JP2007281597A - 圧電デバイス及びその製造方法 - Google Patents

圧電デバイス及びその製造方法 Download PDF

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Publication number
JP2007281597A
JP2007281597A JP2006102096A JP2006102096A JP2007281597A JP 2007281597 A JP2007281597 A JP 2007281597A JP 2006102096 A JP2006102096 A JP 2006102096A JP 2006102096 A JP2006102096 A JP 2006102096A JP 2007281597 A JP2007281597 A JP 2007281597A
Authority
JP
Japan
Prior art keywords
substrate
electronic component
piezoelectric
piezoelectric vibrator
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006102096A
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English (en)
Japanese (ja)
Other versions
JP2007281597A5 (enrdf_load_stackoverflow
Inventor
Yuugo Koyama
裕吾 小山
Kazuhiko Shimodaira
和彦 下平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyazaki Epson Corp
Original Assignee
Epson Toyocom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epson Toyocom Corp filed Critical Epson Toyocom Corp
Priority to JP2006102096A priority Critical patent/JP2007281597A/ja
Publication of JP2007281597A publication Critical patent/JP2007281597A/ja
Publication of JP2007281597A5 publication Critical patent/JP2007281597A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
JP2006102096A 2006-04-03 2006-04-03 圧電デバイス及びその製造方法 Withdrawn JP2007281597A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006102096A JP2007281597A (ja) 2006-04-03 2006-04-03 圧電デバイス及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006102096A JP2007281597A (ja) 2006-04-03 2006-04-03 圧電デバイス及びその製造方法

Publications (2)

Publication Number Publication Date
JP2007281597A true JP2007281597A (ja) 2007-10-25
JP2007281597A5 JP2007281597A5 (enrdf_load_stackoverflow) 2009-05-07

Family

ID=38682641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006102096A Withdrawn JP2007281597A (ja) 2006-04-03 2006-04-03 圧電デバイス及びその製造方法

Country Status (1)

Country Link
JP (1) JP2007281597A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010226397A (ja) * 2009-03-23 2010-10-07 Seiko Epson Corp 圧電デバイス、電子機器および圧電デバイスの製造方法
JP2010226396A (ja) * 2009-03-23 2010-10-07 Seiko Epson Corp 圧電デバイスおよび圧電デバイスの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09172325A (ja) * 1995-12-20 1997-06-30 Daishinku Co 表面実装型圧電発振器
JP2005244512A (ja) * 2004-02-25 2005-09-08 Toyo Commun Equip Co Ltd 圧電発振器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09172325A (ja) * 1995-12-20 1997-06-30 Daishinku Co 表面実装型圧電発振器
JP2005244512A (ja) * 2004-02-25 2005-09-08 Toyo Commun Equip Co Ltd 圧電発振器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010226397A (ja) * 2009-03-23 2010-10-07 Seiko Epson Corp 圧電デバイス、電子機器および圧電デバイスの製造方法
JP2010226396A (ja) * 2009-03-23 2010-10-07 Seiko Epson Corp 圧電デバイスおよび圧電デバイスの製造方法

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