JP2007281435A - レーザ焼結を利用してケミカルメカニカルポリッシングパッドを形成する方法 - Google Patents

レーザ焼結を利用してケミカルメカニカルポリッシングパッドを形成する方法 Download PDF

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Publication number
JP2007281435A
JP2007281435A JP2007058027A JP2007058027A JP2007281435A JP 2007281435 A JP2007281435 A JP 2007281435A JP 2007058027 A JP2007058027 A JP 2007058027A JP 2007058027 A JP2007058027 A JP 2007058027A JP 2007281435 A JP2007281435 A JP 2007281435A
Authority
JP
Japan
Prior art keywords
particles
sintering
polishing pad
thermoplastic
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007058027A
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English (en)
Japanese (ja)
Other versions
JP2007281435A5 (https=
Inventor
Alan H Saikin
アラン・エイチ・サイキン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of JP2007281435A publication Critical patent/JP2007281435A/ja
Publication of JP2007281435A5 publication Critical patent/JP2007281435A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/20—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 for porous or cellular articles, e.g. of foam plastics, coarse-pored
    • B29C67/205—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 for porous or cellular articles, e.g. of foam plastics, coarse-pored comprising surface fusion, and bonding of particles to form voids, e.g. sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/009—Using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/736—Grinding or polishing equipment

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Molding Of Porous Articles (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2007058027A 2006-03-08 2007-03-08 レーザ焼結を利用してケミカルメカニカルポリッシングパッドを形成する方法 Pending JP2007281435A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/372,322 US7517488B2 (en) 2006-03-08 2006-03-08 Method of forming a chemical mechanical polishing pad utilizing laser sintering

Publications (2)

Publication Number Publication Date
JP2007281435A true JP2007281435A (ja) 2007-10-25
JP2007281435A5 JP2007281435A5 (https=) 2010-03-25

Family

ID=38478144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007058027A Pending JP2007281435A (ja) 2006-03-08 2007-03-08 レーザ焼結を利用してケミカルメカニカルポリッシングパッドを形成する方法

Country Status (3)

Country Link
US (1) US7517488B2 (https=)
JP (1) JP2007281435A (https=)
TW (1) TW200800505A (https=)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016128208A (ja) * 2011-05-24 2016-07-14 ローム アンド ハース カンパニーＲｏｈｍ Ａｎｄ Ｈａａｓ Ｃｏｍｐａｎｙ 向上した品質の多スペクトル硫化亜鉛
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
CN110076684A (zh) * 2013-12-20 2019-08-02 应用材料公司 具有受控孔隙率的打印化学机械抛光垫
US10384330B2 (en) 2014-10-17 2019-08-20 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11524384B2 (en) 2017-08-07 2022-12-13 Applied Materials, Inc. Abrasive delivery polishing pads and manufacturing methods thereof
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US12023853B2 (en) 2014-10-17 2024-07-02 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7396497B2 (en) * 2004-09-30 2008-07-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad having reduced striations
US20060108701A1 (en) * 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
TWI410314B (zh) * 2005-04-06 2013-10-01 羅門哈斯電子材料Ｃｍｐ控股公司 藉由反應-射出成形製造多孔化學機械研磨墊之裝置
TWI372108B (en) * 2005-04-06 2012-09-11 Rohm & Haas Elect Mat Method for forming a porous reaction injection molded chemical mechanical polishing pad
US7435364B2 (en) * 2005-04-11 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for forming a porous polishing pad
TW200720001A (en) * 2005-08-10 2007-06-01 Rohm & Haas Elect Mat Method of forming grooves in a chemical mechanical polishing pad utilizing laser ablation
TW200720023A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat A method of forming a stacked polishing pad using laser ablation
US20070235904A1 (en) * 2006-04-06 2007-10-11 Saikin Alan H Method of forming a chemical mechanical polishing pad utilizing laser sintering
CN102400194A (zh) * 2011-12-06 2012-04-04 淮海工学院 一种梯度纳米晶镀层的制备方法
US9463553B2 (en) 2014-02-19 2016-10-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
US9463550B2 (en) 2014-02-19 2016-10-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
EP3271090A4 (en) * 2015-03-19 2018-09-19 Palram Industries (1990) Ltd. Auto clean surface and method of making same
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10189143B2 (en) * 2015-11-30 2019-01-29 Taiwan Semiconductor Manufacturing Company Limited Polishing pad, method for manufacturing polishing pad, and polishing method
JP7033485B2 (ja) * 2018-04-17 2022-03-10 株式会社ディスコ 切削ブレードの整形方法
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02258186A (ja) * 1989-02-08 1990-10-18 General Electric Co <Ge> レーザ溶接方法および装置
JPH11775A (ja) * 1997-06-10 1999-01-06 Mitsubishi Heavy Ind Ltd レーザクラッディング装置
JPH11509485A (ja) * 1995-03-31 1999-08-24 ディーテイーエム・コーポレーション 選択的レーザー焼結用複合プラスチック材料
US6017265A (en) * 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
JP2001522316A (ja) * 1997-04-18 2001-11-13 キャボット マイクロエレクトロニクス コーポレイション 半導体基板用研磨パッド
JP4081508B2 (ja) * 2005-12-01 2008-04-30 松下電器産業株式会社 三次元構造物の製造方法および製造装置

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* Cited by examiner, † Cited by third party
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US6106754A (en) * 1994-11-23 2000-08-22 Rodel Holdings, Inc. Method of making polishing pads
DE10105504A1 (de) * 2001-02-07 2002-08-14 Eos Electro Optical Syst Vorrichtung zur Behandlung von Pulver für eine Vorrichtung zum Herstellen eines dreidimensionalen Objekts, Vorrichtung zum Herstellen eines dreidimensionalen Objekts und Verfahren zum Herstellen eines dreidimensionalen Objekts
US7275856B2 (en) 2004-09-30 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a polishing pad having a reduced striations
US7396497B2 (en) 2004-09-30 2008-07-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad having reduced striations
US7275928B2 (en) 2004-11-23 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a striation reduced chemical mechanical polishing pad
US20060108701A1 (en) 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
TWI372108B (en) 2005-04-06 2012-09-11 Rohm & Haas Elect Mat Method for forming a porous reaction injection molded chemical mechanical polishing pad
TWI410314B (zh) 2005-04-06 2013-10-01 羅門哈斯電子材料Ｃｍｐ控股公司 藉由反應-射出成形製造多孔化學機械研磨墊之裝置
US7435364B2 (en) 2005-04-11 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for forming a porous polishing pad
TW200720001A (en) 2005-08-10 2007-06-01 Rohm & Haas Elect Mat Method of forming grooves in a chemical mechanical polishing pad utilizing laser ablation
TW200720023A (en) 2005-09-19 2007-06-01 Rohm & Haas Elect Mat A method of forming a stacked polishing pad using laser ablation
US20070235904A1 (en) 2006-04-06 2007-10-11 Saikin Alan H Method of forming a chemical mechanical polishing pad utilizing laser sintering

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02258186A (ja) * 1989-02-08 1990-10-18 General Electric Co <Ge> レーザ溶接方法および装置
JPH11509485A (ja) * 1995-03-31 1999-08-24 ディーテイーエム・コーポレーション 選択的レーザー焼結用複合プラスチック材料
US6017265A (en) * 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
JP2001522316A (ja) * 1997-04-18 2001-11-13 キャボット マイクロエレクトロニクス コーポレイション 半導体基板用研磨パッド
JPH11775A (ja) * 1997-06-10 1999-01-06 Mitsubishi Heavy Ind Ltd レーザクラッディング装置
JP4081508B2 (ja) * 2005-12-01 2008-04-30 松下電器産業株式会社 三次元構造物の製造方法および製造装置

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016128208A (ja) * 2011-05-24 2016-07-14 ローム アンド ハース カンパニーＲｏｈｍ Ａｎｄ Ｈａａｓ Ｃｏｍｐａｎｙ 向上した品質の多スペクトル硫化亜鉛
CN110076684B (zh) * 2013-12-20 2021-07-20 应用材料公司 具有受控孔隙率的打印化学机械抛光垫
CN110076684A (zh) * 2013-12-20 2019-08-02 应用材料公司 具有受控孔隙率的打印化学机械抛光垫
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10537974B2 (en) 2014-10-17 2020-01-21 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US12023853B2 (en) 2014-10-17 2024-07-02 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10384330B2 (en) 2014-10-17 2019-08-20 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10953515B2 (en) 2014-10-17 2021-03-23 Applied Materials, Inc. Apparatus and method of forming a polishing pads by use of an additive manufacturing process
US11958162B2 (en) 2014-10-17 2024-04-16 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US11446788B2 (en) 2014-10-17 2022-09-20 Applied Materials, Inc. Precursor formulations for polishing pads produced by an additive manufacturing process
US11724362B2 (en) 2014-10-17 2023-08-15 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
US11524384B2 (en) 2017-08-07 2022-12-13 Applied Materials, Inc. Abrasive delivery polishing pads and manufacturing methods thereof

Also Published As

Publication number Publication date
TW200800505A (en) 2008-01-01
US20070210491A1 (en) 2007-09-13
US7517488B2 (en) 2009-04-14

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