WO2017099217A1 - Electrical module and method for manufacturing same - Google Patents

Abstract

This electrical module of the present invention is an electrical module equipped with a first electrode in which a transparent conductive film is formed on the plate surface of a first substrate and a semiconductor layer is formed on the surface of the transparent conductive film, and a second electrode in which an opposing conductive film is formed on the plate surface of a second substrate so as to oppose the transparent conductive film, a sealing member being used to bond the first electrode and the second electrode together at the first substrate edge and the second substrate edge, the space formed between the first electrode and the second electrode being subdivided into a plurality of cells according to patterning locations, and an electrolyte being sealed in the cells. A welding portion where the plate surface of the first substrate and the plate surface of the second substrate are directly abutting is provided inside a frame comprising the sealing member and patterning locations.

Description

Electric module and manufacturing method thereof

The present invention relates to an electric module and a manufacturing method thereof.
This application claims priority based on Japanese Patent Application No. 2015-240351 for which it applied to Japan on December 9, 2015, and uses the content here.

When manufacturing a dye-sensitized solar cell which is an example of an electric module by Roll to Roll, it is necessary to enclose an electrolytic solution. In a dye-sensitized solar cell, generally, a sealing material prevents leakage of an electrolytic solution.
In Roll to Roll, in-line or long work in progress is made (only the beginning and end of winding are sealed, regardless of method), and a predetermined size (length) according to the order. Therefore, it can be cut and sealed in a direction perpendicular to the line flow direction (see, for example, Patent Document 1).

International Publication No. 2014/0303076

In the manufacture of a dye-sensitized solar cell, when the area of one cell is large with respect to the entire module, the amount of the electrolytic solution is increased, and thus the electrolyte is biased in the cell. When the electrolyte is biased, there is a problem that excessive pressure is applied to the sealing material and the sealing material is easily broken.

This invention is made | formed in view of the said situation, Comprising: It aims at providing the electric module which prevented the bias | inclination of the electrolyte solution in a cell, and its manufacturing method.

[1] A transparent conductive film is formed on the plate surface of the first substrate and a semiconductor layer is formed on the surface of the transparent conductive film, and the transparent electrode is opposed to the plate surface of the second substrate. A second electrode on which a counter conductive film is formed, and a sealing material between the first electrode and the second electrode at an edge of the first substrate and an edge of the second substrate A space formed between the first electrode and the second electrode is partitioned into a plurality of cells by patterning locations, and an electrolyte is sealed in the cells, An electric module, wherein a welded portion in which a plate surface of the first substrate and a plate surface of the second substrate are in direct contact with each other is provided in a frame composed of a stopper and the patterning portion.

[2] The electrical module according to [1], wherein the weld portion is provided at 1 to 10 locations per unit area of 26 cm ^{2 of the} cell.

[3] The electric module according to [1] or [2], wherein when the welded portion is viewed in plan, the area of each welded portion is 1 mm ² to 100 mm ² .

[4] A first electrode having a transparent conductive film formed on the plate surface of the first substrate and a semiconductor layer formed on the surface of the transparent conductive film; and a plate surface of the second substrate facing the transparent conductive film. A second electrode on which a counter conductive film is formed, and a sealing material between the first electrode and the second electrode at an edge of the first substrate and an edge of the second substrate A space formed between the first electrode and the second electrode is partitioned into a plurality of cells by patterning locations, and an electrolyte is sealed in the cells. A bonding step of bonding the first electrode and the second electrode with the transparent conductive film and the counter conductive film facing each other, and a back surface of the first substrate on which the transparent conductive film is formed or From one of the back surfaces of the second substrate on which the counter conductive film is formed, Wave vibration is applied, and the first substrate and the second substrate that are located at the location where the ultrasonic vibration is applied are brought into contact with each other to insulate the first substrate and the second substrate. And dividing the first electrode and the second electrode to form the cell, and in the frame made of the sealing material and the patterning portion, the first substrate and The plate surfaces facing each other of the second substrate are brought into contact with each other and insulated, and the first substrate and the second substrate are welded, and the plate surface of the first substrate and the plate surface of the second substrate are directly connected to each other. And a welding step of forming a welded portion that abuts.

[5] In the welding step, ultrasonic vibration is applied from either the back surface of the first substrate on which the transparent conductive film is formed or the back surface of the second substrate on which the counter conductive film is formed. The method for manufacturing an electric module according to [4], wherein the welded portion located at a location to which the ultrasonic vibration is applied is formed.

[6] The method for manufacturing an electric module according to [4] or [5], wherein, in the welding step, the welding portion is formed at 1 to 10 locations per unit area of 26 cm ^{2 of the} cell.

[7] In the welding process, according to any one of the area per one place when the plan view, and forming the weld portion so as to ^{1mm 2 ~ 100mm 2 [4]} ~ [6] Method of manufacturing the electrical module.

According to the present invention, it is possible to provide an electric module and a method for manufacturing the same that prevent the uneven electrolyte in the cell.

It is sectional drawing which showed typically one Embodiment of the electrical module obtained by the manufacturing method of the electrical module of this invention. FIG. 5 is a cross-sectional view showing a part of the manufacturing process of the electrical module shown as the first embodiment of the method for manufacturing the electrical module of the present invention, in which the first electrode and the second electrode are arranged to face each other. FIG. 5 is a cross-sectional view showing a first electrode, which is a part of the manufacturing process of the electric module shown as the first embodiment of the method for manufacturing the electric module of the present invention. It is sectional drawing which showed a part of manufacturing process of the electrical module shown as 1st Embodiment of the manufacturing method of the electrical module of this invention. It is a bottom view of the 1st electrode which showed a part of manufacturing process of an electric module shown as a 1st embodiment of a manufacturing method of an electric module of the present invention. It is the top view which showed a part of manufacturing process of the electrical module shown as 1st Embodiment of the manufacturing method of the electrical module of this invention. It is the top view which showed a part of manufacturing process of the electrical module shown as 1st Embodiment of the manufacturing method of the electrical module of this invention. It is the top view which showed a part of manufacturing process of the electrical module shown as 1st Embodiment of the manufacturing method of the electrical module of this invention. It is the top view which showed a part of manufacturing process of the electrical module shown as 1st Embodiment of the manufacturing method of the electrical module of this invention. It is the top view which showed a part of manufacturing process of the electric module shown as the 1st Embodiment of this invention. FIG. 9 is a cross-sectional view of the electric module shown as the first embodiment of the method for manufacturing the electric module of the present invention as viewed in the direction of arrows X1-X1 shown in FIG. FIG. 9 is a cross-sectional view taken along the line X2-X2 shown in FIG. 8 of the electric module shown as the first embodiment of the method for manufacturing the electric module of the present invention. It is the perspective view which showed typically the manufacturing process of the electrical module shown as 2nd Embodiment of the manufacturing method of the electrical module of this invention. It is the perspective view which showed typically the manufacturing process of the electrical module shown as 3rd Embodiment of the manufacturing method of the electrical module of this invention. It is the perspective view which showed typically the manufacturing process of the electrical module shown as 3rd modification embodiment of the manufacturing method of the electrical module of this invention.

Embodiments of an electric module and a method for manufacturing the same according to the present invention will be described below with reference to the drawings.
Note that this embodiment is specifically described in order to better understand the gist of the invention, and does not limit the present invention unless otherwise specified.

[Electric module]
An embodiment of the electric module of the present invention will be described.
In the present specification, the “cell” means a single dye-sensitized solar cell. In the present specification and claims, an “electric module” means a unit having a single cell or a plurality of cells. This embodiment shows an aspect of an electric module obtained by dividing a single cell for convenience in order to simply explain the present invention, but the present invention is not limited to this.

As shown in FIG. 1, the dye-sensitized solar cell 1 </ b> A includes a first electrode 5 having a transparent conductive film 3 and a semiconductor layer 4 on a first substrate 2, a counter conductive film 7 and a second substrate 6. And a second electrode 9 provided with a catalyst layer 8. And between the 1st electrode 5 and the 2nd electrode 9, it is a frame shape with the sealing material 11 in the edge of the 1st board | substrate 2 and the edge of the 2nd board | substrate 6 in the state which interposed the separator 12. The space surrounded by the sealing material 11 is divided into a plurality of cells C by welding the first substrate 2 and the second substrate 6. In other words, the first electrode 5 and the second electrode 9 are bonded by the sealing material 11 at the edge of the first substrate 2 and the edge of the second substrate 6, and the first electrode 5 and the second electrode 9 are bonded. The space formed between the two cells is partitioned into a plurality of cells C by patterning locations P, and each cell C is filled with an electrolyte solution 13 and sealed. Further, in the cell C, a welded portion 10 in which the plate surface 2 a of the first substrate 2 and the plate surface 6 a of the second substrate 6 are in direct contact is provided in a frame made up of the sealing material 11 and the patterning portion P. .
In the present invention, the dye-sensitized solar cell 1 </ b> A may not include the separator 12.

The 1st board | substrate 2 and the 2nd board | substrate 6 are the members used as the base of the transparent conductive film 3 and the opposing conductive film 7, respectively, For example, transparent thermoplastics, such as a polyethylene naphthalate (PEN) and a polyethylene terephthalate (PET) A flat plate member made of resin is cut into a substantially rectangular shape. The first substrate 2 and the second substrate 6 may be formed in a film shape.

The transparent conductive film 3 is formed on substantially the entire plate surface 2 a of the first substrate 2.
As a material of the transparent conductive film 3, for example, indium tin oxide (ITO), zinc oxide or the like is used.

The semiconductor layer 4 has a function of receiving and transporting electrons from a sensitizing dye described later. The semiconductor layer 4 is provided on the surface 3a of the transparent conductive film 3 by a semiconductor made of a metal oxide. Examples of the metal oxide include titanium oxide (TiO ₂ ), zinc oxide (ZnO), and tin oxide (SnO ₂ ).

The semiconductor layer 4 carries a sensitizing dye. The sensitizing dye is composed of an organic dye or a metal complex dye. Examples of organic dyes include various organic dyes such as coumarin, polyene, cyanine, hemicyanine, and thiophene. As the metal complex dye, for example, a ruthenium complex is preferably used.
Thus, the first electrode 5 is configured by forming the transparent conductive film 3 on the plate surface 2 a of the first substrate 2 and providing the semiconductor layer 4 on the surface 3 a of the transparent conductive film 3.

The counter conductive film 7 is formed on the entire plate surface 6 a of the second substrate 6.
As the material of the counter conductive film 7, for example, indium tin oxide (ITO), zinc oxide, or the like is used. A catalyst layer 8 made of carbon paste, platinum or the like is formed on the surface 7 a of the counter conductive film 7.
In this way, the second electrode 9 is configured by forming the counter conductive film 7 on the plate surface 6 a of the second substrate 6 and forming the catalyst layer 8 on the surface 7 a of the counter conductive film 7.
The second electrode 9 is disposed opposite to the first electrode 5 with the opposing conductive film 7 facing the transparent conductive film 3.

The sealing material 11 is not particularly limited, and a curable resin, a hot melt resin, or the like is used.
This sealing material 11 has a frame on the surface of the transparent conductive film 3 along the entire circumference of the edges R1 to R4 of the first electrode 5 arranged in a strip shape shown in FIG. Arranged. The sealing material 11 is cured or heat pressed to bond the first electrode 5 and the second electrode 9 together. The sealing material 11 may be disposed along the entire circumference of the edge of the second electrode 9, or at a part or all of the edges of both the first electrode 5 and the second electrode 9. The sealing material 11 may be disposed only on a part of the edges R1 to R4 of the first electrode 5. For example, as in a third embodiment to be described later, the sealing material 11 is disposed along the edges R1 and R2 of the first electrode 5 or the second electrode 9, and is disposed along the edges R3 and R4. You may make it the structure which is not carried out.

As the separator 12 shown in FIG. 1, a sheet material such as a nonwoven fabric having a large number of holes (not shown) through which the sealing material 11 and the electrolytic solution (electrolyte) 13 pass is used.
However, as will be described later, the separator 12 may not be used in the present invention.

Examples of the electrolytic solution 13 include non-aqueous solvents such as acetonitrile and propionitrile; liquid components such as ionic liquid such as dimethylpropylimidazolium iodide or butylmethylimidazolium iodide; and a supporting electrolytic solution such as lithium iodide. A solution or the like in which iodine and iodine are mixed is used. The electrolytic solution 13 may contain t-butylpyridine in order to prevent reverse electron transfer reaction.

The welded portion 10 is provided in the cell C to directly contact the plate surface 2 a of the first substrate 2 and the plate surface 6 a of the second substrate 6. The shape of the welded portion 10 when viewed in plan (when viewed from the normal direction of the plate surface 2a of the first substrate 2 or the plate surface 6a of the second substrate 6) is not particularly limited. Examples include a shape, a square, a rectangle, a triangle, and a pentagon or more polygon (see FIG. 6).
As will be described later, the welded portion 10 is a portion formed by melting the first substrate 2 and the second substrate 6 by ultrasonic vibration and welding them together.

The welded portion 10 is preferably provided at 1 to 10 locations per unit area 26 cm ² of the cell C, and more preferably at 1 to 5 locations.
By providing one to ten welds 10 per unit area 26 cm ² of the cell C, it is possible to prevent the electrolyte 13 from being biased in the cell C without impairing the power generation efficiency.

Further, when the welded part 10 is viewed in plan, the area per part of the welded part 10 is preferably 1 mm ² to 100 mm ² , and more preferably 1 mm ² to 25 mm ² .
When the welded part 10 is viewed in plan, the area per one part of the welded part 10 is 1 mm ² to 100 mm ² , thereby preventing the electrolyte 13 from being biased in the cell C without impairing the power generation efficiency. it can.

According to the dye-sensitized solar cell 1A of the present embodiment, the cell C is provided with the weld portion 10 where the plate surface 2a of the first substrate 2 and the plate surface 6a of the second substrate 6 are in direct contact. Therefore, it is possible to prevent the electrolyte 13 from being biased in the cell C. Thereby, since a predetermined amount of the electrolytic solution 13 can be present between the first electrode 5 and the second electrode 9, it is possible to prevent the power generation efficiency of the dye-sensitized solar cell 1A from being lowered.

[Method for producing dye-sensitized solar cell]
(First embodiment)
Next, a first embodiment of a method for manufacturing the dye-sensitized solar cell 1A will be described with reference to FIGS. 2A to 9B.
The manufacturing method of the dye-sensitized solar cell 1A of the present embodiment includes the following steps. A bonding step of bonding the first electrode 5 and the second electrode 9 with the transparent conductive film 3 and the counter conductive film 7 facing each other. Ultrasonic vibration is applied from either the back surface of the first substrate 2 on which the transparent conductive film 3 and the semiconductor layer 4 are formed or the back surface of the second substrate 6 on which the counter conductive film 7 is formed. The plate surfaces 2a and 6a facing each other of the first substrate 2 and the second substrate 6 positioned at the place where the vibration is applied are brought into contact with each other and insulated, and a plurality of cells C separated from each other are formed by welding. Splitting process. In the cell C, the back surface of the first substrate 2 on which the transparent conductive film 3 and the semiconductor layer 4 are formed or the second substrate on which the counter conductive film 7 is formed in a frame made of the sealing material 11 and the patterning portion P. The ultrasonic vibration is applied from any one of the back surfaces of the plate 6, and the first and second substrates 2 and 6a located at the position where the ultrasonic vibration is applied are brought into contact with each other. A welding step of forming a welded portion 10 that is insulated and welded so that the plate surface 2a of the first substrate 2 and the plate surface 6a of the second substrate 6 directly contact each other.

In the present embodiment, the following is referred to as an electric module precursor. An electrolyte solution (electrolyte) 13 is sealed in a space formed between the first electrode 5 and the second electrode 9. An electrolyte solution (electrolyte) 13 is not sealed in a space formed between the first electrode 5 and the second electrode 9.
In an example of the manufacturing method of the present embodiment, (I) an electrode plate forming step is provided before the bonding step (II), and (IV) after the dividing step (III) and the welding step (IV). An electrical connection step, (V) a liquid injection hole forming step, (VI) a liquid injection step, and (VII) a liquid injection hole sealing step.
Hereinafter, each step will be described.

(I) <Electrode plate forming step>
In the electrode plate forming step, as shown in FIG. 2A, the first electrode in which the transparent conductive film 3 is formed on the plate surface 2 a of the first substrate 2 and the semiconductor layer 4 is formed on the surface 3 a of the transparent conductive film 3. 5 is formed. Further, a second electrode 9 in which the counter conductive film 7 is formed on the plate surface 6 a of the second substrate 6 and the catalyst layer 8 is formed on the surface 7 a of the counter conductive film 7 is formed.
Specifically, the first electrode 5 and the second electrode 9 are formed as follows.

As shown in FIG. 2A, a substrate made of PET or the like is used as the first substrate 2.
The transparent conductive film 3 is formed by sputtering indium tin oxide (ITO) or the like over the entire plate surface 2a of the first substrate 2.
The semiconductor layer 4 is formed on the surface 3a of the transparent conductive film 3 so as to be porous by, for example, a low-temperature film forming method that does not require baking, such as an aerosol deposition method or a cold spray method. At this time, as shown in FIG. 4, the conductor layer 4 is formed leaving the edges R1 to R4 to which the sealing material 11 is applied. Alternatively, the semiconductor layer 4 is formed while leaving at least one end edge R1 of the first substrate 2 in order to extract current or arrange a sealing material.

After forming the semiconductor layer 4, as shown in FIG. 2B, the semiconductor layer 4 is immersed in a sensitizing dye solution in which a sensitizing dye is dissolved in a solvent, and the sensitizing dye is supported on the semiconductor layer 4. The method of supporting the sensitizing dye on the semiconductor layer 4 is not limited to the above, and a method of continuously charging, dipping and pulling up while moving the semiconductor layer 4 in the sensitizing dye solution is also employed.
Thus, the first electrode 5 shown in FIG. 2B is obtained.

As shown in FIG. 2A, the second electrode 9 forms a counter conductive film 7 by sputtering ITO, zinc oxide, platinum or the like on the plate surface 6a of the second substrate 6 made of polyethylene terephthalate (PET) or the like. . The counter conductive film 7 may be formed by a printing method, a spray method, or the like. A carbon paste or the like is formed on the entire surface 7 a of the counter conductive film 7 to form the catalyst layer 8.

(II) <Lamination process>
As shown in FIG. 3, in the bonding step, the first electrode 5 and the second electrode 9 are bonded so as to face each other, and the respective edges R1 to R4 (see FIG. 4) are sealed as necessary. 11 is a step of forming an electrical module precursor that is sealed with 11 and includes the first electrode 5 and the second electrode 9.

"Arrangement of sealing material and injection hole forming member"
Specifically, as shown in FIG. 4, a sheet-like sheet formed in a frame shape having a predetermined width dimension on the entire periphery of the edges R1 to R4 of the transparent conductive film 3 along the undivided semiconductor layer 4. The sealing material 11 is disposed to surround the semiconductor layer 4. However, as described above, in the present invention, the sealing material 11 may be disposed only on a part of the edges R1 to R4 of the first electrode 5 (see, for example, the third embodiment). .
In addition, after arrange | positioning the sealing material 11, an electrolyte may be apply | coated on the semiconductor layer 4 or the opposing electrically conductive film 7, and the board | substrate mentioned later may be bonded after that. This electrolyte may be in a liquid, gel, or solid state.

Thereafter, a plurality of liquid injection hole forming members 19 are arranged at a predetermined interval on the edge R2 facing the one edge R1 of the first electrode 5. At this time, each injection hole forming member 19 is disposed so as to protrude from the edge R <b> 2 of the first substrate 2 across the sealing material 11.
As the injection hole forming member 19, a releasable resin sheet formed in a strip shape is used.
As the releasable resin sheet, for example, polyester, polyethylene terephthalate, polybutylene terephthalate, or the like is used.
The predetermined interval is an interval at which adjacent cells C and C are formed in the first electrode 5 (or the second electrode 9).

"Lamination of substrates"
Next, as shown in FIG. 3, the second electrode 9 is brought into contact with the first electrode 5 so that the transparent conductive film 3 and the counter conductive film 7 are opposed to each other with the separator 12 interposed. As will be described later, the separator 12 may not be used.

"Adhesion process"
In the bonding step, except for the one end edge R1 shown in FIG. 5 of the first electrode 5 and the second electrode 9 that are bonded together, the end edges R2 to R2 on which sealing materials 11 made of a curable resin, a hot-melt resin, or the like are disposed. R4 is pressed in the stacking direction, and the sealing material 11 is cured or heated, and the sealing material 11 is bonded to the first electrode 5 and the second electrode 9. At this time, the sealing material 11 does not adhere to the injection hole forming member 19. This is because the injection hole forming member 19 has a heat resistant temperature higher than the melt curing temperature of the sealing material 11 and is excellent in non-adhesiveness. Therefore, both surfaces of the injection hole forming member 19 are not bonded to the first electrode 5 and the second electrode 9.
In the present embodiment, an example of a method in which a liquid injection hole is provided in advance and liquid injection is performed after the bonding step has been described, but the present invention is not limited to this. For example, an electrolytic solution may be applied in advance, and press bonding or vacuum bonding may be used.

(III) <Division process>
In the dividing step, as shown in FIG. 6, on the boundary that partitions the space formed by the first electrode 5 and the second electrode 9 into a plurality of cells C, C... .., So that the back surface 2b of the first substrate 2 on which the transparent conductive film 3 is formed (see FIG. 3) or the back surface 6b of the second substrate 6 on which the counter conductive film 7 is formed (see FIG. 3). ) To apply ultrasonic vibration.

Then, the transparent conductive film 3 and the semiconductor layer 4 formed on the first substrate 2 are diffused by ultrasonic vibration. At the same time, the opposing conductive film 7 and the catalyst layer 8 facing the transparent conductive film 3 are diffused by ultrasonic vibration. As a result, as shown in FIG. 1, cracks occur in the transparent conductive film 3, the semiconductor layer 4, the counter conductive film 7, and the catalyst layer 8 at positions facing each other, and the plate surface 2 a of the first substrate 2 and the second substrate 6. The plate surface 6a contacts. Further, the first substrate 2 and the second substrate 6 are melted by ultrasonic vibration and welded to each other. As a result, as shown in FIG. 6, a plurality of cells C, C... Divided into each other are formed in the frame of the sealing material 11 arranged so as to surround the semiconductor layer 4.

In this embodiment, the case where ultrasonic vibration is applied from the back surface 2b of the first substrate 2 is exemplified, but the present invention is not limited to this. In the present invention, ultrasonic vibration can be applied from either the back surface 2 b of the first substrate 2 or the back surface 6 b of the second substrate 6.

The ultrasonic vibration is performed at a predetermined output that can be welded while patterning the first electrode 5 and the second electrode 9 simultaneously and reliably.

(IV) <Welding process>
In the welding step, as shown in FIG. 6, the back surface 2b of the first substrate 2 on which the transparent conductive film 3 is formed in the portion where the patterning portions P and P and the sealing material 11 are not provided in the cell C (see FIG. 6). The ultrasonic vibration is applied from either one of the back surface 6b (see FIG. 3) of the second substrate 6 on which the counter conductive film 7 is formed (see FIG. 3).

Then, the transparent conductive film 3 and the semiconductor layer 4 formed on the first substrate 2 are destroyed by ultrasonic vibration, and the opposing conductive film 7 and the catalyst layer 8 facing the transparent conductive film 3 are similarly formed. It is destroyed by ultrasonic vibration. As a result, as shown in FIG. 1, cracks occur in the transparent conductive film 3, the semiconductor layer 4, the counter conductive film 7, and the catalyst layer 8 at positions facing each other, and the plate surface 2 a of the first substrate 2 and the second substrate 6. The plate surface 6a contacts. Further, the first substrate 2 and the second substrate 6 are melted by ultrasonic vibration and welded to each other, and as shown in FIG. 6, the sealing material 11 disposed so as to surround the semiconductor layer 4. And in the frame which consists of the patterning location P, the welding part 10 which the plate surface 2a of the 1st board | substrate 2 and the plate surface 6a of the 2nd board | substrate 6 contact | abutted directly is formed.

In the welding step, it is preferable to form the welded portion 10 at 1 to 10 locations per unit area 26 cm ² of the cell C, and more preferably at 1 to 5 locations.
Further, in the welding step, it is preferable to form the welded portion 10 so that the area per location when viewed in plan is 1 mm ² to 100 mm ^2, and the area when viewed in plan is 1 mm ² to 25 mm ^2. It is more preferable to form the welded portion 10 on the surface.

(V) <Electrical connection process>
In the electrical connection step, a notch 15 straddling between adjacent cells C and C is formed as shown in FIG. 7A at one end edge R1 which is pressed and cured in the laminating direction or is not bonded by heating. As shown in FIG. 5, the conductive members 16, 16... Are arranged in the notches 15, 15. Thereafter, the one end R1 is bonded by a hot press to close the one end R1.
As described above, the first electrode 5 and the second electrode 9 are bonded at the edges R1 to R4 except for the position where the liquid injection hole forming member 19 is disposed.

(VI) <Injection hole forming step>
In the liquid injection hole forming step, as shown in FIG. 8, the liquid injection hole forming members 19, 19 protruding from the edge of the first substrate 2 are pulled out, the cell C is opened, and an electrolyte can be injected. Liquid holes 17, 17... Are formed.
Through the above steps, a joined body 1a in which cells C, C... Are formed between the first electrode 5 and the second electrode 9 is obtained.

(VII) <Liquid injection process>
In the liquid injection process, the joined body 1a of the first electrode 5 and the second electrode 9 obtained in the above-described process is placed in a reduced pressure atmosphere, and the liquid injection holes 17, 17 is immersed and the electrolytic solution 13 is injected into the cell C by evacuation.

(VIII) <Injection hole sealing step>
Thereafter, in the injection hole sealing step, after injection of the electrolytic solution 13, the injection holes 17, 17... Are closed with an adhesive or the like to seal the cell C, and a plurality of cells C, C. A dye-sensitized solar cell 1A shown in FIGS. 9A and 9B connected in series is obtained.

As described above, according to the method for manufacturing the dye-sensitized solar cell 1A of the present embodiment, in the cell C, the plate surface 2a of the first substrate 2 and the plate surface 6a of the second substrate 6 are in direct contact with each other. Since it has the welding process which forms the part 10, the bias | inclination of the electrolyte solution 13 in the cell C can be prevented by the welding part 10 formed in the welding process. Thereby, since a predetermined amount of the electrolytic solution 13 can be present between the first electrode 5 and the second electrode 9, it is possible to prevent the power generation efficiency of the dye-sensitized solar cell 1A from being lowered.

Since the patterning is performed using the ultrasonic vibration after the first electrode 5 and the second electrode 9 are bonded together, the patterning and the welding position P coincide with each other. Therefore, the effect that the division between the cells C and C can be performed easily and accurately is obtained.
According to the dye-sensitized solar cell 1A having a plurality of cells C, C... Manufactured by the method for manufacturing the dye-sensitized solar cell 1A of the present embodiment, the cells C and C are sealed together. After insulating without using a stopper, it is possible to weld and divide the insulated portions. Therefore, it is possible to reduce the material cost and to suppress the deterioration of the electrolytic solution 13 due to the contact with the sealing material 11.

In the present embodiment, the second electrode 9 is brought into contact with the first electrode 5 so that the transparent conductive film 3 and the counter conductive film 7 face each other with the separator 12 interposed. This is because in the dividing step, when a portion where the first electrode 5 and the second electrode 9 are in contact with each other in the patterning portion P and in the vicinity thereof is energized, the battery may be short-circuited.
However, in the present invention, since patterning is performed using ultrasonic vibration, cracks are generated in the transparent conductive film 3, the semiconductor layer 4, the counter conductive film 7, and the catalyst layer 8 at positions where the patterning portions P face each other. Further, cracks are also generated in the vicinity of the patterning portion P. Therefore, there is no portion where the first electrode 5 and the second electrode 9 are in contact with each other in the patterning portion P and the vicinity thereof. Therefore, in the present invention, even if the separator 12 is not used, the first electrode 5 and the second electrode 9 can be reliably insulated at the patterning portion P, so that the battery is not short-circuited.

(Second Embodiment)
Next, 2nd Embodiment of the manufacturing method of 1 A of dye-sensitized solar cells is described using FIG.
In the present embodiment, the same configurations and processes as those in the first embodiment described above are denoted by the same reference numerals, and descriptions of the configurations and processes are omitted, and only configurations and processes different from those in the first embodiment will be described. .
The manufacturing method of the dye-sensitized solar cell 1A according to the present embodiment is a long process in which a plurality of semiconductor layers 4 are formed and wound in a roll from (I) electrode plate forming step to (III) dividing step. The point which manufactures the dye-sensitized solar cell 1A by continuously performing the work of each process using the long strip-shaped second electrode 9 wound in a roll shape like the strip-shaped first electrode 5. This is different from the method for manufacturing the dye-sensitized solar cell 1A of the first embodiment.

(I) Electrode plate formation step The first electrode 5 is a transparent conductive film formed on the entire plate surface 2a at a predetermined position by pulling out the strip-shaped first substrate 2 wound in a roll shape in one direction (arrow L direction). 3 is formed, and the semiconductor layer 4 is intermittently provided in the direction of the arrow L, leaving edges (outer circumferences) R1 to R4 on the surface 3a of the transparent conductive film 3 on the downstream side of the film formation position of the transparent conductive film 3. Establish and produce. Adsorption of the sensitizing dye in the semiconductor layer 4 can be performed by spray coating, for example.
The second electrode 9 draws out the strip-shaped second substrate 6 wound in a roll shape in the direction opposite to the one direction (arrow L direction), and forms the opposing conductive film 7 on the entire plate surface 6a at a predetermined position. Further, the catalyst layer 8 is formed on the entire surface 7 a of the counter conductive film 7 on the downstream side of the position where the counter conductive film 7 is formed.

(II) <Sealing process>
"Arrangement of sealing material and injection hole forming member"
For the arrangement of the sealing material 11, a sheet-like material formed in a frame shape so as to surround the semiconductor layers 4 intermittently formed at predetermined intervals on the first substrate 2 is used. . A region partitioned by the frame-shaped sealing material 11 is one unit T of the dye-sensitized solar cell 1A.
The liquid injection hole forming member 19 is disposed on the sealing material 11 extending along one end edge of the belt-like first substrate 2 as shown in the first embodiment.

"Lamination of substrates"
The strip-shaped first electrode 5 and the sealing material 11 disposed on the first electrode 5 formed as described above are provided with the separator 12 drawn in a strip shape, and further on the downstream side where the separator 12 is disposed. The second electrode 9 is disposed. Also in the second embodiment, the separator 12 may not be used for the same reason as in the first embodiment.

"Adhesion process"
The bonding step is performed in the same manner as in the first embodiment.

(III) <Division process>
In the dividing step, ultrasonic vibration is applied in a direction orthogonal to the arrow L direction so as to divide the inside of the frame of the sealing material 11 in the extending direction of the first electrode 5 and the second electrode 9, A plurality of cells C, C... Are formed between the second electrode 9. (III) The dividing step is performed in the same manner as in the first embodiment.

(IV) <Welding process>
In the welding step, the back surface 2b of the first substrate 2 on which the transparent conductive film 3 is formed or the counter conductive film 7 is formed in a portion of the cell C where the patterning portions P and P and the sealing material 11 are not provided. Ultrasonic vibration is applied from one of the back surfaces 6 b of the second substrate 6, and the first substrate 2 is placed in a frame made up of the sealing material 11 and the patterning portion P disposed so as to surround the conductor layer 4. The welding surface 10 in which the plate surface 2a and the plate surface 6a of the second substrate 6 are in direct contact is formed.

(IV) The welding process is performed in the same manner as in the first embodiment.
Then, (VI) cutting process is performed before or after (V) electrical connection process.
The cutting step is performed by cutting the first electrode 5 and the second electrode 9 that are attached to each other for each unit T of the one dye-sensitized solar cell 1A.
The (V) electrical connection step, (VII) liquid injection hole forming step, (VIII) liquid injection step, and (IX) liquid injection hole sealing step are performed in the same manner as the method in the first embodiment. The (VII) injection hole forming step may be performed before the (VI) cutting step.

As described above, the production of the dye-sensitized solar cell 1A is performed not on each of the dye-sensitized solar cells 1A but on the long strip-shaped first substrate 2 and the long strip-shaped second substrate 6. After the work of the process is continuously performed, and then the first electrode 5 and the second electrode 9 are bonded together, the plurality of joined bodies 1a shown in FIG. 8 or the dye-sensitized solar cell shown in FIG. By cutting 1A one by one, an effect that the dye-sensitized solar cell 1A can be efficiently manufactured is obtained.

Positioning of the first electrode 5 and the second electrode 9 also in the step of bonding and sealing the band-shaped first electrode 5 and the second electrode 9 and the step of forming a plurality of cells C, C. Can be easily sealed without considering the above, or the cells C and C can be insulated and welded very simply. Therefore, the effect that it becomes very efficient also in continuous manufacture of 1 A of dye-sensitized solar cells is acquired.

In the said 1st Embodiment and 2nd Embodiment, the structure which seals between the 1st electrode 5 and the 2nd electrode 9 for every dye-sensitized solar cell 1A using the sealing material 11 It was. In the first embodiment and the second embodiment, instead of sealing with the sealing material 11, ultrasonic vibration is applied to insulate and seal between the first electrode 5 and the second electrode 9. Thus, the dye-sensitized solar cell 1A may be formed.
In this case, in the production of the dye-sensitized solar cell 1A, the work of arranging the frame-shaped sealing material 11 so as to surround the semiconductor layer 4 is omitted, and sealing is more easily performed by ultrasonic welding. The effect that it can do is acquired. Further, the injection hole can be eliminated by bonding after applying the electrolytic solution. In this case, the welding process can be performed at an arbitrary place without considering the injection hole.

In the above-described embodiment, the position where the liquid injection hole forming member 19 is disposed and the position where the conductive material is disposed are different between the edges R1 and R2. As long as the liquid injection hole forming member 19 and the conductive material can be appropriately disposed, the position where the liquid injection hole forming member 19 is disposed and the position where the conductive material is disposed are adjacent to one of R1 and R2. It may be arranged as follows.
In the above embodiment, the position where the conductive material is disposed is either the end edge R1 or the end edge R2. However, the conductive material is disposed on both sides of the end edges R1 and R2, and the cells C and C are connected in parallel. It may be.

(Third embodiment)
Next, a third embodiment of the method for manufacturing the dye-sensitized solar cell 1A will be described with reference to FIG.
In the present embodiment, the same configurations and processes as those of the second embodiment described above are denoted by the same reference numerals, and descriptions of the configurations and processes are omitted, and only configurations and processes different from those of the second embodiment are described. .
In the manufacturing method of the dye-sensitized solar cell 1B of the present embodiment, the long band-like shape in which the semiconductor layer 4 is continuously formed in one direction from (I) the electrode plate forming step to (III) the welding step. Using the first electrode 5 and the long strip-shaped second electrode 9, the operations of each process are continuously performed. The dye-sensitized type of the second embodiment is that the bonded first electrode 5 and second electrode 9 are simultaneously insulated, welded and cut by applying ultrasonic vibration to seal and separate the cells from each other. It is different from the manufacturing method of the solar cell 1A.

(I) Electrode Plate Formation Process In the second embodiment described above, the semiconductor layer 4 is intermittently provided in the direction of the arrow L, leaving the edges (outer circumferences) R1 to R4 on the surface 3a of the transparent conductive film 3. did. In the present embodiment, the semiconductor layer 4 is formed continuously (so-called solid coating) on the surface 3a of the transparent conductive film 3 leaving the edges R1 and R2.

(II) <Lamination process>
In the second embodiment described above, a sheet-like one formed in a frame shape so as to surround the semiconductor layers 4 formed intermittently one by one is arranged on the surface of the first electrode 5, and the second electrode 9 and pasted together. In this embodiment, the sealing material 11 is arranged along the edges R1 and R2 of the first electrode 5 or the second electrode 9, that is, both ends in the width direction, in the extending direction, and in a strip shape. The first electrode 5 and the second electrode 9 are bonded and bonded together. Also in this embodiment, the separator 12 may not be used. As described in the first embodiment, in the present invention, patterning is performed using ultrasonic vibration. Therefore, cracks occur in the transparent conductive film 3, the semiconductor layer 4, the counter conductive film 7, and the catalyst layer 8 at positions where the patterning portions P are opposed to each other. Further, cracks are also generated in the vicinity of the patterning portion P. Therefore, a portion where the first electrode 5 and the second electrode 9 are in contact with each other in the patterning portion P and the vicinity thereof is not generated. Therefore, in the present invention, even if the separator 12 is not used, the first electrode 5 and the second electrode 9 can be reliably insulated at the patterning portion P, so that the battery is not short-circuited.

Then, insulation and welding are performed simultaneously by applying ultrasonic vibration in a direction orthogonal (crossing) to the extending direction of the bonded first electrode 5 and second electrode 9.
In addition to insulation and welding, cutting may be performed simultaneously. In the following, a case where cutting is performed at the same time in addition to insulation and welding will be described.
At this time, insulation, welding, and cutting between the first electrode 5 and the second electrode 9 by applying ultrasonic vibration are formed longer than the width of the bonded first electrode 5 and second electrode 9. The horn 20 is used, and ultrasonic vibration is simultaneously applied to the entire portion to be insulated, welded and cut, and simultaneously insulated, welded and cut.
When the conductive material is arranged in the L direction, if the horn 20 is configured to straddle the conductive material, the first electrode 5 and the second electrode 9 can be insulated, welded, and cut by ultrasonic vibration without destroying the conductive material. Can be performed simultaneously. In the first or second embodiment, when the conductive material is arranged in the L direction, the horn 20 can be configured to straddle the conductive material. Further, if the horn 20 does not straddle the conductive material, the conductive material is destroyed and electrical insulation can be obtained. In the first or second embodiment, the horn 20 can be configured not to straddle the conductive material for the same reason as in the third embodiment.
According to this embodiment, the injection hole can be eliminated by performing the bonding after applying the electrolytic solution. In this case, the welding process can be performed at an arbitrary place without considering the injection hole.

As described above, by performing the electrode plate forming step and the insulating, welding, and cutting steps of the first electrode and the second electrode as described above, the insulating, welding, and cutting steps can be simultaneously performed to reduce the manufacturing process. The effect that it can be obtained.
The transparent conductive film 3 and the semiconductor layer 4 of the first electrode are continuously formed in the extending direction of the first substrate, and the opposing conductive film 7 and the catalyst layer 8 of the second electrode are extended of the second substrate 6. The first electrode 5 and the second electrode 9 can be bonded together in a state where the film is continuously formed in the direction and the film is uniform (not patterned). Therefore, it is not necessary to consider the alignment in the extending direction of the first electrode 5 and the second electrode 9, and the cell or the electric module can be separated at an arbitrary position. Therefore, it is possible to easily bond the first electrode 5 and the second electrode 9 and to greatly reduce the manufacturing time of the dye-sensitized solar cell 1B.

Since the first electrode 5 and the second electrode 9 are wound in a roll shape and both are extended in one direction so that the above-described steps are continuously performed, so-called Roll-to-Roll production can be easily performed. The effect that the productivity of the solar cell 1B can be improved is obtained.

Further, in the electrode plate forming step, it is not necessary to determine the dimensions of the dye-sensitized solar cell 1B in advance and dispose the sealing material, and form the first electrode 5 and the second electrode 9 to extend them. Insulation, welding, and cutting can be performed simultaneously in the direction intersecting in the extending direction by ultrasonic vibration after bonding in the direction. Therefore, the dimensions of the dye-sensitized solar cell 1B in one direction are not restricted by the design of the first electrode 5 and the second electrode 9 formed in the electrode plate forming step, and the dye increase is performed when ultrasonic vibration is applied. The effect that the dimension of the sensitive solar cell 1B can be arbitrarily set is obtained.

According to the manufacturing method of the present embodiment, the electrolyte is applied or filled on the upper portion of the semiconductor layer 4 of the first electrode 5, and then the first electrode 5 and the second electrode 9 are disposed to face each other. It is also possible to make a module, and then to insulate, weld, and cut this single module simultaneously by ultrasonic vibration to re-divide into a plurality of dye-sensitized solar cells 1B. By taking such a method, automatic productivity is increased and productivity is further improved.

In the present embodiment, insulation, welding, and cutting in the direction crossing the extending direction L of the first electrode 5 and the second electrode 9 (that is, the width direction) are performed by applying ultrasonic vibration to the first substrate 2 and the second electrode 9. The plate surfaces 2a, 6a facing each other with the two substrates 6 are brought into contact with each other and welded, and further cut locally by heating. Thereafter, around the periphery of the dye-sensitized solar cell 1B including the cut portion. More preferably, a thermoplastic resin is provided and the inside of the dye-sensitized solar cell 1B is double-sealed to improve liquid tightness.

In the present embodiment, the portion where the first electrode 5 and the second electrode 9 are bonded together with the sealing material 11 may also be welded by ultrasonic vibration.
In the present embodiment, the patterned process is not performed on the first electrode 5 and the second electrode 9, but the semiconductor layer 4 is divided into a plurality of patterns parallel to the longitudinal extension direction L so that the semiconductor layers 4 are arranged in parallel. It may be formed (see FIG. 12), and may be patterned in a direction orthogonal to the longitudinal extending direction L. A plurality of patterns may be connected in series or in parallel. Even in that case, the effect of the present invention that the alignment of the first electrode 5 and the second electrode 9 in the L direction in the film transport direction is unnecessary is achieved. Although FIG. 12 shows an embodiment in which three semiconductor layers 4 are arranged in parallel, the present invention is not limited to this, and the semiconductor layer 4 can be divided into a desired number of patterns. By electrically connecting the divided cells, an electric module can be easily and efficiently manufactured.

Further, in the present embodiment, sealing, insulation, and cutting in the direction crossing the extending direction L of the first electrode 5 and the second electrode 9 (that is, the width direction) are performed by applying ultrasonic vibration to the first substrate. The plate surfaces 2a and 6a of the second substrate 6 and the second substrate 6 which are opposed to each other may be contacted, that is, insulated and welded, and then mechanically cut using the tip of the horn.

The method of welding the first electrode 5 and the second electrode 9 by applying ultrasonic vibration shown in the first or second embodiment and the insulation between the first electrode 5 and the second electrode 9 according to the third embodiment The dye-sensitized solar cells 1A and 1B can also be manufactured by appropriately combining welding and cutting methods. For example, in the third embodiment, the first electrode 5 and the second electrode 9 are insulated, welded, and cut in units of cell C. However, the cells C and C are insulated and welded to form a dye-sensitized solar cell. Insulation, welding, and cutting between the first electrode 5 and the second electrode 9 may be performed for each battery 1B.

Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples, but the present invention is not limited to the following examples.

[Comparative example]
As the transparent conductive substrate, a polyethylene terephthalate film on which an ITO film was formed was used. On the surface of the film on which the ITO film is formed, a titanium oxide paste for low-temperature film formation manufactured by Pexel is applied by screen printing and baked at 150 ° C. for 10 minutes in an air atmosphere. The film thickness is 10 μm and the length is 1 m. A titanium oxide porous film (semiconductor layer) having a width of 50 mm was formed. Then, two were formed at intervals along the width direction, and the 1st electrode was produced.
A polyethylene in which an encapsulating material is disposed in a frame shape on the end of the first electrode on the titanium oxide porous membrane side, and an ITO film having Pt as a catalyst as the second electrode is formed through the encapsulating material. A terephthalate film was bonded to form a cell in which the space between the first electrode and the second electrode was sealed. The sealing material was arranged in a frame shape for each titanium oxide porous film in the first electrode so that the cell was divided for each titanium oxide porous film. In addition, the first electrode and the second electrode were disposed so that the titanium oxide porous film in the first electrode and the ITO film in the second electrode face each other. The ITO film was subjected to a predetermined insulating process so as to have a series structure.
The solar cell precursor of the comparative example was produced through the above steps.
As the sealing material, Aron Melt (trade name) which is a hot melt adhesive manufactured by Toa Gosei Co., Ltd. was used. As the series wiring material, Sekisui Chemical Co., Ltd. conductive fine particle micropearl (trade name) was used.
An electrolytic solution was injected into a cell composed of the first electrode and the second electrode from an injection hole previously formed in the second electrode, and the electrolytic solution was filled in the cell. Thereafter, the injection hole was sealed with an adhesive to obtain a solar cell of a comparative example having a length of 1 m and having two cells.
This solar cell was suspended so that the length of the porous titanium oxide film was along the vertical direction and left for 24 hours.
After 24 hours, in the solar cell, the electrolytic solution accumulates vertically downward, and the sealing material is partially peeled between the first electrode and the second electrode, and the electrolytic solution to be present in each cell is It moved into another cell, and the electrolyte was biased in the cell. That is, the sealing material did not sufficiently fulfill the sealing function.
As a result, the performance as a battery was remarkably reduced, and an output decrease of more than 10% was observed.

[Example 1]
A solar cell precursor was produced in the same manner as in Comparative Example 1.
A horn having a circular contact surface and a diameter of 1 mm from the back surface of the first electrode on which an ITO film is formed at the center in the width direction of the portion of the solar cell precursor cell where no sealing material is provided. Ultrasonic vibration is applied by a horn of an ultrasonic fusing machine (USC Japan Co., Ltd.) with did. Over two cells, 324 welds having a diameter of 1 mm were formed at equal intervals (18 × 18) in an area range of 50 mm × 52 mm.
Example 1 After injecting an electrolytic solution into the solar cell precursor cell in which the welded portion was formed in the same manner as in the comparative example and filling the cell with the electrolytic solution, the injection hole was sealed with an adhesive. The solar cell was obtained.
This solar cell was suspended so that the length of the porous titanium oxide film was along the vertical direction and left for 24 hours.
After 24 hours, the electrolyte did not accumulate vertically downward in the solar cell, and there was no bias of the electrolyte in the cell. That is, the sealing material sufficiently fulfilled the sealing function.
Moreover, there was little fall of the performance as a battery, and the output fall was 10% or less.
Also, instead of the ultrasonic fusion machine made by U.C. Japan, a hand unit type ultrasonic fusion machine equipped with a horn with a diameter of 1 mm, or an ultrasonic fusion machine made by Branson with a horn with a diameter of 1 mm. Even when the machine was used, there was no bias of the electrolyte in the cell, and the sealing material sufficiently performed the sealing function.

[Example 2]
A solar cell precursor was produced in the same manner as in the comparative example.
A horn having a circular contact surface and a diameter of 1 mm from the back surface of the first electrode on which an ITO film is formed at the center in the width direction of the portion of the solar cell precursor cell where no sealing material is provided. Ultrasonic vibration is applied by a horn of an ultrasonic fusing machine (USC Japan Co., Ltd.) with did. 324 welds having a diameter of 1 mm were randomly formed in an area range of 50 mm × 52 mm over two cells.
Example 2 After injecting an electrolytic solution into the solar cell precursor cell in which the welded portion was formed in the same manner as in the comparative example and filling the cell with the electrolytic solution, the injection hole was sealed with an adhesive. The solar cell was obtained.
This solar cell was suspended so that the length of the porous titanium oxide film was along the vertical direction and left for 24 hours.
After 24 hours, the electrolyte did not accumulate vertically downward in the solar cell, and there was no bias of the electrolyte in the cell. That is, the sealing material sufficiently fulfilled the sealing function.
Moreover, there was little fall of the performance as a battery, and the output fall was 10% or less.
Also, instead of the ultrasonic fusion machine made by U.C. Japan, a hand unit type ultrasonic fusion machine equipped with a horn with a diameter of 1 mm, or an ultrasonic fusion machine made by Branson with a horn with a diameter of 1 mm. Even when the machine was used, there was no bias of the electrolyte in the cell, and the sealing material sufficiently performed the sealing function.

[Example 3]
A solar cell precursor was produced in the same manner as in the comparative example.
A horn having a circular contact surface and a diameter of 3 mm from the back surface of the first electrode on which an ITO film is formed at the center in the width direction of the portion of the solar cell precursor cell where no sealing material is provided. Ultrasonic vibration is applied by a horn of an ultrasonic fusing machine (USC Japan Co., Ltd.) with did. 100 welds with a diameter of 3 mm were formed at equal intervals (10 × 10) in an area range of 50 mm × 52 mm over two cells.
Example 3 An electrolytic solution was injected into a solar cell precursor cell having a welded portion in the same manner as in the comparative example, the electrolytic solution was filled into the cell, and the injection hole was sealed with an adhesive. The solar cell was obtained.
This solar cell was suspended so that the length of the porous titanium oxide film was along the vertical direction and left for 24 hours.
After 24 hours, the electrolyte did not accumulate vertically downward in the solar cell, and there was no bias of the electrolyte in the cell. That is, the sealing material sufficiently fulfilled the sealing function.
Moreover, there was little fall of the performance as a battery, and the output fall was 10% or less.
Moreover, instead of the ultrasonic fusion machine manufactured by U.C. Japan, a hand unit type ultrasonic fusion machine equipped with a horn with a diameter of 3 mm, or an ultrasonic fusion machine made with Branson with a horn with a diameter of 3 mm. Even when the machine was used, there was no bias of the electrolyte in the cell, and the sealing material sufficiently performed the sealing function.

[Example 4]
A solar cell precursor was produced in the same manner as in the comparative example.
A horn having a circular contact surface and a diameter of 5 mm from the back surface of the first electrode on which an ITO film is formed at the center in the width direction of the portion where the sealing material is not provided in the solar cell precursor cell Ultrasonic vibration is applied by a horn of an ultrasonic fusing machine (manufactured by U.C. Japan Co., Ltd.), and a welded part in which the polyethylene terephthalate film of the first electrode and the polyethylene terephthalate film of the second electrode are in direct contact with each other is formed. did. 64 welds with a diameter of 5 mm were formed at equal intervals (8 × 8) in an area range of 50 mm × 52 mm over two cells.
Example 4 After injecting an electrolytic solution into the solar cell precursor cell in which the welded portion was formed in the same manner as in the comparative example and filling the cell with the electrolytic solution, the injection hole was sealed with an adhesive. The solar cell was obtained.
This solar cell was suspended so that the length of the porous titanium oxide film was along the vertical direction and left for 24 hours.
After 24 hours, the electrolyte did not accumulate vertically downward in the solar cell, and there was no bias of the electrolyte in the cell. That is, the sealing material sufficiently fulfilled the sealing function.
Moreover, there was little fall of the performance as a battery, and the output fall was 10% or less.
Further, instead of the ultrasonic fusion machine manufactured by U.C. Japan, a hand unit type ultrasonic fusion machine equipped with a horn with a diameter of 5 mm, or an ultrasonic fusion machine made with Branson with a horn with a diameter of 5 mm. Even when the machine was used, there was no bias of the electrolyte in the cell, and the sealing material sufficiently performed the sealing function.

[Example 5]
A solar cell precursor was produced in the same manner as in the comparative example.
A horn having a circular contact surface and a diameter of 10 mm from the back surface of the first electrode on which an ITO film is formed at the center in the width direction of the portion where the sealing material is not provided in the solar cell precursor cell Ultrasonic vibration is applied by a horn of an ultrasonic fusing machine (USC Japan Co., Ltd.) with did. Thirty welds having a diameter of 10 mm were formed at equal intervals (6 × 5) in an area range of 50 mm × 52 mm over two cells.
Example 5 An electrolytic solution was injected into the solar cell precursor cell in which the welded portion was formed in the same manner as in the comparative example, the electrolytic solution was filled into the cell, and the injection hole was sealed with an adhesive. The solar cell was obtained.
This solar cell was suspended so that the length of the porous titanium oxide film was along the vertical direction and left for 24 hours.
After 24 hours, the electrolyte did not accumulate vertically downward in the solar cell, and there was no bias of the electrolyte in the cell. That is, the sealing material sufficiently fulfilled the sealing function.
Moreover, there was little fall of the performance as a battery, and the output fall was 10% or less.
Further, instead of the ultrasonic fusion machine manufactured by U.C. Japan, a hand unit type ultrasonic fusion machine equipped with a horn having a diameter of 10 mm, or an ultrasonic fusion machine produced by Branson having a horn having a diameter of 10 mm. Even when the machine was used, there was no bias of the electrolyte in the cell, and the sealing material sufficiently performed the sealing function.

"Example 6"
A solar cell precursor was produced in the same manner as in the comparative example.
In the solar cell precursor cell, the back surface of the first electrode on which the ITO film is formed and the back surface of the second electrode on which the ITO film is formed at the center in the width direction of the portion where the sealing material is not provided From the horn of an ultrasonic fusion machine (manufactured by U.C. Japan) having a square horn with a contact surface shape of 1 mm on a side, ultrasonic vibration is applied to the polyethylene terephthalate film of the first electrode and A welded portion in direct contact with the polyethylene terephthalate film of the second electrode was formed. Over two cells, 324 square welds each having a side length of 1 mm were formed at equal intervals (18 × 18) in an area range of 50 mm × 52 mm.
Example 6 After injecting an electrolytic solution into the solar cell precursor cell in which the welded portion was formed in the same manner as in the comparative example and filling the cell with the electrolytic solution, the injection hole was sealed with an adhesive. The solar cell was obtained.
This solar cell was suspended so that the length of the porous titanium oxide film was along the vertical direction and left for 24 hours.
After 24 hours, the electrolyte did not accumulate vertically downward in the solar cell, and there was no bias of the electrolyte in the cell. That is, the sealing material sufficiently fulfilled the sealing function.
Moreover, there was little fall of the performance as a battery, and the output fall was 10% or less.
In addition, instead of the ultrasonic fusion machine manufactured by U.C. Japan, a hand unit type ultrasonic fusion machine equipped with a square horn with a side length of 1 mm, or a square with a side length of 1 mm. Even when a Branson ultrasonic fusion machine equipped with a horn was used, there was no bias in the electrolyte in the cell, and the sealing material sufficiently performed the sealing function.

"Example 7"
A solar cell precursor was produced in the same manner as in the comparative example.
In the solar cell precursor cell, the back surface of the first electrode on which the ITO film is formed and the back surface of the second electrode on which the ITO film is formed at the center in the width direction of the portion where the sealing material is not provided Then, ultrasonic vibration is applied by a horn of an ultrasonic fusion machine (manufactured by UC Japan) having a rectangular horn with a contact surface shape of 1 mm × 2 mm, and a polyethylene terephthalate film and a second electrode of the first electrode The welded part was in direct contact with the polyethylene terephthalate film. 100 rectangular welds of 1 mm × 2 mm were formed at equal intervals (10 × 10) in an area range of 50 mm × 52 mm over two cells.
Example 7 An electrolytic solution was injected into the solar cell precursor cell in which the welded portion was formed in the same manner as in the comparative example. After filling the cell with the electrolytic solution, the injection hole was sealed with an adhesive. The solar cell was obtained.
This solar cell was suspended so that the length of the porous titanium oxide film was along the vertical direction and left for 24 hours.
After 24 hours, the electrolyte did not accumulate vertically downward in the solar cell, and there was no bias of the electrolyte in the cell. That is, the sealing material sufficiently fulfilled the sealing function.
Moreover, there was little fall of the performance as a battery, and the output fall was 10% or less.
In addition, instead of the ultrasonic fusion machine manufactured by U.C. Japan, a hand unit type ultrasonic fusion machine equipped with a 1 mm × 2 mm rectangular horn, or a Branson company equipped with a 1 mm × 2 mm rectangular horn Even when a manufactured ultrasonic fusion machine was used, there was no bias in the electrolyte in the cell, and the sealing material sufficiently performed the sealing function.

"Example 8"
In the solar cell precursor produced in Example 5, the welded portion having a diameter of 10 mm is located at a position of 40 mm from the lower end of the portion corresponding to the lower side in a state where the porous titanium oxide film is suspended so as to be along the vertical direction. One was added to form.
Example 8 After injecting an electrolytic solution into the solar cell precursor cell in which the welded portion was formed and filling the cell with the electrolytic solution in the same manner as in the comparative example, the injection hole was sealed with an adhesive. The solar cell was obtained.
This solar cell was suspended so that the length of the porous titanium oxide film was along the vertical direction and left for 24 hours.
After 24 hours, the electrolyte did not accumulate vertically downward in the solar cell, and there was no bias of the electrolyte in the cell. That is, the sealing material sufficiently fulfilled the sealing function.
Moreover, there was little fall of the performance as a battery, and the output fall was 10% or less.

The present invention can be used in the field of electrical modules such as dye-sensitized solar cells.

1A Dye-sensitized solar cell 2 First substrate 3 Transparent conductive film 4 Semiconductor layer 5 First electrode 6 Second substrate 7 Opposing conductive film 8 Catalyst layer 9 Second electrode 10 Welding portion 11 Sealing material 12 Separator 13 Electrolytic solution 15 Notch 16 Conducting member 17 Injection hole 19 Injection hole forming member 20 Horn

Claims (7)

1. A first electrode having a transparent conductive film formed on the plate surface of the first substrate and a semiconductor layer formed on the surface of the transparent conductive film, and a plate surface of the second substrate opposed to the transparent conductive film. A second electrode on which a conductive film is formed, and the first electrode and the second electrode are bonded by an encapsulant between an edge of the first substrate and an edge of the second substrate. An electric module in which a space formed between the first electrode and the second electrode is partitioned into a plurality of cells by patterning locations, and an electrolyte is sealed in the cells,
   An electric module, wherein a welded portion in which a plate surface of the first substrate and a plate surface of the second substrate directly contact each other is provided in a frame formed of the sealing material and the patterning portion.
2. The electrical module according to claim 1, wherein the welded portion is provided at 1 to 10 locations per unit area of 26 cm ^{2 of the} cell.
3. 3. The electric module according to claim 1, wherein when the welded part is viewed in plan, an area per one part of the welded part is 1 mm ² to 100 mm ² .
4. A first electrode having a transparent conductive film formed on the plate surface of the first substrate and a semiconductor layer formed on the surface of the transparent conductive film, and a plate surface of the second substrate opposed to the transparent conductive film. A second electrode on which a conductive film is formed, and the first electrode and the second electrode are bonded by an encapsulant between an edge of the first substrate and an edge of the second substrate. A method of manufacturing an electric module in which a space formed between the first electrode and the second electrode is partitioned into a plurality of cells by patterning locations, and an electrolyte is sealed in the cells,
   A bonding step of bonding the first electrode and the second electrode with the transparent conductive film and the counter conductive film facing each other;
   Ultrasonic vibration is applied from either the back surface of the first substrate on which the transparent conductive film is formed or the back surface of the second substrate on which the counter conductive film is formed, and this ultrasonic vibration is applied. Insulating the first substrate and the second substrate facing each other in contact with each other by in contact with each other, and by welding the first substrate and the second substrate, the first electrode and the second substrate A dividing step of dividing the second electrode to form the cell;
   In the frame composed of the sealing material and the patterning portion, the opposing surfaces of the first substrate and the second substrate are brought into contact with each other and insulated, and the first substrate and the second substrate are welded together. And a welding step of forming a welded portion in which the plate surface of the first substrate and the plate surface of the second substrate are in direct contact with each other.
5. In the welding step, ultrasonic vibration is applied from either the back surface of the first substrate on which the transparent conductive film is formed or the back surface of the second substrate on which the counter conductive film is formed. The method for manufacturing an electric module according to claim 4, wherein the welded portion located at a location to which sonic vibration is applied is formed.
6. 6. The method of manufacturing an electric module according to claim 4, wherein in the welding step, the welding portion is formed at 1 to 10 locations per unit area of 26 cm ^{2 of the} cell.
7. In the welding step, the electrical module according to any one of claims 4-6 in which the area per point when viewed in plan and forming the welded portion so that 1 mm 2 ^~ 100 mm ² Manufacturing method.

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