when the integrated backing material 30 is disposed in a substantially elliptical pattern as viewed in the thickness direction of the release sheet 2b, the direction along the major axis thereof is the longitudinal direction.

The body-type adhesive material 30 of the present embodiment is roughly configured by the conductive member 26 and the insulating material 2a. The conductive member 26 is disposed at the center, and the shape of the cross section perpendicular to the longitudinal direction is a circular shape. The subsequent material 2a is disposed on the outer circumference of the conduction member 26 so as to cover the conduction member 26, and has a center similar to the conduction member 26, and has a shape of a cross section perpendicular to the longitudinal direction of an elliptical shape.

Further, the conduction member 26 has the same center as the insulating material 2a, and the conduction member 26 (circular) is inscribed in the insulating material 2a (elliptical shape).

In the integrated adhesive material 30, the integration of the conductive member 26 and the insulating adhesive material 2a means that the two are in close contact with each other, and it is preferable that there is no gap between the conductive member 26 and the insulating adhesive material 2a. The state of (void).

In the case where the integral type bonding material 30 has an elliptical shape as shown in FIG. 2, the integral bonding material 30 and the release sheet 2b have a bonding surface which can be fixed to the release sheet 2b.

In the release sheet 2b constituting the sheet 2 with the adhesive material according to the third embodiment, the conduction member 26 is disposed at a position corresponding to a portion where the electrical connection between the substrates is obtained, and the sealing member 26 is disposed. The integral bonding material 30 is disposed such that the insulating material 2a functioning as a sealing material is disposed at a position corresponding to the region of the electrolyte, and the integral bonding material is transferred from the bonding material 2 to the negative electrode. Substrate 1 or positive electrode substrate 3. The method of transferring the integral type bonding material 30 may be carried out by the same method as the bonding material of the first embodiment.

The conduction member 26 can also be plastically deformed when it is pressurized during the process of bonding the negative electrode substrate 1 and the positive electrode substrate 3. As the conduction member 26, one or more selected from the group consisting of a wire, a conductive tube, a conductive foil, a conductive plate, and a conductive mesh can be used.

Examples of the wire include those made of a metal such as copper, silver or aluminum.

The shape of the cross section perpendicular to the longitudinal direction of the wire is not particularly limited, and examples thereof include a circular shape, an elliptical shape, a square shape, and a rectangular shape.

Further, the size (for example, the diameter) of the cross section perpendicular to the longitudinal direction of the wire is not particularly limited, and is appropriately set depending on the aperture ratio of the battery, the interval between the electrodes, and the like required for the electric module of the integrated adhesive material 30. As an example, the length of the major axis of the elliptical shape shown in FIG. 2 can be adjusted to, for example, about 5 mm to 5 cm.

Examples of the conductive tube include a resin such as a polyurethane or a polytetrafluoroethylene (PTFE) in which conductive fine particles (fine particles of a metal such as copper, silver, or aluminum or fine particles of carbon black) are dispersed in a tubular shape (for example). A hollow tube, a metal tube made of the above metal, a carbon nanotube, or the like.

The shape of the cross section perpendicular to the longitudinal direction of the conductive tube is not particularly limited, and examples thereof include a circular shape, an elliptical shape, a square shape, and a rectangular shape.

Further, the size (for example, the diameter) of the cross section perpendicular to the longitudinal direction of the conductive tube is not particularly limited, and is appropriately set according to the aperture ratio of the battery required for the electric module of the integrated adhesive material 30, the interval between the electrodes, and the like. .

Examples of the conductive foil include those made of a metal such as copper, silver or aluminum.

The width or thickness of the conductive foil is not particularly limited, and the electrical power of the material 30 is applied according to the application. The aperture ratio of the battery required for the gas module, the interval between the electrodes, and the like are appropriately set.

Examples of the conductive plate include those made of a metal such as copper, silver or aluminum.

The width or thickness of the conductive plate is not particularly limited, and is appropriately set depending on the aperture ratio of the battery, the interval between the electrodes, and the like required for the electric module of the integrated-type bonding material 30.

As the conductive mesh, for example, a mesh made of a metal such as copper, silver or aluminum may be mentioned.

The width or thickness of the conductive mesh is not particularly limited, and is appropriately set depending on the aperture ratio of the battery, the interval between the electrodes, and the like required for the electrical module of the integrated adhesive material 30.

The material of the insulating material 2a may be any material used for the bonding material 2a listed in the first embodiment.

Further, the shape of the cross section perpendicular to the longitudinal direction of the insulating material 2a is not particularly limited, but is preferably a roll shape or a belt shape.

The roll shape means that the shape of the cross section perpendicular to the longitudinal direction of the insulating material 2a is a shape having no corners, for example, a circular shape or an elliptical shape.

The strip shape means that the shape of the cross section perpendicular to the longitudinal direction of the insulating material 2a is an angular shape, for example, a square shape or a rectangular shape. Moreover, the strip shape also includes a case where the insulating material 2a is a flat plate shape (short strip shape).

When the shape of the cross section perpendicular to the longitudinal direction of the insulating material 2a is a roll shape or a strip shape, in the manufacture of the electric module, an integral type is interposed between the substrates provided with the pair of electrodes. When the material 30 is used to seal a pair of substrates, the insulating material 2a is easily spread along the mutually opposing faces of the pair of substrates. In other words, the adhesion between the insulating material 2a and the pair of substrates (electrodes) can be sufficiently ensured.

The method for producing the bulk adhesive material 30 of the present embodiment is not particularly limited, and examples thereof include a method in which the conductive member 26 is contacted (impregnated) with dissolved After the insulating material is followed by the organic solvent solution of the material 2a, the conductive member 26 is pulled from the organic solvent solution and dried in the air or in a vacuum to remove the organic solvent, whereby the conductive member 26 is covered with the insulating material 2a. After the conductive member 26 is contacted (impregnated) with the molten insulating material 2a, the conductive member 26 is pulled from the insulating material 2a and the insulating material 2a is applied to the surface of the conductive member 26. The surface is cured so that the surface of the conduction member 26 is covered by the insulating material 2a.

According to the body type bonding material 30 of the present embodiment, since the conduction member 26 and the insulating material 2a are integrated, the conduction member 26 and the insulating material 2a can be collectively disposed at a specific position. The member 26 is for electrically connecting the opposite pair of electrodes, and the insulating material 2a is followed by and sealing the electrodes. Therefore, it is not necessary to separately provide the conduction member 26 and the insulating connecting material 2a, and the steps can be simplified.

Further, according to the body type bonding material 30 of the present embodiment, since the conduction member 26 is integrated with the insulating material 2a, it is necessary to increase the number of the electrical modules produced by applying the body type bonding material 30 of the present embodiment. In the case of the aperture ratio of the large battery, even if the line width of the conduction member 26 and the insulating material 2a is reduced, it is not necessary to position the conduction member 26 and the insulating material 2a, respectively, and the conduction can be easily performed. The member 26 is in positional alignment with the insulative adhesive material 2a.

Further, in the body-type adhesive material 30 of the present embodiment, the conductive member 26 is integrated with the insulating material 2a in advance, so that when the integral adhesive material 30 is disposed, the conductive member 26 and the insulating adhesive material 2a can be prevented. The adhesion is lowered to cause a gap between the conduction member 26 and the insulating material 2a.

In the integral type bonding material 30, one portion of the conduction member 26 is preferably exposed in the longitudinal direction. Alternatively, the conductive member 26 of the integrated adhesive material 30 may be exposed to the surface of the integrated adhesive material 30 when the conductive member 26 is pressed in the thickness direction and deformed. One part of the conductive member 26 is exposed in the longitudinal direction, and is integrally provided when the following electrical module is fabricated. When the material 30 is held, the conduction between the conduction member 26 and the electrode can be easily achieved.

As a method of exposing a part of the conduction member 26, a method in which the surface of the conduction member 26 is covered with the insulating material 2a by the above-described method, and then the insulating material 2a is removed by slit processing or the like. Part of the conductive member 26 is partially exposed; after covering a portion of the conductive member 26 with a heat-resistant tape, an organic solvent-resistant tape, or the like, the non-covered portion of the surface of the conductive member 26 is covered by the insulating adhesive material 2a by the above method. And removing the heat-resistant tape, the organic solvent-resistant tape, or the like; or, when the conductive member 26 is brought into contact with (impregnated) the organic solvent solution or the molten material of the insulating material 2a, only one portion of the conductive member 26 is contacted (impregnated), The untouched (impregnated) portion is set as the exposed portion.

The method of manufacturing the electric device according to the first to third embodiments described above can also be applied to the device illustrated in Fig. 3 . In FIG. 3, the same components as those in FIG. 1 are denoted by the same reference numerals, and their description is omitted. Further, a circle without an indication symbol indicates a roller that can convey the first substrate 1 or a roller attached to the roller.

In the apparatus shown in FIG. 3, it is extruded by the press machine 25 disposed downstream of the bonding machine 21, and is formed by bonding the first substrate 1 and the second substrate 3 by the bonding material 2a. Excess air in the gap between the substrates. The electric device 4 obtained by laminating the two substrates is sandwiched between the two rolls provided in the press machine 25 and passed therethrough, whereby the end of the film which is not attached after passing through the bonding machine 21 can be squeezed. Excess air.

In the case where the adhesive material 2a is sandwiched between only the MD direction or the TD direction of the porous film, the wall in the MD direction or the TD direction composed of the adhesive material 2a is formed on the negative electrode substrate 1. In the case where the wall is not formed (the TD direction or the MD direction), the sealing portion can be formed by local heating such as laser irradiation or ultrasonic welding. Specific examples of the ultrasonic welding include a method in which the bonding machine 21 is passed and the bonding material 2a is used, followed by the state of the negative electrode substrate 1 and the positive electrode substrate 3 in the MD direction or the TD direction. The direction of the wall of the material 2a (TD direction or MD direction), the negative electrode base is welded by ultrasonic vibration The board 1 and the positive electrode substrate 3 thereby form a sealing portion.

Further, the formation of the sealing portion by local heating such as laser irradiation or ultrasonic welding can be applied not only to the direction in which the wall of the bonding material 2a is not formed but also to the wall on which the bonding material 2a is formed. direction.

Further, an auxiliary adhesive material may be disposed on the first substrate 1 by a roll coater 24 disposed between the first roll 11 and the second roll 12. As the auxiliary adhesive material, the material exemplified as the adhesive material 2a in the first embodiment can be used. For example, when a photocurable resin is used as an auxiliary adhesive material, the UV irradiation device 23 disposed downstream of the press machine 25 is used to coat the auxiliary adhesive material by UV irradiation. The hardened photocurable resin is cured, whereby a stronger substrate can be achieved.

Electrical Installation

<Fourth embodiment>

An electric device according to a fourth embodiment of the present invention is an electric device obtained by the manufacturing method of the first embodiment. As an example of such an electric device, a dye-sensitized solar cell 40A is exemplified.

(Pigment sensitized solar cell 40A)

Fig. 4 is a schematic view showing a portion of a cross section in the MD direction of the dye-sensitized solar cell 40A cut out from a roll-shaped dye-sensitized solar cell at a specific length.

The first substrate 1 (negative electrode substrate 1) includes a transparent base material 1b, a transparent conductive film 1a formed on the surface thereof, and a porous film 5 formed on the transparent conductive film, and functions as a photoelectrode.

The second substrate 3 (positive electrode substrate 3) includes a base material 3b and a conductive layer 3a formed on the surface thereof, and functions as a counter electrode.

The transparent conductive film 1a of the first substrate 1 and the conductive layer 3a of the second substrate 3 are arranged to face each other and are interposed with the sealing material 2a. The porous membrane 5 is in a state of being impregnated (embedded) in the electrolyte 6. The electrolyte 6 is sealed to the gap between the two substrates by the sealing material 2a.

The distance (gap) of the gap between the first substrate 1 and the second substrate 3 is not particularly limited as long as the porous film 5 and the electrolyte 6 can be disposed in the gap, and examples thereof include 50 μm to 250 μm. The above distance is the same as the thickness of the sealing material 2a. The above distance can be controlled by adjusting the thickness of the sealing material 2a at the time of manufacture.

The dye-sensitized solar cell 40A is electrically connected in parallel with a plurality of batteries. In FIG. 4, the configuration in which the unit cells C1, C2, and C3 are arranged in parallel is shown. Each of the unit cells is divided by a slit S1 to be connected in parallel. In the figure, the positive electrode is represented by (+) and the negative electrode is represented by (-). The electrodes constituting the unit cells are connected to lead wires (not shown) as needed to recover the generated electric power. The installation location of the lead wiring is not particularly limited, and examples thereof include (+) and (-) portions shown in the drawings.

The material of the base material 1b constituting the first substrate 1 is not particularly limited as long as it is a material that transmits light, and for example, a transparent resin film can be applied. The thickness of the resin film is, for example, 20 μm to 100 μm. As the transparent conductive film 1a, a transparent conductive film used in a conventionally known dye-sensitized solar cell can be applied, and examples thereof include a film made of ITO or FTO. For the porous membrane 5, a porous membrane used in a conventionally known dye-sensitized solar cell can be used. For example, a porous membrane made of an oxide semiconductor such as titanium oxide can be used. The thickness of the porous film 5 is, for example, 5 μm to 20 μm.

A sensitizing dye known in the art can be applied to the sensitizing dye carried on the porous film 5, and examples thereof include a black dye. The porous membrane 5 is in a state of being impregnated or embedded in the electrolyte 6. The electrolyte 6 may be a liquid electrolyte or a gel or solid electrolyte. As the electrolyte 6, an electrolyte used in a conventionally known dye-sensitized solar cell can be applied, and examples thereof include an electrolyte containing an iodide ion (I) and a triiodide ion (I ₃ ).

The material of the base material 3b constituting the second substrate 3 is not particularly limited, and for example, a resin film can be applied. The substrate 3b can be either transparent or opaque. The thickness of the resin film is, for example, 20 μm to 100 μm. Regarding the conductive layer 3a, a well-known dye-sensitized sun can be applied. Examples of the conductive layer used in the battery include a transparent conductive film made of ITO or FTO, and a film made of a conductive material such as platinum or carbon black.

<Fifth Embodiment>

An electric device according to a fifth embodiment of the present invention is an electric device obtained by the manufacturing method of the second embodiment. As an example of such an electric device, a dye-sensitized solar cell 40B is exemplified.

(Pigment sensitized solar cell 40B)

Fig. 5 is a schematic view showing a portion of a cross section in the MD direction of the dye-sensitized solar cell 40B cut out from a roll-shaped dye-sensitized solar cell with a specific length. In the drawings, the same components as those of the dye-sensitized solar cell 40A of the fourth embodiment are denoted by the same reference numerals, and their description is omitted.

The dye-sensitized solar cell 40B is electrically connected in series to a plurality of batteries. In FIG. 5, the configuration in which the unit cells C4 and C5 are arranged in series is shown. Each of the unit cells is subjected to the breaking required for the series connection by the slit S2. The lead wires (not shown) are connected to the electrodes constituting the unit cells, and the generated electric power is recovered. The installation location of the lead wiring is not particularly limited, and examples thereof include (+) and (-) portions shown in the drawings.

In the dye-sensitized solar cell 40B, the conductive member 7 electrically connects the transparent conductive film 1a of the first substrate 1 and the conductive layer 3a of the second substrate 3, and connects the negative electrode of the unit cell C4 and the positive electrode of the unit cell C5 in series. The electroconductive member 7 is formed of a conductive material which is described in the manufacturing method of the second embodiment.

<Sixth embodiment>

An electric device according to a sixth embodiment of the present invention is an electric device obtained by the manufacturing method of the second embodiment. As an example of such an electric device, a dye-sensitized solar cell 40C is exemplified.

(Pigment sensitized solar cell 40C)

Figure 6 is a graph showing the dye sensitization cut out from a roll-shaped dye-sensitized solar cell with a specific length. A schematic view of a portion of the cross section of the solar cell 40C in the MD direction. In the drawings, the same components as those of the dye-sensitized solar cell 40B of the fifth embodiment are denoted by the same reference numerals, and their description will be omitted.

The dye-sensitized solar cell 40C is electrically connected in series to a plurality of batteries. In FIG. 6, the configuration in which the unit cells C6, C7, C8, and C9 are arranged in series is shown. Each of the unit cells is subjected to the breaking required for the series connection by the slit S2. The lead wires (not shown) are connected to the electrodes constituting the unit cells, and the generated electric power is recovered. The installation location of the lead wiring is not particularly limited, and examples thereof include (+) and (-) portions shown in the drawings.

In the dye-sensitized solar cell 40C, the conductive member 7 is electrically connected to the transparent conductive film 1a of the first substrate 1 and the conductive layer 3a of the second substrate 3, and the negative electrode of the unit cell C6 is connected in series with the positive electrode of the unit cell C7. The negative electrode of the unit cell C7 is connected in series with the positive electrode of the unit cell C8, and the negative electrode of the unit cell C8 is connected in series with the positive electrode of the unit cell C9. Further, at the portion where the conductive member 7 is disposed, the notch S1 is provided on the second substrate 3, and the conductive member 7 is exposed to the second substrate 3 side. That is, the surface of the conductive member 7 is exposed by the slit S1 provided on the second substrate 3. By connecting the lead wires to the exposed conductive member 7, it is possible to recover the electricity emitted from the desired cut. In the dye-sensitized solar cell 40C, the lead wires of both the positive electrode and the negative electrode can be taken from the second substrate 3 side.

<Seventh embodiment>

An electric device according to a seventh embodiment of the present invention is an electric device obtained by the manufacturing method of the third embodiment. As an example of such an electric device, a dye-sensitized solar cell 40D is exemplified.

(Pigment sensitized solar cell 40D)

Fig. 7 is a schematic view showing a portion of a cross section in the MD direction of the dye-sensitized solar cell 40D cut out from a roll-shaped dye-sensitized solar cell at a specific length. In the drawings, the same components as those of the dye-sensitized solar cell 40D of the seventh embodiment are denoted by the same reference numerals, and their description is omitted.

The dye-sensitized solar cell 40D is electrically connected in series to a plurality of batteries. to In FIG. 7, the configuration in which the unit cells C10, C11, C12, and C13 are arranged in series is shown. Each of the unit cells is subjected to the breaking required for the series connection by the slit S2. The lead wires (not shown) are connected to the electrodes constituting the unit cells, and the generated electric power is recovered. The installation location of the lead wiring is not particularly limited, and examples thereof include (+) and (-) portions shown in the drawings.

In the dye-sensitized solar cell 40D, the conductive member 26 is electrically connected to the transparent conductive film 1a of the first substrate 1 and the conductive layer 3a of the second substrate 3, and the negative electrode of the unit cell C10 is connected in series with the positive electrode of the unit cell C11. The negative electrode of the unit cell C11 is connected in series with the positive electrode of the unit cell C12, and the negative electrode of the unit cell C12 is connected in series with the positive electrode of the unit cell C13. Further, at the portion where the conduction member 26 is disposed, the notch S1 is provided on the second substrate 3, and the conduction member 26 is exposed to the second substrate 3 side. That is, the surface of the conduction member 26 is exposed by the slit S1 provided on the second substrate 3. By connecting the lead wires to the exposed conductive members 26, it is possible to recover the electricity emitted from the desired cuts. In the dye-sensitized solar cell 40D, the lead wires of both the positive electrode and the negative electrode can be obtained from the second substrate 3 side.

The respective configurations, combinations, and the like of the embodiments described above are merely examples, and the additions, omissions, substitutions, and other modifications may be made without departing from the spirit and scope of the invention. Further, the present invention is not limited to the respective embodiments, but is limited only by the scope of the patent application (Claim).

[Industrial availability]

The electrical device and the method of manufacturing the same of the present invention can be widely applied to fields such as dye-sensitized solar cells.

1‧‧‧First substrate

2‧‧‧Sheet with attached material

2a‧‧‧Next material (sealing material)

2b‧‧‧ release sheet

3‧‧‧second substrate

4‧‧‧Electrical devices (dye sensitized solar cells)

11‧‧‧First roll

12‧‧‧second roll

13‧‧‧third roll

14‧‧‧fourth roller

15‧‧‧ fifth roller

16‧‧‧6th roller

17‧‧‧ seventh roll

18‧‧‧ eighth roller

19‧‧‧9th roller

20‧‧‧Solid drop device

21‧‧‧Laminating machine

22‧‧‧Feed institutions

Claims (12)

A method of manufacturing an electrical device, comprising the steps of: superposing a sheet on which a subsequent material is disposed on a first substrate, transferring the subsequent material from the sheet to the first substrate, and superposing the second substrate on the second substrate The material and the first substrate are bonded to the first substrate and the second substrate by the bonding material. The method of manufacturing an electrical device according to claim 1, wherein the first substrate, the sheet on which the adhesive material is disposed, and the second substrate are respectively wound from a roll by a roll to roll The method continuously bonds the first substrate and the second substrate with the adhesive material. The method of manufacturing an electrical device according to claim 1 or 2, wherein the adhesive material is previously patterned and disposed on the sheet. The method of manufacturing an electrical device according to any one of claims 1 to 3, wherein the adhesive material is an integral material of the insulating adhesive material and the conductive member, and the material is used in the manufacturing method. The insulating bonding material is bonded to the first substrate and the second substrate, and the first substrate and the second substrate are electrically connected by the conductive member. The method of manufacturing an electrical device according to any one of claims 1 to 3, wherein the adhesive material is a conductive adhesive material, and the conductive substrate is bonded to the first substrate by the conductive adhesive material. And the second substrate is electrically connected to the second substrate at the same time. The method of manufacturing an electric device according to any one of claims 1 to 3, wherein an insulating material and a conductive bonding material are used as the bonding material, and in the manufacturing method, the insulating property is used. The material is then bonded to the first substrate and the second substrate, and the first substrate and the second substrate are electrically connected by the conductive bonding material. The method of manufacturing an electric device according to any one of claims 2 to 6, wherein the electric device is a dye-sensitized solar cell, and in the manufacturing method, the porous film constituting the photoelectrode is disposed a first substrate on which the roll is wound, the sheet on which the adhesive material is placed in advance is superposed on the first substrate including the porous film, and the adhesive material is transferred to the first substrate. The porous film is surrounded by the adhesive material, and the electrolyte is supplied to the inner side of the frame formed of the adhesive material, and the second substrate constituting the opposite electrode is superposed on the first substrate, and the adhesive material is bonded to the first substrate. a substrate and the second substrate, and the electrolyte is sealed by the bonding material. The method of manufacturing an electric device according to any one of claims 2 to 6, wherein the electric device is a dye-sensitized solar cell, and in the manufacturing method, a porous film constituting the photoelectrode is disposed in advance. The first substrate is taken up from the roller, and the sheet on which the adhesive material is placed in advance is superposed on the first substrate including the porous film, and the adhesive material is transferred to the first substrate, and the subsequent The material surrounds the porous film, and supplies the electrolyte to the inner side of the frame formed by the adhesive material, and the second substrate constituting the opposite electrode is superposed on the first substrate, and the first substrate is bonded to the first substrate by the bonding material The second substrate and sealing the electrolyte by the bonding material. The method of manufacturing an electrical device according to any one of claims 1 to 8, wherein at least a part of an adhesive material disposed on the sheet material is a hardening resin in an incompletely cured state, and in the manufacturing method, The transfer is performed by bringing the bonding material into contact with the first substrate. The method of manufacturing an electrical device according to any one of claims 1 to 8, wherein at least a part of an adhesive material disposed on the sheet material is a thermoplastic resin, and in the manufacturing method, the adhesive material is contacted The transfer is performed on the first substrate. The method of manufacturing an electrical device according to any one of claims 1 to 10, wherein at least a part of the adhesive material is a thermosetting resin or a thermoplastic resin, and in the manufacturing method, the second substrate is overlapped with The bonding material and the first substrate are heated, and the first substrate and the second substrate are bonded together. An electrical device manufactured by the manufacturing method of any one of claims 1 to 11.