Summary of the invention
As mentioned above, intensive about the spacing of the probe that disposed on the probe, put forward various plans.But, in configuration of meander-like that Japanese kokai publication hei 6-222079 communique is introduced or multi-ply construction configuration,, adopt the fixing mode of printed wiring bonding to probe as to keep the concrete grammar of intensive spacing stationary probe.Therefore, for the front position of high-precision each probe of configuration, need be used for accurately protecting the precise clamp of each probe configuration.In addition, in TOHKEMY 2002-257859 communique, set forth on silicon substrate the method that embeds probe, but this method is restricted to the material of probe, shape etc.
The object of the present invention is to provide a kind of manufacture method of mini probe guiding device, this device can be protected each probe of configuration accurately, so that the spacing densification of the front-end configuration of each probe becomes possibility.In addition, the present invention also provides a kind of mini probe unit, and this mini probe unit has used the mini probe guiding device of making according to the method described above.In addition, provide a kind of mini probe unit again, this mini probe unit is the meander-like configuration, and has used the mini probe guiding device of making according to the method described above.
The present invention can realize small technology such as mechanism's embedding silicon are applied on the probe by using employed etching technique and the long-pending technology of membrane stack etc. in the semiconductor manufacturing process.This kind embeds the technology of small mechanism, is disclosed as so-called MEMS (Micro Electro MechanicalSystems: small electricapparatus system) technology or micromachine technology.Particularly, on the material that the semiconductor process flow technology is suitable for, for example on substrates such as silicon substrate, implement technology such as heterogeneous body etching, make it to form dark and elongated groove, and with this guiding mechanism as miniature probe.At this, so-called heterogeneous body etching refers to the size with respect to etch mask, does not almost have side etching, but forms the etching of deep hole or groove with the shape measure-alike with covering curtain.Like this, be under the situation of guiding with dark and elongated groove, miniature probe just can adopt common material and adopt well-known Machining Technology or etching technique to make.In addition, pilot hole or the opening that is used for the miniature probe location also can be finished by the micromachine technology.
Like this; the manufacture method of mini probe guiding device of the present invention; be a kind of manufacture method of protecting the mini probe guiding device of elongated miniature probe; it is characterized in that; comprise by heterogeneous body being etched in the operation that forms the miniature probe direction recess on the substrate that this miniature probe direction recess has with the corresponding groove width of miniature probe width and is the groove depth of this groove width more than 2 times.
In addition, the manufacture method of mini probe guiding device of the present invention is characterized in that: comprise first operation and second operation.As first operation; have in the manufacture method of location with the mini probe guiding device of the elongated miniature probe of protection of protuberance at a certain position of axial region; be etched in formation miniature probe direction recess on the substrate by heterogeneous body; wherein, this miniature probe direction recess has with the corresponding groove width of miniature probe width and is the groove depth of this groove width more than 2 times.And, as second operation, at a certain position of the miniature probe gathering sill bottom land of sheet metal, form with miniature probe with corresponding depression of protuberance or opening.
In addition; the manufacture method of mini probe guiding device of the present invention; be a kind of manufacture method of protecting the mini probe guiding device of elongated miniature probe; it is characterized in that: comprise by heterogeneous body being etched in the operation that forms the miniature probe direction recess on the silicon substrate that this miniature probe direction recess has with the corresponding groove width of miniature probe width and is the groove depth of this groove width more than 2 times.In addition, the manufacture method of mini probe guiding device of the present invention is characterized in that: comprise first operation and second operation.As first operation; have in the manufacture method of location with the mini probe guiding device of the elongated miniature probe of protection of protuberance at a certain position of axial region; be etched in formation miniature probe direction recess on the silicon substrate by heterogeneous body; wherein, this miniature probe direction recess has with the corresponding groove width of miniature probe width and is the groove depth of this groove width more than 2 times.And, as second operation, at a certain position of the miniature probe gathering sill bottom land of substrate, form with miniature probe with corresponding depression of protuberance or opening.
Moreover mini probe unit of the present invention has miniature probe and mini probe guiding device.And miniature probe is elongate, and to have highly be the axial region of the rectangular section of width more than 2 times.In addition, the mini probe guiding device permutation disposes a plurality of miniature probe gathering sills; This kind miniature probe gathering sill have with the corresponding groove width of axial region rectangular section width of miniature probe and with the corresponding groove depth of axial region rectangular section height.And mini probe unit imports miniature probe each miniature probe gathering sill respectively.
In addition, in mini probe unit of the present invention, miniature probe should further be provided with the location protuberance at a certain position of its axial region.And mini probe unit also further is provided with location corresponding depression of protuberance or the opening with miniature probe at a certain position of miniature probe gathering sill bottom land.
In addition, in mini probe unit of the present invention, be preferably, miniature probe is a kind of miniature probe of bending two ends type.One side of this miniature probe tilts with respect to axial region and extends, and forms a side end; Another side tilts and extension towards the direction opposite with an above-mentioned side vergence direction with respect to axial region, thereby its front end forms end side.Mini probe guiding device has the corresponding groove length of axial region length with bending two ends type miniature probe.With respect to bottom land, expose a side end of the bending of miniature probe by a side of groove at downside; With respect to bottom land, expose the end side of the bending of miniature probe by the other end of groove at upside.
In addition, in mini probe unit of the present invention, compare with height with respect to the end side of axial region with respect to the front end height of axial region one side end of miniature probe, just different because of the thickness part of mini probe guiding device.
Moreover in mini probe unit of the present invention, mini probe guiding device is preferably a kind of silicon substrate with a plurality of miniature probe direction recess.
In addition, meander-like layout type mini probe unit of the present invention is characterized in that: the miniature probe of bending two ends is configured to respectively on each direction recess of the mini probe guiding device that has a plurality of miniature probe direction recess; The two ends of the bending two ends type miniature probe of mini probe unit are outstanding from the two ends of groove, and the mini probe unit with this kind structure in twos back to combination, and is fixed with carriage.And the front end of adjacent bending two ends type miniature probe is the meander-like configuration respectively mutually at the mini probe guiding device two ends.Here, bending two ends type miniature probe has elongated axial region and one side end and end side; It highly is the rectangular section of width more than 2 times that wherein elongated axial region has.The one side end is the end that an end of axial region tilts to extend with respect to axial region, its end side is that the other end of axial region tilts and extension towards the direction opposite with the inclination of an above-mentioned end with respect to axial region, compare with height with respect to the height of the axial region of its front end with respect to the axial region of the front end of a side end, only different because of the thickness part of mini probe guiding device.In addition, each miniature probe direction recess have with the corresponding groove width of width of the axial region rectangular section of the miniature probe of two sections flexure types of axial region, with the corresponding groove depth of height of axial region rectangular section and with the corresponding flute length of the length of axial region.And this groove depth can be exposed a side end of bending two ends type miniature probe by a side of groove with respect to bottom land at downside; With respect to bottom land, expose the end side of bending two ends type miniature probe by the other end of groove at upside.In addition, utilize carriage with the probe unit of the mini probe unit of a side and opposite side mutually back to combination, to fix.At this moment, any distance that can stagger mutually in the septal direction of miniature probe direction recess, at the length direction of miniature probe direction recess, any distance that the front end of adjacent miniature probe staggers at interval is configured, and fixes.And, to fix by this, the front end of adjacent miniature probe is the meander-like configuration respectively mutually at the mini probe guiding device two ends.
In addition, in meander-like layout type mini probe unit of the present invention, mini probe guiding device should be a kind of silicon substrate with a plurality of miniature probe direction recess.
According to above-mentioned formation, the manufacture method of mini probe guiding device is, by the heterogeneous body etching, forms the miniature probe direction recess on substrate, and this miniature probe direction recess has the groove depth more than 2 times with corresponding groove width of miniature probe width and groove width.Like this, because adopted employed heterogeneous body etching in semiconductor process flow, just can on substrate, accurately produce elongated groove with small dimensional accuracy.
In addition, according to above-mentioned formation, the manufacture method of mini probe guiding device is, can be further form at a certain position of the small probe gathering sill bottom land of sheet metal with the location of miniature probe with corresponding depression of protuberance or opening.This operation is identical with the operation that groove forms, and also can be undertaken by the heterogeneous body etching method.In addition, according to the size of depression or opening, also can use the homogeneous etching.
In addition, according to above-mentioned formation, the manufacture method of mini probe guiding device is, owing to adopted the heterogeneous body dry ecthing on silicon substrate, therefore can adopt well-known micromachine technology, can accurately embed in the deep trouth of mini probe guiding device.Can use for example SiCl4, Cl2, the etching gas of CBrF3 etc.In addition, similarly can embed at a certain position of the bottom land of miniature probe direction recess and the miniature probe location with corresponding depression of protuberance or opening.
In addition, according to above-mentioned formation, in the mini probe unit, can adopt as miniature probe that to have highly be the elongated thing of the rectangular section axial region more than the width twice; And the use mini probe guiding device, this mini probe guiding device has the miniature probe direction recess, wherein, this miniature probe direction recess have with the corresponding groove width of the width of this rectangular section and with its highly corresponding groove depth.For example can be by going out to have the miniature probe of lengthwise section by substrate manufacture, and utilize the mini probe guiding device that has with the corresponding groove of lengthwise section, can accurately lead to miniature probe.Mini probe guiding device with deep trouth can obtain by micromachine technology etc.
Similarly, according to above-mentioned formation, mini probe unit is when Design Orientation is used protuberance on miniature probe, to this, in mini probe guiding device, at a certain position design depression or the opening of miniature probe direction recess bottom land.Thus, just can accurately locate, protect miniature probe.
In addition, according to above-mentioned formation, in mini probe unit, as miniature probe when using bending two ends type miniature probe, the flute length of mini probe guiding device is made as the axial region length of bending two ends type miniature probe, with respect to bottom land, expose a side end of the bending of miniature probe by a side of groove at downside; With respect to bottom land, expose the end side of the bending of miniature probe by the other end of groove at upside.Thus, can realize accurately leading with in the face of the connection with end and connection determination part of the mensuration of determination object separates up and down with the end.In addition, according to above-mentioned formation, in mini probe unit, compare with front end height with the height of the front end of the corresponding side end of axial region of bending two ends type miniature probe corresponding to the end side of axial region, only different because of the thickness part of mini probe guiding device.Therefore, to dispose the mini probe unit of bending two ends type miniature probe of this kind form back to making up, and at the two ends of mini probe unit, the front end that makes the miniature probe that exposes from the upside mini probe unit respectively is consistent with height from the front end of downside mini probe unit.Thus, by with the mini probe unit of this kind shape back to stack combinations, can with by axial region to the different miniature probe laminated configuration of the height of determination object.Thus, can be convenient to the probe of multiple row is disposed in narrower interval, or the front-end configuration of adjacent probe is become meander-like.
According to above-mentioned formation, in meander-like layout type mini probe unit, adopted bending two ends type miniature probe, the corresponding height of axial region with front end end side this miniature probe is compared with the height corresponding to the axial region of the front end of a side, and is only different because of the thickness part of mini probe guiding device.And, mini probe unit back to combination is installed, wherein, is disposed at mini probe guiding device with the bending two ends type miniature probe of described shape in this mini probe unit.At this moment, with the probe unit of the mini probe unit of a side and opposite side mutually back to combination, and in the septal direction of the miniature probe direction recess any distance that staggers mutually, at the length direction of miniature probe direction recess, any distance that the front end of adjacent miniature probe staggers at interval is configured.By this kind structure, at the two ends of mini probe guiding device, the front end with adjacent miniature probe becomes the meander-like configuration mutually respectively.Like this, the adjacent front end of a plurality of probes is meander-like, so that can guide each miniature probe accurately.Thus, can accurately guide probe, also can make the front-end configuration of each probe form the spacing densification.
Embodiment
With reference to the accompanying drawings embodiment of the present invention is elaborated.The testing fixture of lighting a lamp with display panels illustrates the device that mini probe unit is suitable for below.Certainly, other devices also can, so long as the device of measuring etc. with a plurality of probe contact measurement objects gets final product.For example promptly can be the determinator of liquid crystal indicator, also can be the testing fixture of semiconductor wafer.In addition, also can be to make determination object produce the so-called probe unit that relatively moves in addition for a plurality of probes, the example that size described below just is used to illustrate, other size also can.
Fig. 1 is the testing fixture synoptic diagram of lighting a lamp of display panels.Here, not the light a lamp inscape of testing fixture 10 of display panels, but check that object is the synoptic diagram of display panels 8 and terminal extension 9 thereof.Display panels is lit a lamp testing fixture 10 by constituting with lower member: objective table 12 is used to carry display panels 8 and it is moved at an arbitrary position; Probe protection portion 14, its relative objective table 12 is positioned at the fixed position; The detector 16 of lighting a lamp; Mechanical arm 18, it is installed on probe protection portion 14; Contact type probe 20, it is installed on mechanical arm 18 front ends; And banded data line 22 etc., it is connected contact type probe 20 and lights a lamp between the detector 16.
Fig. 2 is the oblique view of contact type probe 20.Contact type probe 20 has the function that a plurality of miniature probe 50,51 permutations are disposed, fix, and is equivalent to sensu lato probe.Contact type probe 20 comprises meander-like layout type mini probe unit 40.Meander-like layout type mini probe unit 40 carries out the permutation configuration with a plurality of miniature probes in the mode of double-layer structural, respectively towards a distolateral A of display panels 8 and with another distolateral B that banded data line 22 is connected in, the leading section of adjacent miniature probe 50,51 is the meander-like configuration.That is, no matter at one end side A still is among the opposite side B, and the front end of adjacent miniature probe 50,51 is along the spacing of the long direction of miniature probe 50,51 with S1, along the column pitch direction of miniature probe 50,51 interval with S2, is meander-like and is configured.
Fig. 3 a, Fig. 3 b, Fig. 3 c are the detail drawings of contact type probe 20.Fig. 3 a is an outboard profile, and Fig. 3 b is a planimetric map, and Fig. 3 c is a sectional view.Sectional view represents to be communicated with the section on the plane of register pin 30 and set bolt 32.Contact type probe 20 is by constituting with lower member: meander-like layout type mini probe unit 40; The mechanical arm base 24 that is used for fixing meander-like layout type mini probe unit 40; Supporting station 26; And pressing plate 28.Pressing plate 28 and supporting station 26 position by register pin 30 and are fixing.After the combination, form one as the door type parts of protecting meander-like layout type mini probe unit 40.With pressing plate 28 formed incorporate supporting station 26 and mechanical arm base 24 undertaken by set bolt 32 suitably fastening, clamping meander-like layout type mini probe unit 40 between opposite face simultaneously, thereby fixing meander-like layout type mini probe unit 40.Why adopting register pin 30 and do not use set bolt, is in order to make the miniaturization of contact type probe 20.That is, because the head dimensions of set bolt is relatively large, if it is placed on the position of register pin 30, the width of contact type probe 20 will increase.
Meander-like layout type mini probe unit 40 is that mini probe unit with two same configuration is back to combining.Fig. 4 constitutes the synoptic diagram of two mini probe units of meander-like layout type mini probe unit 40 back to combination.Here, upside mini probe unit 42 and downside mini probe unit 44 with back to mode dispose.In upside mini probe unit 42, miniature probe 50 is configured in the set groove of mini probe guiding device 70; In downside mini probe unit 44, miniature probe 51 is configured in the set groove of mini probe guiding device 71.Miniature probe the 50, the 51st, a kind of miniature probe of bending two ends type, one end tilt with respect to axial region and extend to form a side end, and the other end towards tilting with an above-mentioned end vergence direction opposition side and extending, forms end side with respect to axial region.Fig. 4 represents the front end 54,55 of a side end and the front end 56,57 of end side.Detailed structure about mini probe guiding device 70,71 and miniature probe 50,51 will be set forth below.Here, upside mini probe unit 42 and downside mini probe unit 44 are back to when combination, and at the downside of Fig. 4, the front end 54 of a side end of upside mini probe unit 42 is configured with the front end 57 of the end side of downside mini probe unit 44.Similarly, at the upside of Fig. 4, the front end 55 of the front end 56 of the end side of upside mini probe unit 42 and a side end of downside mini probe unit 44 is configured.
So, the front end 57 of the front end 54 of a side end of upside mini probe unit 42 and the end side of downside mini probe unit 44 just is set at identical height.And, the front end 56 of the end side of upside mini probe unit 42 is set in identical height too with the front end 55 of a side end of downside mini probe unit 44, and the height of a side end of miniature probe 50,51 and the height of end side are just set thus.That is, as shown in Figure 4, based on the height h1 of a side end of miniature probe 50,51 axial regions, compare, only exceed the thickness t part of mini probe guiding device 50,51 with height h2 based on the end side of axial region.Therefore, upside mini probe unit 42 and downside mini probe unit 44 are back to when combination, at the downside of Fig. 4, the front end 57 of the front end 54 of a side end of upside mini probe unit 42 and the end side of downside mini probe unit 44 just forms identical height.And at the upside of Fig. 4, the front end 56 of the end side of upside mini probe unit 42 forms identical height similarly with the front end 55 of a side end of downside mini probe unit 44.
In addition, upside mini probe unit 42 and downside mini probe unit 44 are positioned, so that the leading section of adjacent miniature probe 50,51 is the meander-like configuration mutually.For example, at the downside of Fig. 4, the front end 57 of the front end 54 of a side end of upside mini probe unit 42 and the end side of downside mini probe unit 44, the interval that forms S1 along the long direction of miniature probe 50,51 positions configuration; In addition, position configuration along the interval that the permutation spacing direction of miniature probe 50,51 forms S2.Because upside mini probe unit 42 and downside mini probe unit 44 are same structures, at this moment, upside at Fig. 4, the front end 55 of the front end 56 of the end side of upside mini probe unit 42 and a side end of downside mini probe unit 44, along the interval than long direction formation S1 of miniature probe 50,51, form the interval of S2 along the permutation spacing direction of miniature probe 50,51.
Fig. 5 a, Fig. 5 b, Fig. 5 c be upside mini probe unit 42 with downside mini probe unit 44 with back to mode combine, and form the synoptic diagram of meander-like layout type mini probe unit 40.Fig. 5 a is that Fig. 5 b is an outboard profile from the being seen planimetric map of upside mini probe unit 42 sides, and Fig. 5 c is from the being seen upward view of downside mini probe unit 44 sides.
As shown in these figures, upside mini probe unit 42 is made of the mini probe guiding device 70 of a plurality of grooves 72 that have and the miniature probe 50 that is configured in respectively in each groove 72.In addition, downside mini probe unit 44 is made of the mini probe guiding device 71 of a plurality of grooves 72 that have and the miniature probe 51 that is configured in respectively in each groove 72.Here, mini probe guiding device 70 and mini probe guiding device 71 are identical construction, and miniature probe 50 and miniature probe 51 are identical construction.But, upside mini probe unit 42 and downside mini probe unit 44 with back to mode when making up, about relation opposite.
At this, between the height h1 of a side end of miniature probe 50,51 axial regions, thickness, there is this relation of h1=h2+t based on the height h2 of the end side of axial region and mini probe guiding device 70,71.Therefore, at Fig. 5 b downside, the front end 57 of the front end 54 of a side end of upside mini probe unit 42 and the end side of downside mini probe unit 44 is positioned on the equal height.Equally, at Fig. 5 b upside, the front end 55 of the front end 56 of the end side of upside mini probe unit 42 and a side end of downside mini probe unit 44 is positioned at equal height.
In addition, shown in Fig. 5 b, at the downside of figure, the front end 57 of the front end 54 of a side end of upside mini probe unit 42 and the end side of downside mini probe unit 44 positions configuration along the interval of the long direction formation S1 of miniature probe 50,51.Same, at the upside of figure, the front end 55 of the front end 56 of the end side of upside mini probe unit 42 and a side end of downside mini probe unit 44, the interval that forms S1 along the long direction of miniature probe 50,51 positions configuration.S1 can be set in the front end of adjacent miniature probe any distance at abundant interval at interval.For example can be set to about 0.1mm.
In addition, in the vertical view of Fig. 5 a, the front end 55 of the front end 56 of the end side of upside mini probe unit 42 and a side end of downside mini probe unit 44 forms the interval of S2 and disposes along the disposition interval direction of miniature probe 50,51.Same, in the ground plan of Fig. 5 c, the front end 57 of the front end 54 of a side end of upside mini probe unit 42 and the end side of downside mini probe unit 44 forms the interval of S2 and disposes along the disposition interval direction of miniature probe 50,51.Can understand by figure, the interval S2 under this kind situation be miniature probe 50,51 disposition interval p 1/2.That is, upside mini probe unit 42 disposes with downside mini probe unit 44 mutual staggered positions, miniature probe 51 is configured in the middle of the configuration of miniature probe 50.Make S2 at interval form 1/2 o'clock of miniature probe 50,51 disposition interval p, front end 54,57 just can dispose with mutual equally spaced relation in turn in the disposition interval direction of miniature probe 50,51.Certainly, also can unequal-interval.That is, can on the direction of the disposition interval of miniature probe 50,51, be set at any distance to the interval of front end 54,57.At this moment, just can distinguish difference from front end 54 to the interval of two adjacent front ends 57.In other words, can distinguish difference from front end 57 to the interval of two adjacent front ends 54.
Because miniature probe 50,51 all is same structures, as representative, the detail drawing of expression miniature probe 50 on Fig. 6 a, Fig. 6 b, Fig. 6 c.Here, Fig. 6 a represents vertical view, and Fig. 6 b represents the side view of front elevation and both sides thereof, and Fig. 6 c represents upward view.Miniature probe the 50, the 51st has the bending two ends type miniature probe of elongate shift 52.The corresponding axial region 52 of one end of axial region 52 tilts and extends and form a side end; The other end tilts and extension towards the direction opposite with an above-mentioned side vergence direction with respect to axial region 52, thereby its front end forms end side.Axial region 52 has the rectangular section shape of high H, wide W.As previously mentioned, compare with height h2, only exceed the thickness t part of mini probe guiding device 70,71 based on front end 56 axial regions of end side based on the height h1 of the axial region 52 of the front end 54 of a side end.That is, set h1, h2, so that h1=h2+t.
Miniature probe 50,51 is provided with the usefulness protuberance 64 of location usefulness at a certain position of elongate shift centre.This protuberance 64 when miniature probe 50,51 is configured on the mini probe guiding device 70,71, can not produce dislocation in the axial direction.Therefore, 70,71 pairs of mini probe guiding devices should protuberance 64 and be provided with depression or opening.In addition, in this example, the quantity of protuberance is one, the quantity of protuberance be two also passable.In this case, corresponding with this protuberance, also be provided with a plurality of depressions or opening on the mini probe guiding device 70,71.
Among Fig. 6 b, the front end 54 of and the end that extend crooked downwards from axial region 52 on the upper side the set projection 60 of portion are position mark projections.This mark is the position when being used to understand miniature probe 50,51 and being configured on the mini probe guiding device 70,71.
In addition, from axial region 52 before a side end bending, be provided with the low slightly tapering of height H 58.Equally, from axial region 52 before the end side bending, be provided with the low slightly tapering of height H 62.This tapering the 58, the 62nd can be out of shape in order to make miniature probe 50,51 have elasticity.Promptly, owing to be configured in mini probe guiding device 70,71, and during by mechanical arm bottom 24 illustrated in Fig. 3 a etc. and supporting station 26 clampings, on the higher position of axial region 52, miniature probe 50,51 is pressed towards the mini probe guiding device bottom and is tied.At this moment, by tapering 58,62, guaranteed between the compression face of the compression face of mechanical arm bottom 24 or supporting station 26 and miniature probe 50,51, to have the gap.In this interstice coverage, miniature probe 50,51 elastically deformables thus, can carry out suitable signature and press between the front end of miniature probe 50,51 and determination object.
Described miniature probe 50,51 can adopt by punch process or etching and processing probes such as tungsten, copper, phosphor bronze are formed specific shape with conductor material.An example as size is directed to axial region 52, height H can be made as 250 μ m, and width W is made as about 25 μ m.At this, should be height H/width W=10, the H/W value is more than 2 at least.In addition, for example: can be set at the thickness t of mini probe guiding device 70,71 about 400 μ m, the height h1 based on the axial region 52 of the front end 54 of a side end is set at about 800 μ m, the height h2 based on the axial region of the front end 56 of end side is set at about 400 μ m.
Because mini probe guiding device 70,71 all is identical construction, as representative, mini probe guiding device 70 is illustrated in Fig. 7 a, Fig. 7 b is on Fig. 7 c.Here, Fig. 7 a represents vertical view,, Fig. 7 b represents side view, Fig. 7 c represents upward view.Mini probe guiding device 70,71 is configured the disposition interval P of miniature probe 50,51 with appointment, and it is a kind of parts that position guiding function that have.Therefore, can adopt the parts that are configured in flat-shaped substrate on spacing P a plurality of grooves and use depression or opening in this bottom land setting location.Promptly, to have with the corresponding groove width of width W of the rectangular section of the axial region 52 of the miniature probe 50,51 of bending two ends type, with the corresponding groove depth of height H of the rectangular section of axial region 52, with the groove 72 of the corresponding flute length of length of axial region 52, dispose with spacing P.And, corresponding with protuberance 64 at bottom portion of groove with the location of miniature probe 50,51, be provided with opening 84.In addition, at an end of groove 72, the side end for the miniature probe 50,51 of outstanding bending two ends type is provided with opening at bottom portion of groove, and just notch part 74.In addition, the other end end of groove 72 is provided with vertical wall 76 with respect to bottom land at upside, and it is used for the end side of the miniature probe that protrudes in the bending two ends type is protected.
Fig. 8 is with the synoptic diagram of mini probe guiding device 70,71 back to when combination.And Fig. 8 is from the being seen figure of C direction, with in perspective making up in length and breadth among Fig. 7 b.In this example, make the thickness of mini probe guiding device 70 be slightly smaller than 400 μ m, be directed to groove 72, because flute pitch P is 50 μ m, therefore can make groove width slightly greater than 25 μ m, for example can be made as 28 μ m.In addition, depth of groove is set at is a bit larger tham 250 μ m, the width of opening 84 also is a bit larger tham 25 μ m, for example, can be set at 28 μ m.In the opening 84, the bottom of mini probe guiding device 70 breaks away from fully.In mini probe guiding device 71, the size of the each several part of groove 73, opening 85 etc. is also identical.And, mini probe guiding device 70 and mini probe guiding device 71 along the direction of groove disposition interval with the configuration of staggering mutually of the spacing of S2=P/2.In addition, on the long direction of groove, as Fig. 4, Fig. 5 b are illustrated, the spacing configuration of staggering with S1.
Meander-like layout type mini probe unit 40 as shown in Figure 8, mini probe guiding device 70,71 is back to combination and position the back installation, afterwards, miniature probe 50,51 inserts groove 72, in 73, the location of each mini probe guiding device 70,71 is positioned opening 84,85 respectively with protuberance, can obtain.
Fig. 9 a, Fig. 9 b, Fig. 9 c, Fig. 9 d are the process flow diagrams that is used to illustrate the manufacture method of mini probe guiding device 70,71.In each figure of Fig. 9 a, Fig. 9 b, Fig. 9 c, Fig. 9 d, represent the planimetric map and the sectional view of each engineering respectively.In addition, the sectional view among Fig. 9 c represents that the sectional view among Fig. 9 d is represented along the sectional view of this planimetric map E-E line along the sectional view of this planimetric map D D line.
Make the initial silicon substrate 90 (silicon substrate making engineering) of setting thickness.For example, silicon wafer is processed as the about 400 μ m of thickness.Silicon wafer after the processing is cleaned fully.After this, the suitable cover curtain of design on silicon substrate 90 covering the part (being used for the cover curtain operation that groove forms) of removing groove shapes on the curtain, as the cover curtain, can adopt suitable inorganic insulating membrane or organic insulating film.When adopting inorganic insulating membrane, can for example make the film that silicifies, silicon nitride film is piled up, and by optical lithography, is etched into the shape of appointment, just can be formed for the cover curtain that groove forms.When using organic insulating film, coat photoresist film,, just can be formed for the cover curtain 92 that groove forms by using the exposure-imaging technique of suitable exposure cover curtain.Fig. 9 a is the synoptic diagram that is formed for the cover curtain 92 of groove formation on silicon substrate 90.The opening of cover curtain can be set at the size identical with groove width, the flute length of desired formation.
Secondly, form groove 72 (groove formation operation) by the dry corrosion method.As the side etching method, can adopt reactive ion-etching.Perhaps can adopt and be referred to as ion beam milling method or sputter etching.These methods mainly are to impact by physical property to remove the heterogeneous body etching method that silicon substrate 90 forms the setting shape.Compare by the homogenieity etching method of generation chemical reactions such as etching solution with employing, side etching is less relatively.Therefore, can be roughly according to the shape of cover curtain to form darker groove or opening.As reacting gas, can use SiCl4, Cl2, CBrF3 etc.The adjustment of depth of groove for example can be undertaken by the reaction time.Fig. 9 b is the synoptic diagram after expression groove 72 forms.
Then, with the silicon substrate that forms groove 72 conversely, design suitable cover curtain inside, and remove the part (being used for the cover curtain operation that opening forms) of cover curtain split shed shape.The detailed content that the cover curtain forms is identical with the cover curtain operation that is used for groove formation.But the cover curtain that opening forms need carry out the location with respect to groove 72.This location can adopt suitable match pattern to wait to carry out.Fig. 9 c represents to be used for making in the inboard of groove 72 formed silicon substrates the state of cover curtain 94 after formation of opening.
Use this cover curtain, form opening (opening formation operation) by dry ecthing method.At this, also can adopt with groove and form the identical heterogeneous body etching method of operation.Opening size the situation of not being strict with, can adopt the wet etching that uses etching solution yet.Fig. 9 d is the synoptic diagram that forms opening 84,74 in the bottom of groove 72.Like this, by silicon substrate 90,, just can obtain mini probe guiding device by heterogeneous dry ecthing method.
As mentioned above, mini probe guiding device 70 that will be adopted on upside mini probe unit 42 and the mini probe guiding device 71 that is adopted on downside mini probe unit 44 describe as identical parts.Here, mini probe guiding device 70,71 is back to when combination, and each groove 72 is with the spacing configured in parallel of P/2=S2.That is to say that when making up as meander-like layout type mini probe unit 40, each miniature probe 50,51 is with the spacing configured in parallel of P/2=S2.Figure 10 is that each miniature probe 50,51 is not parallel, is that S2, banded data line 22 side spacings are S4 but make display panels 8 side spacings, thus the synoptic diagram of the mini probe unit 102,104 of diagonal configuration.At this moment, mini probe guiding device 106,108 is not for a kind of parts, and each groove is with the opposite setting that concerns, miniature probe 50,51 can be selected identical parts for use.
Display panels 8 sides form interval S 2, and banded data line 22 sides form interval S 4, and the reason that forms different spacing at two ends is as described below.That is, display panels 8 carries out thin-film package (TCP) and the formation commercialization on terminal extension 9 after the electric light inspection.Display panels 8 is via this TCP input/output signal, so in the inspection of the manufacturing process of this display panels 8, use this TCP to get final product.From then on viewpoint, the banded data line that banded data line 22 can adopt TCP to use.TCP is bonded on the terminal extension 9 of display panels 8 by pressure sintering.Because because the heat that is produced during hot pressing can make size extend to some extent, therefore formed pattern under the temperature when hot pressing connects should be suitable for the spacing of the terminal extension 9 of display panels 8.Thus, the terminal pitch S4 of the TCP during normal temperature is shorter than the interval S 2 of the terminal extension 9 of display panels 8.Therefore, the interval S 4 of banded data line 22 sides is shorter than the interval S 2 of the terminal extension 9 of display panels 8.
Like this, when the banded data line 22 that TCP is used is applied to display panels 8, need be made as different in display panels 8 sides with banded data line 22 sides the spacing of miniature probe 50,51.At this moment, by the cover curtain in the dry ecthing operation is adopted this kind method, therefore can adopt this kind method to be easy to produce mini probe guiding device 106,108.