JP2006210675A - Package for housing electronic part and electronic device using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for housing an electronic part having the flat top face of a ceramic frame body, being capable of firmly mounting a cover body without an opening and having an excellent reliability on an airtight sealing and an electronic device. <P>SOLUTION: In the package 9 for housing the electronic part, a ceramic frame body 2 is mounted so as to surround a loading section 1a on the top face of a ceramic base body 1 with the loading section 1a for loading the electronic part 4, while the cover body 3 covering the electronic part 4 is fitted on the ceramic frame body 2. In the package 9 for housing the electronic part, the ceramic frame body 2 is formed of the laminates 6 of a plurality of ceramic layers 5 while low shrinkage layers 7 having a smaller shrinkage factor with a baking than ceramic green sheets as the ceramic layers 5 are interposed among the interlayers and/or the laminates 6 of the ceramic layers 5 and the ceramic base body 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component storage package for hermetically storing electronic components such as piezoelectric vibrators and semiconductor elements, and an electronic device using the same.

  Conventionally, electronic parts such as piezoelectric vibrators and semiconductor elements are housed in an electronic part housing package for mounting these electronic parts and are hermetically sealed with a lid to form an electronic device, such as a mobile phone or a computer. Used as a part of various electronic devices.

  What is widely used as such an electronic component storage package is a rectangular insulating base having an electronic component mounting portion on the upper surface, and an insulation attached so as to surround the mounting portion on the upper surface of the insulating base. A structure including a frame.

  The electronic component mounted on the mounting portion is led out to the outside of the mounting portion through a wiring conductor formed so as to be led out from the mounting portion to an outer surface such as an outer surface or a lower surface.

  Then, the electronic component is mounted on the mounting portion, and the electrodes of the electronic component are electrically connected to the wiring conductor exposed on the mounting portion, and the lid is attached to the upper surface of the insulating frame to close the recess, thereby insulating An electronic component is hermetically sealed in a container composed of a base, an insulating frame, and a lid to form an electronic device.

  Such an electronic component storage package is manufactured, for example, by a known ceramic green sheet lamination method when the insulating base and the insulating frame are made of a ceramic material such as an aluminum oxide sintered body.

  That is, first, a raw material powder such as aluminum oxide or glass is formed into a sheet shape together with an organic solvent and a binder to produce a plurality of ceramic green sheets (green sheets), and a predetermined green sheet is punched into a frame. A plurality of green sheets are produced.

  Next, after the green sheet is subjected to predetermined processing such as printing of a metal paste as a wiring conductor, a frame-shaped green sheet is laminated on the upper surface of a flat green sheet that has not been punched, and a concave portion is formed on the upper surface. To form a green sheet laminate.

Then, the green sheet laminate is pressed in the laminating direction to bring the green sheets into close contact with each other, and then fired at a temperature of about 1300 to 1600 ° C., whereby a ceramic frame ( The electronic component storage package is manufactured by attaching the insulating frame) by integral firing.
JP 2004-327856 A JP 2004-186616 A

  However, in such a conventional electronic component storage package, when pressure is applied to bring the green sheets into close contact with each other, the portion that is easily deformed inward or outward (lateral direction) is deformed so as to bulge in the lateral direction. The height of the green sheet laminate (ceramic frame) is lowered by the amount of the lateral expansion caused by this deformation, and as a result, the height of the upper surface of the ceramic frame is partially lowered. For example, if the ceramic frame is a square frame, the height is reduced at the sides, and if the height of the upper surface of the ceramic frame is partially reduced, the lid is firmly attached to the upper surface of the insulating frame without any gaps. It is difficult to attach the electronic component to the electronic component, leading to a drawback that the reliability of the hermetic sealing of the electronic component becomes insufficient.

  The present invention has been devised in view of the above-mentioned drawbacks, and its purpose is excellent in the reliability of hermetic sealing, in which the upper surface of the ceramic frame is flat and the lid can be firmly attached without any gap. Another object is to provide an electronic component storage package and an electronic device.

  An electronic component storage package according to the present invention has a ceramic frame attached to an upper surface of a ceramic substrate having a mounting portion for mounting an electronic component so as to surround the mounting portion. An electronic component storage package on which a lid that covers the electronic component is attached, wherein the ceramic frame is formed of a laminate of a plurality of ceramic layers, and / or between the ceramic layers. A low-shrinkage layer having a smaller shrinkage rate due to firing is interposed between the laminate and the ceramic substrate as compared with the ceramic green sheet serving as the ceramic layer.

  The electronic component storage package of the present invention is characterized in that the low shrinkage layer is made of a conductor material having the same quality as the wiring conductor formed on the surface of the ceramic substrate.

  Furthermore, the electronic component storage package of the present invention is characterized in that the outer shape of the ceramic frame is formed in a square shape, and a non-intervening region of the low shrinkage layer is provided at a corner portion of the ceramic frame. is there.

  Furthermore, in the electronic component storage package of the present invention, the end portion of the low shrinkage layer located on the inner peripheral side of the ceramic frame is positioned outward from the inner peripheral surface of the ceramic frame, The ceramic layers located above and below the low shrinkage layer or the ceramic layers and the ceramic substrate are bonded to each other inward from the end portion of the low shrinkage layer.

  Furthermore, in the electronic component storage package of the present invention, an end portion of the low shrinkage layer located on the outer peripheral side of the ceramic frame body is positioned inward of the outer peripheral surface of the ceramic frame body, The ceramic layers positioned above and below the low shrinkage layer or the ceramic layer and the ceramic substrate are bonded to each other outside the end portion of the shrinkage layer.

  In the electronic device of the present invention, the electronic component is mounted on the mounting portion of the electronic component storage package described above, and the lid is attached to the ceramic frame so as to hermetically seal the electronic component. It is characterized by.

  According to the electronic component storage package of the present invention, the ceramic frame is formed of a laminate of a plurality of ceramic layers, and the ceramic that serves as the ceramic layer between the ceramic layers and / or between the laminate and the ceramic substrate. Since a low shrinkage layer with a smaller shrinkage ratio due to firing is interposed than a green sheet, a frame-shaped ceramic green sheet (ceramic frame) according to the shrinkage difference between the low shrinkage layer and the ceramic green sheet during firing. The stress is applied upward to the body), and the deformation (dent) generated in the frame-shaped ceramic green sheet is corrected by this stress, and the variation in the height of the ceramic frame is suppressed. Moreover, the upper surface of a ceramic frame can be made high in the part where a low shrinkage layer intervenes. As a result, the lid can be firmly attached to the upper surface of the ceramic frame without any gap, and the reliability of hermetic sealing can be improved.

  Further, according to the electronic component storage package of the present invention, the wiring conductor is formed by forming the low shrinkage layer with the same conductive material as the wiring conductor formed on the surface of the ceramic substrate. However, it is easy to predict shrinkage at the time of firing by the low shrinkage layer, control of the stress for returning the warp of the ceramic frame body can be easily performed, and good productivity can be secured.

  Further, according to the electronic component storage package of the present invention, the ceramic frame body has a rectangular outer shape, and the non-intervening region of the low shrinkage layer is provided at the corner portion of the ceramic frame body. In particular, a stress that can more reliably correct the dent can be generated in the side portion of the quadrangular ceramic frame that is easily generated, and the reliability can be further improved.

  Still further, according to the electronic component storage package of the present invention, the end portion of the low shrinkage layer located on the inner peripheral side of the ceramic frame is positioned outward from the inner peripheral surface of the ceramic frame, The ceramic layers positioned on the upper and lower sides of the low-shrinkage layer or the ceramic layer and the ceramic base are bonded to each other on the inner peripheral side of the ceramic frame body. In other words, the ceramic materials are directly bonded to each other, and the layers between the ceramic layers and between the ceramic layer and the ceramic base are more firmly bonded, so that the electronic component storage package is further excellent in airtight sealing reliability. Can do.

  Furthermore, according to the electronic component storage package of the present invention, the end of the low shrinkage layer located on the outer peripheral side of the ceramic frame is positioned inward of the outer peripheral surface of the ceramic frame, The ceramic layers or ceramic layers and ceramic bases that are positioned on the upper and lower sides of the low-shrinkage layer on the outer side of the part are bonded to each other on the outer peripheral side of the ceramic frame body. They are directly bonded to each other, and the layers between the ceramic layers and between the ceramic layer and the ceramic base are more firmly bonded, so that it is possible to provide an electronic component storage package with further excellent hermetic sealing reliability. .

  According to the electronic device of the present invention, the electronic component is mounted on the mounting portion of the electronic component storage package having the above-described configuration, and the lid is attached so as to hermetically seal the electronic component on the ceramic frame. Thus, an electronic device excellent in the reliability of hermetic sealing can be configured.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a cross-sectional view showing an embodiment of an electronic component storage package and an electronic device according to the present invention. In the figure, 1 is a ceramic substrate, 2 is a ceramic frame, and 3 is a lid. The ceramic base 1, the ceramic frame 2, and the lid 3 mainly constitute an electronic component storage package 9. The electronic component 4 is mounted on the electronic component storage package 9 and the electronic component 4 is hermetically sealed. Thus, the electronic device 10 is configured.

  The ceramic substrate 1 has an electronic component mounting portion 1a on its upper surface, and is formed of a ceramic sintered body such as an aluminum oxide sintered body, a glass ceramic, an aluminum nitride sintered body, or a mullite sintered body.

  A ceramic frame 2 is attached to the upper surface of the ceramic substrate 1 so as to surround the mounting portion 1a. The ceramic frame body 2 functions as a side wall for hermetically sealing the electronic component 4 mounted on the mounting portion 1a. The lid 3 is bonded to the upper surface of the ceramic frame body 2 to cover the mounting portion. The electronic component 4 is hermetically sealed inside the container composed of the frame body 2 and the lid body 3.

  The ceramic frame 2 is formed of the same ceramic material as the ceramic substrate 1. Considering the strength and productivity of the bond between the ceramic substrate 1 and the ceramic frame 2, the ceramic substrate 1 and the ceramic frame 2 are preferably formed of the same ceramic material.

  The ceramic substrate 1 and the ceramic frame 2 are formed by cutting a ceramic green sheet formed by forming a ceramic powder into a sheet shape together with an organic solvent and a binder into a predetermined ceramic layer size and shape, laminating them, and firing them. Has been.

  In the electronic component storage package 9 of the present embodiment, the ceramic frame 2 is formed by a laminated body of a plurality of ceramic layers 5, and between the ceramic layers 5 and / or the laminated body 6 and the ceramic substrate 1. In between, a low shrinkage layer 7 having a smaller shrinkage ratio due to firing than a ceramic green sheet to be the ceramic layer 5 is interposed.

  With this configuration, during firing, a stress acts on the laminate in accordance with the difference in shrinkage between the low-shrinkage layer 7 and the ceramic green sheet, and this stress causes deformation in the laminate. The (dent) is corrected, and variations in the height of the ceramic frame 2 are suppressed. Moreover, the upper surface of the ceramic frame 2 can be made high in the portion where the low shrinkage layer 7 is interposed.

  As a result, the lid 3 can be firmly attached to the upper surface of the ceramic frame 2 without a gap, and the reliability of hermetic sealing can be improved.

  Here, the low shrinkage layer 7 is formed of a conductor material having a lower shrinkage rate than the ceramic green sheet to be the ceramic layer 5, an unfired ceramic material, or the like. In order to make the shrinkage rate of the low shrinkage layer 7 lower than that of the ceramic green sheet used as the ceramic layer 5, the filling rate of the conductor forming the low shrinkage layer 7 and the powder of the ceramic material is set. Then, means such as making the filling rate of the ceramic powder forming the ceramic green sheet to be the ceramic layer 5 higher is used.

  The shrinkage rate of the low shrinkage layer 7 is preferably 98% to 95% with respect to the shrinkage rate of the ceramic green sheet. If it exceeds 98%, the low shrinkage layer 7 shrinks to the same extent as the ceramic green sheet, and depending on conditions such as the temperature and atmosphere during firing, it may be difficult to flatten the upper surface. If it is less than 95%, the shrinkage difference between the low-shrinkage layer 7 and the ceramic green sheet tends to be too large, and the laminate is pulled to the low-shrinkage layer 7 side (upper side), and the ceramic at the site where the low-shrinkage layer 7 is interposed. This is because there is a risk that the height of the frame body 2 is increased, and on the contrary, it is difficult to firmly attach the lid body 3 to the upper surface of the ceramic frame body 2.

  Note that the low shrinkage layer 7 may be formed of one layer or a plurality of layers. This is because the number of layers of the low shrinkage layer 7 is not particularly limited as long as the difference in shrinkage between the low shrinkage layer 7 and the ceramic green sheet occurs appropriately.

  Further, when the low shrinkage layer 7 is interposed between a plurality of layers, it is preferable to arrange the low shrinkage layers 7 so as to overlap each other in a plan view. This is because the stresses of the plurality of low shrinkage layers 7 can be collected and shown more prominently.

  Next, a method for manufacturing such an electronic component storage package will be described.

  First, a suitable organic binder and solvent are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a mud, which is made into a sheet by a conventionally known doctor blade method. Prepare a ceramic green sheet.

  Next, a predetermined ceramic green sheet is punched to form a plurality of frame-shaped ceramic green sheets. The punching process is performed using a die for punching a predetermined pattern.

  Next, a metal paste prepared by adding and kneading an organic solvent and a binder to a metal powder such as tungsten is printed and applied along the outer side of the surface of the frame-shaped ceramic green sheet. As the metal paste, a low-shrinkage that has a smaller shrinkage during firing than the ceramic green sheet is used. This metal paste becomes the low shrinkage layer 7.

  Next, a frame-shaped ceramic green sheet is laminated on the upper surface of a flat ceramic green sheet that has not been punched.

  The flat ceramic green sheet becomes the ceramic substrate 1 by firing, and the central portion of the upper surface becomes the electronic component mounting portion 1a. A plurality of frame-shaped ceramic green sheets are laminated to form a green laminate, and are stacked on the upper surface of the flat ceramic green sheet so as to surround the mounting portion 1a.

  The laminated ceramic green sheets are pressed to bring the ceramic green sheets into close contact with each other and baked, whereby the ceramic base 1 and the ceramic frame 2 of the electronic component storage package are manufactured.

  During this firing, a stress acts on the frame-shaped ceramic green sheet (laminated body) in accordance with the difference in shrinkage between the metal paste (low shrinkage layer 7) and the ceramic green sheet. The deformation (dent) occurring in the laminated body is corrected, and variations in the height of the ceramic frame are suppressed.

  The low-shrinkage layer 7 described above is preferably formed of the same conductive material as the wiring conductor 8 formed on the surface of the ceramic substrate 1.

  Even if the wiring conductor 8 is formed by forming the low shrinkage layer 7 with the same conductive material as that of the wiring conductor 8 formed on the surface of the ceramic substrate 1, firing by the low shrinkage layer 7 is performed. The shrinkage at the time can be easily predicted, the stress for returning the warp of the ceramic frame 2 can be easily controlled, and the productivity can be secured satisfactorily.

  Furthermore, it is preferable that the above-described outer shape of the ceramic frame body 2 is rectangular, and a non-intervening region (not shown) of the low shrinkage layer 7 is provided at the corner portion of the ceramic frame body 2.

  In order to efficiently and hermetically seal square plate-like electronic components such as semiconductor elements and piezoelectric vibrators, the ceramic frame 2 is usually formed in a square frame shape, and its outer shape is a square shape. In such a case, by providing a non-intervening region of the low shrinkage layer 7 at the corner portion of the ceramic frame body 2, the side portion of the rectangular ceramic frame body is more likely to have a (dent) of the ceramic frame body. The stress that reliably corrects the (dent) can be generated, and the reliability can be further improved.

  Further, the end portion of the low shrinkage layer 7 located on the inner peripheral side of the ceramic frame body 2 described above is positioned outside the inner peripheral surface of the ceramic frame body 2 and then the end portion of the low shrinkage layer 7. However, it is preferable that the ceramic layers 5 positioned on the upper and lower sides of the low shrinkage layer 7 or the ceramic layer 5 and the ceramic substrate 1 are bonded to each other.

  In this case, the ceramic layers 5 or the ceramic layers 1 and the ceramic substrate 1, that is, the ceramic materials are directly bonded to each other on the inner peripheral side of the ceramic frame 2 so that the layers of the ceramic layers 5 and the ceramic layers 5 and the ceramic substrate are combined. Thus, the electronic component storage package 9 can be obtained which is more firmly coupled to 1 and has excellent hermetic sealing reliability.

  On the other hand, the end of the low shrinkage layer 7 located on the outer peripheral side of the ceramic frame 2 is positioned inward of the outer peripheral surface of the ceramic frame 2 and is lower outside than the end of the low shrinkage layer 7. The ceramic layers 5 positioned above and below the shrink layer 7 or the ceramic layer 5 and the ceramic substrate 1 may be combined.

  In this case, the ceramic layers 5 or the ceramic layers 5 and the ceramic substrate 1, that is, the ceramic materials are directly bonded to each other on the outer peripheral side of the ceramic frame body 2, so that the layers of the ceramic layers 5 and the ceramic layers 5 and the ceramic substrates 1 are combined. The electronic component storage package 9 can be made more firmly coupled to each other and further excellent in hermetic sealing reliability.

  By mounting the electronic component 4 on the mounting portion 1a of the electronic component storing package 9 as described above and attaching the lid 3 so as to hermetically seal the electronic component 4 on the ceramic frame 2, An electronic device 10 is configured.

  According to the electronic device 10, since the electronic component 4 is formed by sealing the electronic component storage package 9 of the present invention, an electronic device having excellent reliability such as airtight sealing can be obtained.

  The lid 3 is made of a metal material such as an iron-nickel alloy or an iron-nickel-cobalt alloy, a ceramic material such as an aluminum oxide sintered body, glass, a resin, or the like.

  If the lid 3 is made of, for example, an iron-nickel-cobalt alloy, the lid 3 is produced by subjecting a plate material of iron-nickel-cobalt to known metal processing such as press punching and processing into a predetermined size and shape. Is done.

  The lid 3 is attached to the upper surface of the insulating frame 2 by a joining method such as a brazing material, an adhesive, or a joining material such as glass or a welding method.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

It is sectional drawing which shows an example of embodiment of the electronic component storage package and electronic device of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Ceramic base body 2 ... Ceramic frame 3 ... Lid body 4 ... Electronic component 5 ... Ceramic layer 6 ... Laminated body 7 ... Low shrinkage Layer 8 ... Wiring conductor 9 ... Electronic component storage package 10 ... Electronic device

Claims (6)

A ceramic frame is attached to an upper surface of a ceramic base having a mounting portion for mounting an electronic component so as to surround the mounting portion, and a lid that covers the electronic component is mounted on the ceramic frame. An electronic component storage package adapted to be attached,
The ceramic frame is formed of a laminate of a plurality of ceramic layers, and is fired as compared to a ceramic green sheet serving as the ceramic layer between the ceramic layers and / or between the laminate and the ceramic base. A package for storing electronic components, characterized in that a low shrinkage layer with a small shrinkage rate is interposed. 2. The electronic component storage package according to claim 1, wherein the low shrinkage layer is made of a conductive material having the same quality as a wiring conductor formed on the surface of the ceramic substrate. 3. The electronic component storage device according to claim 1, wherein the outer shape of the ceramic frame is rectangular, and a non-intervening region of the low shrinkage layer is provided at a corner portion of the ceramic frame. package. The end portion of the low shrinkage layer located on the inner peripheral side of the ceramic frame body is positioned outward from the inner peripheral surface of the ceramic frame body, and the end portion of the low shrinkage layer is inward from the end portion of the low shrinkage layer. 4. The electronic component storage package according to claim 1, wherein ceramic layers positioned above and below the low shrinkage layer or a ceramic layer and a ceramic base are bonded to each other. An end portion of the low shrinkage layer located on the outer peripheral side of the ceramic frame body is positioned inward from the outer peripheral surface of the ceramic frame body, and the low shrinkage layer is located outward from the end portion of the low shrinkage layer. 5. The electronic component storage package according to claim 1, wherein ceramic layers positioned above and below the layers or a ceramic layer and a ceramic base are bonded to each other. An electronic component is mounted on the mounting portion of the electronic component storage package according to any one of claims 1 to 5, and the lid is removed so that the electronic component is hermetically sealed on the ceramic frame. An electronic device.

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