JP2007301715A5 - - Google Patents

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Publication number
JP2007301715A5
JP2007301715A5 JP2007100014A JP2007100014A JP2007301715A5 JP 2007301715 A5 JP2007301715 A5 JP 2007301715A5 JP 2007100014 A JP2007100014 A JP 2007100014A JP 2007100014 A JP2007100014 A JP 2007100014A JP 2007301715 A5 JP2007301715 A5 JP 2007301715A5
Authority
JP
Japan
Prior art keywords
thermoplastic particles
particles
laser beam
sintering
thermoplastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007100014A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007301715A (ja
Filing date
Publication date
Priority claimed from US11/400,401 external-priority patent/US20070235904A1/en
Application filed filed Critical
Publication of JP2007301715A publication Critical patent/JP2007301715A/ja
Publication of JP2007301715A5 publication Critical patent/JP2007301715A5/ja
Pending legal-status Critical Current

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JP2007100014A 2006-04-06 2007-04-06 レーザー焼結を用いたケミカルメカニカルポリッシング用の研磨パッドの形成方法 Pending JP2007301715A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/400,401 US20070235904A1 (en) 2006-04-06 2006-04-06 Method of forming a chemical mechanical polishing pad utilizing laser sintering

Publications (2)

Publication Number Publication Date
JP2007301715A JP2007301715A (ja) 2007-11-22
JP2007301715A5 true JP2007301715A5 (https=) 2010-03-18

Family

ID=38574378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007100014A Pending JP2007301715A (ja) 2006-04-06 2007-04-06 レーザー焼結を用いたケミカルメカニカルポリッシング用の研磨パッドの形成方法

Country Status (3)

Country Link
US (1) US20070235904A1 (https=)
JP (1) JP2007301715A (https=)
TW (1) TW200812754A (https=)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7396497B2 (en) * 2004-09-30 2008-07-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad having reduced striations
US20060108701A1 (en) * 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
TWI410314B (zh) * 2005-04-06 2013-10-01 羅門哈斯電子材料Ｃｍｐ控股公司 藉由反應-射出成形製造多孔化學機械研磨墊之裝置
TWI372108B (en) * 2005-04-06 2012-09-11 Rohm & Haas Elect Mat Method for forming a porous reaction injection molded chemical mechanical polishing pad
US7435364B2 (en) * 2005-04-11 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for forming a porous polishing pad
TW200720001A (en) * 2005-08-10 2007-06-01 Rohm & Haas Elect Mat Method of forming grooves in a chemical mechanical polishing pad utilizing laser ablation
TW200720023A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat A method of forming a stacked polishing pad using laser ablation
US7517488B2 (en) * 2006-03-08 2009-04-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a chemical mechanical polishing pad utilizing laser sintering
TWI465315B (zh) * 2008-11-12 2014-12-21 Bestac Advanced Material Co Ltd 可導電之拋光墊及其製造方法
KR101044279B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 Ｃｍｐ 연마패드와 그의 제조방법
KR101044281B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 기공이 형성된 ｃｍｐ 연마패드와 그의 제조방법
EP2289462B1 (de) * 2009-08-25 2012-05-30 BEGO Medical GmbH Vorrichtung und Verfahren zur kontinuierlichen, generativen Fertigung
EP2289652B2 (de) * 2009-08-25 2022-09-28 BEGO Medical GmbH Vorrichtung und Verfahren zur generativen Fertigung
TWI407023B (zh) 2010-12-03 2013-09-01 Ind Tech Res Inst 自動補償液靜壓軸頸軸承
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US10537027B2 (en) 2013-08-02 2020-01-14 Orbotech Ltd. Method producing a conductive path on a substrate
US9421666B2 (en) 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
US9993907B2 (en) 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
WO2015126431A1 (en) * 2014-02-24 2015-08-27 Empire Technology Development Llc Increased interlayer adhesions of three-dimensional printed articles
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
KR20240015167A (ko) 2014-10-17 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
KR102629800B1 (ko) 2016-01-19 2024-01-29 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
EP3427288B1 (en) 2016-03-09 2021-04-28 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing
US20180079153A1 (en) 2016-09-20 2018-03-22 Applied Materials, Inc. Control of dispensing operations for additive manufacturing of a polishing pad
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US10882160B2 (en) 2017-05-25 2021-01-05 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing using sacrificial material
US10967482B2 (en) 2017-05-25 2021-04-06 Applied Materials, Inc. Fabrication of polishing pad by additive manufacturing onto mold
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
EP3790706A4 (en) 2018-05-07 2022-02-16 Applied Materials, Inc. CHEMICAL MECHANICAL POLISHING PADS WITH ADJUSTABLE HYDROPHIL AND ZETA POTENTIAL
US11577458B2 (en) 2018-06-29 2023-02-14 3M Innovative Properties Company Additive layer manufacturing method and articles
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6106754A (en) * 1994-11-23 2000-08-22 Rodel Holdings, Inc. Method of making polishing pads
US6017265A (en) * 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
US5733497A (en) * 1995-03-31 1998-03-31 Dtm Corporation Selective laser sintering with composite plastic material
AU7138198A (en) * 1997-04-18 1998-11-13 Cabot Corporation Polishing pad for a semiconductor substrate
US7396497B2 (en) * 2004-09-30 2008-07-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad having reduced striations
US7275856B2 (en) * 2004-09-30 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a polishing pad having a reduced striations
US7275928B2 (en) * 2004-11-23 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a striation reduced chemical mechanical polishing pad
US20060108701A1 (en) * 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
TWI410314B (zh) * 2005-04-06 2013-10-01 羅門哈斯電子材料Ｃｍｐ控股公司 藉由反應-射出成形製造多孔化學機械研磨墊之裝置
TWI372108B (en) * 2005-04-06 2012-09-11 Rohm & Haas Elect Mat Method for forming a porous reaction injection molded chemical mechanical polishing pad
US7435364B2 (en) * 2005-04-11 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for forming a porous polishing pad
TW200720001A (en) * 2005-08-10 2007-06-01 Rohm & Haas Elect Mat Method of forming grooves in a chemical mechanical polishing pad utilizing laser ablation
TW200720023A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat A method of forming a stacked polishing pad using laser ablation
WO2007063695A1 (ja) * 2005-12-01 2007-06-07 Matsushita Electric Industrial Co., Ltd. 三次元構造物の製造方法および製造装置
US7517488B2 (en) * 2006-03-08 2009-04-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a chemical mechanical polishing pad utilizing laser sintering

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