JP2007288812A - 弾性表面波デバイス、モジュール装置、発振回路および弾性表面波デバイスの製造方法 - Google Patents
弾性表面波デバイス、モジュール装置、発振回路および弾性表面波デバイスの製造方法 Download PDFInfo
- Publication number
- JP2007288812A JP2007288812A JP2007187896A JP2007187896A JP2007288812A JP 2007288812 A JP2007288812 A JP 2007288812A JP 2007187896 A JP2007187896 A JP 2007187896A JP 2007187896 A JP2007187896 A JP 2007187896A JP 2007288812 A JP2007288812 A JP 2007288812A
- Authority
- JP
- Japan
- Prior art keywords
- surface acoustic
- acoustic wave
- wave device
- electrode
- piezoelectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 115
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 230000010355 oscillation Effects 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims abstract description 184
- 239000010453 quartz Substances 0.000 claims abstract description 114
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 114
- 238000005530 etching Methods 0.000 claims abstract description 80
- 239000013078 crystal Substances 0.000 claims abstract description 62
- 239000000956 alloy Substances 0.000 claims abstract description 15
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 15
- 230000005284 excitation Effects 0.000 claims abstract description 9
- 238000001039 wet etching Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 13
- 230000001902 propagating effect Effects 0.000 claims description 10
- 230000032683 aging Effects 0.000 abstract description 42
- 239000010408 film Substances 0.000 description 100
- 229910052782 aluminium Inorganic materials 0.000 description 39
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 33
- 230000014509 gene expression Effects 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000007772 electrode material Substances 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000002003 electron diffraction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007187896A JP2007288812A (ja) | 2005-09-30 | 2007-07-19 | 弾性表面波デバイス、モジュール装置、発振回路および弾性表面波デバイスの製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005288987 | 2005-09-30 | ||
| JP2007187896A JP2007288812A (ja) | 2005-09-30 | 2007-07-19 | 弾性表面波デバイス、モジュール装置、発振回路および弾性表面波デバイスの製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006228768A Division JP4049195B2 (ja) | 2005-09-30 | 2006-08-25 | 弾性表面波デバイスの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007288812A true JP2007288812A (ja) | 2007-11-01 |
| JP2007288812A5 JP2007288812A5 (enExample) | 2009-09-17 |
Family
ID=38760094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007187896A Pending JP2007288812A (ja) | 2005-09-30 | 2007-07-19 | 弾性表面波デバイス、モジュール装置、発振回路および弾性表面波デバイスの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007288812A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012049717A (ja) * | 2010-08-25 | 2012-03-08 | Seiko Epson Corp | 二端子対弾性表面波共振子、弾性表面波発振器および電子機器 |
| JP2012049764A (ja) * | 2010-08-26 | 2012-03-08 | Seiko Epson Corp | 弾性表面波フィルタ、電子機器 |
| JP2012049716A (ja) * | 2010-08-25 | 2012-03-08 | Seiko Epson Corp | トランスバーサル型弾性表面波デバイス、弾性表面波発振器および電子機器 |
| JP2014112949A (ja) * | 2009-02-27 | 2014-06-19 | Seiko Epson Corp | 弾性表面波共振子、および弾性表面波発振器 |
| JP2015084534A (ja) * | 2014-11-25 | 2015-04-30 | セイコーエプソン株式会社 | 二端子対弾性表面波共振子、弾性表面波発振器および電子機器 |
| JPWO2015012005A1 (ja) * | 2013-07-25 | 2017-03-02 | 日本碍子株式会社 | 複合基板及びその製法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61230418A (ja) * | 1985-04-03 | 1986-10-14 | Toyo Commun Equip Co Ltd | Idt励振型2ポ−ト共振器及びフイルタ |
| JPH05199062A (ja) * | 1991-09-24 | 1993-08-06 | Seiko Epson Corp | 弾性表面波素子とその製造方法および弾性表面波素子用基板 |
| JPH0755680A (ja) * | 1993-08-10 | 1995-03-03 | Nec Corp | ラム波デバイス |
| JP2002330051A (ja) * | 2001-04-27 | 2002-11-15 | Murata Mfg Co Ltd | 表面波装置及びそれを用いた弾性表面波デバイス |
-
2007
- 2007-07-19 JP JP2007187896A patent/JP2007288812A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61230418A (ja) * | 1985-04-03 | 1986-10-14 | Toyo Commun Equip Co Ltd | Idt励振型2ポ−ト共振器及びフイルタ |
| JPH05199062A (ja) * | 1991-09-24 | 1993-08-06 | Seiko Epson Corp | 弾性表面波素子とその製造方法および弾性表面波素子用基板 |
| JPH0755680A (ja) * | 1993-08-10 | 1995-03-03 | Nec Corp | ラム波デバイス |
| JP2002330051A (ja) * | 2001-04-27 | 2002-11-15 | Murata Mfg Co Ltd | 表面波装置及びそれを用いた弾性表面波デバイス |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014112949A (ja) * | 2009-02-27 | 2014-06-19 | Seiko Epson Corp | 弾性表面波共振子、および弾性表面波発振器 |
| JP2012049717A (ja) * | 2010-08-25 | 2012-03-08 | Seiko Epson Corp | 二端子対弾性表面波共振子、弾性表面波発振器および電子機器 |
| JP2012049716A (ja) * | 2010-08-25 | 2012-03-08 | Seiko Epson Corp | トランスバーサル型弾性表面波デバイス、弾性表面波発振器および電子機器 |
| JP2012049764A (ja) * | 2010-08-26 | 2012-03-08 | Seiko Epson Corp | 弾性表面波フィルタ、電子機器 |
| JPWO2015012005A1 (ja) * | 2013-07-25 | 2017-03-02 | 日本碍子株式会社 | 複合基板及びその製法 |
| US10211389B2 (en) | 2013-07-25 | 2019-02-19 | Ngk Insulators, Ltd. | Composite substrate |
| US11239405B2 (en) | 2013-07-25 | 2022-02-01 | Ngk Insulators, Ltd. | Method of producing a composite substrate |
| JP2015084534A (ja) * | 2014-11-25 | 2015-04-30 | セイコーエプソン株式会社 | 二端子対弾性表面波共振子、弾性表面波発振器および電子機器 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7433268B2 (ja) | 弾性波装置、分波器および通信装置 | |
| US8018122B2 (en) | Surface acoustic wave device, module device, oscillation circuit, and method for manufacturing surface acoustic wave device | |
| JP4148294B2 (ja) | 弾性表面波デバイスとこれを用いたモジュール装置又は発振回路 | |
| CN100576738C (zh) | 表面声波器件及利用其的移动通信设备和传感器 | |
| US20190013791A1 (en) | Guided surface acoustic wave device providing spurious mode rejection | |
| JP7080671B2 (ja) | 弾性表面波デバイス | |
| JP2006203408A (ja) | 弾性表面波デバイス | |
| US20060108894A1 (en) | Surface acoustic wave device and electronic apparatus | |
| JP7624796B2 (ja) | ラダー型フィルタおよびマルチプレクサ | |
| JP2007288812A (ja) | 弾性表面波デバイス、モジュール装置、発振回路および弾性表面波デバイスの製造方法 | |
| WO2006137464A1 (ja) | 弾性表面波デバイス、モジュール、及び発振器 | |
| CN100539411C (zh) | 表面声波器件 | |
| JP4356773B2 (ja) | 弾性表面波デバイスとこれを用いたモジュール装置又は発振回路 | |
| JP2007142794A (ja) | 弾性表面波素子片および弾性表面波デバイス | |
| JP2006295311A (ja) | 弾性表面波素子片および弾性表面波装置 | |
| JP4582150B2 (ja) | 弾性表面波デバイスとこれを用いたモジュール装置又は発振回路 | |
| JP2010103720A (ja) | 弾性表面波デバイス | |
| JP7714113B2 (ja) | 弾性波素子、モジュール及び通信装置 | |
| JP4148220B2 (ja) | 弾性表面波デバイス、複合デバイス、発振回路およびモジュール | |
| JP4148216B2 (ja) | 弾性表面波デバイスとこれを用いたモジュール装置又は発振回路 | |
| JP2007088952A (ja) | 弾性表面波デバイス | |
| JPWO2007004661A1 (ja) | 弾性表面波デバイス | |
| JP2007019975A (ja) | 弾性表面波デバイス、モジュール装置、発振回路 | |
| JP2007019976A (ja) | 縦結合多重モードsawフィルタ、モジュール装置 | |
| JP2007013682A (ja) | 弾性表面波デバイス |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090730 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090730 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20110729 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20110729 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110819 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111206 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120116 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120228 |