JP2007281597A - 圧電デバイス及びその製造方法 - Google Patents

圧電デバイス及びその製造方法 Download PDF

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Publication number
JP2007281597A
JP2007281597A JP2006102096A JP2006102096A JP2007281597A JP 2007281597 A JP2007281597 A JP 2007281597A JP 2006102096 A JP2006102096 A JP 2006102096A JP 2006102096 A JP2006102096 A JP 2006102096A JP 2007281597 A JP2007281597 A JP 2007281597A
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JP
Japan
Prior art keywords
substrate
electronic component
piezoelectric
piezoelectric vibrator
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006102096A
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English (en)
Japanese (ja)
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JP2007281597A5 (https=
Inventor
Yuugo Koyama
裕吾 小山
Kazuhiko Shimodaira
和彦 下平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyazaki Epson Corp
Original Assignee
Epson Toyocom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epson Toyocom Corp filed Critical Epson Toyocom Corp
Priority to JP2006102096A priority Critical patent/JP2007281597A/ja
Publication of JP2007281597A publication Critical patent/JP2007281597A/ja
Publication of JP2007281597A5 publication Critical patent/JP2007281597A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2006102096A 2006-04-03 2006-04-03 圧電デバイス及びその製造方法 Withdrawn JP2007281597A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006102096A JP2007281597A (ja) 2006-04-03 2006-04-03 圧電デバイス及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006102096A JP2007281597A (ja) 2006-04-03 2006-04-03 圧電デバイス及びその製造方法

Publications (2)

Publication Number Publication Date
JP2007281597A true JP2007281597A (ja) 2007-10-25
JP2007281597A5 JP2007281597A5 (https=) 2009-05-07

Family

ID=38682641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006102096A Withdrawn JP2007281597A (ja) 2006-04-03 2006-04-03 圧電デバイス及びその製造方法

Country Status (1)

Country Link
JP (1) JP2007281597A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010226396A (ja) * 2009-03-23 2010-10-07 Seiko Epson Corp 圧電デバイスおよび圧電デバイスの製造方法
JP2010226397A (ja) * 2009-03-23 2010-10-07 Seiko Epson Corp 圧電デバイス、電子機器および圧電デバイスの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09172325A (ja) * 1995-12-20 1997-06-30 Daishinku Co 表面実装型圧電発振器
JP2005244512A (ja) * 2004-02-25 2005-09-08 Toyo Commun Equip Co Ltd 圧電発振器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09172325A (ja) * 1995-12-20 1997-06-30 Daishinku Co 表面実装型圧電発振器
JP2005244512A (ja) * 2004-02-25 2005-09-08 Toyo Commun Equip Co Ltd 圧電発振器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010226396A (ja) * 2009-03-23 2010-10-07 Seiko Epson Corp 圧電デバイスおよび圧電デバイスの製造方法
JP2010226397A (ja) * 2009-03-23 2010-10-07 Seiko Epson Corp 圧電デバイス、電子機器および圧電デバイスの製造方法

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