JPH05121531A - Carrier for semiconductor wafer - Google Patents

Abstract

PURPOSE:To surely and easily perform the insertion operation of semiconductor wafer into a carrier for semiconductor wafer use. CONSTITUTION:A carrier is featured in the following manner: a plurality of grooves 4 for semiconductor water insertion use are formed, so as to be faced with each other, in individual inner faces of sidewalls 2, 3 which are faced with each other; the grooves 4 on both inner faces are divided into a plurality of regions; and groove discrimination marks 11 whose shape, size and/or color are different form those of adjacent regions are put on individual guards 7, 8 near groove numbers 9 at the individual grooves 4 in the individual regions. Thereby, it is possible to prevent the erroneous insertion operation of a semiconductor wafer 5 into the carrier 1, the efficiency of the insertion operation of the semiconductor wafer 5 is enhanced, and the fatigue of an operator can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer carrier (hereinafter, simply referred to as "carrier") for facilitating semiconductor wafer insertion work.

[0002]

2. Description of the Related Art An example of a conventional carrier will be described with reference to FIG. This figure is a partial perspective view of the carrier. Code 1
Indicates a carrier as a whole. The carrier 1 has a rectangular parallelepiped box shape, and a pair of opposing side walls 2 thereof.
A plurality of elongated semiconductor wafer insertion grooves (hereinafter, simply referred to as “grooves”) 4 are formed on the inner surfaces of 3 and 3 in parallel at equal intervals. These grooves 4 serve to hold the inserted semiconductor wafers 5 at equal intervals. In FIG. 8, collars 7 and 8 are formed integrally with the side walls 2 and 3 of the upper opening 6 of the carrier 1, respectively, and the plurality of grooves 4 formed in the side walls 2 and 3, respectively. The groove number 9 is given in the same order in the vicinity of each.

When an operator inserts the semiconductor wafer 5 into the carrier 1 having such a structure, the operator holds the semiconductor wafer 5 held by the vacuum tweezers 10 in the groove number 9, for example, the groove 4 in the number 4. In order to insert the semiconductor wafer 5 into the front side of the operator, for example, based on No. 22 of the groove number 9 attached to the collar 8 in FIG. The semiconductor wafer 5 is fitted into the 22nd groove 4 formed on the inner surface of the side wall 3,
Next, move the viewpoint to arrow B, and the groove number 9 on the other side.
No. 22 is used as a base, and the edge of the semiconductor wafer 5 on the other side is fitted into the groove 4, and the semiconductor wafer 5 is inserted.

[0004]

The semiconductor wafer 5 is sequentially inserted into the carrier 1 by the above-described work procedure. However, since the groove number 9 is very difficult to see, the operator is sensitive to the reading. It is necessary to concentrate, and the fatigue level of the operator becomes very large. Further, when the process of fitting the edge of the semiconductor wafer 5 into the groove 4 is started, the viewpoint is changed to the semiconductor wafer 5.
Since both the edge and the groove number 9 are switched alternately, the groove number 9
There is a case where the edge of the semiconductor wafer 5 is fitted into the adjacent groove 4 due to a loss of sight or a mistake in mistake. Now that the diameter of the semiconductor wafer 5 has become larger, the work of inserting the semiconductor wafer 5 is becoming more and more burdensome to the operator, and the semiconductor wafer 5 is easily fitted into the wrong groove 4. The present invention eliminates such drawbacks and enables the semiconductor wafer 5 to be inserted into the predetermined groove 4 of the carrier 1 accurately and easily.

[0005]

Therefore, the present invention provides
Each of the grooves formed on each of the opposite sidewalls is divided into a plurality of regions, and each region has a groove identification mark having a size, shape, and / or color different from that of the adjacent region. It was attached near the groove to solve the above-mentioned drawback.

[0006]

According to the present invention, therefore, it is possible to prevent mistakes in the work of inserting the semiconductor wafer into the carrier, improve the efficiency of the work of inserting the semiconductor wafer, and reduce the fatigue of the worker.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 7 are first to seventh embodiments of the present invention, respectively.
FIG. 3 is a partial perspective view of a carrier that is an embodiment of the present invention. The same components as those of the conventional carrier shown in FIG.
The same reference numerals are given and the description of their configuration and the like is omitted.

First, the structure of the carrier 1 according to the first embodiment of the present invention will be described with reference to FIG. This figure shows a carrier 1 having 25 grooves 43 formed on the inner surface of each side wall thereof. Such many grooves 4
Is divided into, for example, 5 regions, and in each region, in the vicinity of the groove number 9 and inside thereof, that is, in the direction closer to the groove 4,
Black-painted triangular groove identification marks 11 of different sizes,
Corresponding to each groove 4, 1 on the front side collar 8 and the other side collar 7
Each piece was placed side by side periodically.

In the second embodiment of the present invention shown in FIG. 2, instead of the black-painted triangular groove identifying mark 11 of FIG.
As shown in the figure, groove identification marks 11A of five different patterns having different shapes are provided in a periodic manner, one for the front flange 8 and one for the other flange 7, corresponding to each groove 4.

In the third embodiment of the present invention shown in FIG. 3, instead of the black-painted triangular groove identifying mark 11 of FIG.
As shown in the figure, five types of groove identification marks 11B having the same shape but different sizes in sequence are provided on the front side brim 8 and the other side brim 7 corresponding to each groove 4. They were attached one by one periodically.

In the fourth embodiment of the present invention shown in FIG. 4, all of the five groove identification marks 11C in each of the five divided regions have the same shape, size and color and are adjacent to each other. The shape, size, and color are different from the groove identification mark 11C in the area.

In the fifth embodiment of the present invention shown in FIG. 5, all the five groove identification marks 11D in each of the five divided areas have the same shape, size and color, and they are the same. The groove identification marks 11D in the adjacent regions have the same shape and size, but are different only in color.

In the sixth embodiment of the present invention shown in FIG. 6, the entire groove 4 is divided into six regions, and each region has a shape, a size, or both as an adjacent region. Although different, the groove identification mark 11E having the same color was attached. That is,
The groove identification mark 11E in each area has the same shape, size, and color.

In the seventh embodiment of the present invention shown in FIG. 7, in each of the five divided areas, the shape and / or the size are different from the adjacent areas, but the colors are the same. The groove identification mark 11F was attached. The five groove identification marks 11F in each region have the same shape, but their sizes are sequentially different.

Such a groove identification mark 11 (11A, 11
B, 11C, 11D, 11E, 11F and so on), the worker identifies the groove identification mark 11 and the semiconductor wafer 5 on the other side.
When the viewpoints are alternately switched to both edges of the groove, the groove identification information can be used when re-checking the groove identification mark 11 which has been released once. Since the plurality of grooves are divided into predetermined regions, the approximate position of the groove identification mark 11 to be searched now can be easily estimated from the groove identification mark in the vicinity thereof.

That is, it is difficult to specify a desired one groove from a large number of grooves such as 25 grooves, but as shown in each of the above-mentioned embodiments, it is possible to specify a narrow area such as 5 grooves. Identifying the desired single groove from among the grooves is straightforward.
That is, the groove identification mark of the present invention is for narrowing the range that must be searched by the eye, or for enabling instantaneous identification of the groove serving as a reference for searching for a desired groove.

Also, instead of checking the fine characters,
Since it is only necessary to check the size and shape of the symbols and the type of color, it is easy to distinguish between the groove identification mark 11 to be obtained and the groove identification marks 11 on both sides of the groove identification mark 11 and finally one symbol. Can be found in.

[0018]

As described above, according to the carrier of the present invention, it is possible to prevent a mistake in the work of inserting a semiconductor wafer into the carrier, improve the efficiency of the work of inserting the semiconductor wafer, and moreover the operator It has excellent effects such as reducing fatigue.

[Brief description of drawings]

FIG. 1 is a partial perspective view of a semiconductor wafer carrier according to a first embodiment of the present invention.

FIG. 2 is a partial perspective view of a semiconductor wafer carrier according to a second embodiment of the present invention.

FIG. 3 is a partial perspective view of a semiconductor wafer carrier according to a third embodiment of the present invention.

FIG. 4 is a partial perspective view of a semiconductor wafer carrier according to a fourth embodiment of the present invention.

FIG. 5 is a partial perspective view of a semiconductor wafer carrier according to a fifth embodiment of the present invention.

FIG. 6 is a partial perspective view of a semiconductor wafer carrier according to a sixth embodiment of the present invention.

FIG. 7 is a partial perspective view of a semiconductor wafer carrier according to a seventh embodiment of the present invention.

FIG. 8 is a partial perspective view of a conventional semiconductor wafer carrier.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Carrier for semiconductor wafer 2 Side wall 3 Side wall 4 Semiconductor wafer insertion groove (groove) 5 Semiconductor wafer 6 Opening 7 Tsuba 8 Tsuba 9 Groove number 10 Vacuum tweezers 11 Groove identification mark 11

Claims (3)

[Claims] 1. A plurality of semiconductor wafer insertion grooves are formed on respective inner surfaces of opposed side walls so as to oppose each other.
Both of these semiconductor wafer insertion grooves are divided into a plurality of areas, and in each area, a groove identification mark having a size, shape, and / or color different from that of the adjacent area is provided in the vicinity of each semiconductor wafer insertion groove that faces each other. A carrier for a semiconductor wafer, characterized by being attached to. 2. The groove number of the semiconductor wafer groove is attached to a collar formed facing the opening formed in the side wall, and the groove identification mark is closer to the opening than the groove number. The carrier for semiconductor wafer according to claim 1, wherein the carrier is provided near the groove for inserting the semiconductor wafer. 3. The carrier for a semiconductor wafer according to claim 1, wherein at least one of the regions comprises two or more semiconductor wafer insertion grooves.