JP2007273643A - Wafer cassette and wafer storing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely insert a wafer 2 into a desired groove 3. <P>SOLUTION: The wafer 2 is pushed up by the end of a turning arm 13 on one side of an L-shaped arm 12 by turning the L-shaped arm 12. Using the pushed-up wafer 2 as a standard for inserting wafers into desired grooves 3, the wafers 2 are surely inserted into desired grooves 3. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a wafer cassette for storing a wafer in a semiconductor manufacturing process and a method for storing a wafer in the wafer cassette.

  Currently, in the manufacture of semiconductors and the like, a plurality of wafers are transferred in a state of being accommodated in a wafer cassette and subjected to necessary processing. 2. Description of the Related Art Conventionally, a wafer cassette has a shape in which a pair of side plates in which a plurality of grooves are formed is connected at the bottom, and a structure in which the grooves are arranged in a stacked state is known (see Patent Document 1, Patent Document 2, etc.). ). In a conventionally known wafer cassette, a plurality of wafers are held in a stacked state by inserting the wafers between opposed grooves.

  In semiconductor manufacturing processes, wafers are processed in various atmospheres, such as heat treatment, cleaning, film formation, and etching. After a wafer cassette is transferred to a desired location, a robot arm or the like is used. The wafer is set in the processing apparatus or the like. For this reason, the width of the groove into which the wafer is inserted is set so that there is a margin with respect to the thickness of the wafer, and the robot arm or the like is easily inserted.

  Conventionally known wafer cassettes are set in a shape with a margin in the groove width, so there is a possibility that the wafer cassette may be inserted into a shifted groove when the wafer is inserted between the opposing grooves by a human manual operation. . In particular, since the wafer is generally disk-shaped, if it is not inserted more than half, the outer peripheral edge portion is not inserted into the opposing groove, so that it is likely that the wafer is easily inserted into the shifted grooves. In order to facilitate the insertion of a wafer, a wafer cassette in which a slot number is assigned to a groove portion is also known. However, since the slot number is the same as the color on the main body side and is difficult to see, the current situation is that it cannot be said to be a means for reliably inserting the wafer into the grooves facing each other.

Japanese Patent Laid-Open No. 5-175320 JP 2002-57201 A

  The present invention has been made in view of the above situation, and an object of the present invention is to provide a wafer cassette and a wafer accommodation method capable of reliably inserting a wafer into a desired accommodation portion.

  In order to achieve the above object, a wafer cassette according to a first aspect of the present invention is a wafer cassette in which a plurality of wafers are accommodated in a stacked state, and a receiving portion into which a peripheral edge of the wafer is inserted while being guided by a groove is stacked. A plurality of positioning means are provided, and positioning means for inserting the wafer into a desired accommodating portion is provided.

  According to the first aspect of the present invention, the wafer can be reliably inserted into the desired accommodating portion by guiding the wafer to the desired accommodating portion by the positioning means.

  A wafer cassette according to a second aspect of the present invention is the wafer cassette according to the first aspect, wherein the wafer moving means for moving the wafer inserted in the accommodating portion adjacent to the desired accommodating portion in the anti-insertion direction. The positioning means is configured by using a wafer in a state moved by the wafer moving means as a reference for insertion into a desired accommodating portion.

  In the present invention according to claim 2, by moving the wafer inserted in the adjacent accommodating portion by the wafer moving means, the moved wafer is guided to the reference for inserting the wafer into the desired accommodating portion. Thus, the wafer can be surely inserted into the desired accommodating portion.

  The wafer cassette of the present invention according to claim 3 is the wafer cassette according to claim 2, wherein the wafer moving means is supported by an L-shaped L-shaped arm so that the L-shaped arm is rotatable. Thus, the wafer is moved by the tip of the rotating arm on one side pushing the wafer.

  In the present invention according to claim 3, the wafer can be easily moved by rotating the L-shaped arm.

  The wafer cassette of the present invention according to claim 4 is the wafer cassette according to claim 2, wherein the wafer moving means is supported so that the arm can reciprocate in the direction along the insertion direction, and the anti-insertion direction of the arm The wafer is moved by pushing the wafer by the arm by moving to the position.

  In the present invention according to claim 4, the wafer can be easily moved by reciprocating the arm.

  The wafer cassette of the present invention according to claim 5 is the wafer cassette according to any one of claims 2 to 4, wherein the wafer moving means is supported so as to be capable of reciprocating in the stacking direction of the housing portion. It is characterized by.

  In the present invention according to claim 5, since the wafer moving means is movable in the stacking direction of the storage section, the wafer stored in an arbitrary position can be moved.

  A wafer cassette according to a sixth aspect of the present invention is the wafer cassette according to any one of the second to fifth aspects, further comprising a stopper for preventing the wafer from coming off when the wafer moving means is not operated. It is characterized by that.

  According to the sixth aspect of the present invention, when a wafer in which the wafer moving means is not operated is accommodated, the stopper is prevented from coming off and the wafer can be reliably accommodated.

  According to a seventh aspect of the present invention, there is provided the wafer cassette according to the first aspect, wherein the positioning means is provided on the inlet side of the accommodating portion so as to be movable in the stacking direction of the accommodating portions, and the desired accommodating portion. And a guide that serves as a reference for inserting the wafer into the desired accommodation portion by moving the entrance of the accommodation portion adjacent to the desired accommodation portion.

  In the present invention according to claim 7, the entrance of the accommodating portion adjacent to the desired accommodating portion is blocked by the guide, the wafer is guided to the desired accommodating portion, and the wafer can be reliably inserted into the desired accommodating portion. it can.

  According to an eighth aspect of the present invention, there is provided a wafer cassette according to the first aspect of the present invention, wherein each of the housing portions is constituted by an independent case, and each case is supported so as to be movable in the wafer insertion direction. The positioning means is configured by the case that has been moved into a desired accommodating portion.

  In the present invention according to claim 8, by moving an independent case, the moved case becomes a desired accommodating portion, and the wafer can be surely inserted into the desired accommodating portion.

  A wafer cassette according to a ninth aspect of the present invention is the wafer cassette according to any one of the first to eighth aspects, wherein a slot number is assigned to a main body of the housing portion, and a slot is provided with respect to a base of the main body. It is characterized by different numbers.

  According to the ninth aspect of the present invention, the wafer storage position can be easily recognized by the slot number having a color different from that of the base.

  A wafer cassette according to a tenth aspect of the present invention is the wafer cassette according to any one of the first to eighth aspects, wherein a slot number is assigned to the main body of the housing portion, and the slot number is attached to a base of the main body. On the other hand, it is marked in an uneven state.

  According to the tenth aspect of the present invention, it is possible to easily recognize the wafer accommodation position by the slot number marked in a concavo-convex state with respect to the base.

  According to an eleventh aspect of the present invention, there is provided a wafer accommodating method of the present invention, wherein a desired accommodating portion is inserted when a wafer is inserted into a wafer cassette in which a plurality of accommodating portions for individually accommodating wafers are arranged in a stacked state. A desired accommodation portion is specified at a position adjacent to the wafer, and a wafer is inserted into the desired accommodation portion.

  According to the eleventh aspect of the present invention, the wafer can be guided by specifying the desired accommodating portion at a position adjacent to the desired accommodating portion, and the wafer can be reliably inserted into the desired accommodating portion.

  The wafer cassette and the wafer accommodation method of the present invention can reliably insert a wafer into a desired accommodation portion.

  A first embodiment of the present invention will be described.

  FIG. 1 is a schematic view of a wafer cassette according to a first embodiment of the present invention, FIG. 2 is a plan view of the wafer cassette, FIG. 3 is a detailed view of a main part in FIG. 2, and FIG. FIG. 5 shows a cross section in a state where the wafer is moving. 6 and 7 show other embodiments of the positioning means.

  As shown in FIGS. 1 and 2, the wafer cassette 11 includes a box-shaped cassette body 1. The cassette body 1 is formed in a state where the upper surface and both end faces are open, and a groove portion 3 as a housing portion for housing the wafer 2 is provided inside the side wall 5 of the cassette body 1 so as to face each other. The groove portion 3 is provided in a state orthogonal to the upper surface, and the periphery of the wafer 2 is guided by the groove portion 3 so that the wafer 2 is inserted from the upper surface. A plurality of groove portions 3 are provided so that the wafers 2 are accommodated in a laminated state. When the wafers 2 are accommodated in the groove portions 3, a large number of wafers 2 are laminated on the wafer cassette 11 in a state parallel to both end faces. The

  As shown in FIG. 3, in the wafer cassette 11, a number that is a multiple of 5 is placed in a predetermined position such as 5, 10, 15, 20,. The displayed slot number 4 is assigned, and the slot number 4 is different in color from the base of the cassette body 1. By making the color of slot number 4 different, the accommodation position of the wafer 2 can be easily recognized. In addition, when making the color of slot number 4 different, the number of a different color can be colored, or the sticker of a different color number can be stuck. Further, it is possible to mark the slot number 4 in an uneven state, and it is also possible to mark the slot number 4 in an uneven state and to change the color.

  The wafer cassette 11 described above is provided with positioning means for inserting the wafer 2 into a desired groove 3 (accommodating portion). The positioning means of the present embodiment moves the wafer 2 accommodated in the accommodating part adjacent to the desired accommodating part (wafer moving means), and the moving wafer 2 is used as a reference for insertion into the desired accommodating part. Is done.

  That is, as shown in FIGS. 1, 4 and 5, an L-shaped L-shaped arm 12 is rotatably supported on the side wall 5 of the cassette body 1 of the wafer cassette 11, and as shown in FIG. By rotating the L-shaped arm 12, the wafer 2 is pushed upward by the tip of the one-side rotating arm 13, and the wafer 2 can be moved upward. The L-shaped arm 12 is supported by a slide mechanism 14 so as to be movable in the stacking direction of the wafer 2, and the L-shaped arm 12 of the wafer 2 that is accommodated in an arbitrary position, that is, an accommodating part adjacent to a desired accommodating part. It can be moved directly underneath. The support of the rotating end of the L-shaped arm 12 can be easily moved by using a resin guide rail or the like excellent in lubricity.

  When the wafer cassette 11 described above needs to be placed horizontally and horizontally, the wafer cassette 11 is placed on a tilting table in a state where the wafer 2 does not pop out when placed, and the tilt of the tilting table is set to a predetermined state after being placed. It is preferable to operate in a state where the upper surface is placed horizontally and horizontally. Thereby, when the wafer cassette 11 is moved and placed, the wafer 2 accommodated therein does not jump out.

  When accommodating the first wafer 2 in the wafer cassette 11 described above, the peripheral edge of the wafer 2 is inserted into a desired facing groove 3 while confirming the slot number 4. When the next wafer 2 is accommodated, the L-shaped arm 12 is moved directly below the already accommodated wafer 2 (see FIG. 4), and the L-shaped arm 12 is rotated as shown in FIG. By rotating the L-shaped arm 12, the wafer 2 is pushed upward by the tip of the rotating arm 13, and the wafer 2 moves upward. As a result, the wafer 2 is projected from the upper surface, and the wafer 2 is used as a reference for insertion into a desired accommodating portion, and a new wafer 2 can be reliably inserted into the adjacent accommodating portion.

  In other words, even if the groove width is set to a shape with a margin, or even if the wafer 2 is not inserted into the opposing groove portion 3 unless it is inserted in a disc shape more than half, the groove portion 3 that has been displaced is The wafer 2 is not inserted, and the disk-shaped wafer 2 can be reliably inserted into the opposing groove portions 3.

  Although not shown, a stopper is provided on the upper surface side of the cassette body 1 to prevent the wafer 2 that is accommodated in the accommodating portion and does not need to be moved out.

  As positioning means (wafer moving means), as shown in FIGS. 6 and 7, one end of a rod-like arm 15 is supported so as to be reciprocally movable in a direction along the insertion direction of the wafer 2 (vertical direction in the figure). However, the wafer 2 can be pushed upward by the tip of the arm 15. In this case, one end of the arm 15 is supported on the side wall 5 by the slide mechanism 16 and is supported by the vertical guide 17 so as to be reciprocally movable in the vertical direction at the position of each accommodating portion.

  In addition, as positioning means, a lid member or a long member that is movable in the stacking direction of the wafer 2 is provided on the upper surface portion that is the entrance side of the accommodating portion, and the lid member or the long member is moved so as to be blocked. It is also possible to use the removed accommodating portion as a reference for inserting the wafer 2 as an adjacent portion of the desired accommodating portion.

  A second embodiment of the present invention will be described.

  FIG. 8 shows a schematic situation of the wafer cassette according to the second embodiment of the present invention, FIG. 9 shows a cross section in a state where the wafer is accommodated, and FIG. 10 shows a cross section in a state where the wafer is moving. .

  As shown in FIG. 8, the wafer cassette 21 includes a box-shaped cassette body 22. The cassette body 22 is formed in a state where the upper surface and both end faces are open, and a groove case 24 as a case for housing the wafer 25 is housed independently inside the side wall 23 of the cassette body 22. The groove case 24 is a case having a U-shaped groove portion, and a large number of groove cases 24 are stacked so that the wafer 25 is accommodated in a stacked state. Each groove case 24 is individually reciprocable in the vertical direction (the insertion direction of the wafer 25). By inserting the wafers 25 into the respective groove cases 24, a large number of wafers 25 are stacked in a state parallel to both end faces.

  Although not shown, the slot numbers are assigned to the wafer cassettes 21 corresponding to the respective groove cases 24 as in the first embodiment.

  The wafer cassette 21 described above is provided with positioning means for inserting the wafer 25 into a desired groove case 24 (accommodating portion). As shown in FIGS. 8 to 10, the positioning means of this embodiment is used as a reference for inserting a wafer 25 by moving a desired groove case 24. That is, a lever 27 penetrating the groove 26 of the side wall 23 is fixed to the side portion of each groove case 24, and the desired groove is formed by moving the lever 27 of the desired groove case 24 up and down along the groove 26 of the side wall 23. Only the case 24 can be moved upward.

  When the wafer 25 is accommodated in the wafer cassette 21 described above, only the desired groove case 24 moves upward by moving the lever 27 of the desired groove case 24 along the groove 26 (see FIG. 10). . Accordingly, only the groove case 24 into which the wafer 25 is inserted protrudes from the upper surface, and the wafer 25 can be reliably inserted as a reference for insertion.

  In other words, even if the groove width is set to have a marginal shape, or even if the wafer 25 has a disc shape and the outer edge is not inserted into the groove case 24 if it is not inserted more than half of the groove width, The wafer 25 is not inserted, and the disc-shaped wafer 25 can be reliably inserted into one groove case 24.

  As a means for moving the groove case 24, a means for pushing up the groove case 24 from the bottom surface can be provided. In this case, it is possible to provide a means for pushing up each groove case 24 or a means for appropriately moving to a desired position of the bottom surface of the groove case 24.

  INDUSTRIAL APPLICABILITY The present invention can be used in the industrial field of a wafer cassette for storing a wafer in a semiconductor manufacturing process and a method for storing a wafer in a wafer cassette.

It is a schematic block diagram of the wafer cassette which concerns on the example of 1st Embodiment of this invention. It is a top view of a wafer cassette. It is a principal part enlarged view in FIG. It is sectional drawing of the state in which the wafer was accommodated. It is sectional drawing of the state which the wafer is moving. It is sectional drawing of the state in which the wafer was accommodated in the other embodiment. It is sectional drawing of the state which the wafer is moving in the other embodiment. It is a schematic block diagram of the wafer cassette which concerns on the example of 2nd Embodiment of this invention. It is sectional drawing of the state in which the wafer was accommodated. It is sectional drawing of the state which the wafer is moving.

Explanation of symbols

1, 22 Cassette body 2, 25 Wafer 3 Groove 4 Slot number 5, 23 Side wall 11, 21 Wafer cassette 12 L-shaped arm 13 Rotating arm 14, 16 Slide mechanism 15 Arm 17 Vertical guide 24 Groove case

Claims (11)

  A wafer cassette for storing a plurality of wafers in a stacked state, and a positioning means for inserting a wafer into a desired storage portion, wherein a plurality of storing portions are provided in a stacked state in which the peripheral edge of the wafer is guided by a groove. A wafer cassette comprising: The wafer cassette according to claim 1,
Wafer moving means for moving the wafer inserted in the accommodating section adjacent to the desired accommodating section in the anti-insertion direction is provided, and the wafer moved by the wafer moving means is used as a reference for insertion into the desired accommodating section. A wafer cassette comprising a positioning means. The wafer cassette according to claim 2,
The wafer moving means is characterized in that an L-shaped L-shaped arm is rotatably supported, and the wafer is moved by the tip of the rotating arm on one side pushing the wafer by the rotation of the L-shaped arm. cassette. The wafer cassette according to claim 2,
A wafer cassette characterized in that the wafer moving means is supported so that the arm can reciprocate in a direction along the insertion direction, and the wafer is moved by pushing the wafer by the arm moving in the anti-insertion direction. In the wafer cassette in any one of Claims 2-4,
A wafer cassette characterized in that a wafer moving means is supported so as to be reciprocally movable in the stacking direction of the accommodating portion. In the wafer cassette in any one of Claims 2-5,
A wafer cassette comprising a stopper for preventing the wafer from coming off when the wafer moving means is not operated. The wafer cassette according to claim 1,
The positioning means is provided on the inlet side of the accommodating portion so as to be movable in the stacking direction of the accommodating portions, and moves the wafer into a state in which the inlet of the accommodating portion adjacent to the desired accommodating portion is closed, thereby inserting the wafer into the desired accommodating portion. A wafer cassette comprising a reference guide. The wafer cassette according to claim 1,
Each housing part is composed of an independent case, each case is supported so as to be movable in the wafer insertion direction, and a positioning means is constructed by making the moved case a desired housing part. A wafer cassette characterized by In the wafer cassette in any one of Claims 1-8,
A wafer cassette, characterized in that a slot number is assigned to a main body of a receiving portion, and a color of the slot number is different from a base of the main body. In the wafer cassette in any one of Claims 1-8,
A wafer cassette characterized in that a slot number is assigned to the main body of the accommodating portion, and the slot number is marked in an uneven state with respect to a base of the main body. When a wafer is inserted into a wafer cassette in which a plurality of storage units for individually storing wafers are arranged in a stacked state, the desired storage unit is specified at a position adjacent to the desired storage unit, and the wafer is converted into the desired storage unit. A wafer accommodation method comprising inserting the wafer.

Images