JP2007278799A - Method of manufacturing microprobe guide, microprobe unit using microprobe guide, and staggered type microprobe unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To guide a probe highly accurately, and to narrow a pitch of tip arrangement of each probe, in a probe unit. <P>SOLUTION: A staggered type microprobe unit 40 is constituted by combining back to back an upper side microprobe unit 42 and a lower side microprobe unit 44. The upper side microprobe unit 42 is constituted of a microprobe guide 70 having a plurality of grooves 72, and microprobes 50 arranged respectively on each groove 72. The lower side microprobe unit 44 has a similar configuration. The microprobe guides 70, 71 having the plurality of grooves 72 are acquired by forming each elongate deep groove having the groove depth and the groove width corresponding to the height and the width of a shaft part of the microprobes 50, 51 by using an anisotropic dry etching method to a silicon plate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a microprobe guide in which microprobes having small dimensions are arranged and a microprobe unit in which the microprobes are arranged in the microprobe guide, and in particular, a method for manufacturing a microprobe guide, a microprobe unit using the microprobe guide, and a staggered pattern. The present invention relates to an arrangement type microprobe unit.

  A so-called probe card is used to inspect the circuit characteristics and the like of an IC chip or a liquid crystal display element manufactured on a semiconductor wafer by bringing a probe into contact with an electrode terminal of the semiconductor wafer or liquid crystal display element.

  For example, in Patent Document 1, as a general probe card, a printed wiring is provided on a disk-shaped probe card substrate having an opening in the center, and the base end of each probe is connected and fixed to each printed wiring terminal, It is described that the tips of these probes extend toward an electrode pad to be inspected such as a semiconductor wafer or a liquid crystal display element. And as electrode pads such as semiconductor wafers and liquid crystal display elements become denser, the probe group itself must be placed with high precision and precision, and it opens in a fan shape from the tip to the base of each probe. In addition, it is described that the probes constituting the probe group are arranged in multiple layers with different heights. In addition, it is also known that the tips of adjacent probes are arranged in a staggered pattern.

  Further, Patent Document 2 utilizes the fact that the {100} plane of the silicon substrate is etched faster than the {111} plane, and forms a groove in the silicon substrate with a KOH solution or the like, and electroless plating the groove. A method of making a probe is disclosed.

Japanese Patent Laid-Open No. 6-222079 Japanese Patent Laid-Open No. 2002-257859

  As described above, various proposals have been made for narrowing the pitch of probes in a probe card. However, in the staggered arrangement or the multi-layer arrangement introduced in Patent Document 1, the specific method for holding and fixing the probe at a narrow pitch is adhesive fixing to the printed wiring of the probe card. In order to arrange the position of the tip with high accuracy, a precise jig or the like for accurately guiding the arrangement of each probe is required. Moreover, in the method of making a probe on a silicon substrate described in Patent Document 2, there are limitations on the material, shape, etc. of the probe.

  An object of the present invention is to provide a microprobe guide manufacturing method, a microprobe guide using the microprobe guide, and a staggered microprobe unit that can guide the probe with high accuracy and reduce the pitch of the tips of each probe. Is to provide.

  The present invention is realized by applying a so-called MEMS technology or micromachine technology, which creates a micro mechanism in silicon or the like by using an etching technology or a film deposition technology used in a semiconductor manufacturing process, to a probe card. Can do. More specifically, a material to which semiconductor process technology can be applied, for example, a silicon plate, is subjected to a technique such as anisotropic etching to form a deep and narrow groove, which is used as a guide for the microprobe. Here, the anisotropic etching is used to mean etching that forms a deep hole or groove in a shape according to the size of the mask with almost no side etching with respect to the size of the etching mask. In this case, as the microprobe, a microprobe manufactured by a known machining technique or etching technique using a normal material can be used. A positioning hole or opening for positioning the microprobe can also be formed by a micromachine technique or the like.

  As described above, the microprobe guide manufacturing method according to the present invention is a microprobe guide manufacturing method for holding an elongated microprobe, and a groove width corresponding to the width of the microprobe and at least twice the groove width. A step of forming a microprobe guide groove having a groove depth on the plate by anisotropic etching.

  Also, the microprobe guide manufacturing method according to the present invention is a microprobe guide manufacturing method for holding an elongated microprobe having a positioning convex portion at a part of a shaft portion, and a groove corresponding to the width of the microprobe. Forming a microprobe guide groove having a width and a groove depth more than twice the groove width on the plate by anisotropic etching, and forming a microprobe on a part of the groove bottom of the microprobe guide groove of the plate Forming a recess or an opening corresponding to the positioning convex portion.

  The method of manufacturing a microprobe guide according to the present invention is a method of manufacturing a microprobe guide that holds an elongated microprobe, and includes a groove width corresponding to the width of the microprobe and a groove that is twice or more the groove width. And forming a microprobe guide groove having a depth on the silicon plate by anisotropic dry etching.

  Also, the microprobe guide manufacturing method according to the present invention is a microprobe guide manufacturing method for holding an elongated microprobe having a positioning convex portion at a part of a shaft portion, and a groove corresponding to the width of the microprobe. Forming a microprobe guide groove having a width and a groove depth more than twice the groove width on the silicon plate by anisotropic dry etching; Forming a recess or an opening corresponding to the positioning protrusion of the probe by anisotropic dry etching.

  In addition, the microprobe unit according to the present invention includes an elongated microprobe having a rectangular cross-section shaft portion whose height is twice or more the width, a groove width corresponding to the width of the shaft probe rectangular cross section, and a shaft portion. A plurality of microprobe guide grooves having a groove depth corresponding to the height of the rectangular cross section are arranged, and the microprobe is held in each microprobe guide groove.

  Further, in the microprobe unit according to the present invention, the microprobe further has a positioning convex portion at a part of the shaft portion, and the microprobe guide is further at a part of the groove bottom of the microprobe guide groove, It is preferable to have a recess or an opening corresponding to the positioning protrusion of the microprobe.

  Further, in the microprobe unit according to the present invention, the microprobe has one end inclined to the shaft portion and becomes one end portion, and the other end is inclined with respect to the shaft portion in a direction opposite to the tilt of the one end. The microprobe guide has a groove length corresponding to the length of the shaft portion of the both ends bent microprobe and has one end of the groove. Preferably, one end of the microprobe is bent downward from the bottom of the groove and the other end of the microprobe is bent upward from the other end of the groove.

  In the microprobe unit according to the present invention, the height of the tip of one end with respect to the shaft portion of the microprobe differs from the height of the tip of the other end with respect to the shaft by the thickness of the microprobe guide. Is preferred.

  In the microprobe unit according to the present invention, the microprobe guide is preferably a silicon plate having a plurality of microprobe guide grooves.

  Further, the staggered microprobe unit according to the present invention is arranged such that both ends of the microprobe are arranged in each guide groove of the microprobe guide having a plurality of microprobe guide grooves, and both ends of the microprobe unit are bent from both ends of the groove. Two microprobe units that project both ends of the probe are back-to-back with each other and held by a holder, and the ends of adjacent micro-probes adjacent to each other at both ends of the microprobe guide are arranged in a staggered manner. A micro-probe unit, a both-ends bending type micro-probe includes an elongated shaft portion having a rectangular cross section whose height is twice or more of a width, and one end portion in which one end of the shaft portion extends while being inclined with respect to the shaft portion. The other end of the shaft portion extends in a direction opposite to the inclination of the one end with respect to the shaft portion, and Each of the microprobe guide grooves is bent at both ends. The other end is different in height by the thickness of the microprobe guide compared to the height of the tip of the one end. The groove width corresponding to the width of the shaft section rectangular cross section of the microprobe, the groove depth corresponding to the height of the shaft section rectangular section, and the groove length corresponding to the length of the shaft section, from one end of the groove A groove length that allows one end of a curved microprobe to protrude downward from the bottom of the groove and allows the other end of the curved microprobe to protrude upward from the other end of the groove to the bottom of the groove. The holder is designed so that the microprobe unit on one side and the microprobe unit on the other side are back-to-back with each other, and are shifted by an arbitrary distance in the pitch direction of the microprobe guide groove. In the length direction of the groove, the tip of the adjacent microprobe is shifted and held at an arbitrary distance so that the tips of the adjacent microprobes are staggered at each end of the microprobe guide. It is characterized by that.

  In the staggered microprobe unit according to the present invention, the probe guide is preferably a silicon plate having a plurality of microprobe guide grooves.

  With at least one of the above structures, a microprobe guide groove having a groove width corresponding to the width of the microprobe and a groove depth more than twice the groove width is formed in the plate by anisotropic etching. Since anisotropic etching used in the semiconductor process is used as described above, a long and narrow groove can be accurately manufactured in a minute size on a plate.

  Further, according to at least one of the above-described structures, a recess or opening corresponding to the convex portion for positioning the microprobe is formed in a part of the groove bottom of the microprobe guide groove of the plate. This step can also be performed by an anisotropic etching method as in the groove forming step. In addition, an isotropic etching method may be used depending on the size of the recess or the opening.

In addition, since the silicon plate is subjected to anisotropic dry etching by at least one of the above-described structures, a well-known micromachine technique can be applied to accurately form the deep groove of the microprobe guide. For example, an etching gas such as SiCl ₄ , Cl ₂ , or CBrF ₃ can be used. Similarly, a recess or opening corresponding to the convex portion for positioning of the microprobe can be formed in a part of the groove bottom of the microprobe guide groove.

  In addition, according to at least one of the above-described configurations, a microprobe having a long and narrow shaft portion having a rectangular cross section whose height is twice or more the width, and corresponding to the width and height of the groove corresponding to the width of the rectangular cross section. Since the microprobe guide is configured by using the microprobe guide having the microprobe guide groove having the groove depth to be formed, for example, a microprobe having a longitudinal section is made from a plate material, and the microprobe having a groove corresponding to the longitudinal section is formed. The probe guide can guide with high accuracy. A microprobe guide having a deep groove can be obtained by micromachine technology or the like.

  Similarly, when the positioning probe is provided on the microprobe according to at least one of the above configurations, a recess or an opening is provided in a part of the groove bottom of the microprobe guide groove in the microprobe guide. As a result, the microprobe can be accurately positioned and guided.

  In addition, when a both-ends bent microprobe is used as a microprobe according to at least one of the above configurations, the groove length of the microprobe guide is set to the length of the shaft of the both ends bent microprobe, and the groove bottom extends from one end of the groove. One end of the microprobe is bent downward and the other end of the microprobe is bent upward from the other end of the groove. Thereby, it is possible to guide with high accuracy while separating the measurement end facing the measurement object and the connection end connected to the measurement unit vertically.

  In addition, with at least one of the above-described configurations, the height of the tip of one end with respect to the shaft portion of the both-ends bent microprobe is equal to the height of the tip of the other end with respect to the shaft portion by the thickness of the microprobe guide. Different. As a result, when the microprobe units having the bent microprobes arranged on both ends are combined back to back, the tip of the microprobe protruding from the upper microprobe unit and the lower microprobe at each end of the microprobe guide. The tips of the microprobes protruding from the probe unit are aligned. Therefore, by using the microprobe units of this form in a back-to-back manner, microprobes having different heights from the shaft portion to the measurement object can be stacked and arranged. This makes it easy to arrange a plurality of rows of probes at a narrow pitch, or to arrange the tips of adjacent probes in a staggered pattern.

  Due to at least one of the above configurations, the height of the tip of the other end of the microprobe relative to the shaft of the tip of the other end differs from the height of the tip of the tip of the one end by the thickness of the microprobe guide. A double-ended curved microprobe is used. And the microprobe unit which arrange | positioned the both ends bending type | mold microprobe of the aspect to the microprobe guide is combined back-to-back. In that case, the microprobe unit on one side and the microprobe unit on the other side are back-to-back with each other, shifted by an arbitrary distance in the pitch direction of the microprobe guide groove, and adjacent in the length direction of the microprobe guide groove The microprobe is shifted by an arbitrary distance that separates the tip of the microprobe. With this configuration, the tips of adjacent microprobes are staggered with respect to each other at both ends of the microprobe guide. In this way, each microprobe can be guided with high precision so that the adjacent tips of the plurality of microprobes have a staggered arrangement. As a result, the probes can be guided with high precision, and the pitch of the tips of the probes can be reduced.

  Embodiments according to the present invention will be described below in detail with reference to the drawings. In the following, a device to which the microprobe unit is applied will be described as a lighting inspection device for a liquid crystal display panel. However, even in other devices, processing such as measurement is performed by bringing a plurality of probes into contact with a measurement object. Any device can be used. For example, it may be a liquid crystal display measuring device or a semiconductor wafer inspection device. Moreover, what is called a prober apparatus which moves a measurement object relatively with respect to a some probe may be sufficient. The dimensions described below are examples for explanation, and other dimensions may be used.

  FIG. 1 is a diagram showing a configuration of a liquid crystal display panel lighting inspection device 10. Here, although not a component of the liquid crystal display panel lighting inspection apparatus 10, a liquid crystal display panel 8 and its terminal pads 9 which are inspection objects are illustrated. The liquid crystal display panel lighting inspection device 10 includes a stage 12 that holds the liquid crystal display panel 8 and moves the liquid crystal display panel 8 to an arbitrary position, a prober holding unit 14 that is fixed with respect to the stage 12, a lighting inspection device 16, and a prober holding unit. 14, a manipulator 18 attached to 14, a contact probe 20 attached to the tip of the manipulator 18, a flat cable 22 that connects between the contact probe 20 and the lighting tester 16, and the like.

  FIG. 2 is a perspective view of the contact probe 20. The contact probe 20 has a function of arranging and holding a plurality of microprobes 50 and 51, and corresponds to a probe card in a broad sense. The contact probe 20 includes a staggered microprobe unit 40. The staggered microprobe unit 40 has a plurality of microprobes aligned and arranged in a two-layer structure. The microprobe unit 40 is adjacent to each other on one side A facing the liquid crystal display panel 8 and the other side B connected to the flat cable 22. The tips of the probes 50 and 51 are staggered. That is, on either one side A or the other side B, the tips of the adjacent microprobes 50 and 51 are arranged at intervals of S1 along the longitudinal direction of the microprobes 50 and 51, and the alignment pitch direction of the microprobes 50 and 51 is the same. Are arranged in a staggered arrangement at intervals of S2.

  3A and 3B are detailed views of the contact probe 20. FIG. 3A is a side view, FIG. 3B is a plan view, and FIG. 3C is a cross-sectional view. In the sectional view, a section in a plane passing through the positioning pin 30 and the fixing bolt 32 is shown. The contact probe 20 includes a staggered microprobe unit 40, a manipulator base 24 for holding the staggered microprobe unit 40, a support base 26, and a pressing plate 28. The presser plate 28 and the support base 26 are positioned and fixed by positioning pins 30 and are integrated as a gate-shaped member for guiding the staggered microprobe unit 40 after assembly. The support base 26 integrated with the presser plate 28, together with the manipulator base 24, sandwiches the staggered microprobe unit 40 between the opposing faces and appropriately tightens it with the fixing bolt 32, thereby staggering the microprobe unit 40. To fix. The reason that the fixing bolt is not used in place of the positioning pin 30 is to reduce the size of the contact probe 20. That is, the dimension of the head portion of the fixing bolt is larger than that of the screw portion, and when this is brought to the position of the positioning pin 30, the lateral width of the contact probe 20 is increased.

  The staggered microprobe unit 40 is a combination of two microprobe units having the same structure, back to back. FIG. 4 is a view showing a state in which two microprobe units constituting the staggered microprobe unit 40 are combined back to back, and an upper microprobe unit 42 and a lower microprobe unit 44 are arranged back to back. The The microprobe 50 is disposed in the groove provided in the microprobe guide 70 in the upper microprobe unit 42, and the microprobe is disposed in the groove provided in the microprobe guide 71 in the lower microprobe unit 44. 51 is arranged. The microprobes 50 and 51 have one end extending with an inclination with respect to the shaft portion to become one end portion, and the other end extending with respect to the shaft portion in a direction opposite to the inclination of the one end, with the tip thereof being the other end. It is a micro probe of the both ends bending type used as a part. In FIG. 4, tips 54 and 55 at one end and tips 56 and 57 at the other end are shown. Details of the structure of the microprobe guides 70 and 71 and details of the structure of the microprobes 50 and 51 will be described later.

  Here, when the upper microprobe unit 42 and the lower microprobe unit 44 are combined back to back, on the lower side in FIG. 4, the tip 54 of one end of the upper microprobe unit 42 and the lower microprobe unit 44 are The tip 57 of the other end is arranged. Similarly, on the upper side in FIG. 4, the tip 56 at the other end of the upper microprobe unit 42 and the tip 55 at the one end of the lower microprobe unit 44 are arranged.

  Similarly, the upper microprobe unit 42 has the same height so that the tip 54 at one end of the upper microprobe unit 42 and the tip 57 at the other end of the lower microprobe unit 44 are at the same height. The height of one end and the height of the other end of the macroprobes 50 and 51 are set so that the tip 56 of the other end of 42 and the tip 55 of one end of the lower microprobe unit 44 are at the same height. Sato is set. That is, as shown in FIG. 4, the height h1 of one end portion from the shaft portion of the macroprobes 50 and 51 is smaller than the height h2 of the other end portion from the shaft portion. The thickness is high by t. As a result, when the upper microprobe unit 42 and the lower microprobe unit 44 are combined back to back, the tip 54 of one end of the upper microprobe unit 42 and the lower microprobe unit 44 on the lower side in FIG. The tip 57 of the other end is at the same height. Similarly, on the upper side in FIG. 4, the tip 56 at the other end of the upper microprobe unit 42 and the tip 55 at the one end of the lower microprobe unit 44 are at the same height.

  The upper microprobe unit 42 and the lower microprobe unit 44 are positioned so that the tips of the adjacent microprobes 50 and 51 are in a staggered arrangement with each other. For example, on the lower side of FIG. 4, the tip 54 at one end of the upper microprobe unit 42 and the tip 57 at the other end of the lower microprobe unit 44 are S1 along the longitudinal direction of the microprobes 50 and 51. And positioned so as to be at an interval of S2 along the alignment pitch direction of the microprobes 50 and 51. Since the upper microprobe unit 42 and the lower microprobe unit 44 have the same structure, the tip 56 of the other end of the upper microprobe unit 42 and the lower microprobe unit 44 are also at the upper side in FIG. On the other hand, the tip 55 of the one end is a distance S1 along the longitudinal direction of the microprobes 50 and 51, and a distance S2 along the alignment pitch direction of the microprobes 50 and 51.

  FIG. 5 is a diagram showing a state where the upper microprobe unit 42 and the lower microprobe unit 44 are combined back to back to form a staggered microprobe unit 40. 5A is a plan view seen from the upper microprobe unit 42 side, FIG. 5B is a side view, and FIG. 5C is a bottom view seen from the lower microprobe unit 44 side.

  As shown in these drawings, the upper microprobe unit 42 includes a microprobe guide 70 having a plurality of grooves 72 and microprobes 50 respectively disposed in the grooves 72. The lower microprobe unit 44 includes a microprobe guide 71 having a plurality of grooves 72 and a microprobe 51 disposed in each groove 72. Here, the microprobe guide 70 and the microprobe guide 71 have the same structure, and the microprobe 50 and the microprobe 51 have the same structure. However, when the upper microprobe unit 42 and the lower microprobe unit 44 are combined back to back, the left-right relationship is opposite to each other.

  Here, the height h1 of the one side end portion from the shaft portion of the microprobes 50 and 51, the height h2 of the other end portion from the shaft portion, and the thickness t of the microprobe guides 70 and 71 are between. , H1 = h2 + t so that the lower end in FIG. 5 (b) has one end 54 of the upper microprobe unit 42 and the other end of the lower microprobe unit 44. 57 and the same height position. Similarly, on the upper side in FIG. 5B, the tip 56 of the other end of the upper microprobe unit 42 and the tip 55 of the one end of the lower microprobe unit 44 are at the same height.

  Further, as shown in FIG. 5B, on the lower side of the drawing, the tip 54 at one end of the upper microprobe unit 42 and the tip 57 at the other end of the lower microprobe unit 44 are microprobes. It is shown that they are arranged so as to have an interval of S1 along the longitudinal direction of 50 and 51. Similarly, on the upper side of the figure, the tip 56 of the other end of the upper microprobe unit 42 and the tip 55 of the one end of the lower microprobe unit 44 extend along the longitudinal direction of the microprobes 50, 51. It arrange | positions so that it may become an interval. The interval S1 is set to an arbitrary distance at which the tips of adjacent microprobes are sufficiently separated. For example, it can be set to about 0.1 mm.

  In the top view of FIG. 5A, the tip 56 of the other end of the upper microprobe unit 42 and the tip 55 of the one end of the lower microprobe unit 44 have the arrangement pitch of the microprobes 50 and 51. It is shown that they are arranged at intervals of S2 in the direction. Similarly, in the bottom view of FIG. 5C, the tip 54 of one end of the upper microprobe unit 42 and the tip 57 of the other end of the lower microprobe unit 44 are arranged pitches of the microprobes 50 and 51. Are arranged at intervals of S2. As can be seen from these figures, the interval S2 in this case is ½ of the arrangement pitch P of the microprobes 50 and 51. That is, the upper microprobe unit 42 and the lower microprobe unit 44 are arranged so that the mutual positional relationship is shifted so that the microprobe 51 is arranged in the middle of the arrangement of the microprobe 50. When the interval S2 is ½ of the arrangement pitch P of the microprobes 50 and 51, the tips 54 and 57 are sequentially arranged in the same pitch in the direction of the arrangement pitch of the microprobes 50 and 51. Of course, the pitch may not be equal. That is, the distance between the tips 54 and 57 may be set to an arbitrary distance in the direction of the arrangement pitch of the microprobes 50 and 51. In this case, the distance from the tip 54 to the two adjacent tips 57 can be different. Alternatively, the distance from the tip 57 to the two adjacent tips 54 can be different.

  Since the microprobes 50 and 51 have the same configuration, a detailed view of the microprobe 50 is shown in FIG. Here, FIG. 6A shows a top view, FIG. 6B shows a side view, FIG. 6C shows a bottom view, and FIGS. Each of the microprobes 50 and 51 has an elongated shaft portion 52, and one end of the microprobes 50 and 51 extends while being inclined with respect to the shaft portion 52, and the other end is opposite to the inclination of the one end with respect to the shaft portion 52. It is a microprobe of the both ends bending type which inclines inclining and the front-end | tip becomes the other end part. The shaft portion 52 has a rectangular cross-sectional shape having a height H and a width W. As already described, the height h1 of the tip 54 of the one end from the shaft 52 is greater than the height h2 of the tip 56 of the other end from the shaft t. It ’s expensive. That is, h1 and h2 are set so that h1 = h2 + t.

  The microprobes 50 and 51 are provided with a convex portion 64 for positioning at a part of the elongated shaft portion 52. The convex portions 64 prevent the positions of the projections 64 from being displaced in the axial direction when the microprobes 50 and 51 are disposed on the microprobe guides 70 and 71. For this purpose, the microprobe guides 70 and 71 are also provided with recesses or openings corresponding to the convex portions 64. In this example, the number of convex portions is one, but the number of convex portions may be two or more. In that case, the microprobe guides 70 and 71 are also provided with a plurality of indentations or openings corresponding to these convex portions.

  In FIG. 6B, the protrusion 60 provided slightly above the tip 54 at one end extending downward from the shaft portion 52 is positioned when the microprobes 50 and 51 are disposed on the microprobe guides 70 and 71. It is a position mark protrusion which serves as a mark for knowing.

  In addition, a taper 58 is provided in which the height H gradually decreases before bending from the shaft portion 52 toward the one end portion. Similarly, a taper 62 is provided in which the height H slightly lowers before bending from the shaft portion 52 toward the other end portion. The tapers 58 and 62 are for allowing the microprobes 50 and 51 to be deformed with elasticity. That is, the microprobes 50 and 51 are placed on the bottom of the microprobe guide when they are arranged on the microprobe guides 70 and 71 and are sandwiched between the manipulator base 24 and the support base 26 described in FIG. It is pressed down and restrained. At this time, the presence of the tapers 58 and 62 ensures a gap between the pressing surface of the manipulator base 24 or the pressing surface of the support base 26 and the microprobes 50 and 51. Within the range of the gap, the microprobes 50 and 51 can be elastically deformed, whereby an appropriate pressing pressure can be applied between the tips of the microprobes 50 and 51 and the measurement object.

  As the microprobes 50 and 51, a probe conductor material such as tungsten, copper, phosphor bronze, or the like formed into a predetermined shape by pressing or etching can be used. As an example of the dimensions, the shaft portion 52 can have a height H of about 250 μm and a width W of about 25 μm. Here, height H / width W = 10, but at least H / W is preferably 2 or more. Further, for example, the thickness t of the microprobe guides 70 and 71 is about 400 μm, the height h1 of the tip 54 at one end from the shaft 52 is about 800 μm, and the height from the shaft 56 of the tip 56 at the other end. h2 can be about 400 μm.

  Since the microprobe guides 70 and 71 have the same configuration, the state of the microprobe guide 70 is representatively shown in FIG. 7A is a top view, FIG. 7B is a side view, and FIG. 7C is a bottom view. The microprobe guides 70 and 71 are parts having a guiding function for positioning the microprobes 50 and 51 at a predetermined arrangement pitch P. Therefore, a flat plate is used in which a plurality of grooves are arranged at a pitch P and a positioning recess or opening is provided at the groove bottom. That is, the groove width corresponding to the width W of the rectangular section of the shaft portion 52 of the both-end bent microprobes 50, 51, the groove depth corresponding to the height H of the rectangular section of the shaft portion 52, and the length of the shaft portion 52. Grooves 72 having a groove length corresponding to the length are arranged at a pitch P. An opening 84 is provided at the groove bottom corresponding to the positioning convex portion 64 of the microprobes 50 and 51. In addition, one end of the groove 72 is provided with an opening at the bottom of the groove so as to protrude one end portion of the both-end bent microprobes 50 and 51, so as to be a notched opening 74. Further, a rising wall 76 is provided at the other end of the groove 72 so as to serve as a guide when the other end of the curved microprobe is protruded upward from the groove bottom.

  FIG. 8 is a view showing a state when the microprobe guides 70 and 71 are assembled back to back. FIG. 8 is a view as seen from the direction C in FIG. 7, and the scales in the vertical and horizontal directions are accurately adjusted. In this example, since the thickness of the microprobe guide 70 is slightly smaller than 400 μm and the groove 72 has a groove pitch P of 50 μm, the groove width can be slightly larger than 25 μm, for example, about 28 μm. Further, the groove depth can be set slightly larger than 250 μm, and the width of the opening 84 can also be set slightly larger than 25 μm, for example, 28 μm. In the opening 84, the bottom of the microprobe guide 70 is completely removed. In the microprobe guide 71, the dimensions of the respective parts such as the groove 73 and the opening 85 are the same. The microprobe guide 70 and the microprobe guide 71 are arranged so as to be shifted from each other in the direction of the groove arrangement pitch by S2 = P / 2. In addition, about the longitudinal direction of a groove | channel, as demonstrated in FIG. 4, FIG.

  As shown in FIG. 8, the staggered microprobe unit 40 is assembled with the microprobe guides 70 and 71 positioned back to back, and thereafter, the microprobes 50 and 51 are inserted into the grooves 72 and 73, and the openings 84 and 85. The positioning projections of the microprobes 70 and 71 are respectively positioned and obtained.

  FIG. 9 is a diagram for explaining the procedure of the manufacturing method of the microprobe guides 70 and 71. FIG. 9 shows a plan view and a sectional view in each step. 9C is a cross-sectional view taken along the line DD of the plan view, and FIG. 9D is a cross-sectional view taken along the line EE of the plan view. ing.

  First, a silicon plate 90 having a predetermined thickness is manufactured (silicon plate manufacturing process). For example, a silicon wafer is processed to a thickness of about 400 μm. The processed silicon wafer is sufficiently cleaned. Thereafter, an appropriate mask is provided on the upper surface of the silicon plate 90, and a groove-shaped portion is removed from the mask (mask process for forming a groove). As the mask, an appropriate inorganic insulating film or organic insulating film can be used. When an inorganic insulating film is used, for example, a silicon oxide film, a silicon nitride film, or the like is deposited and etched into a predetermined shape by a photoetching technique to form a mask 92 for forming a groove. When an organic insulating film is used, a mask 92 for groove formation can be formed by applying a photoresist film and exposing / developing using an appropriate exposure mask. FIG. 9A is a diagram illustrating a state in which a mask 92 for forming a groove is formed on the silicon plate 90. The opening of the mask is set to the same dimension as the groove width and groove length to be formed.

Next, the groove 72 is formed by a dry etching method (groove forming step). As the dry etching method, a reactive ion etching method can be used. Alternatively, a method called an ion beam etching method or a sputter etching method can be used. These methods are anisotropic etching methods in which the silicon plate 90 is removed mainly by physical impact so as to have a predetermined shape. Side etching is much more effective than isotropic etching methods using a chemical reaction with an etchant or the like. Less is. Therefore, deep grooves and openings can be formed almost in accordance with the mask shape. As the reaction gas, SiCl ₄ , Cl ₂ , CBrF ₃ or the like can be used. The adjustment of the groove depth can be performed by the reaction time, for example. FIG. 9B is a diagram illustrating a state in which the groove 72 is formed.

  Next, the silicon plate in which the groove 72 is formed is inverted, and an appropriate mask is provided on the back surface, and an opening-shaped portion is removed from the mask (mask process for forming an opening). The detailed contents of the mask formation are the same as the mask process for forming the grooves. However, the opening formation mask needs to be positioned with respect to the groove 72. This positioning can be performed using an appropriate alignment pattern or the like. FIG. 9C shows a state in which a mask 94 for forming a groove is formed on the back side of the silicon plate in which the groove 72 is formed.

  Using this mask, an opening is formed by dry etching (opening forming step). Here too, an anisotropic etching method similar to the groove forming step can be used. When the dimensional accuracy of the opening is not so strict, wet etching with an etchant may be used. FIG. 9D shows a state where the openings 84 and 74 are formed at the groove bottom of the groove 72. In this manner, a microprobe guide can be obtained from the silicon plate 90 by anisotropic dry etching.

  In the above description, the microprobe guide 70 used for the upper microprobe unit 42 and the microprobe guide 71 used for the lower microprobe unit 44 have been described as being the same. Here, when the microprobe guides 70 and 71 are assembled back to back, the grooves 72 are arranged in parallel at a pitch of P / 2 = S2, that is, when assembled as a staggered microprobe unit 40, The microprobes 50 and 51 are arranged in parallel at a pitch of P / 2 = S2. FIG. 10 shows the microprobe units 102 and 104 arranged obliquely so that the microprobes 50 and 51 are not parallel but have a pitch S2 on the liquid crystal display panel 8 side and a pitch S4 on the flat cable 22 side. FIG. In this case, the microprobe guides 106 and 108 are not the same, and each groove is provided in an inverted relationship, but the same microprobes 50 and 51 can be used.

  The reason why the pitch S2 is set on the liquid crystal display panel 8 side and the pitch S4 is set on the flat cable 22 side is different at both ends is as follows. That is, after the lighting test, the liquid crystal display panel 8 is commercialized by mounting a tape carrier package (TCP) on the terminal pads 9. Since the liquid crystal display panel 8 inputs and outputs signals via this TCP, it is convenient to divert this TCP in the inspection in the manufacturing process of the liquid crystal display panel 8. From this point of view, a flat cable for TCP is used as the flat cable 22. The TCP is bonded to the terminal pad 9 of the liquid crystal display panel 8 by thermocompression bonding. However, since the dimension is increased by heat at the time of thermocompression bonding, the pitch of the terminal pad 9 of the liquid crystal display panel 8 at the temperature at the time of thermocompression bonding. A pattern is formed so as to meet the above. Therefore, the terminal pitch S4 of TCP at normal temperature is shorter than the pitch S2 of the terminal pads 9 of the liquid crystal display panel 8. For this reason, the pitch S4 on the flat cable 22 side is shorter than the pitch S2 of the terminal pads 9 of the liquid crystal display panel 8.

  Thus, when diverting the TCP used for the liquid crystal display panel 8 to the flat cable 22, the pitch of the microprobes 50 and 51 needs to be different between the liquid crystal display panel 8 side and the flat cable 22 side. . Even in such a case, the microprobe guides 106 and 108 can be easily manufactured in accordance with the specifications of the mask used in the dry etching process.

It is a figure which shows the structure of the liquid crystal display panel lighting test | inspection apparatus with which the microprobe unit of embodiment which concerns on this invention is applied. It is a perspective view of the contact probe in the embodiment according to the present invention. It is detail drawing of the contact probe in embodiment which concerns on this invention. In embodiment which concerns on this invention, it is a figure which shows a mode that two microprobe units which comprise a staggered microprobe unit are combined back-to-back. In embodiment which concerns on this invention, it is detail drawing which shows a mode that an upper side microprobe unit and a lower side microprobe unit are combined back-to-back, and become a staggered microprobe unit. It is detail drawing of the microprobe in embodiment which concerns on this invention. It is a figure which shows the mode of the microprobe guide in embodiment which concerns on this invention. In embodiment which concerns on this invention, it is a figure which shows a mode when a microprobe guide is assembled back to back. In embodiment which concerns on this invention, it is a figure explaining the procedure of the manufacturing method of a microprobe guide. In embodiment which concerns on this invention, it is a figure which shows a mode that arrangement | positioning of each microprobe becomes pitch S2 on the liquid crystal display panel side, and becomes pitch S4 on the flat cable side.

Explanation of symbols

  8 liquid crystal display panel, 9 terminal pad, 10 liquid crystal display panel lighting inspection device, 12 stage, 14 prober holder, 16 lighting inspection device, 18 manipulator, 20 contact probe, 22 flat cable, 24 manipulator base, 26 support base, 28 Presser plate, 30 Positioning pin, 32 Fixing bolt, 40 Staggered microprobe unit, 42, 44, 102, 104 Microprobe unit, 50, 51 Microprobe, 52 Shaft, 54, 55, 56, 57 Tip, 58 62, taper, 60 protrusion, 64 convex, 70, 71, 106, 108 microprobe guide, 72, 73 groove, 74, 84, 85, 74 opening, 76 upright wall, 90 silicon plate, 92, 94 mask.

Claims (11)

A method of manufacturing a microprobe guide for holding an elongated microprobe,
A step of forming a microprobe guide groove having a groove width corresponding to the width of the microprobe and a groove depth more than twice the groove width by anisotropic etching on a plate. Production method. A method of manufacturing a microprobe guide for holding an elongated microprobe having a positioning convex portion at a part of a shaft portion,
Forming a microprobe guide groove on the plate by anisotropic etching, having a groove width corresponding to the width of the microprobe and a groove depth more than twice the groove width;
Forming a recess or opening corresponding to the positioning probe of the microprobe in a part of the groove bottom of the microprobe guide groove of the plate;
A method for manufacturing a microprobe guide, comprising: A method of manufacturing a microprobe guide for holding an elongated microprobe,
A microprobe comprising a step of forming a microprobe guide groove having a groove width corresponding to the width of the microprobe and a groove depth more than twice the groove width by anisotropic dry etching on a silicon plate. Guide manufacturing method. A method of manufacturing a microprobe guide for holding an elongated microprobe having a positioning convex portion at a part of a shaft portion,
Forming a microprobe guide groove having a groove width corresponding to the width of the microprobe and a groove depth more than twice the groove width by anisotropic dry etching on a silicon plate;
Forming a recess or opening corresponding to the convex portion for positioning of the microprobe in a part of the groove bottom of the microprobe guide groove of the plate by anisotropic dry etching;
A method for manufacturing a microprobe guide, comprising: An elongated microprobe having a rectangular cross-section shaft portion having a height of at least twice the width;
A microprobe guide in which a plurality of microprobe guide grooves having a groove width corresponding to the width of the shaft section rectangular cross section of the microprobe and a groove depth corresponding to the height of the shaft section rectangular section are arranged;
And a microprobe unit that holds each microprobe in each microprobe guide groove. The microprobe unit according to claim 5,
The microprobe further has a positioning convex part on a part of the shaft part,
The microprobe guide further has a recess or an opening corresponding to the convex portion for positioning the microprobe at a part of the groove bottom of the microprobe guide groove. In the microprobe unit according to claim 5 or 6,
Microprobe
One end bent to extend toward the shaft portion to become one end portion, the other end to the shaft portion extends in a direction opposite to the inclination of one end, and the tip is the other end bent type A microprobe,
The microprobe guide has a groove length corresponding to the length of the shaft part of the both ends bent microprobe, and projects one end of the microprobe bent downward from one end of the groove to the bottom of the groove. A microprobe unit, wherein the other end of the microprobe is bent upward from the other end of the groove with respect to the groove bottom. The microprobe unit according to claim 7,
A microprobe unit characterized in that the height of the tip of one end relative to the shaft of the microprobe differs from the height of the tip of the other end relative to the shaft by the thickness of the microprobe guide. The microprobe unit according to claim 5,
The microprobe unit is a silicon plate having a plurality of microprobe guide grooves. Two micro-probe units are arranged so that each end-bend microprobe is arranged in each guide groove of a micro-probe guide having a plurality of micro-probe guide grooves, and both ends of the both-ends bend-type microprobe protrude from each end of the groove. A staggered microprobe unit that is held back-to-back with holders, and the ends of adjacent curved microprobes adjacent to each other at both ends of the microprobe guide are arranged in a staggered fashion,
Both ends bend type microprobe
An elongated shaft portion having a rectangular cross section whose height is at least twice the width;
One end of the shaft portion extending at an angle with respect to the shaft portion;
The other end of the shaft portion extends in a direction opposite to the inclination of the one end with respect to the shaft portion, and the height of the tip end relative to the shaft portion is smaller than the height of the tip end of the one end portion relative to the shaft portion. The other end that differs by the thickness of the guide,
Including
Each microprobe guide groove
The groove width corresponding to the width of the shaft rectangular cross section of the both ends bent microprobe,
The groove depth corresponding to the height of the rectangular section of the shaft,
The length of the groove corresponds to the length of the shaft part. One end of the bent microprobe protrudes from one end of the groove downward to the groove bottom, and the other end of the groove extends upward from the groove bottom. A groove length capable of projecting the other end of the both ends bent microprobe,
Have
The holder is
The microprobe unit on one side and the microprobe unit on the other side are back-to-back with respect to each other, shifted by an arbitrary distance in the pitch direction of the microprobe guide groove, and adjacent microprobes in the length direction of the microprobe guide groove Staggered microprobe unit characterized in that the tips of adjacent microprobes are arranged in a staggered manner at both ends of the microprobe guide, and are shifted and held by an arbitrary distance apart from each other. . In the staggered microprobe unit according to claim 10,
A staggered microprobe unit, wherein the probe guide is a silicon plate having a plurality of microprobe guide grooves.

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