JP2010092674A - Organic electroluminescent display and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a solid sealing method of an organic EL display for efficiently preventing permeation of moisture and suppressing a production cost as well. <P>SOLUTION: A positioning mark 32 is formed on a mother adhesive material sheet 30 simultaneously with such a process as an outer shape punching or the like. The mother adhesive material sheet 30 is adhered on a mother sealing substrate 400 on an outer shape basis. The mother sealing substrate 400 and a mother element substrate 100 are positioned and adhered on a basis of the positioning mark 32 of the mother adhesive material sheet 30 adhered to the mother sealing substrate 400 and the positioning mark 33 of the mother element substrate 100. Since it is not necessary to form the positioning mark 32 on the mother sealing substrate 400 in a separate process, a production cost is reduced. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an organic EL display device, and more particularly to a method for manufacturing a highly reliable organic EL display device that suppresses generation of dark spots due to moisture.

  In an organic EL display device, an organic EL layer is sandwiched between a pixel electrode (lower electrode) and an upper electrode, a constant voltage is applied to the upper electrode, and a data signal voltage is applied to the lower electrode to emit light from the organic EL layer. An image is formed by controlling. The data signal voltage is supplied to the lower electrode through a thin film transistor (TFT). In the organic EL display device, light emitted from the organic EL layer is extracted in the direction opposite to the glass substrate on which the organic EL layer is formed, and the bottom emission type in which the light is emitted toward the glass substrate on which the organic EL layer is formed. There is a top emission type.

  The organic EL material used in the organic EL display device has a light emitting characteristic that deteriorates when moisture is present. When the organic EL material is operated for a long time, the place where the moisture is deteriorated does not emit light. This appears as a dark spot in the display area. This dark spot grows with time and becomes an image defect. Note that the phenomenon of edge growth in which the area that does not emit light around the pixel increases is also caused by the influence of moisture.

In order to prevent the occurrence or growth of dark spots or the like, it is necessary to prevent moisture from entering the organic EL display device or to remove the moisture that has entered. For this purpose, the element substrate on which the organic EL layer is formed is sealed by a sealing substrate through a seal placed around the device substrate, and moisture can be prevented from entering the organic EL display device from the outside. The sealed internal space is filled with an inert gas such as N ₂ . On the other hand, in order to remove moisture that has entered the organic EL display device, a desiccant is placed in the organic EL display device. This is called a hollow sealed organic EL display device.

  In the hollow sealing type organic EL display device, it is difficult to adjust the gap between the element substrate and the sealing substrate, it is difficult to adjust the inside of the sealing, and the organic due to the gas released from the sealing agent when sealing with the sealing agent There are problems such as contamination of EL material and low throughput.

  As a countermeasure against the problem of hollow sealing, there is a technique in which a resin sheet having a predetermined thickness is sandwiched between an element substrate and a sealing substrate, and the organic EL material is protected from moisture by this resin sheet. This is called solid sealing.

  “Patent Document 1” describes an example of solid sealing, and FIG. 18 shows a configuration described in “Patent Document 1”. In FIG. 16, the photocurable resin 102 formed on the light transmissive film 101 is pasted onto the element substrate 10 provided with the organic EL layer 22 using a pressure roller 105 heated to 80 ° C. Next, an organic EL display device sealed with a photocurable resin is obtained by irradiating ultraviolet rays to cure the photocurable resin 102 and peeling off the light transmissive film 101. Moreover, the structure which coat | covers an organic EL element with a silicon nitride film as needed is described.

  "Non-patent document 1" describes the following technique as shown in FIG. 19 for sealing an organic EL display device. That is, the resin film 107 is pasted on the sealing substrate 40 at a location corresponding to the organic EL element 103, and then the sealing agent 108 is drawn around the resin film 107. The resin film 107 is bonded to the sealing substrate 40 on which the sealing agent 108 is formed and the element substrate 10 on which the organic EL element 103 is formed. Next, the sealing agent 108 is cured by irradiating ultraviolet rays from the sealing substrate 40 and performing a heat treatment at 80 ° C. to 100 ° C. At the same time, the resin film 107 having fluidity is formed into the sealing substrate 40 and the element substrate. 10 and the space formed by the sealant 108 is spread to fill this space. Finally, it is divided into individual organic EL display panels and completed.

  In “Patent Document 2”, a plurality of display elements are formed on a mother substrate, a sealing film is formed collectively on the plurality of display elements, and then a protective film is formed from the terminal portion by laser abrasion. The configuration to be removed is described. FIG. 20 shows a configuration described in “Patent Document 2”. A plurality of display elements each having a light emitting portion 207 and a terminal portion 209 are formed on a mother substrate 206 and covered with a protective film 208. Then, the protective film 208 is removed from the part 210 of the terminal portion 209 by laser abrasion to form the opening 210.

JP 2004-139777 A JP 2006-66364 A Shinya Sasaki Nikkei Electronics September 10, 2007 Non-No. 960 PP10-11

  In a solid-sealed organic EL display device, a mother element substrate on which a plurality of element substrates are formed and a mother sealing substrate on which an adhesive sheet is attached are bonded in a negative pressure atmosphere. A manufacturing method for separating into individual organic EL display panels is used. In an organic EL display device, an organic EL layer, a thin film transistor (TFT) for switching, etc. are formed on an element substrate, and a sealing substrate is used to block moisture from the outside, so a simple glass substrate is used. You can also

  On the other hand, in order to protect the organic EL display device from moisture from the outside, the bonding accuracy between the element substrate and the sealing substrate is required. In general, in order to superimpose two glass substrates with high accuracy, superposition is performed based on alignment marks formed on both substrates.

  When various patterns are formed on the glass substrate, alignment marks are formed simultaneously with the pattern formation. However, in the case of a sealing substrate, since a pattern is not formed, a method is employed in which a pattern is formed only for alignment or a glass is scratched to form alignment marks. This will increase the manufacturing cost.

  An object of the present invention is to solve the above-described problems, and it is possible to accurately align the sealing substrate and the element substrate without separately forming a pattern for alignment on the sealing substrate. It is to realize a possible configuration.

  SUMMARY OF THE INVENTION The present invention solves the above-described problem, and forms a registration mark on an adhesive sheet that bonds the sealing substrate and the element substrate, and the element is based on the alignment mark and the alignment mark formed on the element substrate. The substrate and the sealing substrate are overlaid. Specific means are as follows.

  (1) In the manufacturing method of an organic EL display device in which an adhesive sheet is formed on an element substrate having a display region and a terminal portion so as to cover the display region, and a sealing substrate is bonded to the adhesive sheet. The organic EL display device includes a mother sealing substrate on which a plurality of the sealing substrates are formed, a mother element substrate on which the plurality of element substrates are formed, and a mother adhesive sheet that bonds the mother sealing substrate and the mother element substrate. The mother adhesive sheet has an alignment mark and an adhesive removing part, and adheres the mother adhesive sheet to the mother sealing substrate. The sealing substrate is bonded to the mother element substrate with reference to the alignment mark formed on the mother adhesive sheet, and the adhesive removing portion is a composite formed on the mother element substrate. A method of manufacturing an organic EL display device characterized by bonding the mother sealing substrate and the mother element substrate so as to be arranged in the terminal portion of the.

  (2) The mother adhesive sheet bonded to the mother sealing substrate is a single sheet, and the mother adhesive sheet is removed from the portions corresponding to the terminal portions of the plurality of element substrates formed on the mother element substrate. (1) The manufacturing method of the organic EL display device according to (1).

  (3) A plurality of mother adhesive sheets adhered to the mother sealing substrate are bonded so as to cover a plurality of display areas formed on the element substrate, and the plurality of mother adhesive sheets have alignment marks. The method for producing an organic EL display device according to (1), wherein the mother adhesive sheet does not cover portions corresponding to terminal portions of a plurality of element substrates formed on the mother element substrate.

  (4) The method for producing an organic EL display device according to any one of (1) to (3), wherein the mother adhesive sheet is attached to a protective film that is a roll film.

  (5) In the method of manufacturing an organic EL display device in which an adhesive is formed on an element substrate having a display region and a terminal portion so as to cover the display region, and a sealing substrate is bonded to the adhesive. The display device is formed of a mother sealing substrate on which a plurality of the sealing substrates are formed, a mother element substrate on which the plurality of element substrates are formed, and an adhesive that bonds the mother sealing substrate and the mother element substrate. And the adhesive material covers a plurality of display areas formed on the mother element substrate, but does not cover a plurality of terminal portions formed on the mother element substrate, and A method of manufacturing an organic EL display device, wherein the mother sealing substrate is applied so that alignment marks are formed.

  (6) The method for manufacturing an organic EL display device according to (5), wherein the application is performed by screen printing.

  (7) An organic EL display device in which an adhesive sheet is formed on an element substrate having a display region and a terminal portion so as to cover the display region, and a sealing substrate is bonded to the adhesive sheet, the bonding The material sheet has alignment marks, and the element substrate has alignment marks.

  (8) An organic EL display device in which an adhesive material is formed by coating an element substrate having a display region and a terminal portion so as to cover the display region, and a sealing substrate is bonded to the adhesive. An organic EL display device, wherein an alignment mark is formed on the adhesive, and an alignment mark is formed on the element substrate.

  According to the present invention, it is not necessary to form alignment marks on the sealing substrate for alignment between the element substrate and the sealing substrate. That is, it is not necessary to perform processing for forming alignment marks on the sealing substrate, and a simple glass plate can be used as the sealing glass. Therefore, the manufacturing cost of the organic EL display device can be reduced.

  Before describing specific embodiments of the present invention, the configuration of an organic EL display device to which the present invention is applied will be described. FIG. 1 is a cross-sectional view of an organic EL display panel 300 constituting the organic EL display device of the present invention. In FIG. 1, an element substrate 10 is formed with a display region 101 in which an organic EL layer for constantly displaying an image, a thin film transistor (TFT) for driving, and the like are formed in a matrix.

  An adhesive sheet 30 that covers the display area 101 and also serves as a seal is provided. A sealing substrate made of glass is bonded to the element substrate by the adhesive sheet. As the adhesive sheet 30, a thermosetting epoxy resin is used. The thickness of the adhesive is 10 μm to 20 μm. The adhesive sheet 30 is not limited to an epoxy resin but may be an acrylic resin or a silicon resin.

  The adhesive sheet 30 is preferably non-moisture permeable, but does not necessarily have a strong barrier against moisture. This is because the sealing substrate 40 formed mainly of glass serves as a barrier against moisture. That is, in the configuration as shown in FIG. 1, the intrusion of moisture from above is blocked by the sealing substrate 40 made of glass, but it takes a long distance for moisture from the side to reach the organic EL layer. It is necessary to do.

  A terminal portion 102 for supplying power to the organic EL layer, a video signal, and the like extends to the display region 101 at an end portion of the element substrate 10. Although the terminal portion 102 is not covered with the adhesive, the conductive film of the terminal portion 102 is not corroded because the wiring is covered with the inorganic passivation film or the organic passivation film. Further, the conductive film is not affected by moisture as much as the organic EL layer.

  FIG. 1 shows so-called solid sealing, and no space is formed between the sealing substrate 40 and the element substrate 10. Therefore, as in the case of hollow sealing, there is no problem that black spots are generated by contacting the element substrate 10 when the sealing substrate 40 is pressed. In addition, various problems due to the internal pressure of the sealing gas during sealing do not occur.

  In the present invention, a plurality of organic EL display panels 300 as shown in FIG. Then, after the large-sized adhesive sheet 30 for bonding the mother element substrate 100 and the mother sealing substrate 400 is attached to the mother sealing substrate, the mother sealing substrate 400 and the mother element substrate 100 are bonded. The present invention is characterized in that the adhesive sheet 30 is installed in the display area 101 and the adhesive sheet 30 is not installed in the terminal portion 102.

  FIG. 2 is a cross-sectional view of a display region of a top emission type organic EL display device to which the present invention is applied. In this embodiment, a top emission type organic EL display device will be described as an example. However, the present invention can be similarly applied to a bottom emission type organic EL display device. The top emission type organic EL display device includes a top anode type in which an anode is present on an organic EL layer and a top cathode type in which a cathode is present on an organic EL layer. Although FIG. 1 shows a case of a top anode type, the present invention can be similarly applied to a case of a top cathode.

In FIG. 2, a first base film 11 made of SiN and a second base film 12 made of SiO ₂ are formed on the element substrate 10. This is to prevent impurities from the glass substrate from contaminating the semiconductor layer 13. A semiconductor layer 13 is formed on the second base film 12. The semiconductor layer 13 is converted into a poly-Si film by laser irradiation after an a-Si film is formed by CVD.

A gate insulating film 14 made of SiO ₂ is formed so as to cover the semiconductor layer 13. A gate electrode 15 is formed in a portion facing the semiconductor layer 13 with the gate insulating film 14 interposed therebetween. Using the gate electrode 15 as a mask, an impurity such as phosphorus or boron is implanted into the semiconductor layer 13 by ion implantation to impart conductivity, thereby forming a source portion or a drain portion in the semiconductor layer 13.

An interlayer insulating film 16 is formed of SiO ₂ so as to cover the gate electrode 15. This is because the gate wiring and the drain wiring 171 are insulated. A drain wiring 171 is formed on the interlayer insulating film 16. The drain wiring 171 is connected to the drain of the semiconductor layer 13 through the through hole in the interlayer insulating film 16 and the gate insulating film 14.

  Thereafter, in order to protect the thin film transistor (TFT) manufactured as described above, an inorganic passivation film 18 made of SiN is deposited. An organic passivation film 19 is formed on the inorganic passivation film 18. The organic passivation film 19 has a role of protecting the TFT more completely together with the inorganic passivation film 18 and a function of flattening the surface on which the organic EL layer 22 is formed. Therefore, the organic passivation film 19 is formed as thick as 1 to 4 μm.

  A reflective electrode 24 is formed of Al or an Al alloy on the organic passivation film 19. Since Al or Al alloy has a high reflectance, it is suitable as the reflective electrode 24. The reflective electrode 24 is connected to the drain wiring 171 through a through hole formed in the organic passivation film 19 and the inorganic passivation film 18.

  Since this embodiment is a top anode type organic EL display device, the lower electrode 21 of the organic EL layer 22 serves as a cathode. Therefore, Al or Al alloy used as the reflective electrode 24 can also serve as the lower electrode 21 of the organic EL layer 22. This is because Al or an Al alloy has a relatively small work function and can function as a cathode.

  An organic EL layer 22 is formed on the lower electrode 21. The organic EL layer 22 is an electron transport layer, a light emitting layer, and a hole transport layer from the lower layer. In some cases, an electron injection layer is provided between the electron transport layer and the lower electrode 21. In some cases, a hole injection layer is provided between the hole transport layer and the upper electrode 23. An upper electrode 23 serving as an anode is formed on the organic EL layer 22. In this embodiment, IZO is used as the upper electrode 23. IZO is deposited on the entire display area without using a mask. The thickness of IZO is formed to be about 30 nm in order to maintain the light transmittance. ITO can also be used instead of IZO.

  The electron transporting layer is not particularly limited as long as it exhibits electron transporting properties and can be easily formed into a charge transfer complex by co-evaporation with an alkali metal. Quinolinolato) aluminum, bis (2-methyl-8-quinolinolato) -4-phenylphenolate-aluminum, bis [2- [2-hydroxyphenyl] benzoxazolate] zinc and other metal complexes and 2- (4-biphenylyl) ) -5- (4-tert-butylphenyl) -1,3,4-oxadiazole, 1,3-bis [5- (p-tert-butylphenyl) -1,3,4-oxadiazole- 2-yl] benzene or the like can be used.

  The light emitting layer material is not particularly limited as long as it can be formed as a light emitting layer by co-evaporation by adding a dopant that emits fluorescence or phosphorescence by recombination to a host material having electron and hole transport capability. For example, tris (8-quinolinolato) aluminum, bis (8-quinolinolato) magnesium, bis (benzo {f} -8-quinolinolato) zinc, bis (2-methyl-8-quinolinolato) aluminum oxide, tris ( 8-quinolinolato) indium, tris (5-methyl-8-quinolinolato) aluminum, 8-quinolinolatolithium, tris (5-chloro-8-quinolinolato) gallium, bis (5-chloro-8-quinolinolato) calcium, 5 , 7-dichloro-8-quinolinolato aluminum, tris ( , 7-dibromo-8-hydroxyquinolinolato) aluminum, poly [zinc (II) -bis (8-hydroxy-5-quinolinyl) methane] -like complexes, anthracene derivatives, carbazole derivatives, and the like. .

  In addition, the dopant captures electrons and holes in the host and recombines them to emit light. For example, a red light emitting substance such as a pyran derivative, a green coumarin derivative, and a blue anthracene derivative, or iridium. It may be a phosphorescent substance such as a complex or a pyridinate derivative.

  The hole transport layer includes, for example, a tetraarylbenzidine compound (triphenyldiamine: TPD), an aromatic tertiary amine, a hydrazone derivative, a carbazole derivative, a triazole derivative, an imidazole derivative, an oxadiazole derivative having an amino group, a polythiophene derivative, Copper phthalocyanine derivatives and the like can be used.

  In addition, in order to prevent the organic EL layer 22 from being broken at the end portion due to disconnection, the bank 20 is formed between the pixels. The bank 20 may be formed of an organic material or an inorganic material such as SiN. When using an organic material, it is generally formed of an acrylic resin.

  An auxiliary electrode may be used on the upper electrode 23 on the bank 20 to assist conduction. This is because luminance unevenness may occur when the resistance of the upper electrode 23 is large. Although the auxiliary electrode is not used in this embodiment, it goes without saying that the present invention can be applied to an organic EL display device using the auxiliary electrode.

  An adhesive sheet 30 is formed on the upper electrode. The adhesive sheet 30 is a thermosetting epoxy resin, and bonds the element substrate 10, specifically, the upper electrode and the sealing substrate 40 formed of glass. The thickness of the adhesive sheet 30 is 10 μm to 20 μm. A sealing substrate 40 is bonded to the adhesive sheet 30, and the organic EL layer is protected from moisture by the sealing substrate 40.

  Hereinafter, the contents of the present invention will be described in detail using examples.

  3 and 4 show the adhesive film 35 in a state where the sheet-like adhesive 30 used in the present invention is protected by the protective film 36. FIG. In this specification, as shown in FIG. 3 or FIG. 4, the large-sized mother adhesive sheet 30 existing in the mother panel and the adhesive sheet 30 existing in each organic EL display panel are both adhesives. This is called a sheet 30.

  FIG. 3 shows a state of one large-sized adhesive film 35. In FIG. 3, a large-sized adhesive sheet 30 is sandwiched between large-sized protective films 36 formed of PET. As shown by the arrow in FIG. 3B, the adhesive film 35 in FIG. 3 is cut with a cutter or punched out with a press to remove a part of the adhesive film 35. The parts to be removed are the adhesive removal part 31 corresponding to the terminal part 102 of the element substrate 10 and the alignment mark 32.

  FIG. 4 shows a state in which a part of the adhesive film 35 has been removed. 4A is a plan view, and FIG. 4B is a cross-sectional view taken along line AA of FIG. 4A. In FIG. 4A, the protective film 36 is visible on the surface, and a part of the adhesive sheet 30 adhered to the back side of the protective film 36 is removed in a long shape. FIG. 4B is a cross-sectional view of the protective film 35 at a portion where the adhesive removing portion 31 and the alignment mark are formed.

  In FIG. 4A, the adhesive sheet removing unit 31 reaches the left end of the adhesive sheet 30. The adhesive sheet 30 is bonded to the mother sealing substrate 400, and then the mother sealing substrate 400 to which the adhesive sheet 30 is bonded is bonded to the mother element substrate 100 in a reduced-pressure atmosphere, and then returned to the atmosphere. This is to prevent the material sheet removing portion 31 from being deformed and the shape of the adhesive sheet 30 around the terminal portion from becoming irregular.

  In FIG. 4A, alignment marks are formed at the corners. This alignment mark is punched at the same time when the adhesive removing portion 31 is punched. Therefore, no new process is required to form the alignment mark on the adhesive sheet 30. The shape of the alignment mark in FIG. 4A is a circle, which means that the alignment mark is formed in the vicinity of this position. The alignment mark is not limited to a circle, and is like a cross. Often in shape.

  The back side protective film 36 in FIG. 4B is removed, and the adhesive sheet 30 is attached to the sealing substrate 40 as shown in FIG. This pasting is performed by applying a temperature of about 80 ° C. under reduced pressure so as not to include bubbles. If it is about 80 degreeC, although the adhesive material sheet 30 will not fully solidify, since it has a certain amount of adhesiveness, the sealing substrate 40 and the adhesive material sheet 30 can be adhere | attached with a certain amount of intensity | strength.

  FIG. 5A shows a state where the adhesive sheet 30 of FIG. 4 is bonded to the sealing substrate 40. In FIG. 5A, the protective film 36 of the adhesive sheet 30 is visible on the surface. The dotted line in FIG. 5A is the long removal part 31 of the adhesive sheet 30.

  An alignment mark is formed in the corner portion of FIG. In the present invention, the sealing substrate 40 itself is not formed with a pattern such as alignment marks, but is merely a glass plate. Therefore, the manufacturing cost of the sealing glass is low. As shown in FIG. 4, alignment marks are formed on the adhesive sheet 30, and when the adhesive sheet 30 adheres to the sealing substrate 40, the sealing substrate 40 has the alignment marks.

  The adhesive sheet 30 in the present invention is provided with an adhesive sheet removing portion in a portion corresponding to the terminal portion 102. Since the adhesive mark removing portion can be formed at the same time as the adhesive sheet removing portion, the alignment mark can be formed. The manufacturing cost for forming the alignment mark hardly increases.

  In addition, when bonding the adhesive sheet 30 and the sealing substrate 40, the alignment mark cannot be used, but this bonding is sufficient on the basis of the outer shape. For the positional accuracy in the planar direction for protecting the organic EL layer formed on the element substrate 10 from moisture, the relationship between the adhesive sheet 30 and the element substrate 10 is important. Therefore, it is only necessary to ensure the positional accuracy of the planar method of the sealing substrate 40 and the element substrate 10 after the adhesive sheet 30 is bonded.

  FIG.5 (b) is AA sectional drawing of Fig.5 (a), and is sectional drawing of the part from which the adhesive material sheet 30 was removed. In this part, the adhesive sheet 30 is sandwiched between the protective substrate and the sealing substrate 40 only on one side. FIG. 5C is a cross-sectional view taken along the line B-B in FIG. 5A, and shows a state where the adhesive sheet 30 is sandwiched between the protective film 36 and the sealing substrate 40.

  FIG. 6 shows a state where the adhesive sheet 30 is attached to the sealing substrate 40 with the protective film in FIG. 5 peeled off. FIG. 6A is a plan view showing a state in which a protective film is bonded onto a mother sealing substrate 400 on which a plurality of sealing substrates 40 are formed. In FIG. 6A, alignment marks are formed at the corners. That is, the alignment mark by the adhesive sheet 30 is formed on the sealing substrate 40 in this state.

  FIG.6 (b) is AA sectional drawing of Fig.6 (a). The mother sealing substrate 400 is covered with the adhesive sheet 30 over the entire surface except for the elongated removal portion 31 that corresponds to the terminal portion 102 formed on the element substrate 10. The elongated removal portion 31 reaches the end on the left side.

  FIG. 7 is a plan view of the mother element substrate 100 in which eight element substrates 10 are formed. Each element substrate 10 is provided with a display region 101 and a terminal portion 102. The terminal portion 102 of the mother element substrate 100 in FIG. 7 corresponds to the adhesive sheet removing portion 31 of the mother sealing substrate 400 in FIG.

  The alignment mark 33 is formed in the corner part of FIG. In the element substrate 10, various patterns such as TFTs, scanning lines, video signal lines, power supply lines and the like are formed in addition to the organic EL layer. Therefore, the alignment mark 33 formed on the element substrate 10 may be formed simultaneously when these patterns are formed.

  FIG. 8 is a diagram showing a process of bonding the mother element substrate 100 and the mother sealing substrate 400 via the adhesive sheet 30. FIG. 8A is a diagram for bonding the sealing substrate 40 and the adhesive sheet 30 having alignment marks. In FIG. 8A, the mother sealing substrate 400 and the adhesive sheet 30 are bonded on the basis of the external shape. In FIG. 8, the hatched portion of the adhesive sheet 30 indicates a portion corresponding to the individual display area 101 formed on the element substrate 10, and other portions of the adhesive sheet 30 are omitted.

  FIG. 8B shows a state where the mother sealing substrate 400 and the adhesive sheet 30 are bonded. In this state, the mother sealing substrate 400 has the alignment mark 32. FIG. 8C is a diagram in which the separately formed mother element substrate 100 is bonded to the mother sealing substrate 400 to which the adhesive sheet 30 is attached. The mother sealing substrate 400 includes the alignment mark 32 formed on the adhesive sheet 30, and the mother sealing substrate 400 and the mother are based on the alignment mark and the alignment mark 33 formed on the mother element substrate 100. The element substrate 100 is bonded. FIG. 8D is a perspective view showing a state in which a mother panel is formed by bonding the mother sealing substrate 400 to the mother element substrate 100 in this way.

  Bonding of the mother sealing substrate 400 and the mother element substrate 100 is performed in a reduced pressure atmosphere while applying pressure to the mother element substrate 100 and heating. The heating condition is, for example, heating for 2 hours at 100 ° C. and for about 30 minutes at 120 ° C. By this heating, the adhesive sheet 30 is cured, and the mother sealing substrate 400 and the mother element substrate 100 are firmly bonded. Further, it is possible to prevent moisture from entering from the interface.

  FIG. 9 shows a mother panel 200 in which the mother sealing substrate 400 of FIG. 6 and the mother element substrate 100 of FIG. 7 are bonded via the adhesive sheet 30. 9A is a plan view of the mother panel 200 viewed from the sealing substrate 40 side, FIG. 9B is a cross-sectional view taken along the line AA in FIG. 9A, and FIG. It is EE sectional drawing of 9 (a).

  As shown in FIGS. 9A and 9C, the adhesive sheet removing portion 31 reaches the end on the left side of the mother panel 200. Therefore, the inside of the adhesive sheet removing portion 31 is at the same pressure as the outside even in a negative pressure atmosphere or atmospheric pressure. If the adhesive sheet removing unit 31 is closed on both sides as shown on the right side of FIG. 9A, the following problem occurs. In the reduced pressure atmosphere, the mother element substrate 100 and the mother sealing substrate 400 are bonded together by the adhesive sheet 30. When returning to the atmosphere after bonding, the adhesive sheet removing portion 31 remains at a negative pressure, so that the adhesive sheet 30 receives pressure due to atmospheric pressure, and as a result, the adhesive sheet removing portion 31 is deformed. To do. Since the adhesive sheet removing portion 31 exposes the terminal portion 102, the adhesive sheet 30 covering the periphery of the terminal portion is deformed, resulting in a situation that affects the conduction of the terminal portion 102. Moreover, peeling of the adhesive material sheet 30 may occur from a portion where the adhesive material sheet 30 is deformed.

  On the other hand, if the adhesive sheet removing portion 31 in the adhesive sheet 30 is formed up to the end of the adhesive sheet 30 as in the present invention, the mother sealing substrate 400 and the mother element substrate 100 are bonded. After that, even if the pressure is returned to the atmospheric pressure, the air enters the adhesive sheet removing unit 31, so that the pressure is balanced and the adhesive sheet removing unit 31 can be prevented from being deformed.

  In FIG. 9A, the hatched portion is the portion where the adhesive sheet 30 is installed. In FIG. 9B, the adhesive sheet 30 is formed on the display area 101 formed on the mother element substrate 100, and the mother sealing substrate 400 is adhered thereon. On the other hand, the adhesive sheet 30 does not exist in the terminal portion 102 of the mother element substrate 100. Therefore, when the mother panel 200 is separated into individual organic EL display devices, neither the adhesive sheet 30 nor the sealing substrate 40 exists on the terminal portion 102.

  After the mother element substrate 100 is bonded to the mother sealing substrate 400, scribing is performed from the mother element substrate 100 side along the dotted line y and the dotted line x in FIG. 9A. In addition, scribing is performed from the mother sealing substrate 400 side along the dotted line xt. Thereafter, when an impact is applied to the glass from the mother element substrate 100 side, the mother panel 200 is broken along the dotted lines x and y, and separated into individual organic EL display devices. After the organic EL display panel 300 is individually separated, when the glass is impacted along the scribing xt from the sealing substrate 40 side, the sealing substrate 40 on the terminal portion 102 is broken and removed, and the element substrate is removed. Ten terminal portions 102 are exposed.

  Since the individual organic EL display panel 300 is separated from the mother panel 200 by the method as described above, the cross section differs depending on the separated location. FIG. 10 shows the difference in cross section depending on the location where the organic EL display panel 300 formed as described above is cut off. FIG. 10A is a cross-sectional view taken along the line B-B of the cut-out organic EL display panel (1). In FIG. 10A, the adhesive sheet 30 is retracted inward from the end of the sealing substrate 40 by d1.

  In the BB cross section, since the adhesive sheet 30 is partitioned by a previously formed removal portion 31, d1 in FIG. 10 can be designed in advance. In other words, it can be controlled so that the adhesive sheet 30 is always inside the fracture surface of the sealing substrate 40 or the element substrate 10. That is, in FIG. 10A, d1 can be zero or larger than zero. In general, since the adhesive sheet 30 undergoes compositional deformation at the time of bonding, d1 is set to about 0.5 mm in consideration of this.

  FIG. 10B is a cross-sectional view taken along the line C-C of the cut-out organic EL display panel (2). In FIG. 10B, the end of the organic EL display panel (2) is a surface where the sealing substrate 40, the adhesive sheet 30, and the element substrate 10 are broken. The element substrate 10 and the sealing substrate 40 are made of glass, whereas the adhesive sheet 30 is made of resin, so that the method of breaking is different. Therefore, as shown in FIG.10 (b), the edge part of glass and the edge part of the adhesive material sheet 30 become an irregular shape.

  In FIG.10 (b), the edge part of the right side has shown the state which the adhesive material sheet 30 protruded only d2 rather than the glass edge part. The amount of protrusion is, for example, about 0.2 mm. On the other hand, the adhesive sheet 30 enters 0.2 mm inside from the glass end at the left end in FIG. This shows a state in which the end portion of the adhesive sheet 30 is brought to the adjacent organic EL display panel when the adhesive sheet 30 is broken. In FIG. 10B, the adhesive sheet 30 happens to be protruded on the right side and retracted on the left side, but this is an example. For example, the reverse is also possible, or the adhesive sheet 30 protrudes on both sides. There is also a possibility. With such a manufacturing method, there can be a plus or minus d2 of about 0.2 mm.

  FIG.10 (c) is DD sectional drawing of an organic electroluminescent display panel (3). In FIG. 10C, the adhesive sheet 30 exists on the left side, that is, the terminal side end surface, inside the end portion of the sealing substrate 40. This portion can be controlled as described with reference to FIG. On the other hand, on the right side, that is, on the side opposite to the terminal portion 102, the adhesive sheet 30 protrudes outside the sealing substrate 40. As described with reference to FIG. 10B, this portion cannot predict the fracture surface of the adhesive sheet 30, and d2 may have a plus or minus of about 0.2 mm. Thus, according to the manufacturing method of the present invention, the positional relationship between the end of the adhesive sheet 30 and the end of the sealing substrate 40 or the element substrate 10 differs depending on the cross section of the organic EL display panel. .

  FIG. 11 shows an adhesive film 35 used in the second embodiment of the present invention. Fig.11 (a) is a top view of the adhesive film 35, FIG.11 (b) is the AA sectional drawing. The adhesive film 35 in FIG. 11 (a) is also formed in such a manner that the adhesive sheet 30 is initially formed on the entire surface of the protective film 36 and sandwiched between the other protective films 36, as in FIG. It is. Then, the state which removed the one protective film 36 and the adhesive material sheet 30 leaving the required part is FIG.

  In FIG. 11A, alignment marks 32 are formed at the corners of each adhesive sheet 30. This alignment mark 32 is formed simultaneously when each adhesive sheet 30 is formed into a predetermined shape.

  The adhesive sheet 30 of the present embodiment has a reverse relationship to that of the first embodiment. That is, in Example 1, an unnecessary portion, that is, a portion corresponding to the terminal portion 102 is removed from the adhesive sheet 30, whereas in this embodiment, the adhesive material is applied only to a portion where the adhesive sheet 30 is necessary. A seat 30 is installed.

  FIG. 12 shows a state where one protective film 36 in FIG. 11 is peeled off, the adhesive sheet 30 is adhered to the mother sealing substrate 400, and then the other protective film 36 is removed. The adhesive sheet 30 is bonded to the sealing substrate 40 by heating in a reduced pressure atmosphere as in the first embodiment. Fig.12 (a) is a top view, FIG.12 (b) is AA sectional drawing of Fig.12 (a). In the state of FIG. 12, the sealing substrate 40 has the alignment mark 32.

  FIG. 13 shows a mother panel 200 formed by bonding the mother sealing substrate 400 formed as described above to a separately formed mother element substrate 100. The separately formed element substrate 10 is the same as FIG. The method for bonding the mother element substrate 100 and the mother sealing substrate 400 is the same as that described in the first embodiment. Fig.13 (a) is a top view of the mother panel 200, FIG.13 (b) is AA sectional drawing of Fig.13 (a).

  In FIG. 13A, the hatched portion is a portion where the adhesive sheet 30 is installed. Scribing is performed from the mother element substrate 100 side along dotted lines x and y in FIG. 13A, and scribing is performed from the mother sealing substrate 400 side along dotted line xt in FIG. Thereafter, an impact is applied to the glass from the mother sealing substrate 400 side to separate each organic EL display panel. Further, an impact is applied to the separated organic EL display panel 300 from the sealing substrate 40 side to remove a part of the sealing substrate 40 to expose the terminal portion 102.

  In this embodiment, since the shape of the adhesive sheet 30 is different from that in the first embodiment, the cross section of the organic EL display panel 300 may be different from that in the first embodiment. The EE cross section of the organic EL display panel (4) separated from the mother panel 200 shown in FIG. 13 (a) is the same as FIG. 10 (a) of the first embodiment. Since this part of the adhesive sheet 30 can be designed in advance, the end of the adhesive sheet 30 can be controlled.

  The FF cross section of the organic EL display panel (5) separated from the mother panel 200 has the shape shown in FIG. That is, irregular ends of the adhesive sheet 30 appear. On the other hand, the GG cross section of the organic EL display panel (6) separated from the mother panel 200 is the same as that of FIG. This is because in this embodiment, the cross section of this portion is the same as the EE cross section of the organic EL display panel (4).

  In Example 1 and Example 2, the adhesive sheet 30 having the alignment mark 32 is attached to the mother sealing substrate 400, and this mother sealing substrate 400 is overlapped with the mother element substrate 100 on which the alignment mark 33 is formed. Match. Whether or not the element substrate 10 and the adhesive sheet 30 or the element substrate 10 and the sealing substrate 40 are bonded with high precision in each organic EL display panel after the mother sealing substrate 400 and the mother element substrate 100 are overlaid. You may want to check.

  FIG. 14 showing this embodiment responds to this request. FIG. 14A is a plan view showing a state in which the mother element substrate 100 and the mother sealing substrate 400 are bonded via the adhesive sheet 30 in this embodiment. The mother element substrate 100 and the mother sealing substrate 400 are aligned and bonded by the adhesive sheet 30 alignment mark 32 and the mother element substrate 100 alignment mark 33. FIG.14 (b) is AA sectional drawing of Fig.14 (a).

  In this embodiment, as shown in FIG. 14 (a), the alignment mark 32 is formed on the adhesive sheet 30, and at the same time, the individual alignment mark 34 is formed in the portion corresponding to each organic EL display panel. Yes. Since the individual alignment mark 34 in the adhesive sheet 30 can be formed at the same time as the adhesive sheet 30 is formed, an additional process for this purpose is unnecessary. On the other hand, since the individual alignment marks in the individual organic EL display panels in the mother element substrate 100 can be performed simultaneously with the patterning of the element substrate 10, a process for this purpose is not added.

  Thus, according to the present embodiment, after bonding the mother sealing substrate 400 and the mother element substrate 100, the alignment accuracy between the element substrate 10 and the sealing substrate 40 or the element substrate 10 and the adhesive sheet 30 is increased. Since the individual alignment marks 34 can be used to confirm individual organic EL display panels, the reliability of the organic EL display device can be improved. FIG. 14 shows the application of the present embodiment to the configuration of the first embodiment, but this embodiment can also be applied to the configuration of the second embodiment.

  As described in Example 1 and Example 2, the adhesive sheet 30 may be attached to each mother sealing substrate 400. However, in the case where the adhesive sheet 30 has a large area, from the standpoint of a manufacturing place or the like. In some cases, it is not always efficient. 15 and 16 show an example for solving this problem.

  FIG. 15 shows a case where a large number of adhesive sheets 30 shown in Example 1 are attached to the protective film 36 to form a roll film 361. In FIG. 15, the dotted line is the assumed outer shape of the mother sealing substrate 400. A roll film 361 is supplied from the left side in FIG. 15 to transfer the adhesive sheet 30 to the mother sealing substrate 400. Then, the protective sheet after the transfer is wound on the right side.

  In the adhesive sheet 30 of FIG. 15, an adhesive removal part 31 and alignment marks 32 are formed. The adhesive removing part 31 and the alignment mark 32 are formed at the same time when shaping the outer shape of the adhesive sheet 30. The bonding of the adhesive sheet 30 to the mother sealing substrate 400 and the bonding of the mother sealing substrate 400 and the mother element substrate 100 are the same as described in the first embodiment.

  FIG. 16 shows an example in which the adhesive sheet 30 used in Example 2 is formed on a roll adhesive film 361. In FIG. 16, the dotted line is the assumed outer shape of the mother protection sheet. In the case of FIG. 16 as well, as in FIG. 15, the roll film 361 is supplied from the left side, and after transferring the adhesive sheet 30 to the mother sealing substrate 400, the protective film 36 is wound up on the right side.

  Each adhesive sheet 30 in FIG. 16 is formed with an adhesive removing portion 31 and alignment marks 32. The adhesive removing part 31 and the alignment mark 32 are formed at the same time when shaping the outer shape of the adhesive sheet 30. The bonding of the adhesive sheet 30 to the mother sealing substrate 400 and the bonding of the mother sealing substrate 400 and the mother element substrate 100 are the same as described in the second embodiment.

  By taking the configuration as shown in FIG. 15 or FIG. 16, the adhesive sheet 30 can be efficiently attached to many mother boards. Also, there is no need to make a large manufacturing site for winding with a roll.

  In Example 1 to Example 4, the element substrate 10 and the sealing substrate 40 are bonded using the adhesive sheet 30, and at the same time, the adhesive sheet 30 has a moisture-proof effect. In this embodiment, instead of using the adhesive sheet 30 as an adhesive, the adhesive 38 is directly printed on the mother sealing substrate 400 by application.

  FIG. 17A shows a situation in which an adhesive 38 having the same shape as the adhesive sheet 30 of Example 1 is formed by a coating film. FIG. 17B shows a situation where an adhesive 38 having the same shape as the adhesive sheet 30 of Example 2 is formed by a coating film. Since the coating film does not require fineness, it can be formed, for example, by screen printing.

  For example, an epoxy resin or an acrylic resin can be used as the material of the adhesive 38 by printing. The film thickness for printing is, for example, 10 μm to 20 μm. The film thickness of printing may be made thinner as long as sufficient adhesion between the element substrate 10 and the sealing substrate 40 can be secured.

  In FIG. 17A, the hatched area is an area where an adhesive is formed by screen printing. The adhesive 38 is not formed on the adhesive removing portion 31 and the alignment mark portion. The adhesive removing part 31 is an area where the terminal part 102 is formed in the element substrate 10. The adhesive removing part 31 and the alignment mark 32 can be arbitrarily formed by a screen printing pattern.

  In FIG. 17B, an adhesive sheet 30 corresponding to Example 2 is formed with an adhesive 38 by screen printing. In FIG. 17, alignment marks 32 are formed at the corners of the individual adhesive material regions. This alignment mark can also be formed simultaneously with screen printing.

  In this way, after forming the adhesive 38 as shown in FIG. 17A or 17B on the sealing substrate 40 by printing, pre-baking is performed at about 80 ° C., and the adhesive 38 is half-finished. Harden. The semi-cured adhesive 38 has a certain level of adhesive strength. Thereafter, the element substrate 10 and the sealing substrate 40 are bonded to each other with a semi-cured adhesive 38 to manufacture the mother panel 200. Then, final baking is performed at 100 ° C. for 2 hours or 120 ° C. for 30 minutes. After the final baking, the element substrate 10 and the sealing substrate 40 are firmly bonded, and the moisture resistance effect of the adhesive 38 is also produced.

  Thereafter, the mother panel 200 is separated into individual organic EL display panels 300. The separation method is as described in Example 1. Further, the fracture surface of each separated organic EL display panel 300 is the same as that described in the first or second embodiment. That is, the organic EL display panel 300 formed in FIG. 17A has a cross section as described in the first embodiment, and the organic EL display panel 300 formed in FIG. 17B has a cross section as described in the second embodiment. It becomes.

  Thus, when the adhesive 38 is directly formed on the mother sealing substrate 400, the alignment mark 32 is formed at the same time, so that it is not necessary to separately provide a process for forming the alignment mark on the mother sealing substrate 400. . Therefore, the manufacturing cost can be reduced accordingly.

  In the above description, the adhesive 38 is applied by screen printing. However, the application of the adhesive 38 is not limited to screen printing, and can be formed by an inkjet method or a dispenser method.

It is sectional drawing of the organic electroluminescence display of this invention. It is sectional drawing of the display area of the organic electroluminescence display panel of this invention. It is an adhesive film before processing. 2 is an adhesive film of Example 1. FIG. It is the figure which the adhesive material sheet with a protective film of Example 1 adhere | attached on the mother sealing substrate. It is the figure which the adhesive material sheet of Example 1 adhere | attached on the mother sealing substrate. It is a top view of a mother element substrate. It is a figure which shows the adhesion process of a mother sealing substrate and a mother element substrate. 2 is a mother panel of Example 1. FIG. 1 is a cross-sectional view of an organic EL display panel formed in Example 1. FIG. 2 is an adhesive film of Example 2. It is the figure which the adhesive material sheet of Example 2 adhere | attached on the mother sealing substrate. 6 is a mother panel of Example 2. FIG. 10 is a mother panel of Example 3. 3 is an example of a roll adhesive film of Example 4. FIG. 6 is another example of the roll adhesive film of Example 4. FIG. This is an example in which an adhesive is formed on a mother sealing substrate by printing. This is the technique described in “Patent Document 1”. This is a technique described in “Non-Patent Document 1”. This is the technique described in “Patent Document 2”.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Element substrate, 11 ... 1st base film, 12 ... 2nd base film, 13 ... Semiconductor layer, 14 ... Gate insulating film, 15 ... Gate electrode, 16 ... Interlayer insulating film, 17 ... SD electrode, 18 ... Inorganic passivation Membrane, 19 ... Organic passivation film, 20 ... Bank, 21 ... Lower electrode, 22 ... Organic EL layer, 23 ... Upper electrode, 30 ... Adhesive sheet, 31 ... Adhesive sheet removing part, 32 ... Adhesive sheet alignment mark 33 ... Mother element substrate alignment mark, 34 ... Individual alignment mark, 35 ... Adhesive film, 36 ... Protective film, 38 ... Printing adhesive, 40 ... Sealing substrate, 100 ... Mother element substrate, 101 ... Display area 102 ... Terminal part 200 ... Mother panel 300 ... Organic EL display panel 361 ... Rolled film 400 ... Mother -Sealing substrate.

Claims (8)

In an element substrate having a display region and a terminal portion, an adhesive sheet is formed so as to cover the display region, and a sealing substrate is bonded to the adhesive sheet.
The organic EL display device includes a mother sealing substrate on which a plurality of the sealing substrates are formed, a mother element substrate on which the plurality of element substrates are formed, and a mother adhesive that bonds the mother sealing substrate and the mother element substrate Formed separately from the mother panel formed from the sheet,
The mother adhesive sheet has alignment marks and an adhesive removal part,
Adhering the mother adhesive sheet to the mother sealing substrate,
Adhering the mother sealing substrate to the mother element substrate based on the alignment mark formed on the mother adhesive sheet,
A method for manufacturing an organic EL display device, comprising: bonding the mother sealing substrate and the mother element substrate so that the adhesive removing portion is disposed at a plurality of terminal portions formed on the mother element substrate.   The mother adhesive sheet adhered to the mother sealing substrate is a single sheet, and the mother adhesive sheet is removed from the portions corresponding to the terminal portions of the plurality of element substrates formed on the mother element substrate. The method for producing an organic EL display device according to claim 1.   A plurality of mother adhesive sheets adhered to the mother sealing substrate are bonded so as to cover a plurality of display areas formed on the element substrate, and the plurality of mother adhesive sheets have alignment marks, and the mother 2. The method of manufacturing an organic EL display device according to claim 1, wherein the adhesive sheet does not cover portions corresponding to terminal portions of a plurality of element substrates formed on the mother element substrate.   The said mother adhesive material sheet is affixed on the protective film used as the roll-shaped film, The manufacturing method of the organic electroluminescent display apparatus of Claims 1-3 characterized by the above-mentioned. In an element substrate having a display region and a terminal portion, an adhesive is formed so as to cover the display region, and a sealing substrate is bonded to the adhesive.
The organic EL display device includes a mother sealing substrate on which a plurality of the sealing substrates are formed, a mother element substrate on which the plurality of element substrates are formed, and an adhesive that bonds the mother sealing substrate and the mother element substrate. Formed separately from the mother panel formed from
The adhesive covers a plurality of display areas formed on the mother element substrate, but does not cover a plurality of terminal portions formed on the mother element substrate, and an alignment mark is formed. A method for producing an organic EL display device, characterized by being applied to the mother sealing substrate.   6. The method of manufacturing an organic EL display device according to claim 5, wherein the application is performed by screen printing. An organic EL display device in which an adhesive sheet is formed on an element substrate having a display region and a terminal portion so as to cover the display region, and a sealing substrate is bonded to the adhesive sheet,
The organic EL display device, wherein the adhesive sheet has alignment marks, and the element substrate has alignment marks. An organic EL display device in which an adhesive material is formed by coating an element substrate having a display region and a terminal portion so as to cover the display region, and a sealing substrate is bonded to the adhesive.
An alignment mark is formed on the adhesive, and an alignment mark is formed on the element substrate.

Images