JP2007301715A5 - - Google Patents

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Publication number
JP2007301715A5
JP2007301715A5 JP2007100014A JP2007100014A JP2007301715A5 JP 2007301715 A5 JP2007301715 A5 JP 2007301715A5 JP 2007100014 A JP2007100014 A JP 2007100014A JP 2007100014 A JP2007100014 A JP 2007100014A JP 2007301715 A5 JP2007301715 A5 JP 2007301715A5
Authority
JP
Japan
Prior art keywords
thermoplastic particles
particles
laser beam
sintering
thermoplastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007100014A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007301715A (ja
Filing date
Publication date
Priority claimed from US11/400,401 external-priority patent/US20070235904A1/en
Application filed filed Critical
Publication of JP2007301715A publication Critical patent/JP2007301715A/ja
Publication of JP2007301715A5 publication Critical patent/JP2007301715A5/ja
Pending legal-status Critical Current

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JP2007100014A 2006-04-06 2007-04-06 レーザー焼結を用いたケミカルメカニカルポリッシング用の研磨パッドの形成方法 Pending JP2007301715A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/400,401 US20070235904A1 (en) 2006-04-06 2006-04-06 Method of forming a chemical mechanical polishing pad utilizing laser sintering

Publications (2)

Publication Number Publication Date
JP2007301715A JP2007301715A (ja) 2007-11-22
JP2007301715A5 true JP2007301715A5 (https=) 2010-03-18

Family

ID=38574378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007100014A Pending JP2007301715A (ja) 2006-04-06 2007-04-06 レーザー焼結を用いたケミカルメカニカルポリッシング用の研磨パッドの形成方法

Country Status (3)

Country Link
US (1) US20070235904A1 (https=)
JP (1) JP2007301715A (https=)
TW (1) TW200812754A (https=)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7396497B2 (en) * 2004-09-30 2008-07-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad having reduced striations
US20060108701A1 (en) * 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
TWI372108B (en) * 2005-04-06 2012-09-11 Rohm & Haas Elect Mat Method for forming a porous reaction injection molded chemical mechanical polishing pad
TWI410314B (zh) * 2005-04-06 2013-10-01 羅門哈斯電子材料Ｃｍｐ控股公司 藉由反應-射出成形製造多孔化學機械研磨墊之裝置
US7435364B2 (en) * 2005-04-11 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for forming a porous polishing pad
TW200720001A (en) * 2005-08-10 2007-06-01 Rohm & Haas Elect Mat Method of forming grooves in a chemical mechanical polishing pad utilizing laser ablation
TW200720023A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat A method of forming a stacked polishing pad using laser ablation
US7517488B2 (en) * 2006-03-08 2009-04-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a chemical mechanical polishing pad utilizing laser sintering
TWI465315B (zh) * 2008-11-12 2014-12-21 Bestac Advanced Material Co Ltd 可導電之拋光墊及其製造方法
KR101044279B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 Ｃｍｐ 연마패드와 그의 제조방법
KR101044281B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 기공이 형성된 ｃｍｐ 연마패드와 그의 제조방법
EP2289652B2 (de) * 2009-08-25 2022-09-28 BEGO Medical GmbH Vorrichtung und Verfahren zur generativen Fertigung
ES2386602T3 (es) * 2009-08-25 2012-08-23 Bego Medical Gmbh Dispositivo y procedimiento para la producción continua generativa
TWI407023B (zh) 2010-12-03 2013-09-01 Ind Tech Res Inst 自動補償液靜壓軸頸軸承
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US10537027B2 (en) 2013-08-02 2020-01-14 Orbotech Ltd. Method producing a conductive path on a substrate
US9421666B2 (en) 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
US9993907B2 (en) 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
CN106029333B (zh) * 2014-02-24 2018-06-12 英派尔科技开发有限公司 增加的三维打印物品的层间粘附性
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10456886B2 (en) 2016-01-19 2019-10-29 Applied Materials, Inc. Porous chemical mechanical polishing pads
US10537973B2 (en) 2016-03-09 2020-01-21 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing
US20180079153A1 (en) 2016-09-20 2018-03-22 Applied Materials, Inc. Control of dispensing operations for additive manufacturing of a polishing pad
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US11059149B2 (en) 2017-05-25 2021-07-13 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing using initial layer
US10967482B2 (en) 2017-05-25 2021-04-06 Applied Materials, Inc. Fabrication of polishing pad by additive manufacturing onto mold
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112088069B (zh) 2018-05-07 2024-03-19 应用材料公司 亲水性和z电位可调谐的化学机械抛光垫
EP3814112A4 (en) 2018-06-29 2022-03-23 3M Innovative Properties Company Additive layer manufacturing method and articles
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6017265A (en) * 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
US6106754A (en) * 1994-11-23 2000-08-22 Rodel Holdings, Inc. Method of making polishing pads
US5733497A (en) * 1995-03-31 1998-03-31 Dtm Corporation Selective laser sintering with composite plastic material
EP1011922B1 (en) * 1997-04-18 2002-11-06 Cabot Microelectronics Corporation Polishing pad for a semiconductor substrate
US7396497B2 (en) * 2004-09-30 2008-07-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad having reduced striations
US7275856B2 (en) * 2004-09-30 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a polishing pad having a reduced striations
US7275928B2 (en) * 2004-11-23 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a striation reduced chemical mechanical polishing pad
US20060108701A1 (en) * 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
TWI372108B (en) * 2005-04-06 2012-09-11 Rohm & Haas Elect Mat Method for forming a porous reaction injection molded chemical mechanical polishing pad
TWI410314B (zh) * 2005-04-06 2013-10-01 羅門哈斯電子材料Ｃｍｐ控股公司 藉由反應-射出成形製造多孔化學機械研磨墊之裝置
US7435364B2 (en) * 2005-04-11 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for forming a porous polishing pad
TW200720001A (en) * 2005-08-10 2007-06-01 Rohm & Haas Elect Mat Method of forming grooves in a chemical mechanical polishing pad utilizing laser ablation
TW200720023A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat A method of forming a stacked polishing pad using laser ablation
CN101111362B (zh) * 2005-12-01 2010-09-01 松下电器产业株式会社 三维结构物的制造方法以及制造装置
US7517488B2 (en) * 2006-03-08 2009-04-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a chemical mechanical polishing pad utilizing laser sintering

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