JP2007273905A - Fabrication method for electronic component package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance a fabrication method for forming an electronic component package with a laminated board, having a step at a convex part mounting the electronic component, by adhering fully the board having the step with the other board. <P>SOLUTION: The fabrication method for the electronic component comprises, at least, a first process in which a second ceramic board 17 having an aperture is laminated and compressively bonded on a first ceramic board 16 after the first process; a second process of the compressive bonding in which a third ceramic board 18 having the aperture is laminated with the aperture of the second board 17 and the aperture of the third ceramic board 18, so as to form the step on the second ceramic board 17 after the second process; and a firing process in which a laminated body is fired consisting of the first ceramic board, the second ceramic board, and the third ceramic board. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method of manufacturing an electronic component package configured by sealing an electronic component such as a piezoelectric resonator including a crystal resonator in a package made of a ceramic substrate and then hermetically sealing the package with a lid. .

  For example, a piezoelectric vibrator device includes a package made of an insulating substrate such as ceramics and a metal lid that seals an opening of the package. Contained and configured. As electronic parts such as piezoelectric vibrator devices become smaller and thinner, demands for smaller, thinner, lower costs, and the like are increasing. For this reason, many surface mount type (SMD) types have been developed in recent years.

  FIG. 3 is a cross-sectional view illustrating a conventional configuration example of an electronic component sealing body configured by housing electronic components such as piezoelectric vibrator devices. In FIG. 3, the electronic component sealing body 110 has an IC chip 112 attached to the bottom surface of the recess 111 a of the package 111, one end of the piezoelectric vibrator 113 fixed and attached to the stepped portion 111 b, and a sealing material 115 on the package 111. A lid 114 is attached to hermetically seal the piezoelectric vibrator 113 and the IC chip 112. The package 111 is composed of a ceramic multilayer substrate. In the example illustrated in FIG. 3, the second substrate 117 and the third substrate 118 are formed on the first substrate 116 that forms the bottom surface of the package 111. The second substrate 117 and the third substrate 118 are each provided with openings, and the recesses 111 a are formed by the openings and the first substrate 116. Further, the opening of the second substrate 117 is formed smaller than the opening of the third substrate 118, and a part of the second substrate 117 is formed when the second substrate 117 and the third substrate 118 are stacked. Projecting toward the recess 111a, a step 111b is formed in the recess 111a, and the step 111b is used as a mounting location of the piezoelectric vibrator 113. Although not shown, electrodes are formed on the surface of the piezoelectric vibrator 113, and the piezoelectric vibrators are also formed on the surfaces of the first, second, and third substrates 116, 117, and 118 that form the package 111. A metallized layer for connecting the 113 and the IC chip 112 and attaching the lid 114 is applied as necessary. As a prior art related to such an electronic component sealing body, for example, Patent Document 1 is known.

4A and 4B are diagrams for explaining a conventional method of manufacturing a package for an electronic component encapsulant, wherein FIG. 4A is a cross-sectional view of the first, second, and third substrates, and FIG. It is sectional drawing which shows the process of laminating | stacking the 2nd and 3rd board | substrate, and pressure-bonding. The ceramic multilayer substrate is generally manufactured using a ceramic green sheet made of alumina or the like, and the first substrate 116, the second substrate 117, and the third substrate forming the package 111 of the conventional piezoelectric component sealing body 110 are formed. The substrate 118 is also formed of a ceramic green sheet. For the production of the package 111, first, a metallized layer is formed on the ceramic green sheets to be the first, second and third substrates 116, 117 and 118, if necessary, by screen printing or the like. Further, openings are formed in the second substrate 117 and the third substrate 118 by means such as punching. Next, the second substrate 117 and the third substrate 118 having openings are formed on the first substrate 116, and the stepped portion 111 b is formed by the respective openings of the second substrate 117 and the third substrate 118. Then, the substrates are pressed from above the stacked body by a press to pressure-bond the respective substrates. After that, the package 111 is completed by firing the substrate in a pressure-bonded state (see, for example, Patent Document 2).
Usually, in order to increase the productivity of the substrate (package) formed in this way, a plurality of substrates (packages) are formed on a ceramic green sheet and divided into individual substrates (packages) in the final process. It has produced.

Japanese Patent Laid-Open No. 2002-133504 JP 2004-356687 A

In the method of manufacturing the package of the electronic component sealing body in the prior art described in the background art, the first, second and third substrates 116, 117, and 118 constituting the package are respectively applied with pressure by a press machine. 4 are pressure-bonded from the lower surface of the first substrate 116 and the upper surface of the third substrate 117, as shown in FIG. No pressure is applied to the portion 111b. As described above, since no pressure is applied to the stepped portion 111b, the stepped portion 111b is not sufficiently pressure-bonded to the first substrate 116, and in the packaged state in which the stacked body in which each substrate is stacked is baked and completed. The step 111b was peeled off from the first substrate 116, and the tip of the step 111b was warped. When the piezoelectric vibrator 113 is mounted on the stepped portion 111b in this state, the piezoelectric vibrator 113 is along the surface of the stepped portion 111b where the warp has occurred, that is, the free end that is not fixed to the stepped portion 111b of the piezoelectric vibrator 113. Is mounted in an inclined state (on the lid 114 side), and the free end of the piezoelectric vibrator 113 may come into contact with the lid 114 to cause oscillation failure. In general, since the piezoelectric vibrator 113 is supplied and mounted in a horizontal state with respect to the stepped portion 111b where no warpage occurs, if the stepped portion 111b is warped, the piezoelectric vibration is generated. The child 113 contacts only the tip of the stepped portion 111b where the warp has occurred, and the piezoelectric vibrator 113 falls down to the free end side at that time, or is held in the stepped portion 111b once by the conductive adhesive or the like in the above state. However, since the piezoelectric vibrator 113 is held in an unstable state by the stepped portion 111b, there arises a problem that the piezoelectric vibrator 113 falls down in a later process.

  The present invention solves the above-described problem, and is a method for manufacturing an electronic component package formed of a laminated substrate and having a step portion in a recess for housing an electronic component, wherein the substrate on which the step portion is formed is another substrate. And a method of manufacturing a highly reliable electronic component package sufficiently bonded to each other.

  A method of manufacturing an electronic component package that is formed of a multilayer ceramic substrate laminate in which a plurality of ceramic substrates are stacked and that stores an electronic component, and has a stepped portion in the concave portion, at least on the first ceramic substrate A second step of laminating a second ceramic substrate having an opening and pressure bonding, and after the first step, a third ceramic substrate having an opening on the second ceramic substrate. A second step of laminating and press-bonding the stepped portion by the opening of the second substrate and the opening of the third ceramic substrate, and after the second step, the first step And a step of firing a laminate of the ceramic substrate, the second ceramic substrate, and the third ceramic substrate.

  In a manufacturing method of an electronic component package formed of a multilayer ceramic substrate laminate in which a plurality of ceramic substrates are stacked and housing an electronic component, and a stepped portion in the recessed portion, the substrate forming the stepped portion, and the step The substrate to be bonded to the substrate can apply the pressure required for bonding to the stepped portion in the bonding process, and the stepped portion and the substrate to be bonded to the stepped portion are sufficiently bonded to each other. The component package can be manufactured.

  A method of manufacturing an electronic component package that is formed of a multilayer ceramic substrate laminate in which a plurality of ceramic substrates are stacked and that stores an electronic component, and has a stepped portion in the concave portion, at least on the first ceramic substrate A second step of laminating a second ceramic substrate having an opening and pressure bonding, and after the first step, a third ceramic substrate having an opening on the second ceramic substrate. A second step of laminating and press-bonding the stepped portion by the opening of the second substrate and the opening of the third ceramic substrate, and after the second step, the first step And a step of firing a laminate of the ceramic substrate, the second ceramic substrate, and the third ceramic substrate.

  2A and 2B are views for explaining an electronic component sealing body using the electronic component package of the present invention, in which FIG. 2A is a front view with the lid removed, and FIG. A sectional drawing and (c) have shown BB sectional drawing of (a). The package 11 is composed of a ceramic multilayer substrate. A second substrate 17 and a third substrate 18 are laminated on a first substrate 16 that forms the bottom surface of the package 11, and the second substrate 17. The third substrate 18 has an opening, and the opening 11 and the first substrate 16 form a recess 11a. The opening of the second substrate 17 is formed smaller than the opening of the third substrate, and the step portion 11 b is formed by the opening of the second substrate 17 and the opening of the third substrate 18. Are stacked. The first substrate 16 is provided with a through hole 16a. The through hole 16 a is disposed at a position where a part of the through hole 16 a is shielded by the second substrate 17. Although not shown, a metallized layer for connecting the piezoelectric vibrator 13 to the electronic component sealing body 10 and a lid 114 are attached to the surfaces of the first, second and third substrates 16, 17 and 18. A metallization layer is provided as needed.

  The electronic component sealing body 10 is attached to the step portion 11 b of the package 11 with one end of the piezoelectric vibrator 13 fixed by a conductive adhesive 19, and the lid body 14 is attached to the upper portion of the package 11 with a sealing material 15. . After the piezoelectric vibrator 13 and the lid 14 are attached to the package 11, the inside of the package 11 is evacuated by an exhaust mechanism such as an exhaust chamber or a vacuum pump (not shown) through the through-hole 16a, and the inside of the package 11 is brought into a vacuum state. Thus, the through hole 16a is closed with the sealing material 20, and the inside of the package is hermetically sealed.

1A and 1B are views for explaining a method of manufacturing an electronic component package according to the present invention. FIG. 1A is a cross-sectional view of first, second, and third substrates, and FIG. Sectional drawing which shows the process of laminating | stacking and pressure-bonding the board | substrate of (1), (c) is sectional drawing which shows the process of laminating | stacking and pressure-bonding a 3rd board | substrate on the laminated | stacked 1st board | substrate and 2nd board | substrate. . First, a first substrate 16, a second substrate 17, and a third substrate 18 made of ceramic green sheets are prepared.
Next, a metallized layer (not shown) is formed on the surfaces of the prepared first, second and third substrates 16, 17, 18 as necessary by screen printing or the like. In addition, openings are formed in the second substrate 17 and the third substrate by means such as punching. (Fig. 1 (a))
Next, the 2nd board | substrate 17 which has an opening part is laminated | stacked on the 1st board | substrate 16, and the 1st board | substrate 16 and the 2nd board | substrate 17 are pressure-bonded with a press. (Fig. 1 (b))
Next, the third substrate 18 is laminated on the second substrate 17 in the laminate of the first substrate 16 and the second substrate 17 that are pressure-bonded in the previous step. Here, the third substrate 18 is laminated so that the stepped portion 11b is formed by the opening of the second substrate and the opening of the third substrate. The substrate thus laminated is pressurized by a press, and the laminate of the first substrate 16 and the second substrate 17 and the third substrate 18 are pressure bonded. (Fig. 1 (c))
Next, the laminated body in which the first, second and third substrates 16, 17 and 18 are pressure bonded is baked.
The package 11 in the present invention is manufactured through the above steps. In the manufacturing method according to the prior art, the first substrate 16 and the second substrate 17 are pressure-bonded in a state where no pressure is applied to the portion to be the stepped portion 11b of the second substrate 17, but in the present invention, First, by applying pressure bonding between the first substrate 16 and the second substrate 17, pressure can be applied to the entire surface of the second substrate 17, and the step portion 11 b is sufficiently connected to the first substrate 16. Pressure bonding can be performed. Therefore, even after the third substrate 18 is pressure-bonded and the laminated body of each substrate is fired, the stepped portion 11b does not warp and the piezoelectric vibrator can be mounted satisfactorily.

  Further, in the present embodiment, the example in which the size of the opening of the second substrate 17 and the size of the opening of the third substrate 18 are different from each other has been described. However, in practicing the present invention, the size of the opening of each substrate. Regardless of the thickness, it may be a laminated substrate in which at least three or more substrates are arranged so as to form a stepped portion.

As described above, the method of manufacturing the electronic component package of the present invention has been described by taking the electronic component sealing body in which the piezoelectric vibrator is housed as an example. However, the electronic component may be a semiconductor element or the like, and a plurality of ceramic green sheets may be provided on the ceramic green sheet. Of course, a substrate (package) portion may be formed and divided into individual substrates (packages) in the final process, and of course, changes may be made as appropriate without departing from the gist of the present invention. .

It is a figure for demonstrating the manufacturing method of the electronic component package of this invention, (a) is sectional drawing of a 1st, 2nd, and 3rd board | substrate, (b) is a 1st board | substrate and a 2nd board | substrate. Sectional drawing which shows the process of laminating | stacking and press-bonding, (c) is sectional drawing which shows the process of laminating | stacking and pressure-bonding a 3rd board | substrate on the laminated | stacked 1st board | substrate and 2nd board | substrate. It is a figure for demonstrating the electronic component sealing body using the electronic component package of this invention, (a) is a front view of the state which removed the cover body, (b) is AA sectional drawing, (c) is a figure. BB sectional drawing. It is a figure for demonstrating one example of the conventional structure of the electronic component sealing body comprised by accommodating electronic components, such as a piezoelectric device, and sectional drawing. It is a figure for demonstrating the manufacturing method of the package of the conventional electronic component sealing body, (a) is sectional drawing of a 1st, 2nd and 3rd board | substrate, (b) is 1st, 2nd and 1st. Sectional drawing which shows the process of laminating | stacking three board | substrates and carrying out pressure bonding.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electronic component sealing body 11 Package 11a Recessed part 11b Step part 13 Piezoelectric vibrator 14 Lid body 15 Sealing material 16 1st board | substrate 16a Through-hole 17 2nd board | substrate 18 3rd board | substrate 19 Conductive adhesive 20 Sealing material 110 Electronic component sealing body 111 Package 111a Recessed portion 111b Stepped portion 112 IC chip 113 Piezoelectric vibrator 114 Cover body 115 Sealing material 116 First substrate 117 Second substrate 118 Third substrate

Claims (1)

A method of manufacturing an electronic component package that is formed of a multilayer ceramic substrate laminate in which a plurality of ceramic substrates are stacked and that stores an electronic component, and has a stepped portion in the recess,
at least,
A first step of laminating a second ceramic substrate having an opening on the first ceramic substrate and pressure bonding;
After the first step, a third ceramic substrate having an opening is formed on the second ceramic substrate, and a step portion is formed by the opening of the second substrate and the opening of the third ceramic substrate. A second step of laminating and pressure bonding to form,
After the second step, firing the laminate of the first ceramic substrate, the second ceramic substrate, and the third ceramic substrate;
A method of manufacturing an electronic component package, comprising:

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