JP2007281435A5 - - Google Patents
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- Publication number
- JP2007281435A5 JP2007281435A5 JP2007058027A JP2007058027A JP2007281435A5 JP 2007281435 A5 JP2007281435 A5 JP 2007281435A5 JP 2007058027 A JP2007058027 A JP 2007058027A JP 2007058027 A JP2007058027 A JP 2007058027A JP 2007281435 A5 JP2007281435 A5 JP 2007281435A5
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic particles
- sintered
- particles
- polishing pad
- thermoplastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 claims 22
- 229920001169 thermoplastic Polymers 0.000 claims 21
- 239000004416 thermosoftening plastic Substances 0.000 claims 19
- 238000005245 sintering Methods 0.000 claims 9
- 238000005498 polishing Methods 0.000 claims 8
- 238000000034 method Methods 0.000 claims 7
- 238000002347 injection Methods 0.000 claims 4
- 239000007924 injection Substances 0.000 claims 4
- 238000000151 deposition Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000004814 polyurethane Substances 0.000 claims 3
- 229920002635 polyurethane Polymers 0.000 claims 3
- 239000000126 substance Substances 0.000 claims 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 229920000728 polyester Polymers 0.000 claims 2
- -1 polyethylene Polymers 0.000 claims 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 claims 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 239000004677 Nylon Substances 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 claims 1
- 239000004698 Polyethylene Substances 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims 1
- 150000001408 amides Chemical class 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 230000009477 glass transition Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 229920001778 nylon Polymers 0.000 claims 1
- 229920002492 poly(sulfone) Polymers 0.000 claims 1
- 229920000058 polyacrylate Polymers 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 150000003457 sulfones Chemical class 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/372,322 US7517488B2 (en) | 2006-03-08 | 2006-03-08 | Method of forming a chemical mechanical polishing pad utilizing laser sintering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007281435A JP2007281435A (ja) | 2007-10-25 |
| JP2007281435A5 true JP2007281435A5 (https=) | 2010-03-25 |
Family
ID=38478144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007058027A Pending JP2007281435A (ja) | 2006-03-08 | 2007-03-08 | レーザ焼結を利用してケミカルメカニカルポリッシングパッドを形成する方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7517488B2 (https=) |
| JP (1) | JP2007281435A (https=) |
| TW (1) | TW200800505A (https=) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7396497B2 (en) * | 2004-09-30 | 2008-07-08 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a polishing pad having reduced striations |
| US20060108701A1 (en) * | 2004-11-23 | 2006-05-25 | Saikin Allan H | Method for forming a striation reduced chemical mechanical polishing pad |
| TWI410314B (zh) * | 2005-04-06 | 2013-10-01 | 羅門哈斯電子材料Ｃｍｐ控股公司 | 藉由反應-射出成形製造多孔化學機械研磨墊之裝置 |
| TWI372108B (en) * | 2005-04-06 | 2012-09-11 | Rohm & Haas Elect Mat | Method for forming a porous reaction injection molded chemical mechanical polishing pad |
| US7435364B2 (en) * | 2005-04-11 | 2008-10-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for forming a porous polishing pad |
| TW200720001A (en) * | 2005-08-10 | 2007-06-01 | Rohm & Haas Elect Mat | Method of forming grooves in a chemical mechanical polishing pad utilizing laser ablation |
| TW200720023A (en) * | 2005-09-19 | 2007-06-01 | Rohm & Haas Elect Mat | A method of forming a stacked polishing pad using laser ablation |
| US20070235904A1 (en) * | 2006-04-06 | 2007-10-11 | Saikin Alan H | Method of forming a chemical mechanical polishing pad utilizing laser sintering |
| JP2012240192A (ja) * | 2011-05-24 | 2012-12-10 | Rohm & Haas Co | 向上した品質の多スペクトル硫化亜鉛 |
| CN102400194A (zh) * | 2011-12-06 | 2012-04-04 | 淮海工学院 | 一种梯度纳米晶镀层的制备方法 |
| US9993907B2 (en) * | 2013-12-20 | 2018-06-12 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having printed window |
| US9463553B2 (en) | 2014-02-19 | 2016-10-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers |
| US9463550B2 (en) | 2014-02-19 | 2016-10-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| SG11201703114QA (en) | 2014-10-17 | 2017-06-29 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| EP3271090A4 (en) * | 2015-03-19 | 2018-09-19 | Palram Industries (1990) Ltd. | Auto clean surface and method of making same |
| KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10189143B2 (en) * | 2015-11-30 | 2019-01-29 | Taiwan Semiconductor Manufacturing Company Limited | Polishing pad, method for manufacturing polishing pad, and polishing method |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US20180304539A1 (en) | 2017-04-21 | 2018-10-25 | Applied Materials, Inc. | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| JP7033485B2 (ja) * | 2018-04-17 | 2022-03-10 | 株式会社ディスコ | 切削ブレードの整形方法 |
| KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IL92427A0 (en) * | 1989-02-08 | 1990-07-26 | Gen Electric | Laser welding apparatus and process |
| US6017265A (en) | 1995-06-07 | 2000-01-25 | Rodel, Inc. | Methods for using polishing pads |
| US6106754A (en) * | 1994-11-23 | 2000-08-22 | Rodel Holdings, Inc. | Method of making polishing pads |
| US5733497A (en) * | 1995-03-31 | 1998-03-31 | Dtm Corporation | Selective laser sintering with composite plastic material |
| EP1011922B1 (en) * | 1997-04-18 | 2002-11-06 | Cabot Microelectronics Corporation | Polishing pad for a semiconductor substrate |
| JPH11775A (ja) * | 1997-06-10 | 1999-01-06 | Mitsubishi Heavy Ind Ltd | レーザクラッディング装置 |
| DE10105504A1 (de) * | 2001-02-07 | 2002-08-14 | Eos Electro Optical Syst | Vorrichtung zur Behandlung von Pulver für eine Vorrichtung zum Herstellen eines dreidimensionalen Objekts, Vorrichtung zum Herstellen eines dreidimensionalen Objekts und Verfahren zum Herstellen eines dreidimensionalen Objekts |
| US7275856B2 (en) | 2004-09-30 | 2007-10-02 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Apparatus for forming a polishing pad having a reduced striations |
| US7396497B2 (en) | 2004-09-30 | 2008-07-08 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a polishing pad having reduced striations |
| US7275928B2 (en) | 2004-11-23 | 2007-10-02 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Apparatus for forming a striation reduced chemical mechanical polishing pad |
| US20060108701A1 (en) | 2004-11-23 | 2006-05-25 | Saikin Allan H | Method for forming a striation reduced chemical mechanical polishing pad |
| TWI372108B (en) | 2005-04-06 | 2012-09-11 | Rohm & Haas Elect Mat | Method for forming a porous reaction injection molded chemical mechanical polishing pad |
| TWI410314B (zh) | 2005-04-06 | 2013-10-01 | 羅門哈斯電子材料Ｃｍｐ控股公司 | 藉由反應-射出成形製造多孔化學機械研磨墊之裝置 |
| US7435364B2 (en) | 2005-04-11 | 2008-10-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for forming a porous polishing pad |
| TW200720001A (en) | 2005-08-10 | 2007-06-01 | Rohm & Haas Elect Mat | Method of forming grooves in a chemical mechanical polishing pad utilizing laser ablation |
| TW200720023A (en) | 2005-09-19 | 2007-06-01 | Rohm & Haas Elect Mat | A method of forming a stacked polishing pad using laser ablation |
| CN101111362B (zh) * | 2005-12-01 | 2010-09-01 | 松下电器产业株式会社 | 三维结构物的制造方法以及制造装置 |
| US20070235904A1 (en) | 2006-04-06 | 2007-10-11 | Saikin Alan H | Method of forming a chemical mechanical polishing pad utilizing laser sintering |
-
2006
- 2006-03-08 US US11/372,322 patent/US7517488B2/en not_active Expired - Fee Related
-
2007
- 2007-02-15 TW TW096105644A patent/TW200800505A/zh unknown
- 2007-03-08 JP JP2007058027A patent/JP2007281435A/ja active Pending
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