JP2007281163A5 - - Google Patents

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Publication number
JP2007281163A5
JP2007281163A5 JP2006105056A JP2006105056A JP2007281163A5 JP 2007281163 A5 JP2007281163 A5 JP 2007281163A5 JP 2006105056 A JP2006105056 A JP 2006105056A JP 2006105056 A JP2006105056 A JP 2006105056A JP 2007281163 A5 JP2007281163 A5 JP 2007281163A5
Authority
JP
Japan
Prior art keywords
substrate
flow path
disposed
inverter
cooler according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006105056A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007281163A (ja
JP4649359B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2006105056A external-priority patent/JP4649359B2/ja
Priority to JP2006105056A priority Critical patent/JP4649359B2/ja
Priority to PCT/JP2007/057522 priority patent/WO2007116894A1/ja
Priority to CN2007800123917A priority patent/CN101416307B/zh
Priority to US12/293,469 priority patent/US20090090490A1/en
Priority to DE112007000829T priority patent/DE112007000829B4/de
Publication of JP2007281163A publication Critical patent/JP2007281163A/ja
Publication of JP2007281163A5 publication Critical patent/JP2007281163A5/ja
Publication of JP4649359B2 publication Critical patent/JP4649359B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006105056A 2006-04-06 2006-04-06 冷却器 Expired - Fee Related JP4649359B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006105056A JP4649359B2 (ja) 2006-04-06 2006-04-06 冷却器
DE112007000829T DE112007000829B4 (de) 2006-04-06 2007-03-28 Anordnung aus Wechselrichter und Kühler und ihre Verwendung
CN2007800123917A CN101416307B (zh) 2006-04-06 2007-03-28 冷却器
US12/293,469 US20090090490A1 (en) 2006-04-06 2007-03-28 Cooler
PCT/JP2007/057522 WO2007116894A1 (ja) 2006-04-06 2007-03-28 冷却器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006105056A JP4649359B2 (ja) 2006-04-06 2006-04-06 冷却器

Publications (3)

Publication Number Publication Date
JP2007281163A JP2007281163A (ja) 2007-10-25
JP2007281163A5 true JP2007281163A5 (enExample) 2008-09-18
JP4649359B2 JP4649359B2 (ja) 2011-03-09

Family

ID=38581184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006105056A Expired - Fee Related JP4649359B2 (ja) 2006-04-06 2006-04-06 冷却器

Country Status (5)

Country Link
US (1) US20090090490A1 (enExample)
JP (1) JP4649359B2 (enExample)
CN (1) CN101416307B (enExample)
DE (1) DE112007000829B4 (enExample)
WO (1) WO2007116894A1 (enExample)

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US8169779B2 (en) * 2009-12-15 2012-05-01 GM Global Technology Operations LLC Power electronics substrate for direct substrate cooling
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US8077460B1 (en) 2010-07-19 2011-12-13 Toyota Motor Engineering & Manufacturing North America, Inc. Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same
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DE102012202708A1 (de) * 2012-02-22 2013-08-22 Siemens Aktiengesellschaft Vorrichtung zur Kühlung von elektrischen Bauteilen
JP5938574B2 (ja) * 2012-04-09 2016-06-22 パナソニックＩｐマネジメント株式会社 冷却装置およびこれを搭載した電気自動車
KR101540146B1 (ko) * 2012-06-22 2015-07-28 삼성전기주식회사 전력 모듈용 방열 시스템
US9353999B2 (en) * 2012-07-30 2016-05-31 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and electronics modules having branching microchannels
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CN102799244B (zh) * 2012-08-27 2016-06-22 无锡市福曼科技有限公司 计算机cpu的多流道水冷装置结构
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
US10018430B2 (en) 2013-03-14 2018-07-10 Rochester Institute Of Technology Heat transfer system and method incorporating tapered flow field
US9410746B2 (en) 2013-03-20 2016-08-09 Basf Se Temperature-regulating element
JP6157887B2 (ja) * 2013-03-21 2017-07-05 株式会社豊田中央研究所 冷却装置
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
US9352856B1 (en) * 2013-12-04 2016-05-31 Space Systems/Loral, Llc Axially grooved crossing heat pipes
JP5880531B2 (ja) 2013-12-11 2016-03-09 トヨタ自動車株式会社 冷却器
JP6162632B2 (ja) * 2014-03-25 2017-07-12 株式会社Ｓｏｋｅｎ 冷却器
US10462939B2 (en) * 2015-01-22 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
FR3031969B1 (fr) * 2015-01-27 2017-01-27 Airbus Defence & Space Sas Satellite artificiel et procede de remplissage d'un reservoir de gaz propulsif dudit satellite artificiel
WO2016193618A1 (fr) * 2015-06-02 2016-12-08 Airbus Defence And Space Sas Satellite artificiel
DE102016214959B4 (de) * 2016-08-11 2018-06-28 Siemens Healthcare Gmbh Temperiereinheit für ein elektronisches Bauelement und Verfahren zu dessen Herstellung
JP6715818B2 (ja) 2017-03-22 2020-07-01 ベジ 佐々木 冷却構造体、冷却システム、発熱装置および構造物
KR20210090231A (ko) * 2018-11-13 2021-07-19 마그나 인터내셔널 인코포레이티드 열전달이 개선된 파워 일렉트로닉스용 충돌 제트 냉각판
US10490482B1 (en) * 2018-12-05 2019-11-26 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling devices including jet cooling with an intermediate mesh and methods for using the same
CN109764706B (zh) * 2019-03-12 2024-04-26 山东省科学院能源研究所 一种带有喷管的微通道换热器结构及工作方法
CN113892172B (zh) 2019-05-30 2025-01-14 三菱电机株式会社 半导体装置
JP7307010B2 (ja) * 2020-02-28 2023-07-11 トヨタ自動車株式会社 冷却器
JP7580233B2 (ja) * 2020-10-01 2024-11-11 株式会社日立製作所 半導体装置およびホイール内蔵システム
JP7544881B2 (ja) 2023-01-23 2024-09-03 Ｎｅｃプラットフォームズ株式会社 冷却器および電子機器
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AT527256B1 (de) 2023-05-22 2025-04-15 Miba Sinter Austria Gmbh Verfahren zur Herstellung einer Kühlvorrichtung
AT526921B1 (de) 2023-05-22 2024-09-15 Miba Sinter Austria Gmbh Verfahren zur Herstellung einer Kühlvorrichtung
AT527041B1 (de) 2023-07-27 2024-10-15 Miba Sinter Austria Gmbh Verfahren zur Herstellung einer Kühlanordnung sowie Kühlanordnung für leistungselektronische Bauteile
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