JP2013182737A - Method for manufacturing electric module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electric module capable of reducing electrolyte usage as much as possible.SOLUTION: A method for manufacturing an electric module comprises the steps of: forming a transparent conductive film on one substrate and forming a semiconductor layer to form a first electrode plate; forming a counter electrode film on the other substrate to form a second electrode plate; providing a sealing material in at least one of the first electrode plate and the second electrode plate so as to surround the semiconductor layer; bonding the first electrode plate and the second electrode plate with the sealing material to form an electrolyte holding unit 17 composed of the space surrounded by the sealing material; notching prescribed positions of outer edges of the first electrode plate and the second electrode plate to form a protrusion 20 protruding outward; forming a through hole 18 communicating with the electrolyte holding unit 17 on the protrusion 20; immersing an electrolyte 12 in the protrusion 20 to fill the electrolyte holding unit 17 with the electrolyte 12 via the through hole 18; and closing the through hole 18 to seal the electrolyte holding unit 17.

Description

  The present invention relates to an electrical module manufacturing method.

In recent years, solar cells have attracted attention as clean energy power generation devices that replace fossil fuels, and silicon (Si) solar cells and dye-sensitized solar cells have been developed.
In particular, dye-sensitized solar cells are widely researched and developed for their structures and manufacturing methods as being inexpensive and easy to mass-produce. In general, an electric module includes a first electrode plate in which a transparent conductive film is formed on a plate surface of a substrate and a semiconductor layer is formed on the surface of the transparent conductive film, and a counter electrode film disposed to face the transparent conductive film. A second electrode plate formed, and an electrolyte injected between the transparent conductive film and the counter electrode film, the first electrode plate and the second electrode surrounding the semiconductor layer and sealing the electrolyte. A sealing layer is provided between the electrode plate and the electrode plate. Conventionally, as a method for manufacturing such an electric module, for example, a method described in Patent Document 1 below has been proposed.

  According to the method for manufacturing an electric module of Patent Document 1, the transparent conductive film of the rectangular first electrode plate and the counter electrode film of the rectangular second electrode plate are opposed to each other, and the first electrode plate and the second electrode are sealed with a sealing material. When forming the electrolytic solution holding part that adheres the electrode plate and seals the electrolytic solution, a releasable resin sheet is disposed at the center of one end edge where the sealing material made of hot melt resin is disposed. Then, after the first electrode plate and the second electrode plate are bonded, the release resin sheet is pulled out to form a through hole communicating with the electrolyte solution holding portion, and the one end edge is immersed in the electrolyte solution. After filling the electrolytic solution holding part with the electrolytic solution, the sealing material in the vicinity of the through hole is heated to seal the electrolytic solution holding part, thereby completing the manufacture of the electric module.

JP 2006-4827 A

By the way, according to the manufacturing method of the electric module of Patent Document 1, the entire one end edge is immersed in the electrolyte solution, and the electrolyte solution holding part is filled with the electrolyte solution by capillary action. A large amount of electrolyte solution with a high material cost adheres to the whole. The electrolytic solution adhering to the entire edge is washed and discarded. Therefore, according to the conventional method of manufacturing an electric module, there is a problem that a large amount of the electrolyte is deposited on the entire edge and discarded when the electrolyte is filled, and a large amount of raw material is wasted.
Then, in view of the said subject, this invention makes it a subject to provide the manufacturing method of the electric module which can reduce the usage-amount of electrolyte solution in the manufacturing process of an electric module as much as possible.

According to the first aspect of the present invention, a transparent conductive film is formed on one plate surface of one substrate and a semiconductor layer is formed to form a first electrode plate, and one plate surface of another substrate is opposed. Forming a second electrode plate by forming an electrode film, and forming the first electrode on at least one of the one plate surface of the first electrode plate and the one plate surface of the second electrode plate; Providing a sealing material so as to surround the semiconductor layer when the plate and the second electrode plate face each other, and bonding the first electrode plate and the second electrode plate by the sealing material. A step of forming an electrolytic solution holding portion constituted by a space surrounded by the sealing material, and a predetermined portion of the outer edge portion of the first electrode plate and the outer edge portion of the second electrode plate opposed thereto. A step of forming a projecting portion that protrudes outward and projects outward, and the projecting portion communicates with the electrolyte solution holding portion A step of forming a through hole, a step of immersing the protruding portion in an electrolyte solution and filling the electrolyte solution holding portion with the electrolyte solution through the through hole; and closing the through hole to hold the electrolyte solution And a step of sealing the portion.
According to the present invention, only the protrusions formed on the first electrode plate and the second electrode plate can be immersed in the electrolytic solution, and the electrolytic solution holding unit can be filled through the through holes. Therefore, it can suppress as much as possible that electrolyte solution adheres to the surface of the 1st electrode plate and the 2nd electrode plate at the time of electrolyte solution filling.
Invention of Claim 2 is a manufacturing method of the electric module of Claim 1, Comprising: The said electrolyte solution is filled, After the said electrolyte solution holding part is sealed, the said protrusion part is cut | disconnected, It is characterized by the above-mentioned. To do.
According to the present invention, since the protruding portion is cut after the electrolytic solution is filled and the electrolytic solution holding portion is sealed, cleaning of the electrolytic solution adhering to the surface of the protruding portion can be omitted. it can.
A third aspect of the present invention is the method of manufacturing the electric module according to the first or second aspect, wherein the outer shape of the projecting portion is formed so as to gradually narrow toward the tip.
According to the present invention, since the outer shape of the protruding portion is formed so as to gradually narrow toward the tip, the amount of the electrolytic solution that adheres to the surface of the protruding portion when filling the electrolytic solution with a smaller surface area of the protruding portion Can be reduced to a smaller amount.
The invention of claim 4 is the method of manufacturing an electric module according to any one of claims 1 to 3, wherein each of the first electrode plate and the second electrode plate is formed in a rectangular shape, and the corner of the rectangular shape is formed. The protruding portion having the through hole is formed in a portion.
According to the present invention, the first electrode plate and the second electrode plate are formed in a rectangular shape, and the protrusions are formed at the corners of the rectangle. Therefore, the protrusions can be efficiently cut out from the outer edge and cut. Material such as discarded substrates is minimized.
According to a fifth aspect of the present invention, there is provided a step of forming a transparent conductive film on one plate surface of one substrate and forming a plurality of semiconductor layers at intervals to form a first electrode plate; Forming a second electrode plate by forming a counter electrode film on the plate surface, and at least one of the one plate surface of the first electrode plate and the one plate surface of the second electrode plate Providing a sealing material so as to surround each of the semiconductor layers when the first electrode plate and the second electrode plate are opposed to each other; and the first electrode plate and the first electrode by the sealing material. Bonding a two-electrode plate and forming a plurality of electrolyte solution holding portions constituted by a space surrounded by the sealing material; and an outer edge portion of the first electrode plate and an outer edge portion of the second electrode plate Cutting the predetermined portion and forming a plurality of protrusions protruding outward, and the plurality of protrusions, A step of forming a through hole communicating with the solution holding part, a step of immersing the plurality of protrusions in an electrolyte solution, and filling the electrolyte solution holding part with the electrolyte solution through the through hole; A step of closing the plurality of through holes and sealing the plurality of electrolyte solution holding portions.
According to the present invention, a plurality of semiconductor layers are formed between one substrate and another substrate facing the substrate, and the plurality of semiconductor layers are surrounded by the sealing material to form a plurality of electrolyte solution holding portions. In order to form a protrusion having a through hole communicating with each electrolytic solution holding portion, the electrolytic solution is efficiently filled in the multiple electrolytic solution holding portions to efficiently manufacture a plurality of electric modules. Can do.

  According to the method for manufacturing an electric module of the present invention, since only the protruding portion can be immersed in the electrolytic solution and filled with the electrolytic solution, the electrolytic solution adhering to the surfaces of the first electrode plate and the second electrode plate is greatly reduced. It is possible to reduce the cost, and it is possible to effectively use the electrolytic solution and suppress an increase in the cost of the electrolytic solution.

These are the cross-sectional perspective views of the thickness direction which showed typically the electric module shown as the 1st Embodiment of this invention. These are the figures which showed the electrode plate formation process of the manufacturing method of the electric module shown as the 1st Embodiment of this invention, (a) is the state which has arrange | positioned the 1st electrode plate and the 2nd electrode plate facing each other. It is sectional drawing shown, (b) is the figure which looked at (a) at the X1-X1 line. These are the figures which showed the sealing material arrangement | positioning process of the manufacturing method of the electrical module shown as the 1st Embodiment of this invention, (a) is the figure which looked at FIG. 2 (a) by the X1-X1 line | wire. (B) is the figure which looked at FIG. 2 (a) by the X2-X2 line. These are sectional drawings which showed the adhesion | attachment process of the manufacturing method of the electric module shown as the 1st Embodiment of this invention. These are the figures which showed the adhesion process of the manufacturing method of the electric module shown as the 1st Embodiment of this invention, (a) is a cross section which shows the state which bonded together the 1st electrode plate and the 2nd electrode plate It is a figure, (b) is a top view of (a). (A), (b) is the top view which showed the protrusion formation process of the manufacturing method of the electric module shown as the 1st Embodiment of this invention. These are sectional drawings which showed the through-hole formation process of the manufacturing method of the electric module shown as the 1st Embodiment of this invention. These are explanatory drawings which showed the electrolyte solution injection | pouring process of the manufacturing method of the electric module shown as the 1st Embodiment of this invention. These are the figures which showed the electrolyte solution injection | pouring process of the manufacturing method of the electrical module shown as the 1st Embodiment of this invention, (a) is sectional drawing of thickness direction, (b) is the plane of (a). FIG. These are the figures which showed the sealing process of the manufacturing method of the electrical module shown as the 1st Embodiment of this invention, (a) is sectional drawing of thickness direction, (b) is a top view of (a) It is. These are the figures which showed the process of cut | disconnecting the protrusion part of the manufacturing method of the electrical module shown as the 1st Embodiment of this invention, (a) is sectional drawing of thickness direction, (b) is (a). FIG. (A), (b) is explanatory drawing which showed a part of process of the manufacturing method of the electric module shown as a modification of the 1st Embodiment of this invention. (A), (b) is explanatory drawing which showed a part of process of the manufacturing method of the electric module shown as a modification of the 1st Embodiment of this invention. (A), (b) is the figure which showed a part of process of the manufacturing method of the electric module shown as the 2nd Embodiment of this invention, (a) is (b) by X3-X3 line | wire. It is the figure seen from the arrow, (b) is sectional drawing which shows the state which has arrange | positioned the 1st electrode plate and the 2nd electrode plate facing each other. These are sectional drawings which showed the adhesion | attachment process of the manufacturing method of the electric module shown as the 2nd Embodiment of this invention. These are the top views which showed the protrusion formation process of the manufacturing method of the electric module shown as the 2nd Embodiment of this invention. These are explanatory drawings which showed the electrolyte solution injection | pouring process of the manufacturing method of the electric module shown as the 2nd Embodiment of this invention. These are explanatory drawings which showed the electrolyte solution injection | pouring process of the manufacturing method of the electric module shown as the 2nd Embodiment of this invention. These are explanatory drawings which showed the protrusion part cutting process of the manufacturing method of the electric module shown as the 2nd Embodiment of this invention. These are explanatory drawings which showed a part of process of the manufacturing method of the electrical module shown as a modification of the 2nd Embodiment of this invention.

Hereinafter, a first embodiment of a manufacturing method of the present invention will be described with reference to the drawings. FIG. 1 schematically shows a dye-sensitized solar cell 1A shown as an example of an electric module manufactured by the manufacturing method of the present invention regardless of actual dimensions and ratios (the same applies to all the drawings below). It is.
As shown in the figure, the dye-sensitized solar cell 1A includes a first electrode plate 5 having a transparent conductive film 3 and a semiconductor layer 4 on one substrate 2, and a counter electrode film 7 on another substrate 6. And a second electrode plate 9 provided with a catalyst layer 8, a separator 10 is interposed, and sealing materials 11 and 11 are arranged along the outer edges of the first electrode plate 5 and the second electrode plate 9. In addition, the inside is filled with the electrolytic solution 12 and sealed in a liquid-tight manner.

  One substrate 2 and another substrate 6 are members that serve as a base for the transparent conductive film 3 and the counter electrode film 7, for example, transparent synthetic resin materials such as polyethylene naphthalate (PEN) and polyethylene terephthalate (PET). Is formed by punching into a substantially rectangular shape.

  The transparent conductive film 3 serves as a so-called first electrode. As a material for the transparent conductive film 3, tin oxide (ITO), zinc oxide, or the like is used, and the film is formed on the entire plate surface 2 a of one substrate 2.

The semiconductor layer 4 has a function of receiving and transporting electrons from a sensitizing dye described later, and is provided on the surface 3 a of the transparent conductive film 3 by a semiconductor made of a metal oxide. As the metal oxide, for example, titanium oxide (TiO ₂ ), zinc oxide (ZnO), tin oxide (SnO ₂ ), or the like is used.

The semiconductor layer 4 carries a sensitizing dye. The sensitizing dye is composed of an organic dye or a metal complex dye. Examples of organic dyes include various organic dyes such as coumarin, polyene, cyanine, hemicyanine, and thiophene. As the metal complex dye, for example, a ruthenium complex is preferably used.
Under the above configuration, the first electrode plate 5 has the transparent conductive film 3 formed on the entire surface 2a of one substrate 2 and the semiconductor layer 4 formed on the surface 3a of the transparent conductive film 3. It is formed with.

The counter electrode film 7 is a so-called second electrode, and is formed on the entire plate surface 6 a of the other substrate 6.
The counter electrode film 7 is made of the same material as that of the transparent conductive film 3 such as tin oxide (ITO) or zinc oxide.

The catalyst layer 8 promotes the transfer of electrons between the transparent conductive film 3 and the counter electrode film 7, and platinum, polyaniline, PEDOT, carbon, or the like is used.
Under this configuration, the second electrode plate 9 has the counter electrode film 7 formed on the entire surface of one plate 6a of the other substrate 6, and the catalyst layer 8 provided on the surface 7a of the counter electrode film 7 is formed. It is formed in preparation.

  The separator 10 is formed of a sheet material such as a nonwoven fabric having a large number of holes (not shown) through which the electrolytic solution 12 and the sealing material 11 pass, and the first electrode plate 5, the second electrode plate 9, Is interposed between the sealing materials 11 and 11.

  The sealing material 11 is disposed along the outer edge portions of the first electrode plate 5 and the second electrode plate 9 so as to surround the semiconductor layer 4, and a gap is provided between the first electrode plate 5 and the second electrode plate 9. These are bonded in a state in which is formed, and the electrolytic solution 12 is held and sealed between the first electrode plate 5 and the second electrode plate 9. As the material of the sealing material 11, for example, an ultraviolet curable resin, a thermosetting resin, a thermoplastic resin, or the like is used.

  Examples of the electrolytic solution 12 include non-aqueous solvents such as acetonitrile and propionitrile; liquid components such as ionic liquids such as dimethylpropylimidazolium iodide and butylmethylimidazolium iodide; and a supporting electrolytic solution such as lithium iodide. A solution or the like in which iodine and iodine are mixed is used. Further, the electrolytic solution 12 may contain t-butylpyridine in order to prevent reverse electron transfer reaction.

Next, the manufacturing method of 1 A of dye-sensitized solar cells is demonstrated using FIGS.
The manufacturing method of 1 A of dye-sensitized solar cells of 1st Embodiment has the following processes. That is,
(I) As shown in FIGS. 2A and 2B, a transparent conductive film 3 is formed on one plate surface 2 a of one substrate 2 and a semiconductor layer 4 is formed to form a first electrode plate 5. A step of forming the counter electrode film 7 on one plate surface 6a of the other substrate 6 and forming the second electrode plate 9 by forming the catalyst layer 8 <electrode plate forming step>
(II) As shown in FIGS. 3A and 3B, the surface 3a of the transparent conductive film 3 (one plate surface of the first electrode plate 5) and the surface 8a of the catalyst layer 8 (of the second electrode plate 9). Step of providing a sealing material 11 so as to surround the semiconductor layer 4 when the first electrode plate 5 and the second electrode plate 9 are opposed to each other on one plate surface) <Sealing material arranging step>
(III) As shown in FIGS. 4 and 5A and 5B, a separator 10 is interposed between the first electrode plate 5 and the second electrode plate 9, and the first electrode plate is sealed by the sealing material 11. 5 and 2nd electrode plate 9 are adhere | attached, and the process of forming the electrolyte solution holding part 17 comprised by the space enclosed by the sealing material 11 <adhesion process>
(IV) As shown in FIGS. 6 (a) and 6 (b), the outer edge portion of the first electrode plate 5 and the predetermined portion of the outer edge portion of the second electrode plate 9 facing the first electrode plate 5 are cut out and directed outward. Step of forming protruding portion 20 protruding in the above-<Projection portion forming step>
(V) As shown in FIG. 7, the process of forming the through-hole 18 connected to the electrolyte solution holding | maintenance part 17 in the protrusion part 20 <Through-hole formation process>
(VI) As shown in FIG. 8 and FIGS. 9A and 9B, the step of immersing the protruding portion 20 in the electrolyte solution 12 and filling the electrolyte solution holding portion 17 with the electrolyte solution 12 through the through holes 18 <Electrolyte injection process>
(VII) As shown in FIG. 10, the step of closing the through-hole 18 and sealing the electrolytic solution holding part 17 <Sealing step>
(VIII) As shown in FIGS. 11A and 11B, after the electrolytic solution holding portion 17 is sealed, the step of cutting the protruding portion 20 <cutting step>

(I) <Electrode plate forming step>
In the substrate formation step, as shown in FIG. 2A, the first electrode plate 5 in which the semiconductor layer 4 is formed on the surface 3a of the transparent conductive film 3 on one plate surface 2a of one substrate 2, and the other A second electrode plate 9 having a counter electrode film 7 and a catalyst layer 8 formed on one plate surface 6a of the substrate 6 is formed. Specifically, the first electrode plate 5 is formed as follows.

As shown in FIG. 2A, a PET film or the like is used as one substrate 2, and indium tin oxide (ITO) or the like is sputtered on a plate surface 2a of the PET film or the like to form a transparent conductive film 3.
The semiconductor layer 4 is formed, for example, by applying a titanium oxide-containing paste that can be baked to the surface 3a of the transparent conductive film 3 by a mask, a printing method, or the like, and sintering it to be porous.

  As shown in FIG. 2B, when applying the titanium oxide-containing paste, the end portions 3e, 3f, 3g, and 3h of the transparent conductive film 3 are connected to the outer peripheral portion where the current is taken out or the sealing material 11 is arranged. In addition to G1, the end portion 3e is used as a region G2 (outer edge portion) for forming a protrusion 20 described later, and a titanium oxide-containing paste is applied to the surface 3a other than the outer peripheral portion G1 and the region G2. The semiconductor layer 4 may be formed by a low temperature firing method or an aerosol deposition method.

  After the semiconductor layer 4 is formed, the semiconductor layer 4 is immersed in a sensitizing dye solution in which a sensitizing dye is dissolved in a solvent, and the sensitizing dye is supported on the semiconductor layer 4. The method for supporting the sensitizing dye on the semiconductor layer 4 is not limited to the above, and a method of continuously charging, dipping and pulling up while moving the semiconductor layer 4 in the sensitizing dye solution is also employed. .

  As shown in FIG. 2A, the second electrode plate 9 is formed by sputtering ITO or zinc oxide or the like on one plate surface 6a of another substrate 6 made of a polyethylene terephthalate (PET) film or the like. Further, platinum or the like is provided as a catalyst layer 8 on the surface 7a of the counter electrode film 7. The counter electrode film 7 may be formed by a printing method, a spray method, or the like.

(II) <Encapsulant placement step>
As shown in FIGS. 3A and 3B, in the sealing material arranging step, an outer peripheral portion G <b> 1 excluding a region from which current is taken out of the surface 3 a of the transparent conductive film 3, that is, the peripheral portion of the semiconductor layer 4. And the sealing material 11 is apply | coated to the area | region G2, and the semiconductor layer 4 is surrounded. Further, the sealing material 11 is also applied to the surface 8 a of the catalyst layer 8 facing the application position of the sealing material 11 on the transparent conductive film 3.

At this time, as a part of the through-hole forming process described later, the releasable resin sheet 19 is disposed before the sealing material 11 is applied. The sealing material 11 is also applied to the surface of the releasable resin sheet 19.
The releasable resin sheet 19 is formed by cutting a resin sheet of polyester, polyethylene terephthalate, polybutylene terephthalate or the like into a strip shape, and the catalyst layer 8 facing the sealing material 11 or the region G2 applied on the region G2. It arrange | positions so that it may protrude from the edge of this sealing material 11 in the sealing material 11 distribute | arranged to the surface of this.

(III) <Adhesion process>
As shown in FIG. 4 and FIG. 5 (a), the bonding step is performed after the sealing material placement step with the separator 10 interposed between the first electrode plate 5 and the second electrode plate 9. The membrane 3 and the catalyst layer 8 are bonded to face each other, and the sealing material 11 applied to the outer peripheral portion G1 and the region G2 is thermally cured to bond the first electrode plate 5 and the second electrode plate 9 together. At this time, the releasable resin sheet 19 has a heat resistant temperature higher than the curing temperature of the encapsulant 11 and is excellent in non-adhesiveness. Therefore, the releasable resin sheet 19 is released by heating or light irradiation to the encapsulant 11. Neither the sealing material 11 on the conductive resin sheet 19 nor the second electrode plate 9 is bonded. Therefore, as shown in FIG. 5 (b), the both sides where the releasable resin sheet 19 is arranged are bonded by the sealing material 11, while as shown in FIG. 5 (a), the releasable resin sheet. The electrolyte solution surrounded by the first electrode plate 5, the second electrode plate 9, and the sealing material 11 in a state in which neither the first electrode plate 5 nor the second electrode plate 9 is bonded to both plate surfaces 19. A holding portion 17 is formed.

(IV) <Protrusion forming step>
As shown in FIGS. 6A and 6B, the protrusion forming step is integrated at a position spaced from both side edges 19a and 19b extending in the longitudinal direction of the releasable resin sheet 19 after the bonding step. The outer edge portions 15a and 15b of the first electrode plate 5 and the outer edge portions 16a and 16b of the second electrode plate 9 are cut out along both side edges 19a and 19b, and a releasable resin sheet 19 is provided at the center in the width direction. A protruding portion 20 that protrudes outward in a substantially rectangular shape is formed while being held.

(V) <Through hole forming step>
In the through hole forming step, as shown in FIG. 7, after the protruding portion forming step, the releasable resin sheet 19 is pulled out from the tip of the protruding portion 20 to form a through hole 18 communicating with the electrolyte solution holding portion 17. This through hole 18 becomes a hole for sucking the electrolyte solution 12 into the electrolyte solution holding portion 17.

(VI), (VII) <electrolyte injection process> and <sealing process>
In the electrolytic solution injection step, as shown in FIG. 8, the tip end portion of the protruding portion 20 is immersed in the container C in which the electrolytic solution 12 is stored after the through hole forming step, and a capillary phenomenon is generated from the through hole 18. Then, as shown in FIGS. 9A and 9B, the electrolytic solution holding unit 17 is filled with the electrolytic solution 12.
In the sealing step, as shown in FIGS. 10A and 10B, the electrolytic solution holding portion 17 is sealed by closing and bonding the through hole 18 with an adhesive or the like after the electrolytic solution injection step.
In the sealing material arranging step, an adhesive other than a thermosetting adhesive such as a thermoplastic resin such as hot melt, an ultraviolet curable resin, etc. is applied around and around the position where the releasable resin sheet 19 is arranged. In the case where it has been prepared, the releasable resin sheet 19 is pulled out to form a through hole 18, and after passing through the electrolytic solution injection step, the through hole 18 portion is heated, irradiated with ultraviolet rays, etc., and pressed. After the injection of the electrolytic solution, the sealing can be easily performed at the position P where the sealing material 11 closer to the electrolytic solution holding portion 17 than the protruding portion 20 is applied.

(VIII) <Cutting step>
After the sealing step, as shown in FIG. 11, the protruding portion 20 including the tip portion to which the electrolytic solution 12 adheres to the surface is cut from the root, and the protruding portion 20 is discarded, and the dye-sensitized solar cell 1A is removed. obtain.

  As described above, according to the method for manufacturing the dye-sensitized solar cell 1A of the first embodiment, the protruding portion forming step and the through hole forming step have the through hole 18 and protrude outward at the end 3e. A protruding portion 20 is formed, and only the protruding portion 20 can be immersed in the electrolytic solution 12 to fill the electrolytic solution holding portion 17 with the electrolytic solution 12. Therefore, the amount of the electrolytic solution 12 adhering to the surfaces of the first electrode plate 5 and the second electrode plate 9 can be minimized, and it is possible to reduce waste of material cost and suppress increase in manufacturing cost. The effect that it can be obtained.

  In addition, after sealing the electrolytic solution holding part 17 in the sealing step, the protruding part 20 may be cut from the root and discarded together with the electrolytic solution 12 attached to the surface. The effect that the last process can be simply performed without the trouble of washing the dye-sensitized solar cell 1A after stopping is obtained. Moreover, the cost for washing | cleaning the dye-sensitized solar cell 1A is abbreviate | omitted, and the effect that the manufacturing cost of 1A of dye-sensitized solar cells can be suppressed is acquired.

In the first embodiment, the protrusions 20 protrude outward in a substantially rectangular shape so that the outer edges 15a and 15b of the integrated first electrode plate 5 and the second electrode plate 9 (not shown) are integrated. The outer edge portions 16a and 16b are notched, but the outer shape of the protruding portion 20 is not limited to a rectangular shape. For example, as shown in FIGS. It is desirable that the surface area of the protruding portion 20 be formed as small as possible, for example, so as to be gradually narrowed.
Thus, when the protrusion part 20 is formed so that the surface area of the protrusion part 20 may become small, when filling the electrolyte solution 12, the quantity of the electrolyte solution 12 adhering to the surface of the protrusion part 20 is reduced as much as possible. The material cost required for manufacturing the dye-sensitized solar cell 1A can be reduced.

Further, in the first embodiment, the protruding portion 20 is formed at the central portion in the longitudinal direction of the end portion 3e. However, the forming position of the protruding portion 20 is not limited to this position. For example, FIG. As shown, it may be formed at the corner K of the rectangular first electrode plate 5 and second electrode plate 9 bonded together.
When the protruding portion 20 is formed at the corner K, the corner K is already in a shape that gradually narrows toward the tip, so that this shape is used to separate the tip 20 from the tip of the corner K at a predetermined position. The protruding portion 20 can be formed simply by cutting out the end portions 3 e and 3 f so as to have sides along the side edges of the moldable resin sheet 19.

  Thus, by forming the protrusion 20 at the corner K, the amount of the electrolyte solution 12 used in the dye-sensitized solar cell 1A can be reduced as in the case described above, and the first electrode that is notched The amount of the outer edge portion of the plate 5, the outer edge portion of the second electrode plate 9, the separator 10 and the sealing material 11 can be suppressed, and the material cost required for manufacturing the dye-sensitized solar cell 1A can be further suppressed. Is obtained.

In the above embodiment, the protruding portion 20 is formed after the bonding step between the first electrode plate 5 and the second electrode plate 9, but it is not essential to be after the bonding step. The first electrode plate As long as the protruding portion of 5 and the protruding portion of the second electrode plate 9 are appropriately bonded to each other, they may be formed in any step as long as they are before the electrolyte solution injection step.
The sealing material 11 was applied to both the surface 3a of the transparent conductive film 3 of the first electrode plate 5 and the surface 8a of the catalyst layer 8 of the second electrode plate 9, but the surface 3a of the transparent conductive film 3 or the catalyst You may apply | coat to any one of the surface 8a of the layer 8. FIG.
In addition, the releasable resin sheet 19 is disposed on the second electrode plate 9 side before the sealing material 11 is applied, but may be disposed on the first electrode plate 5 side. Later, it may be arranged before the bonding step.

Next, a second embodiment of the present invention will be described with reference to FIGS.
In the method of manufacturing the dye-sensitized solar cell 1B of the second embodiment shown in FIG. 19, (i) a transparent conductive film is formed on one plate surface of one substrate and a plurality of semiconductor layers are spaced apart. Forming a first electrode plate; forming a counter electrode film on one plate surface of another substrate to form a second electrode plate; and (ii) the one of the first electrode plates. When the first electrode plate and the second electrode plate are opposed to at least one of the plate surface and the one plate surface of the second electrode plate, the semiconductor layers are sealed so as to surround each semiconductor layer. (Iii) providing a separator between the first electrode plate and the second electrode plate, and bonding the first electrode plate and the second electrode plate with the sealing material; And a step of forming a plurality of electrolytic solution holding parts constituted by a space surrounded by the sealing material, and (iv) the first A step of notching predetermined portions of the outer edge portion of the electrode plate and the outer edge portion of the second electrode plate to form a plurality of protruding portions protruding outward, and (v) the electrolysis on the plurality of protruding portions. A step of forming a through-hole communicating with the liquid holding portion; and (vi) a step of immersing the plurality of protrusions in the electrolytic solution and filling the electrolytic solution into the plurality of electrolytic solution holding portions through the through-hole. And (vii) closing the plurality of through holes and sealing the plurality of electrolyte solution holding portions.
In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, the description thereof is omitted, and only components different from those in the first embodiment will be described.

  In the present embodiment, as shown in FIG. 19, a dye-sensitized solar cell 1 </ b> B formed by connecting a plurality of one dye-sensitized solar cell 1 </ b> A obtained by the manufacturing method of the first embodiment is manufactured. This is different from the manufacturing method of the first embodiment.

Hereinafter, in each process, the point which 2nd Embodiment differs from 1st Embodiment is demonstrated in detail.
(I) In the electrode plate forming step, as shown in FIGS. 14A and 14B, a region G2 in which the protruding portion 20 is formed on the end portion 3e of one substrate 2 on which the transparent conductive film 3 is formed is formed. A plurality of semiconductor layers 4 are formed, for example, at equal intervals so as to be provided in a band shape and not to cover the region G2.
(Ii) In the sealing material forming step, the surface 3 a of the transparent conductive film 3 other than the region where the semiconductor layer 4 is formed leaves a region from which current is taken, that is, the peripheral portion of the semiconductor layer 4, and the sealing material 11 Is applied to surround the semiconductor layers 4 one by one, and the sealing material 11 is applied to the surface 8 a of the catalyst layer 8 at a position facing the sealing material 11 of the surface 3 a of the transparent conductive film 3. In this step, before the sealing material 11 is applied, the releasable resin sheet 19 is straddled across each region surrounded by the sealing material 11 and the outer edge of the end portion 3e, and each is equally spaced. Place them so that they are parallel to each other.

(Iii) In the bonding step, as shown in FIG. 15, the first electrode plate 5 and the second electrode plate 9 are opposed to each other and bonded by the sealing material 11, thereby being surrounded by the sealing material 11. A plurality of electrolytic solution holding parts 17, 17.
(Iv) In the protruding portion forming step, as shown in FIG. 16, the outer edge portions 25, 25,... Of the end portion 3e are cut out along the both side edges 19a, 19b of the releasable resin sheet 19, and equidistant. Are formed in parallel with the projections 20, 20.
(V) In the through-hole forming step, the releasable resin sheets 19, 19... Are pulled out from the respective protrusions 20 to form through-holes 18 (see FIG. 17) communicating with the respective electrolyte solution holding portions 17.

(Vi) In the electrolytic solution filling step, as shown in FIG. 17, the projecting portions 20, 20,... Are simultaneously immersed in the container C in which the electrolytic solution 12 is stored with the tips thereof directed downward, and capillary action occurs. As shown in FIG. 18, each electrolyte solution holding part 17 is filled with the electrolyte solution 12.
(Vii) In the sealing step, as shown in FIG. 19, each electrolytic solution holding part 17 is similar to the sealing method shown in the first embodiment in the vicinity P, P. Seal by method. Thereafter, the protruding portion 20 to which the electrolytic solution 12 is attached is cut and discarded to obtain the dye-sensitized solar cell 1B.

  As described above, according to the manufacturing method of the second embodiment, the same effects as those of the manufacturing method of the first embodiment can be obtained, and the protrusions 20, 20. Since the plurality of electrolytic solution holding portions 17, 17... Provided one by one are formed at equal intervals, the electrolytic solution 12 can be filled into each electrolytic solution holding portion 17 simultaneously and efficiently. . Therefore, the effect that the dye-sensitized solar cell 1B in which the plurality of dye-sensitized solar cells 1A are continuously provided can be efficiently manufactured is obtained.

In the present embodiment, similarly to the first embodiment, the projecting portions 20, 20,... Can be gradually narrowed toward the tip.
Further, as shown in FIG. 20, the releasable resin sheet 19 is arranged at a corner K of the electrolytic solution holding portions 17 and 17 formed in a rectangular shape so as to straddle the two adjacent electrolytic solution holding portions 17 and 17. In addition, the protrusions 20 may be formed along the releasable resin sheets 19.

  By doing in this way, the quantity of the protrusion part 20 immersed in the electrolyte solution 12 is reduced, the quantity of the electrolyte solution 12 adhering to the front-end | tip part of the protrusion part 20 is reduced further, and dye-sensitized solar efficiently and cheaply. There exists an effect that the battery 1B can be manufactured.

1A Dye-sensitized solar cell (electric module)
2 One substrate 2a One plate surface 3 Transparent conductive film 4 Semiconductor layer 5 First electrode plate 6 Other substrate 6a One plate surface 7 Counter electrode film 9 Second electrode plate 11 Sealing material 17 Electrolyte holding part 18 Through Hole 20 Projection G2 area (outer edge)

Claims (5)

Forming a transparent conductive film on one plate surface of one substrate and forming a semiconductor layer to form a first electrode plate;
Forming a counter electrode film on one plate surface of another substrate to form a second electrode plate;
When the first electrode plate and the second electrode plate are opposed to at least one of the one plate surface of the first electrode plate and the one plate surface of the second electrode plate, the semiconductor Providing a sealing material to surround the layer;
Bonding the first electrode plate and the second electrode plate with the sealing material, and forming an electrolyte solution holding portion constituted by a space surrounded by the sealing material;
Cutting out a predetermined portion of the outer edge portion of the first electrode plate and the outer edge portion of the second electrode plate facing the first electrode plate, and forming a protruding portion protruding outward;
Forming a through hole communicating with the electrolyte solution holding portion in the protruding portion;
Immersing the protruding portion in an electrolytic solution, and filling the electrolytic solution holding portion with the electrolytic solution through the through hole;
And a step of closing the through hole and sealing the electrolytic solution holding part. It is a manufacturing method of the electric module of Claim 1, Comprising:
A method of manufacturing an electric module, comprising: filling the electrolytic solution and cutting the protruding portion after the electrolytic solution holding portion is sealed. It is a manufacturing method of the electric module according to claim 1 or 2,
The external shape of the protrusion is formed so as to gradually narrow toward the tip. It is a manufacturing method of the electric module according to any one of claims 1 to 3,
The method of manufacturing an electric module, wherein the first electrode plate and the second electrode plate are each formed in a rectangular shape, and the protruding portion having the through hole is formed in a corner portion of the rectangular shape. Forming a transparent conductive film on one plate surface of one substrate and forming a plurality of semiconductor layers at intervals to form a first electrode plate;
Forming a second electrode plate by forming a counter electrode film on one plate surface of another substrate;
When the first electrode plate and the second electrode plate are opposed to at least one of the one plate surface of the first electrode plate and the one plate surface of the second electrode plate, Providing a sealing material so as to surround the semiconductor layer;
Bonding the first electrode plate and the second electrode plate with the sealing material, and forming a plurality of electrolytic solution holding parts constituted by a space surrounded by the sealing material;
Forming a plurality of protrusions protruding outward by cutting out predetermined portions of the outer edge of the first electrode plate and the outer edge of the second electrode plate;
Forming a through hole communicating with the electrolyte solution holding portion in the plurality of protrusions;
Immersing the plurality of protrusions in an electrolyte solution, and filling the electrolyte solution holding portions with the electrolyte solution via the through holes;
And a step of closing the plurality of through holes and sealing the plurality of electrolytic solution holding portions.

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