JP2003197366A - Display and manufacturing method for it - Google Patents
Display and manufacturing method for itInfo
- Publication number
- JP2003197366A JP2003197366A JP2001392308A JP2001392308A JP2003197366A JP 2003197366 A JP2003197366 A JP 2003197366A JP 2001392308 A JP2001392308 A JP 2001392308A JP 2001392308 A JP2001392308 A JP 2001392308A JP 2003197366 A JP2003197366 A JP 2003197366A
- Authority
- JP
- Japan
- Prior art keywords
- display device
- organic
- adhesive resin
- liquid
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- 239000004840 adhesive resin Substances 0.000 claims description 53
- 229920006223 adhesive resin Polymers 0.000 claims description 53
- 239000007788 liquid Substances 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 31
- 238000005401 electroluminescence Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 38
- 238000001723 curing Methods 0.000 abstract description 12
- 238000003848 UV Light-Curing Methods 0.000 abstract 3
- 239000005357 flat glass Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 16
- 239000002274 desiccant Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000011049 filling Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical class N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- JHYLKGDXMUDNEO-UHFFFAOYSA-N [Mg].[In] Chemical compound [Mg].[In] JHYLKGDXMUDNEO-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、有機エレクトロルミ
ネッセンス素子（有機ＥＬ素子）を封止して成る表示装
置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device formed by encapsulating an organic electroluminescence element (organic EL element).
【０００２】[0002]
【従来の技術】図５は、有機ＥＬ素子５０を用いる従来
の表示装置を示した断面図である。透明なガラス基板５
１上には、有機ＥＬ素子５０がその発光面側をガラス基
板５１側に向けた状態で接着されている。封止材である
金属缶５２は有機ＥＬ素子５０の本体部の大きさに対応
しており、この金属缶５２で有機ＥＬ素子５０の本体部
を覆うと取り出し電極５０ａのみが露呈されるかたちと
なる。金属缶５２は凹形状をなしており、その周囲壁部
５２ａの下端面側にＵＶ硬化樹脂５３を介在させてガラ
ス基板５１に載せられ、ＵＶ硬化樹脂５３に紫外線（Ｕ
Ｖ）を照射し硬化させることでガラス基板５１に接着固
定される。有機ＥＬ素子５０と金属缶５２との間には空
間が形成されるようにしてあり、この空間部分に乾燥剤
を装填しておくことで防湿性を向上させている。2. Description of the Related Art FIG. 5 is a sectional view showing a conventional display device using an organic EL element 50. Transparent glass substrate 5
The organic EL element 50 is adhered onto the substrate 1 with its light emitting surface side facing the glass substrate 51 side. The metal can 52, which is a sealing material, corresponds to the size of the main body of the organic EL element 50. When the metal can 52 covers the main body of the organic EL element 50, only the extraction electrode 50a is exposed. Become. The metal can 52 has a concave shape, and is placed on the glass substrate 51 with the UV curable resin 53 interposed on the lower end surface side of the peripheral wall portion 52a, and the UV curable resin 53 is exposed to ultraviolet rays (U).
V) is irradiated and cured to be bonded and fixed to the glass substrate 51. A space is formed between the organic EL element 50 and the metal can 52, and a moisture-proof property is improved by loading a desiccant in this space.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記従
来の構造では、封止材に金属缶５２を用い、有機ＥＬ素
子５０と金属缶５２との間に乾燥剤充填用の空間が形成
されるようにしているため、表示装置としての薄型化が
図れないという欠点があった。However, in the above conventional structure, the metal can 52 is used as the sealing material, and the space for the desiccant filling is formed between the organic EL element 50 and the metal can 52. Therefore, there is a drawback that the display device cannot be thinned.
【０００４】表示装置としての薄型化という目的達成の
ため、図６の参考図に示すように、有機ＥＬ素子５０の
全体をＵＶ硬化樹脂５３にて覆い、その上に封止材とし
て薄板ガラス５５を密着させてＵＶ硬化樹脂５３を硬化
させることを試みたが、かかる構造では、ＵＶ硬化樹脂
５３の硬化時の収縮度が大きく、有機ＥＬ素子５０に応
力が加わってダメージを生じることがわかった。In order to achieve the object of making the display device thinner, as shown in the reference diagram of FIG. 6, the entire organic EL element 50 is covered with a UV curable resin 53, and a thin glass 55 as a sealing material is provided thereon. An attempt was made to bring the UV curable resin 53 into close contact with the resin, but with such a structure, it was found that the shrinkage of the UV curable resin 53 at the time of curing was large and stress was applied to the organic EL element 50 to cause damage. .
【０００５】この発明は、上記の事情に鑑み、有機ＥＬ
素子を用いた表示装置において、その薄型化を図りつ
つ、樹脂硬化による有機ＥＬ素子へのダメージを回避す
ることを目的とする。In view of the above circumstances, the present invention is an organic EL device.
An object of the present invention is to prevent damage to an organic EL element due to resin curing while reducing the thickness of a display device using the element.
【０００６】[0006]
【課題を解決するための手段】この発明の表示装置は、
上記の課題を解決するために、有機エレクトロルミネッ
センス素子を封止して成る表示装置において、有機エレ
クトロルミネッセンス素子と封止用板材との間に接着用
樹脂が充填されており、周辺部分に位置する接着用樹脂
は硬化され、有機エレクトロルミネッセンス素子上の接
着用樹脂の全部又は一部が未硬化であることを特徴とす
る。The display device of the present invention comprises:
In order to solve the above problems, in a display device formed by sealing an organic electroluminescence element, an adhesive resin is filled between the organic electroluminescence element and a sealing plate material, and the resin is located in a peripheral portion. The adhesive resin is cured, and all or part of the adhesive resin on the organic electroluminescence element is uncured.
【０００７】上記の構成であれば、封止用板材は接着用
樹脂を介して有機エレクトロルミネッセンス素子に密着
する構造であるから、乾燥剤充填用の中空構造に比べ、
表示装置としての薄型化が図れることになる。また、接
着用樹脂は周辺部分では硬化されるものの、有機エレク
トロルミネッセンス素子上では、接着用樹脂の全部又は
一部は未硬化であり、硬化による応力を生じさせない或
いは硬化による応力を微小に抑えることができるため、
有機エレクトロルミネッセンス素子へのダメージは軽減
されることになる。With the above structure, since the sealing plate material has a structure in which it is adhered to the organic electroluminescence element through the adhesive resin, compared with the hollow structure for filling the desiccant,
A thin display device can be achieved. Further, although the adhesive resin is hardened in the peripheral portion, on the organic electroluminescence element, the adhesive resin is wholly or partially uncured, so that the stress due to curing is not generated or the stress due to curing is suppressed to a small extent. Because you can
Damage to the organic electroluminescence element will be reduced.
【０００８】前記接着用樹脂として紫外線硬化樹脂を採
用してもよい。この構造の表示装置を製造する方法は、
基板上に載置した有機エレクトロルミネッセンス素子を
接着用樹脂にて被覆した後、この接着用樹脂上に封止用
板材を載せ、紫外線を周辺部分に照射するとともに有機
エレクトロルミネッセンス素子上の接着用樹脂に対して
は全部又は一部の未照射部位を形成することを特徴とす
る。An ultraviolet curable resin may be adopted as the adhesive resin. The method of manufacturing the display device of this structure is
After coating the organic electroluminescent element placed on the substrate with the adhesive resin, the sealing plate material is placed on this adhesive resin, and the peripheral portion is irradiated with ultraviolet rays and the adhesive resin on the organic electroluminescent element However, it is characterized in that all or part of the unirradiated portion is formed.
【０００９】前記接着用樹脂は第１液と第２液とが混ざ
り合うことで硬化する樹脂であり、周辺部分には第１液
と第２液とが存在して硬化しており、有機エレクトロル
ミネッセンス素子上の接着用樹脂の全部又は一部は一方
の液のみが存在して未硬化状態となるようにしてもよ
い。また、前記第１液又は第２液のうち、未硬化状態で
防湿性に優れている方が有機エレクトロルミネッセンス
素子上に多く存在するのがよい。The adhesive resin is a resin that cures when the first liquid and the second liquid are mixed, and the first liquid and the second liquid exist in the peripheral portion and are cured, so that the organic electro All or part of the adhesive resin on the luminescent element may be in an uncured state with only one liquid present. Further, among the first liquid or the second liquid, it is preferable that the one having excellent moisture resistance in the uncured state is present on the organic electroluminescence device in a large amount.
【００１０】接着用樹脂が第１液と第２液とから成る表
示装置を製造する方法は、基板上に載置した有機エレク
トロルミネッセンス素子を覆うように第１液を塗布した
後、第２液が周囲に塗布されているとともに有機エレク
トロルミネッセンス素子に対応する位置の全部又は一部
が未塗布部である封止用板材を貼り合わせることを特徴
とする。或いは、基板上に載置した有機エレクトロルミ
ネッセンス素子の周囲に第１液を塗布するとともに有機
エレクトロルミネッセンス素子上の全部又は一部には未
塗布部を残し、第２液が全体に塗布された封止用板材を
貼り合わせることを特徴とする。The method of manufacturing a display device in which the adhesive resin is composed of the first liquid and the second liquid is as follows. The first liquid is applied so as to cover the organic electroluminescence element mounted on the substrate, and then the second liquid is applied. Is applied to the surroundings, and a sealing plate material in which all or part of the position corresponding to the organic electroluminescence element is an uncoated portion is bonded. Alternatively, the first liquid is applied to the periphery of the organic electroluminescence element placed on the substrate, and an uncoated part is left on all or part of the organic electroluminescence element, and the second liquid is applied to the entire seal. It is characterized in that a stop plate material is attached.
【００１１】前記接着用樹脂は第１接着用樹脂と第２接
着用樹脂とから成り、第１接着用樹脂は硬化状態で存在
し、第２接着用樹脂は未硬化状態で存在するようにして
もよい。The adhesive resin comprises a first adhesive resin and a second adhesive resin. The first adhesive resin exists in a cured state and the second adhesive resin exists in an uncured state. Good.
【００１２】[0012]
【発明の実施の形態】この発明の表示装置を図１乃至図
４に基づいて説明していく。DESCRIPTION OF THE PREFERRED EMBODIMENTS The display device of the present invention will be described with reference to FIGS.
【００１３】図１は、この実施形態の表示装置１を示し
た断面図である。透明なガラス基板１１上に有機ＥＬ素
子１０がその発光面側をガラス基板１１側に向けた状態
で接着されている。FIG. 1 is a sectional view showing a display device 1 of this embodiment. The organic EL element 10 is bonded onto the transparent glass substrate 11 with its light emitting surface side facing the glass substrate 11 side.
【００１４】有機ＥＬ素子１０は、例えば、図２に示す
ような断面構造を有している。この構造では、絶縁性基
板２１上にＴＦＴ構成体２２が形成され、このＴＦＴ構
成体２２上に層間絶縁膜２３及び平坦化絶縁膜２４を介
して有機ＥＬ層２５が形成されている。ＴＦＴ構成体２
２は、ソース及びドレインをなす導電層２２ａ、及びこ
の導電層２２ａ上にゲート絶縁膜２２ｂを介して形成さ
れたゲート電極２２ｃによって構成される。前記ドレイ
ンには駆動信号線２２ｄが接続されており、前記ソース
には有機ＥＬ層２５の陽極（ホール注入層）２５ａが接
続されている。有機ＥＬ層２５は、ＩＴＯ（Indium Thi
n Oxide)から成る前記陽極２５ａ、ＭＴＤＡＴＡ（4,4'
-bis(3-methylphenylphenylamion)biphenyl)から成る第
１ホール輸送層２５ｂ、ＴＰＤ(4,4',4 ″-tris(3-meth
ylphenylphenylamion)triphenylanine) から成る第２ホ
ール輸送層２５ｃ、キナクリドン（Quinacridone) 誘導
体を含むＢｅｂｑ２（10−ベンゾ[h] キノリノール−ベ
リリウム錯体) から成る発光層２５ｄ、及びＢｅｂｑ２
からなる電子輸送層２５ｅ、マグネシウム・インジウム
（ＭｇＩｎ）から成る陰極（電子注入層）２５ｆから成
る（特開２００１−１０２５９５号公報参照）。The organic EL element 10 has, for example, a sectional structure as shown in FIG. In this structure, the TFT structure 22 is formed on the insulating substrate 21, and the organic EL layer 25 is formed on the TFT structure 22 via the interlayer insulating film 23 and the planarizing insulating film 24. TFT structure 2
Reference numeral 2 includes a conductive layer 22a forming a source and a drain, and a gate electrode 22c formed on the conductive layer 22a via a gate insulating film 22b. A drive signal line 22d is connected to the drain, and an anode (hole injection layer) 25a of the organic EL layer 25 is connected to the source. The organic EL layer 25 is made of ITO (Indium Thi
n Oxide), the anode 25a, MTDATA (4,4 '
first hole transport layer 25b made of -bis (3-methylphenylphenylamion) biphenyl), TPD (4,4 ', 4 "-tris (3-meth
ylphenylphenylamion) triphenylanine) second hole transport layer 25c, Bebq2 (10-benzo [h] quinolinol-beryllium complex) containing a quinacridone derivative, and Bebq2
And the cathode (electron injection layer) 25f made of magnesium indium (MgIn) (see Japanese Patent Laid-Open No. 2001-102595).
【００１５】なお、上記構造に限らず、有機ＥＬ層２５
として例えば、２ＴＮＡＴＡ(4,4',4 ″-tris[2-naphth
yl(phenyl)amino]triphenylaminc) から成るホール注入
層（厚さ１００Å）、ＮＰＢ(N,N'-Di(naphthalen-1-y
l)-N,N'-diphenyl-benzidine)から成るホール輸送層
（厚さ１５００Å）、Ａｌｑ（ホスト材料:tris-(8-hyd
roxyquinoline)aluminum) から成る発光層（厚さ３５０
Å）、ＭｇＩｎ（比率１０：１）から成る陰極（厚さ２
０００Å）を備え、この陰極上にＳｉＯ（３μｍ）の保
護層を備える有機ＥＬ素子構造もある。後述する比較試
験では、当該構造の有機ＥＬ素子を用いた。この有機Ｅ
Ｌ素子の製造においては、ＴＦＴ構成体（陽極形成済
み）を形成したガラス基板１１を中性洗剤により洗浄
し、更にアセトン中で１０分間、エタノール中で１０分
間の超音波洗浄を行った後、オゾンクリーナーにて基板
表面の洗浄を行う。その後、上記基板にホール輸送層、
発光層、電子輸送層、陰極、及び保護膜の順に真空蒸着
法にて積層する。これらの蒸着はいずれも真空度が１×
１０-6 Torr とし、基板温度制御無しの条件下で行っ
た。The organic EL layer 25 is not limited to the above structure.
For example, 2TNATA (4,4 ', 4 "-tris [2-naphth
yl (phenyl) amino] triphenylaminc) hole injection layer (thickness 100Å), NPB (N, N'-Di (naphthalen-1-y)
l) -N, N'-diphenyl-benzidine) hole transport layer (thickness 1500Å), Alq (host material: tris- (8-hyd
roxyquinoline) aluminum) emitting layer (thickness 350
Å), a cathode made of MgIn (ratio 10: 1) (thickness 2
There is also an organic EL device structure having a protective layer of SiO (3 μm) on the cathode. In the comparative test described later, the organic EL device having the structure was used. This organic E
In the production of the L element, the glass substrate 11 on which the TFT structure (having the anode formed) is washed with a neutral detergent, and further ultrasonically washed in acetone for 10 minutes and in ethanol for 10 minutes. Clean the substrate surface with an ozone cleaner. Then, the hole transport layer on the substrate,
The light emitting layer, the electron transport layer, the cathode, and the protective film are laminated in this order by a vacuum vapor deposition method. The degree of vacuum for each of these vapor depositions is 1 ×
The temperature was set to 10 -6 Torr and the substrate temperature was not controlled.
【００１６】薄板ガラス（厚み１００μｍ）１２は有機
ＥＬ素子１０の本体部の大きさに対応しており、この薄
板ガラス１２で有機ＥＬ素子１０の本体部を覆うと取り
出し電極１０ａのみが露呈されるかたちとなる。有機Ｅ
Ｌ素子１０と薄板ガラス１２との間にはＵＶ硬化樹脂
（例えば、スリーボンド社製のTB3027C ，ナガセケムテ
ック社製のXNR5623,XNR5506,XNR5516HVなど）１３が充
填されており、周辺部分に位置するＵＶ硬化樹脂１３は
硬化されており（この硬化部には符号１３ａを付記して
いる）、有機ＥＬ素子１０上及び縁部近傍のＵＶ硬化樹
脂１３の全部を未硬化としてある（この未硬化部には符
号１３ｂを付記している）。The thin glass plate (thickness 100 μm) 12 corresponds to the size of the main body of the organic EL element 10. When the thin glass plate 12 covers the main body of the organic EL element 10, only the extraction electrode 10a is exposed. It becomes a form. Organic E
UV curable resin (for example, TB3027C manufactured by ThreeBond Co., Ltd., XNR5623, XNR5506, XNR5516HV manufactured by Nagase Chemtech Co., Ltd.) 13 is filled between the L element 10 and the thin glass plate 12, and UV located in the peripheral portion is filled. The cured resin 13 has been cured (this cured portion is denoted by reference numeral 13a), and all of the UV cured resin 13 on the organic EL element 10 and in the vicinity of the edge portion is uncured (in this uncured portion). Indicates the reference numeral 13b).
【００１７】上記構造の表示装置１を得るには、ガラス
基板１１上に有機ＥＬ素子１０を貼り付け、この有機Ｅ
Ｌ素子１０上にＵＶ硬化樹脂１３を垂らしてスピンコー
ト塗布を行う。その後、このＵＶ硬化樹脂１３上に薄板
ガラス１２を載せ、紫外線を周辺部分に照射する。In order to obtain the display device 1 having the above structure, the organic EL element 10 is attached on the glass substrate 11, and the organic EL element 10 is attached.
The UV curable resin 13 is hung on the L element 10 and spin coating is performed. Then, the thin glass plate 12 is placed on the UV curable resin 13, and the peripheral portion is irradiated with ultraviolet rays.
【００１８】上記の構成であれば、封止用板材である薄
板ガラス１２はＵＶ硬化樹脂１３を介して有機ＥＬ素子
１０に密着する構造であるから、乾燥剤充填用の中空構
造に比べ、表示装置１としての薄型化が図れることにな
る。特に、この実施形態では薄板ガラス１２として厚み
１００μｍのものを用いており、表示装置１の厚みはほ
ぼガラス基板１１の厚みとなる。また、ＵＶ硬化樹脂１
３は周辺部分では硬化部１３ａをなすものの、有機ＥＬ
素子１０上では、ＵＶ硬化樹脂１３の全部が未硬化部１
３ｂをなしており、この有機ＥＬ素子１０上では硬化に
よる応力を生じさせないことになり、有機ＥＬ素子１０
へのダメージは軽減される。なお、有機ＥＬ素子１０上
の一部のＵＶ硬化樹脂１３を未硬化部１３ｂとする場合
でも、硬化による応力を微小に抑えることができるた
め、有機ＥＬ素子１０へのダメージは軽減される。With the above structure, since the thin glass plate 12 as the sealing plate material is in close contact with the organic EL element 10 through the UV curable resin 13, the thin glass plate 12 has a display as compared with the hollow structure for filling the desiccant. The device 1 can be made thin. In particular, in this embodiment, the thin glass 12 having a thickness of 100 μm is used, and the thickness of the display device 1 is almost the same as the thickness of the glass substrate 11. Also, UV curable resin 1
Numeral 3 forms the hardened portion 13a in the peripheral portion, but the organic EL
On the element 10, all of the UV curable resin 13 is the uncured portion 1
3b, the stress due to curing is not generated on this organic EL element 10, and the organic EL element 10
Damage to is reduced. Even when a part of the UV curable resin 13 on the organic EL element 10 is used as the uncured portion 13b, the stress due to curing can be suppressed to a small degree, and therefore damage to the organic EL element 10 is reduced.
【００１９】信頼性試験結果を下記の表１に示す。この
表において、「従来例」は図５に示した構造（ただし、
乾燥剤無し）の表示装置であり、「比較例」は図６に示
した構造の表示装置であり、「本実施例１」は前記図１
に示した構造の表示装置であり、「本実施例２」は後述
する図４に示す構造の表示装置である。この試験におい
ては、温度６０℃で湿度９０％の雰囲気下で表示装置を
保管して非発光面積率の経時変化を測定した。The reliability test results are shown in Table 1 below. In this table, “conventional example” is the structure shown in FIG.
1 is a display device having no desiccant, "Comparative Example" is a display device having the structure shown in FIG. 6, and "This Example 1" is the same as that shown in FIG.
The display device having the structure shown in FIG. 4 is a display device having the structure shown in FIG. In this test, the display device was stored in an atmosphere of a temperature of 60 ° C. and a humidity of 90% and the change with time of the non-light emitting area ratio was measured.
【００２０】[0020]
【表１】 [Table 1]
【００２１】この信頼性試験結果から分かるように、
「比較例」（樹脂全部硬化）では初期において既に硬化
収縮による非発光面積が多数存在し、時間の経過ととも
に非発光面積が大きく増加する傾向が見られた。これに
対し、「本実施例１」「本実施例２」では、非発光面積
率の増加の割合は、「従来例」（乾燥剤無し）と比べて
も低くすることができた。なお、図５の従来構造におい
て乾燥剤を入れた場合について同様の試験を行うと、
「本実施例１」「本実施例２」と同等の結果が得られ
た。このことから、有機ＥＬ素子１０を覆っている未硬
化樹脂が大気から侵入する水分をブロックする効果を持
つことが分かった。As can be seen from the results of this reliability test,
In the "Comparative Example" (all resins cured), many non-light emitting areas already existed due to curing shrinkage in the initial stage, and it was observed that the non-light emitting area greatly increased with the passage of time. On the other hand, in "this Example 1" and "this Example 2," the rate of increase in the non-light emitting area ratio could be made lower than that of the "conventional example" (without a desiccant). In addition, when the same test is performed in the case where a desiccant is added in the conventional structure of FIG.
Results equivalent to those of "this Example 1" and "this Example 2" were obtained. From this, it was found that the uncured resin that covers the organic EL element 10 has an effect of blocking moisture that enters from the atmosphere.
【００２２】図３は表示装置１′を示した断面図であ
る。この表示装置１′では、第１接着用樹脂１４Ａと第
２接着用樹脂１４Ｂの２種類の接着用樹脂を用いてい
る。そして、周辺部分には第１接着用樹脂１４Ａが硬化
状態で存在し、有機ＥＬ素子１０上の全部を覆うように
第２接着用樹脂（例えば、ＵＶ硬化樹脂）１４Ｂが未硬
化状態で存在する。かかる構成においても、薄板ガラス
１２は接着用樹脂１４Ａ，１４Ｂを介して有機ＥＬ素子
１０に密着する構造であるから、乾燥剤充填用の中空構
造に比べ、表示装置１′としての薄型化が図れることに
なる。また、有機ＥＬ素子１０上では、第２接着用樹脂
１４Ｂが未硬化で存在しており、有機ＥＬ素子１０への
ダメージは軽減される。なお、有機ＥＬ素子１０上の一
部の第２接着用樹脂を未硬化とする場合でも、硬化によ
る応力を微小に抑えることができるため、有機ＥＬ素子
１０へのダメージは軽減される。かかる構造の表示装置
１′を製造する方法としては、第１接着用樹脂１４Ａと
して粘性の高いものを用いてこれを周囲に堤状に配し、
有機ＥＬ素子１０上に第２接着用樹脂１４Ｂを垂らして
平坦化させ（前記堤状の第１接着用樹脂１４Ａにてせき
止められる）、その後に薄板ガラス１２を貼り合わせる
ことが考えられる。FIG. 3 is a sectional view showing the display device 1 '. In this display device 1 ', two types of adhesive resins, that is, a first adhesive resin 14A and a second adhesive resin 14B are used. Then, the first adhesive resin 14A exists in a cured state in the peripheral portion, and the second adhesive resin (for example, UV curable resin) 14B exists in an uncured state so as to cover the entire organic EL element 10. . Even in such a configuration, the thin glass plate 12 has a structure in which it adheres to the organic EL element 10 via the adhesive resins 14A and 14B, so that the display device 1'can be made thinner than the hollow structure for filling the desiccant. It will be. Further, the second adhesive resin 14B is present on the organic EL element 10 in an uncured state, and damage to the organic EL element 10 is reduced. Even when a part of the second adhesive resin on the organic EL element 10 is uncured, the stress due to the curing can be suppressed to a small degree, so that the damage to the organic EL element 10 is reduced. As a method of manufacturing the display device 1'having such a structure, a highly viscous resin is used as the first adhesive resin 14A, which is arranged in a bank shape around the resin.
It is conceivable that the second adhesive resin 14B is hung down on the organic EL element 10 to be flattened (stopped by the bank-shaped first adhesive resin 14A), and then the thin glass plate 12 is attached.
【００２３】図４は表示装置１″を示した断面図であ
る。この表示装置１″では、第１液１５ａと第２液１５
ｂとから成る２液混合タイプの接着用樹脂（例えば、２
液エポキシ樹脂（セメダインハイスーパー３０等）等）
１５を用いている。周辺部分には第１液１５ａと第２液
１５ｂとが混合させられることによって硬化部が形成さ
れ、有機ＥＬ素子１０上ではその全部を覆うように第１
液１５ａが単独で未硬化状態で存在する。同図（ａ）に
示す構造では、第２液１５ｂが薄板ガラス１２側に塗布
された場合を示し、同図（ｂ）に示す構造では、第２液
１５ｂがガラス基板１１側に塗布された場合を示してい
る。かかる構成においても、薄板ガラス１２は接着用樹
脂１５を介して有機ＥＬ素子１０に密着する構造である
から、乾燥剤充填用の中空構造に比べ、表示装置１″と
しての薄型化が図れることになる。また、有機ＥＬ素子
１０上では、第１液１５ａが未硬化で存在しており、有
機ＥＬ素子１０へのダメージは軽減される。なお、有機
ＥＬ素子１０上の一部に第１液１５ａを単独で（未硬化
で）存在させる場合でも、硬化による応力を微小に抑え
ることができるため、有機ＥＬ素子１０へのダメージは
軽減される。また、上記構造においては、一液状態で防
湿性に優れている方を有機ＥＬ素子１０上に多く存在さ
せることとするのがよい。4 is a sectional view showing the display device 1 ". In this display device 1", the first liquid 15a and the second liquid 15 are provided.
a two-liquid mixed type adhesive resin (for example, 2
Liquid epoxy resin (cemedine high super 30 etc.)
15 is used. The first liquid 15a and the second liquid 15b are mixed in the peripheral portion to form a cured portion, and the first liquid is coated on the organic EL element 10 so as to cover the entire first portion.
The liquid 15a exists alone in an uncured state. In the structure shown in FIG. 7A, the second liquid 15b is applied to the thin glass plate 12 side, and in the structure shown in FIG. 3B, the second liquid 15b is applied to the glass substrate 11 side. The case is shown. Even in such a configuration, the thin glass plate 12 has a structure in which the thin glass plate 12 is in close contact with the organic EL element 10 through the adhesive resin 15. Therefore, it is possible to make the display device 1 ″ thinner than the hollow structure for filling the desiccant. In addition, the first liquid 15a is present in the uncured state on the organic EL element 10, and damage to the organic EL element 10 is reduced. Even when 15a is present alone (unhardened), the stress due to hardening can be suppressed to a small extent, so that damage to the organic EL element 10 is reduced. It is preferable that a large number of excellent ones are present on the organic EL element 10.
【００２４】図４（ａ）の表示装置１″を製造するに
は、ガラス基板１１上に載置した有機ＥＬ素子１０を覆
うように第１液１５ａを塗布し、第２液１５ｂが周囲に
のみ塗布された薄板ガラス１２を貼り合わせればよい。
なお、有機ＥＬ素子１０上の一部を未硬化とする場合に
は、有機ＥＬ素子１０に対応する位置の一部において第
２液１５ｂを塗布しておけばよい。第１液１５ａと第２
液１５ｂとを混合させる箇所において押圧力を加えるこ
とで、この混合を促進することができる。To manufacture the display device 1 "of FIG. 4 (a), the first liquid 15a is applied so as to cover the organic EL element 10 placed on the glass substrate 11, and the second liquid 15b is applied to the surroundings. It suffices to bond the thin glass plate 12 coated only with the glass.
When a part of the organic EL element 10 is uncured, the second liquid 15b may be applied to a part of the position corresponding to the organic EL element 10. First liquid 15a and second
This mixing can be promoted by applying a pressing force at the place where the liquid 15b is mixed.
【００２５】図４（ｂ）の表示装置１″を製造するに
は、ガラス基板１１上に載置した有機ＥＬ素子１０の周
囲に第２液１５ｂを塗布し、第１液１５ａが全体に塗布
された薄板ガラス１２を貼り合わせればよい。なお、有
機ＥＬ素子１０上の一部を未硬化とする場合には、薄板
ガラス１２において、有機ＥＬ素子１０に対応する位置
の一部にも第２液１５ｂを塗布しておけばよい。第１液
１５ａと第２液１５ｂとを混合させる箇所において押圧
力を加えることで、この混合を促進することができる。To manufacture the display device 1 "of FIG. 4B, the second liquid 15b is applied around the organic EL element 10 placed on the glass substrate 11, and the first liquid 15a is applied over the entire surface. The laminated thin glass 12 may be attached to the organic EL element 10. If a part of the organic EL element 10 is to be uncured, the second thin glass 12 may also be formed on a part of the thin glass 12 corresponding to the organic EL element 10. It is sufficient to apply the liquid 15b.By applying a pressing force at the place where the first liquid 15a and the second liquid 15b are mixed, this mixing can be promoted.
【００２６】なお、上記の実施形態では、ガラス基板１
１側から光を出射する構成を採用しており、基板として
透明なガラス基板１１を用いたが、これに限るものでは
なく、透明なプラスチック板などを用いてもよい。ま
た、薄板ガラス１２に替えてプラスチック板や金属板な
どを用いてもよく、勿論、これらは不透明のものでもよ
い。また、接着用樹脂についても不透明のものを用いて
もよい。一方、ガラス基板１１側とは反対の側から光を
出射する構成を採用する場合には、接着用樹脂及び封止
用板材としては可視光域で透明なものを用いる。なお、
ＵＶ硬化樹脂１３として例示したものは透明であり、か
かる構造においても用いることができる。また、基板に
ついてはガラス基板１１に限らず、不透明な金属板を用
いることも可能である。In the above embodiment, the glass substrate 1
Although the transparent glass substrate 11 is used as the substrate in which the light is emitted from the first side, the present invention is not limited to this, and a transparent plastic plate or the like may be used. Further, instead of the thin glass plate 12, a plastic plate or a metal plate may be used, and of course, these may be opaque. Also, an opaque adhesive resin may be used. On the other hand, when adopting a configuration in which light is emitted from the side opposite to the glass substrate 11 side, transparent adhesives in the visible light range are used as the adhesive resin and the sealing plate material. In addition,
The UV-curable resin 13 exemplified above is transparent and can be used in such a structure. Further, the substrate is not limited to the glass substrate 11, and it is also possible to use an opaque metal plate.
【００２７】[0027]
【発明の効果】以上説明したように、この発明によれ
ば、封止用板材は接着用樹脂を介して有機エレクトロル
ミネッセンス素子に密着する構造であるから、乾燥剤充
填用の中空構造に比べ、表示装置としての薄型化が図れ
ることになる。また、有機エレクトロルミネッセンス素
子上では接着用樹脂の全部又は一部は未硬化であり、硬
化による応力を生じさせない或いは硬化による応力を微
小に抑えることができるため、有機エレクトロルミネッ
センス素子へのダメージは軽減される。また、未硬化樹
脂が大気から侵入する水分をブロックする効果を持ち得
るので、経時的な発光劣化も十分に防止し得るという効
果を奏する。As described above, according to the present invention, the sealing plate material has a structure in which the sealing plate material is in close contact with the organic electroluminescent element through the adhesive resin. A thin display device can be achieved. In addition, all or part of the adhesive resin is uncured on the organic electroluminescent element, and the stress due to curing is not generated or the stress due to curing can be suppressed to a small degree, so that damage to the organic electroluminescent element is reduced. To be done. Further, since the uncured resin can have an effect of blocking moisture invading from the atmosphere, it is possible to sufficiently prevent deterioration of light emission over time.
【図１】この発明の実施形態の表示装置を示した断面図
である。FIG. 1 is a cross-sectional view showing a display device according to an embodiment of the present invention.
【図２】有機ＥＬ素子の具体的構成例を示した拡大断面
図である。FIG. 2 is an enlarged cross-sectional view showing a specific configuration example of an organic EL element.
【図３】この発明の実施形態の表示装置の他の例を示し
た断面図である。FIG. 3 is a cross-sectional view showing another example of the display device of the embodiment of the present invention.
【図４】同図（ａ）及び（ｂ）はこの発明の実施形態の
表示装置の他の例を示した断面図である。4A and 4B are cross-sectional views showing another example of the display device according to the embodiment of the present invention.
【図５】従来の表示装置（金属缶タイプ）を示した断面
図である。FIG. 5 is a cross-sectional view showing a conventional display device (metal can type).
【図６】比較例である表示装置（接着剤全部硬化）を示
した断面図である。FIG. 6 is a cross-sectional view showing a display device (adhesive completely cured) as a comparative example.
１ 表示装置 １′ 表示装置 １″ 表示装置 １０ 有機ＥＬ素子 １１ ガラス基板 １２ 薄板ガラス １３ ＵＶ硬化樹脂 １４Ａ第１接着用樹脂 １４Ｂ第２接着用樹脂 １５ 接着用樹脂 1 Display device 1'display device 1 ″ display device 10 Organic EL element 11 glass substrate 12 Thin glass 13 UV curable resin 14A First adhesive resin 14B Second adhesive resin 15 Adhesive resin
Claims (8)
止して成る表示装置において、有機エレクトロルミネッ
センス素子と封止用板材との間に接着用樹脂が充填され
ており、周辺部分に位置する接着用樹脂は硬化され、有
機エレクトロルミネッセンス素子上の接着用樹脂の全部
又は一部が未硬化であることを特徴とする表示装置。1. A display device formed by encapsulating an organic electroluminescent element, wherein an adhesive resin is filled between the organic electroluminescent element and a sealing plate material, and the adhesive resin located in a peripheral portion is A display device, wherein the adhesive resin on an organic electroluminescent element is cured and all or part of the adhesive resin is uncured.
記接着用樹脂は紫外線硬化樹脂であることを特徴とする
表示装置。2. The display device according to claim 1, wherein the adhesive resin is an ultraviolet curable resin.
法であって、基板上に載置した有機エレクトロルミネッ
センス素子を接着用樹脂にて被覆した後、この接着用樹
脂上に封止用板材を載せ、紫外線を周辺部分に照射する
とともに有機エレクトロルミネッセンス素子上の接着用
樹脂に対しては全部又は一部の未照射部位を形成するこ
とを特徴とする表示装置の製造方法。3. The method for manufacturing the display device according to claim 2, wherein the organic electroluminescence element mounted on the substrate is covered with an adhesive resin, and then the adhesive resin is sealed. A method of manufacturing a display device, comprising: mounting a plate material, irradiating the peripheral portion with ultraviolet rays, and forming all or part of the unirradiated portion with respect to the adhesive resin on the organic electroluminescent element.
記接着用樹脂は第１液と第２液とが混ざり合うことで硬
化する樹脂であり、周辺部分には第１液と第２液とが存
在して硬化しており、有機エレクトロルミネッセンス素
子上の接着用樹脂の全部又は一部は一方の液のみが存在
して未硬化状態であることを特徴とする表示装置。4. The display device according to claim 1, wherein the adhesive resin is a resin that cures when the first liquid and the second liquid are mixed, and the first liquid and the second liquid are provided in a peripheral portion. Is present and cured, and all or part of the adhesive resin on the organic electroluminescence element is in an uncured state with only one liquid present.
記第１液又は第２液のうち、未硬化状態で防湿性に優れ
ている方が有機エレクトロルミネッセンス素子上に多く
存在することを特徴とする表示装置。5. The display device according to claim 4, wherein one of the first liquid and the second liquid that is excellent in moisture resistance in an uncured state is present on the organic electroluminescent element in a large amount. And display device.
する方法であって、基板上に載置した有機エレクトロル
ミネッセンス素子を覆うように第１液を塗布した後、第
２液が周囲に塗布されているとともに有機エレクトロル
ミネッセンス素子に対応する位置の全部又は一部が未塗
布部である封止用板材を貼り合わせることを特徴とする
表示装置の製造方法。6. The method for manufacturing the display device according to claim 4, wherein the first liquid is applied so as to cover the organic electroluminescence element mounted on the substrate, and then the second liquid is applied to the surroundings. A method for manufacturing a display device, comprising: applying a sealing plate material, which is not applied to all or part of the position corresponding to the organic electroluminescence element, which is applied to the substrate.
する方法であって、基板上に載置した有機エレクトロル
ミネッセンス素子の周囲に第１液を塗布するとともに有
機エレクトロルミネッセンス素子上の全部又は一部には
未塗布部を残し、第２液が全体に塗布された封止用板材
を貼り合わせることを特徴とする表示装置の製造方法。7. A method for manufacturing a display device according to claim 4 or 5, wherein the first liquid is applied around the organic electroluminescent element mounted on the substrate and the entire organic electroluminescent element is covered. Alternatively, a method for manufacturing a display device is characterized in that an uncoated portion is left in a part thereof and a sealing plate material coated with the second liquid is bonded to the whole.
記接着用樹脂は第１接着用樹脂と第２接着用樹脂とから
成り、第１接着用樹脂は硬化状態で存在し、第２接着用
樹脂は未硬化状態で存在することを特徴とする表示装
置。8. The display device according to claim 1, wherein the adhesive resin comprises a first adhesive resin and a second adhesive resin, the first adhesive resin being in a cured state, and the second adhesive resin. The display device, wherein the resin for use is present in an uncured state.
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| JP2001392308A JP2003197366A (en) | 2001-12-25 | 2001-12-25 | Display and manufacturing method for it |
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| JP2001392308A JP2003197366A (en) | 2001-12-25 | 2001-12-25 | Display and manufacturing method for it |
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| JP2003197366A true JP2003197366A (en) | 2003-07-11 |
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