TW200800505A - Method of forming a chemical mechanical polishing pad utilizing laser sintering - Google Patents

Method of forming a chemical mechanical polishing pad utilizing laser sintering Download PDF

Info

Publication number
TW200800505A
TW200800505A TW096105644A TW96105644A TW200800505A TW 200800505 A TW200800505 A TW 200800505A TW 096105644 A TW096105644 A TW 096105644A TW 96105644 A TW96105644 A TW 96105644A TW 200800505 A TW200800505 A TW 200800505A
Authority
TW
Taiwan
Prior art keywords
particles
polishing pad
thermoplastic
sintering
laser beam
Prior art date
Application number
TW096105644A
Other languages
English (en)
Chinese (zh)
Inventor
Alan H Saikin
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200800505A publication Critical patent/TW200800505A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/20—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 for porous or cellular articles, e.g. of foam plastics, coarse-pored
    • B29C67/205—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 for porous or cellular articles, e.g. of foam plastics, coarse-pored comprising surface fusion, and bonding of particles to form voids, e.g. sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/009—Using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/736—Grinding or polishing equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Molding Of Porous Articles (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW096105644A 2006-03-08 2007-02-15 Method of forming a chemical mechanical polishing pad utilizing laser sintering TW200800505A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/372,322 US7517488B2 (en) 2006-03-08 2006-03-08 Method of forming a chemical mechanical polishing pad utilizing laser sintering

Publications (1)

Publication Number Publication Date
TW200800505A true TW200800505A (en) 2008-01-01

Family

ID=38478144

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105644A TW200800505A (en) 2006-03-08 2007-02-15 Method of forming a chemical mechanical polishing pad utilizing laser sintering

Country Status (3)

Country Link
US (1) US7517488B2 (https=)
JP (1) JP2007281435A (https=)
TW (1) TW200800505A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI791816B (zh) * 2018-04-17 2023-02-11 日商迪思科股份有限公司 切削刀的整形方法

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7396497B2 (en) * 2004-09-30 2008-07-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad having reduced striations
US20060108701A1 (en) * 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
TWI410314B (zh) * 2005-04-06 2013-10-01 羅門哈斯電子材料Ｃｍｐ控股公司 藉由反應-射出成形製造多孔化學機械研磨墊之裝置
TWI372108B (en) * 2005-04-06 2012-09-11 Rohm & Haas Elect Mat Method for forming a porous reaction injection molded chemical mechanical polishing pad
US7435364B2 (en) * 2005-04-11 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for forming a porous polishing pad
TW200720001A (en) * 2005-08-10 2007-06-01 Rohm & Haas Elect Mat Method of forming grooves in a chemical mechanical polishing pad utilizing laser ablation
TW200720023A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat A method of forming a stacked polishing pad using laser ablation
US20070235904A1 (en) * 2006-04-06 2007-10-11 Saikin Alan H Method of forming a chemical mechanical polishing pad utilizing laser sintering
JP2012240192A (ja) * 2011-05-24 2012-12-10 Rohm & Haas Co 向上した品質の多スペクトル硫化亜鉛
CN102400194A (zh) * 2011-12-06 2012-04-04 淮海工学院 一种梯度纳米晶镀层的制备方法
US9993907B2 (en) * 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
US9463553B2 (en) 2014-02-19 2016-10-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
US9463550B2 (en) 2014-02-19 2016-10-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
EP3271090A4 (en) * 2015-03-19 2018-09-19 Palram Industries (1990) Ltd. Auto clean surface and method of making same
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10189143B2 (en) * 2015-11-30 2019-01-29 Taiwan Semiconductor Manufacturing Company Limited Polishing pad, method for manufacturing polishing pad, and polishing method
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL92427A0 (en) * 1989-02-08 1990-07-26 Gen Electric Laser welding apparatus and process
US6017265A (en) 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
US6106754A (en) * 1994-11-23 2000-08-22 Rodel Holdings, Inc. Method of making polishing pads
US5733497A (en) * 1995-03-31 1998-03-31 Dtm Corporation Selective laser sintering with composite plastic material
EP1011922B1 (en) * 1997-04-18 2002-11-06 Cabot Microelectronics Corporation Polishing pad for a semiconductor substrate
JPH11775A (ja) * 1997-06-10 1999-01-06 Mitsubishi Heavy Ind Ltd レーザクラッディング装置
DE10105504A1 (de) * 2001-02-07 2002-08-14 Eos Electro Optical Syst Vorrichtung zur Behandlung von Pulver für eine Vorrichtung zum Herstellen eines dreidimensionalen Objekts, Vorrichtung zum Herstellen eines dreidimensionalen Objekts und Verfahren zum Herstellen eines dreidimensionalen Objekts
US7275856B2 (en) 2004-09-30 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a polishing pad having a reduced striations
US7396497B2 (en) 2004-09-30 2008-07-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad having reduced striations
US7275928B2 (en) 2004-11-23 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a striation reduced chemical mechanical polishing pad
US20060108701A1 (en) 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
TWI372108B (en) 2005-04-06 2012-09-11 Rohm & Haas Elect Mat Method for forming a porous reaction injection molded chemical mechanical polishing pad
TWI410314B (zh) 2005-04-06 2013-10-01 羅門哈斯電子材料Ｃｍｐ控股公司 藉由反應-射出成形製造多孔化學機械研磨墊之裝置
US7435364B2 (en) 2005-04-11 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for forming a porous polishing pad
TW200720001A (en) 2005-08-10 2007-06-01 Rohm & Haas Elect Mat Method of forming grooves in a chemical mechanical polishing pad utilizing laser ablation
TW200720023A (en) 2005-09-19 2007-06-01 Rohm & Haas Elect Mat A method of forming a stacked polishing pad using laser ablation
CN101111362B (zh) * 2005-12-01 2010-09-01 松下电器产业株式会社 三维结构物的制造方法以及制造装置
US20070235904A1 (en) 2006-04-06 2007-10-11 Saikin Alan H Method of forming a chemical mechanical polishing pad utilizing laser sintering

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI791816B (zh) * 2018-04-17 2023-02-11 日商迪思科股份有限公司 切削刀的整形方法

Also Published As

Publication number Publication date
JP2007281435A (ja) 2007-10-25
US20070210491A1 (en) 2007-09-13
US7517488B2 (en) 2009-04-14

Similar Documents

Publication Publication Date Title
TW200800505A (en) Method of forming a chemical mechanical polishing pad utilizing laser sintering
US20070235904A1 (en) Method of forming a chemical mechanical polishing pad utilizing laser sintering
US20190299357A1 (en) Printed chemical mechanical polishing pad
Holman et al. Spreading and infiltration of inkjet-printed polymer solution droplets on a porous substrate
KR102539021B1 (ko) 통합된 연마재 연마 패드들 및 제조 방법들
US6328634B1 (en) Method of polishing
TWI687280B (zh) 具有磨蝕粒於其中的印刷化學機械研磨墊
TW491755B (en) Polishing pad having an advantageous micro-texture and methods relating thereto
US6293852B1 (en) Polishing pads and methods relating thereto
TWI405639B (zh) 具有混合黏結的多功能研磨工具
CN109075057A (zh) 垫结构及制造方法
EP1175965A2 (en) Polishing tool, manufacturing method therefor, polishing apparatus for polishing a semiconductor wafer and method of polishing a substrate
CN107107305A (zh) 由积层制造工艺所生产的研磨垫
TW202308797A (zh) 拋光墊、形成拋光墊的方法、及加成製造系統
CN1336861A (zh) 改进的抛光垫及其抛光方法
KR20230005760A (ko) Cmp 폴리싱 패드
US11965103B2 (en) Additive manufacturing of polishing pads
KR100881162B1 (ko) 연마패드용 컨디셔닝 디스크의 제조방법
WO2021252537A1 (en) Additive manufacturing of polishing pads
WO2021252540A1 (en) Additive manufacturing of polishing pads
US6688956B1 (en) Substrate polishing device and method
EP4028440A1 (en) Additive manufacturing of polishing pads
KR101413530B1 (ko) Ｃｍｐ 패드 컨디셔너 및 그 제조방법
KR20140028918A (ko) 연마부재용 조성물, 이를 포함하는 연마부재 및 그 제조방법