JP2007281597A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2007281597A5 JP2007281597A5 JP2006102096A JP2006102096A JP2007281597A5 JP 2007281597 A5 JP2007281597 A5 JP 2007281597A5 JP 2006102096 A JP2006102096 A JP 2006102096A JP 2006102096 A JP2006102096 A JP 2006102096A JP 2007281597 A5 JP2007281597 A5 JP 2007281597A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electronic component
- conductive pattern
- piezoelectric vibrator
- external terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006102096A JP2007281597A (ja) | 2006-04-03 | 2006-04-03 | 圧電デバイス及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006102096A JP2007281597A (ja) | 2006-04-03 | 2006-04-03 | 圧電デバイス及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007281597A JP2007281597A (ja) | 2007-10-25 |
| JP2007281597A5 true JP2007281597A5 (enExample) | 2009-05-07 |
Family
ID=38682641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006102096A Withdrawn JP2007281597A (ja) | 2006-04-03 | 2006-04-03 | 圧電デバイス及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007281597A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010226396A (ja) * | 2009-03-23 | 2010-10-07 | Seiko Epson Corp | 圧電デバイスおよび圧電デバイスの製造方法 |
| JP2010226397A (ja) * | 2009-03-23 | 2010-10-07 | Seiko Epson Corp | 圧電デバイス、電子機器および圧電デバイスの製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3101996B2 (ja) * | 1995-12-20 | 2000-10-23 | 株式会社大真空 | 表面実装型圧電発振器 |
| JP4241430B2 (ja) * | 2004-02-25 | 2009-03-18 | エプソントヨコム株式会社 | 圧電発振器 |
-
2006
- 2006-04-03 JP JP2006102096A patent/JP2007281597A/ja not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2007267113A5 (enExample) | ||
| JP2008507134A5 (enExample) | ||
| JP2007194598A5 (enExample) | ||
| JP2006521703A5 (enExample) | ||
| JP2009225093A5 (enExample) | ||
| JP2009110983A5 (enExample) | ||
| JP2012089724A5 (ja) | 半導体装置の製造方法 | |
| JP2009141169A5 (enExample) | ||
| JP2014127706A5 (ja) | 半導体装置の製造方法 | |
| JP2013066021A5 (enExample) | ||
| JP2012099352A5 (enExample) | ||
| JP2009158999A5 (enExample) | ||
| JP2009194189A5 (enExample) | ||
| JP2007074066A5 (enExample) | ||
| JP2007281597A5 (enExample) | ||
| JP2009077341A5 (enExample) | ||
| JP2022085834A5 (enExample) | ||
| KR20110062482A (ko) | 본딩 구조물의 형성 방법 | |
| JP2010153491A5 (ja) | 電子装置及びその製造方法、並びに半導体装置 | |
| JP2007243536A5 (enExample) | ||
| JP2008109429A5 (enExample) | ||
| JPWO2007058134A1 (ja) | 半導体パッケージ、電子部品、及び電子機器 | |
| JP3824545B2 (ja) | 配線基板、それを用いた半導体装置、それらの製造方法 | |
| JP2010040955A5 (enExample) | ||
| JP4910886B2 (ja) | 圧電デバイス |