JP2007273510A - Substrate processor and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processor having sufficiently large processing spaces of respective processing units secured within a range of limited outside dimensions, and its manufacturing method. <P>SOLUTION: When the substrate processor is to be manufactured, four couplings 120 including fluid boxes 2a-2d and cleaning processing parts 5a-5d which are respectively integrally formed are made in the first place. The couplings 120 are coupled with a conveyance region frame 30F and also coupled with one another. An indexer frame 40F is coupled with one end of the conveyance region frame 30F having an elongate shape. Each of the fluid boxes 2a-2d includes a fluid box frame 20F. The boxes 2a-2d are made by attaching a plurality of resin-made members to the metallic fluid box frame 20F. Each of the cleaning processing parts 5a-5d includes a processing part frame 10F. The processing parts 5a-5d are made by attaching a plurality of resin-made members to the metallic processing part frame 10F. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus that performs predetermined processing on a substrate and a manufacturing method thereof.

  Conventionally, a substrate processing apparatus in which a plurality of processing units are integrated is used to perform various processes on a substrate such as a semiconductor substrate, a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, and a glass substrate for an optical disk. It has been.

  Examples of the plurality of processing units include a heat treatment unit that performs heat treatment on the substrate and a cleaning processing unit that supplies a processing liquid to the substrate to perform a cleaning process.

  As a method for manufacturing a substrate processing apparatus, in Patent Document 1, various processing units are manufactured in advance and a frame to which these processing units can be attached is manufactured, and then the specifications of the substrate processing apparatus are determined. It is described that the type and number of processing units according to the specifications are attached to the frame.

  In the substrate processing apparatus manufactured as described above, a frame to which various processing units are attached needs high rigidity to support components such as a driving device that rotates the substrate and a driving device that moves the nozzle. Is done. Therefore, the frame is generally made of metal.

  In the above-described cleaning processing unit, for example, BHF (buffered hydrofluoric acid), DHF (dilute hydrofluoric acid), hydrofluoric acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, oxalic acid or A chemical solution such as ammonia or a mixed solution thereof (hereinafter collectively referred to as a chemical solution) is used.

  Such a chemical solution may corrode a metal frame. Therefore, the cleaning processing unit accommodates components such as a nozzle for supplying a chemical to the substrate, a chemical supply system for supplying the chemical to the nozzle, and a moving mechanism of the nozzle in a resin casing having excellent chemical resistance. It is produced by doing.

  As the resin forming the casing, PVC (polyvinyl chloride), PPS (polyphenylene sulfide), PTFE (polytetrafluoroethylene), PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer), or the like is used.

  Therefore, at the time of manufacturing the substrate processing apparatus including the cleaning processing unit, the cleaning processing unit manufactured in advance is attached to the metal frame manufactured in advance according to the specifications.

  A specific example of manufacturing a substrate processing apparatus including a plurality of cleaning processing units will be described. FIG. 8 is a diagram illustrating a specific example of conventional manufacturing of a substrate processing apparatus including a plurality of cleaning processing units. In FIG. 8, a manufacturing example of the substrate processing apparatus 900 is shown in a top view.

  At the time of manufacturing the substrate processing apparatus 900 of FIG. 8, first, a plurality of cleaning processing units 910 for cleaning the substrate W are manufactured. In addition, a plurality of fluid boxes 920 incorporating a supply system for supplying a treatment liquid such as a chemical solution to the cleaning processing units 910 and a discharge system for discharging the used processing liquid from the cleaning processing units 910. Is produced.

  Further, a cleaning processing unit frame 930 to which a cleaning processing unit 910 can be attached and a fluid box frame 940 to which a fluid box 920 can be attached are manufactured. In addition, the indexer frame 950 and the transport region frame 970 that form the transport region of the substrate W, and the control unit frame 960 that holds the control unit of the substrate processing apparatus 900 are manufactured.

  In FIG. 8, the cleaning processing unit 910 is attached in the manufactured cleaning processing unit frame 930 as indicated by an arrow ja. Further, as indicated by an arrow jb, a fluid box 920 is attached in the produced fluid box frame 940.

  As indicated by an arrow jc, a fluid box frame 940 to which a fluid box 920 is attached is connected to the cleaning processing unit frame 930. Then, as indicated by a thick arrow jd, the cleaning processing unit frame 930 and the fluid box frame 940 that are connected to each other are connected to the transfer region frame 970.

  In FIG. 8, four cleaning processing unit frames 930 and fluid box frames 940 are connected to one transfer area frame 970.

  An indexer frame 950 is connected to one end of the transport frame 970 having a longitudinal shape. The indexer frame 950 is connected to the control unit frame 960, and a carrier mounting table 901 for mounting a carrier for storing the substrate W is attached to the indexer frame 950.

  As described above, various frames are manufactured, and the substrate processing apparatus 900 is manufactured by attaching components such as the cleaning processing unit 910 and the fluid box 920 to the frames.

Conventionally, when manufacturing the substrate processing apparatus 900 as described above, the designer of the substrate processing apparatus 900 designs the dimensions of the frames 930 to 960 according to a predetermined installation space, and the designed frames 930. It was necessary to design the size of the components to be installed in those frames according to the dimensions of ~ 960.
JP 2005-64349 A

  By the way, according to the manufacturing method of the substrate processing apparatus 900 described above, for example, by connecting the cleaning processing unit frame 930 to which the cleaning processing unit 910 is attached and the fluid box frame 940 to which the fluid box 920 is attached, In addition, a waste interval t is generated between the cleaning processing unit 910 and the fluid box 920 by the cleaning processing unit frame 930 and the fluid box frame 940.

  Further, when the two cleaning processing unit frames 930 to which the cleaning processing unit 910 is attached are connected to each other, a useless interval t is generated by the cleaning processing unit frame 930 between them.

  Therefore, when the external dimensions are limited, the designer of the substrate processing apparatus 900 performs the cleaning process while considering the distance t between the adjacent cleaning processing unit frames 930 and the distance t between the adjacent fluid boxes 920. The unit 910 and the fluid box 920 had to be designed to be small.

  Here, in the cleaning processing unit 910, for example, the substrate W is cleaned by supplying a chemical solution to the rotating substrate W. Accordingly, during this cleaning process, the chemical solution is scattered in the cleaning process unit 910.

  As described above, when the size of the cleaning processing unit 910 is designed to be small, the chemical liquid that scatters around the substrate W bounces around the inner wall of the cleaning processing unit 910 during the cleaning processing, and the chemical liquid once used for the cleaning processing again There is a case where it adheres to the substrate W. Thereby, processing defects of the substrate W occur.

  In general, a downward flow (down flow) is formed in the cleaning processing unit 910 in order to keep the internal atmosphere clean, but the down flow becomes more stable as the cross-sectional area of the flow increases. Therefore, if the size of the cleaning processing unit 910 is designed to be small, the downflow formed therein may become unstable.

  If the downflow becomes unstable, the cleanliness in the cleaning processing unit 910 is lowered, and there is a possibility that a processing failure of the substrate W may occur.

  An object of the present invention is to provide a substrate processing apparatus in which a processing space of each processing unit is sufficiently large within a limited range of external dimensions and a method for manufacturing the same.

  (1) A substrate processing apparatus according to a first invention is a substrate processing apparatus having a plurality of processing units for performing predetermined processing on a substrate, and a plurality of frame members are combined so as to partition a plurality of processing spaces. And a plurality of partition members attached to the frame so as to partition the plurality of processing spaces, and a plurality of processing spaces partitioned by the plurality of partition members, respectively, to perform processing on the substrate Each processing unit is configured by a plurality of partition members surrounding each processing space and processing means in each processing space.

  In the substrate processing apparatus according to the first aspect of the present invention, a plurality of partition members are attached to the frame formed so as to partition the plurality of processing spaces so that the plurality of processing spaces are partitioned. Thereby, each processing space is surrounded by a plurality of partition members. Each processing space is provided with processing means for processing the substrate. Thereby, each processing unit is configured.

  In this case, the processing space of the adjacent processing units is partitioned by the partition member, so that a useless interval due to the frame body does not occur between the adjacent processing units.

  Thereby, the designer of the substrate processing apparatus can design the dimensions of the processing space of each processing unit without considering the dimensions of the frame body within the limited outer dimensions of the entire substrate processing apparatus.

  Thus, since the dimension of the processing space of each processing unit can be ensured sufficiently large, substrate processing defects caused by the small processing space can be sufficiently reduced.

  (2) The adjacent processing units may be partitioned by a common partition member. As described above, the adjacent processing units are partitioned by the common partition member, so that a plurality of partition members do not exist between the adjacent processing units.

  Thereby, the designer of the substrate processing apparatus can design the dimensions of the processing unit processing spaces in consideration of only the dimensions of the common partition member within the limited outer dimensions of the entire substrate processing apparatus. Therefore, since the size of the processing space of each processing unit can be ensured to the maximum, the processing defects of the substrate caused by the small processing space can be reduced more sufficiently.

  (3) A method for manufacturing a substrate processing apparatus according to a second aspect of the present invention is a method for manufacturing a substrate processing apparatus having a plurality of processing units for performing predetermined processing on a substrate, and a plurality of processing methods are defined so as to partition a plurality of processing spaces. A step of fabricating a frame body by combining the frame materials, a step of attaching a plurality of partition members to the frame body so as to partition the plurality of processing spaces, and a plurality of processing spaces partitioned by the plurality of partition members on the substrate. By providing each processing means for performing processing, a plurality of partition members surrounding each processing space and a step of manufacturing each processing unit constituted by the processing means in each of the plurality of processing spaces are provided.

  In this case, a frame body is produced by dividing a plurality of processing spaces by combining a plurality of frame materials. A plurality of partition members are attached to the frame so as to partition the plurality of processing spaces.

  Moreover, each processing unit comprised by a partition member and a process means is produced by providing a process means in the some process space partitioned off by the some partition member.

  In this case, the processing space of the adjacent processing units is partitioned by the partition member, so that a useless interval due to the frame body does not occur between the adjacent processing units.

  Thereby, the designer of the substrate processing apparatus can design the dimensions of the processing space of each processing unit without considering the dimensions of the frame body within the limited outer dimensions of the entire substrate processing apparatus.

  Thus, since the dimension of the processing space of each processing unit can be ensured sufficiently large, substrate processing defects caused by the small processing space can be sufficiently reduced.

  (4) The step of attaching the plurality of partition members to the frame may include a step of temporarily attaching the plurality of partition members to the frame via a predetermined joining member.

  As described above, by temporarily attaching the plurality of partition members to the frame body via a predetermined joining member, the position of the plurality of partition members can be adjusted when each processing unit is manufactured.

  This facilitates attachment of the plurality of partition members to the frame, and improves the dimensional accuracy of each processing unit to be manufactured.

  (5) In the process of manufacturing each processing unit, the plurality of partition members are fixed to the frame body by welding the plurality of partition members surrounding each processing space after the step of temporarily attaching the partition member to the frame body. The process of carrying out may be included.

  In this case, after the plurality of partition members are temporarily attached to the frame, the plurality of partition members are welded to fix the plurality of partition members to the frame.

  Thus, the plurality of partition members surrounding each processing space are welded, so that each processing space can be sealed with the plurality of partition members.

  In addition, since the plurality of partition members are fixed to the frame body by welding, there is no need to provide connection portions on the frame body and the plurality of partition members, and there is no need to produce a connection member. Thereby, manufacture of a frame and a plurality of partition members is easy.

  According to the present invention, the processing space of the adjacent processing units is partitioned by the partition member, and no wasteful space due to the frame body is generated between the adjacent processing units.

  Thereby, the designer of the substrate processing apparatus can design the dimensions of the processing space of each processing unit without considering the dimensions of the frame body within the limited outer dimensions of the entire substrate processing apparatus.

  Thus, since the dimension of the processing space of each processing unit can be ensured sufficiently large, substrate processing defects caused by the small processing space can be sufficiently reduced.

  Hereinafter, a substrate processing method and a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings.

  In the following description, a substrate refers to a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a PDP (plasma display panel), a glass substrate for a photomask, a substrate for an optical disk, and the like.

  The chemical solution means, for example, an aqueous solution of BHF (buffered hydrofluoric acid), DHF (dilute hydrofluoric acid), hydrofluoric acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, oxalic acid or ammonia, or a mixed solution thereof.

  The rinsing liquid refers to an organic solvent such as pure water, carbonated water, ozone water, magnetic water, reduced water (hydrogen water) or ionic water, or IPA (isopropyl alcohol).

(1) Configuration of Substrate Processing Apparatus FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. As shown in FIG. 1, the substrate processing apparatus 100 has processing areas A and B, and a transfer area C between the processing areas A and B.

  In the processing area A, a control unit 4, fluid box units 2a and 2b, and cleaning processing units 5a and 5b are arranged.

  1 are pipes, joints, valves, and flow meters for supplying chemical liquids and rinse liquids to the cleaning processing units 5a and 5b and for disposal (drainage) from the cleaning processing units 5a and 5b, respectively. Houses fluid-related equipment such as regulators, pumps, temperature controllers, and processing liquid storage tanks.

  In the cleaning processing units 5a and 5b, a cleaning process using a chemical solution (hereinafter referred to as a chemical process) and a cleaning process using a rinse liquid (hereinafter referred to as a rinse process) are performed. In the present embodiment, for example, the chemical liquid used in the cleaning processing units 5a and 5b is hydrogen fluoride water, and the rinse liquid is pure water.

  As indicated by thick dotted lines in FIG. 1, the fluid boxes 2a and 2b each include a fluid box frame 20F. The fluid boxes 2a and 2b are manufactured by attaching a plurality of resin members to be described later to the fluid box frame 20F.

  Further, as indicated by thick dotted lines, the cleaning processing units 5a and 5b each include a processing unit frame 10F. As with the fluid boxes 2a and 2b, the cleaning processing units 5a and 5b are manufactured by attaching a plurality of resin members to be described later to the processing unit frame 10F.

  In the processing region B, fluid box portions 2c and 2d and cleaning processing portions 5c and 5d are arranged. Each of the fluid box portions 2c and 2d and the cleaning processing portions 5c and 5d has the same configuration as the fluid box portions 2a and 2b and the cleaning processing portions 5a and 5b, and the cleaning processing portions 5c and 5d are the cleaning processing portion 5a. , 5b.

  Furthermore, the fluid box portions 2c and 2d and the cleaning processing portions 5c and 5d are manufactured in the same manner as the fluid box portions 2a and 2b and the cleaning processing portions 5a and 5b.

  Hereinafter, the cleaning processing units 5a, 5b, 5c, and 5d are collectively referred to as processing units. In the transfer area C, a substrate transfer robot CR is provided. In the transfer area C, a transfer area frame 30F indicated by a thick dashed line is provided.

  An indexer ID for carrying in and out the substrate W is arranged on one end side of the processing areas A and B, and the indexer robot IR is provided inside the indexer ID. The indexer ID is provided with an indexer frame 40F indicated by a thick dashed line. A carrier mounting table 1U for mounting the carrier 1 for storing the substrate W is attached to the indexer frame 40F.

  The indexer robot IR with the indexer ID moves in the direction of the arrow U, takes out the substrate W from the carrier 1 and passes it to the substrate transport robot CR, and conversely receives the substrate W subjected to a series of processing from the substrate transport robot CR. Return to carrier 1.

  The substrate transfer robot CR transfers the substrate W delivered from the indexer robot IR to the designated processing unit, or transfers the substrate W received from the processing unit to another processing unit or the indexer robot IR.

  In the present embodiment, after the chemical processing and the rinsing processing are performed on the substrate W in any of the cleaning processing units 5a to 5d, the substrate W is unloaded from the cleaning processing units 5a to 5d by the substrate transport robot CR, and the indexer It is carried into the carrier 1 via the robot IR.

  The control unit 4 includes a computer including a CPU (Central Processing Unit) and the like. The operation of each processing unit in the processing areas A and B, the operation of the substrate transfer robot CR in the transfer area C, and the operation of the indexer robot IR of the indexer ID. To control. The control unit 4 includes a part of the indexer frame 40F.

  The processing unit frame 10F, the fluid box frame 20F, the transfer region frame 30F, and the indexer frame 40F are made of metal. As this metal, iron, aluminum, copper, or an alloy thereof is used.

(2) Manufacturing of Substrate Processing Apparatus FIG. 2 is a diagram showing a manufacturing method of the substrate processing apparatus 100 according to an embodiment of the present invention.

  As shown in FIG. 2, when manufacturing the substrate processing apparatus 100 of FIG. 1, first, the fluid boxes 2a, 2b, 2c, and 2d and the cleaning processing units 5a, 5b, 5c, and 5d are each integrated. Thus, four connected bodies 120 are formed.

  And these connection bodies 120 are connected with the conveyance area | region frame 30F, and the adjacent connection body 120 is mutually connected. Further, the indexer frame 40F is connected to one end of the transport area frame 30F having a longitudinal shape. Further, the carrier mounting table 1U is attached to the indexer frame 40F.

  Thereafter, the substrate transfer robot CR is installed in the transfer area frame 30F, and the indexer robot IR is installed in the indexer frame 40F. Further, the control unit 4 is produced so as to include a part of the indexer frame 40F. Thereby, the substrate processing apparatus 100 of FIG. 1 is manufactured.

  In addition, in the installation of the substrate transfer robot CR in the transfer area frame 30F, the installation of the indexer robot IR in the indexer frame 40F, and the production of the control unit 4, a plurality of linked bodies 120 are connected to the transfer area frame 30F. It may be done before.

(3) Appearance of connected body The connected body 120 in FIG. 2 will be described. FIG. 3 is an external perspective view of the connecting body 120 of FIG. FIG. 3 shows a coupling body 120 in which the cleaning processing unit 5b and the fluid box 2b of FIG. 2 are integrally formed. Although not described above, in the present embodiment, the cleaning processing unit 5b has a two-stage structure including an upper cleaning processing unit 5bu and a lower cleaning processing unit 5bb.

  As shown in FIG. 3, the processing unit frame 10F and the fluid box frame 20F are integrally formed. Hereinafter, the integrally formed processing unit frame 10F and fluid box frame 20F are referred to as a connecting frame 120F.

  A plurality of plate materials PL are attached to the connecting frame 120F as resin members. Thereby, outer walls of the upper cleaning processing unit 5bu and the lower cleaning processing unit 5bb are formed, and an outer wall of the fluid box 2b is formed.

  As the resin of the resin member, PVC (polyvinyl chloride), PPS (polyphenylene sulfide), PTFE (polytetrafluoroethylene), PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer), or the like is used.

  These resins are excellent in chemical resistance. This prevents the outer walls of the upper cleaning processing unit 5bu, the lower cleaning processing unit 5bb and the fluid box 2b from being corroded by the chemical solution when the chemical processing is performed in the upper cleaning processing unit 5bu and the lower cleaning processing unit 5bb. .

  By attaching a resin member to the connection frame 120F, a fan space 51S, a substrate processing space 52S, and a drive device installation space 53S are formed in each of the upper cleaning processing unit 5bu and the lower cleaning processing unit 5bb.

  In FIG. 3, the components provided in the fan space 51S, the substrate processing space 52S, and the drive device installation space 53S are not shown. Actually, a fan filter unit is provided in the fan space 51S.

  The substrate processing space 52S is provided with a nozzle for supplying the chemical solution and the rinse solution to the substrate W, a spin chuck for rotating the substrate W, a recovery mechanism for collecting the chemical solution and the rinse solution scattered from the substrate W, and the like. It is done. Thereby, the cleaning process of the substrate W is performed.

  In the drive device installation space 53S, for example, a drive device for driving the spin chuck and a drive device for moving the nozzle are provided. As this drive device, for example, a motor is used.

  By attaching a resin member to the fluid box frame 20F of the connection frame 120F, a fluid-related device storage space 20S is formed.

  As described above, in the fluid-related equipment storage space 20S, the chemical solution and the rinse solution are supplied to the upper cleaning processing unit 5bu and the lower cleaning processing unit 5bb, and discarded (discharged) from the upper cleaning processing unit 5bu and the lower cleaning processing unit 5bb. Fluid-related equipment such as pipes, joints, valves, flow meters, regulators, pumps, temperature controllers, processing liquid storage tanks, etc. are provided.

(4) Manufacture of connected body The manufacture of the connected body 120 in FIG. 3 will be described. 4-6 is a figure which shows the preparation methods of the coupling body 120 of FIG.

  At the time of manufacturing the connection body 120, the connection frame 120F is manufactured in advance by combining and connecting a plurality of metal frame members. Then, a plurality of resin members are temporarily attached to the produced connecting frame 120F. The temporary attachment of the resin member to the connecting frame 120F is performed by an adhesive sheet member such as a double-sided tape TP.

  Note that an adhesive or the like may be used instead of the adhesive sheet member as long as a resin member can be temporarily attached to the metal connection frame 120F.

  A specific example will be described with reference to FIGS. In the following description, lower frame plates 12 and 22 to be attached to the connecting frame 120F, driving device mounting plates 13a and 13b, a central frame plate 14a, fan mounting plates 15a and 15b, processing unit bottom plates 16a and 16b, an upper portion The frame 21, the window plate members 32 a and 32 b, the plate members 101, 102, 103, 104, 105, 202, 203, 204, 302, 31 a, 31 b, the fluid box top plate 201, the box member 301, and the plurality of strip members 310 This is an example of a resin member.

  As shown in FIG. 4, the upper frame 11 having a pentagonal shape is formed at the upper end of the processing unit frame 10F constituting the connection frame 120F. Four support frames 10a, 10b, 10c, and 10d are formed so as to extend downward from the four apexes of the upper frame 11.

  A driving device mounting plate 13a, a central frame plate 14a, and a driving device mounting plate 13b are formed on the column frames 10a to 10d at predetermined intervals in order from above, and a lower frame plate 12 is formed at the lower ends of the column frames 10a to 10d. Is formed.

  The drive device mounting plate 13a, the central frame plate 14a, the drive device mounting plate 13b, and the lower frame plate 12 have the same outer shape (pentagonal shape) as the upper frame 11, respectively.

  The fluid box frame 20F constituting the connection frame 120F includes an upper frame 21 and a lower frame plate 22. The upper frame 21 is formed to extend in the horizontal direction from the upper frame 11 of the processing unit frame 10F, and the lower frame plate 22 is formed to extend in the horizontal direction from the lower frame plate 12.

  A plate material 104 is attached to the outside of the lower portion of the support frames 10a, 10c with a double-sided tape TP. Similarly, the board | plate material 103 is affixed on the upper outer side of the support | pillar frames 10a and 10c with double-sided tape TP.

  4 to 6, illustration of the double-sided tape TP other than the double-sided tape TP attached to the plate member 104 is omitted.

  In this manner, the plate members 101, 102, 105 extending in the vertical direction in addition to the plate members 103, 104 are attached to the support frames 10a, 10b, 10d.

  Then, the fan mounting plate 15a is attached slightly below the upper frame 11 inside the support frames 10a to 10d with double-sided tape, and the processing unit bottom plate 16a is attached slightly above the drive device mounting plate 13a with double-sided tape.

  Also, the fan mounting plate 15b is attached slightly below the central frame plate 14a inside the support frames 10a to 10d with double-sided tape, and the processing unit bottom plate 16b is attached slightly above the drive device mounting plate 13b with double-sided tape.

  As shown in FIG. 5, the plate material 31a, the window plate material 32a, the plate material 31b, and the window plate material 32b are attached to the outside of the support frames 10c and 10d in order from the top to the bottom using double-sided tape.

  Furthermore, the fluid box upper surface plate 201 is attached to the lower side of the upper frame 21 of the fluid box frame 20F with double-sided tape, and the plate material 202 is attached to the outside of one side of the upper frame 21 and the lower frame plate 22 with double-sided tape.

  Further, the plate material 203 is attached to one side of the fluid box upper surface plate 201 and the plate material 202 attached to the fluid box frame 20F by the double-sided tape, and the plate material 204 is attached to one side of the plate material 203 by the double-sided tape.

  As shown in FIG. 6, a box-shaped member 301 is pasted on the lower frame plate 22 with double-sided tape, and a plate member 302 is pasted on the outside of the other sides of the upper frame 21 and the lower frame plate 22 with double-sided tape. Further, a plurality of strip members 310 are attached to the connecting frame 120F with a double-sided tape.

  Finally, the plurality of resin members attached to the connection frame 120F are welded together. Accordingly, the plurality of resin members are connected to each other and fixed to the coupling frame 120F. As a result, the connection body 120 of FIG. 3 is produced.

  Although not shown in FIG. 4, the processing unit bottom plates 16 a and 16 b include a nozzle for supplying a chemical solution and a rinse solution to the substrate W, a spin chuck for rotating the substrate W, a chemical solution and a rinse solution scattered from the substrate W. Constituent elements such as a recovery mechanism for recovering the water are provided. These components are preferably made of a resin having chemical resistance. In this case, each component is prevented from corroding. Further, the components of each component are prevented from being adversely affected on the substrate W during the cleaning process by being dissolved in the chemical solution and the rinse solution.

(5) Installation Example of Components in Cleaning Processing Unit FIG. 7 is a longitudinal sectional view showing an installation example of a nozzle for supplying a chemical solution and a rinsing solution to the substrate W in the upper cleaning processing unit 5bu of FIG.

  As shown in FIG. 7, for example, a nozzle 503 is movably provided in the substrate processing space 52S.

  In the example of FIG. 7, the nozzle 503 is attached to one end of the arm 502 in the substrate processing space 52 </ b> S. The other end of the arm 502 is connected to the rotation shaft 404. As the rotation shaft 404 rotates, the arm 502 rotates and the nozzle 503 swings in a horizontal plane.

  A cleaning liquid supply pipe 504 is provided inside the nozzle 503 and the arm 502. The cleaning liquid supply pipe 504 extends to the fluid box 2b in FIG. Thereby, a chemical | medical solution and a rinse liquid can be supplied to the nozzle 503 from the fluid box 2b.

  As described above, when the coupling body 120 is manufactured, the processing unit bottom plate 16a is attached slightly above the drive device attachment plate 13a. A through hole 16h through which the rotation shaft 404 can be inserted is formed in the processing unit bottom plate 16a.

  Further, a through-hole 13h through which the rotation shaft 404 can be inserted is also formed in the drive device mounting plate 13a located below the processing unit bottom plate 16a.

  Thereby, the rotation shaft 404 that supports the other end of the arm 502 is connected to the motor 403 provided in the drive device installation space 53S through the through holes 13h and 16h.

  In the drive device installation space 53S, the motor 403 is supported by a motor lifting device 401 attached to the lower surface of the drive device mounting plate 13a. Specifically, the motor 403 is provided on a support plate 402 that extends horizontally from the motor lifting device 401.

  Thereby, as indicated by an arrow UD, the motor 403 can be moved in the vertical direction by the motor lifting device 401.

  When the motor elevating device 401 operates and the motor 403 moves in the vertical direction, the rotation shaft 404 also moves in the vertical direction. Thereby, the nozzle 503 moves up and down together with the arm 502.

  Here, the rotation shaft 404 is made of metal because it requires rigidity. Accordingly, the rotation shaft 404 is covered with the bellows cover 501 in order to prevent the rotation shaft 404 from being exposed to the chemical solution processing atmosphere in the substrate processing space 52S.

  As described above, the motor 403 for moving the nozzle 503 in the substrate processing space 52S and the motor lifting device 401 are attached to the drive device mounting plate 13a. Accordingly, even when vibration is generated by the operation of the motor 403 and the motor lifting device 401, the vibration is prevented from being transmitted into the substrate processing space 52S. As a result, processing defects of the substrate W due to vibrations generated by the motor 403 and the motor lifting device 401 can be prevented.

  Further, since the motor 403 and the motor elevating device 401 are attached to the metal driving device mounting plate 13a having excellent rigidity, the mounting portions of the motor 403 and the motor elevating device 401 and the driving device mounting plate 13a are not stable. Can be prevented.

(6) Effect As described above, the substrate processing apparatus 100 according to the present embodiment is manufactured by connecting the four coupling bodies 120 and the indexer frame 40F to the transport area frame 30F.

  At the time of manufacturing the connection body 120, a plurality of resin members are attached to the integrally formed connection frame 120F. Thereby, the upper cleaning processing unit 5bu, the lower cleaning processing unit 5bb and the fluid box 2b are formed.

  Here, as shown in FIG. 3, the substrate processing space 52S in which the cleaning process of the substrate W is performed is surrounded by a plurality of resin members. In this case, since the substrate processing space 52S and the fluid-related device storage space 20S are partitioned by the resin member, when the cleaning processing units 5a to 5d and the fluid boxes 2a to 2d are arranged adjacent to each other, the adjacent cleaning processing unit No frame is located between 5a-5d and fluid boxes 2a-2d.

  Accordingly, the designer of the substrate processing apparatus 100 can perform the substrate processing of the cleaning processing units 5a to 5d and the fluid boxes 2a to 2d without considering the dimensions of the frame within the range of the limited outer dimensions of the entire substrate processing apparatus 100. The dimensions of the space 52S and the fluid-related device storage space 20S can be designed to be sufficiently large.

  Thereby, when the substrate W is processed using the chemical solution in the substrate processing space 52S of the cleaning processing units 5a to 5d, processing defects of the substrate W due to the chemical solution scattering in the substrate processing space 52S are reduced.

  Further, a stable downward flow (down flow) can be formed in the substrate processing space 52S of the cleaning processing units 5a to 5d using the fan filter unit, and processing defects of the substrate W are reduced. Therefore, the processing defect of the substrate W caused by the small size of the substrate processing space 52S can be sufficiently reduced.

  Further, by designing the size of the substrate processing space 52S and the fluid-related equipment storage space 20S to be large, for example, when new components are added to the substrate processing space 52S, the arrangement of these components is easily determined. can do.

  In the present embodiment, as shown in FIG. 3, a plate member 105 provided between the cleaning processing unit 5b and the fluid box 2b is used as a common outer wall. Thus, the absence of a plurality of plate members between the cleaning processing unit 5b and the fluid box 2b allows the designer of the substrate processing apparatus 100 to be within the limited outer dimensions of the entire substrate processing apparatus 100. The dimensions of the substrate processing space 52S and the fluid-related device storage space 20S of the cleaning processing units 5a to 5d and the fluid boxes 2a to 2d should be designed to be as large as possible without considering the dimensions (thickness) of the frame and the plurality of plate members. Can do.

  As described above, when the coupling body 120 is manufactured, a plurality of resin members are temporarily attached to the coupling frame 120F with a double-sided tape. Thereby, when welding a some resin-made member, each positional relationship can be finely adjusted. As a result, a plurality of resin members can be welded at an accurate position with respect to the connection frame 120F according to the design dimensions, and the dimensional accuracy of the substrate processing apparatus 100 is improved.

  A plurality of resin members may be temporarily attached to the connecting frame 120F for transportation. In this case, even when the temperature environment changes due to transportation, the plurality of resin members are not completely fixed to the connection frame 120F. Therefore, the thermal expansion coefficient of the metal connection frame 120F and the thermal expansion of the plurality of resin members. The distortion and damage of the resin member due to the difference from the rate can be prevented.

  As described above, the plurality of resin members are welded in a state of being attached to the connection frame 120F. Thus, the substrate processing space 52S can be sealed by closing the gaps between the connecting portions of the plurality of resin members.

  Thereby, when chemical processing is performed in the substrate processing space 52S, it is possible to prevent the chemical processing atmosphere in the substrate processing space 52S from leaking outside.

  Further, since there is no need to screw a plurality of resin members, connection members such as screws are not necessary. Furthermore, there is no need to provide screwing points on the connecting frame 120F and the plurality of resin members. This facilitates the production of the connecting frame 120F and the plurality of resin members.

(11) Correspondence relationship between each constituent element of claims and each part of the embodiment As described above, in one embodiment of the present invention, the fluid box parts 2a, 2b, 2c, 2d, the cleaning processing parts 5a, 5b, 5c. , 5d, the upper cleaning processing unit 5bu and the lower cleaning processing unit 5bb correspond to a plurality of processing units, the upper frame 11, the support frames 10a, 10b, 10c, 10d, the lower frame plates 12, 22, the central frame plate 14a, the drive The apparatus mounting plates 13a and 13b, the fan mounting plates 15a and 15b, the processing unit bottom plates 16a and 16b, and the upper frame 21 correspond to a plurality of frame members.

  Further, the connecting frame 120F, the processing unit frame 10F, the fluid box frame 20F, the transfer region frame 30F, and the indexer frame 40F correspond to the frame body, and are made of resin members, window plate members 32a and 32b, plate members 101, 102, 103, and 104. , 105, 202, 203, 204, 302, 31a, 31b, the fluid box top plate 201, the box-shaped member 301, and the plurality of strip-shaped members 310 correspond to a plurality of partition members.

  Further, the substrate processing space 52S and the fluid-related device storage space 20S correspond to a plurality of processing spaces, the nozzle 503 corresponds to a processing means, and the double-sided tape TP corresponds to a joining member.

  The present invention can be used for manufacturing a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a glass substrate for an optical disk, and the like.

1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. It is a figure which shows the manufacturing method of the substrate processing apparatus which concerns on one embodiment of this invention. It is an external appearance perspective view of the coupling body of FIG. It is a figure which shows the preparation methods of the coupling body of FIG. It is a figure which shows the preparation methods of the coupling body of FIG. It is a figure which shows the preparation methods of the coupling body of FIG. It is a longitudinal cross-sectional view which shows the example of installation of the nozzle which supplies a chemical | medical solution and a rinse liquid to a board | substrate to the upper washing process part of FIG. It is a figure which shows the specific example in the past of the substrate processing apparatus provided with a some cleaning processing unit.

Explanation of symbols

2a, 2b, 2c, 2d Fluid box portion 5a, 5b, 5c, 5d Cleaning processing portion 5bu Upper cleaning processing portion 5bb Lower cleaning processing portion 120F Connection frame 10F Processing portion frame 10a, 10b, 10c, 10d Post frame 11 Upper frame 12 , 22 Lower frame plate 13a, 13b Drive device mounting plate 14a Central frame plate 15a, 15b Fan mounting plate 16a, 16b Processing unit bottom plate 20F Fluid box frame 20S Fluid related device storage space 21 Upper frame 30F Transport region frame 32a, 32b Window Substrate material 40F Indexer frame 52S Substrate processing space 100 Substrate processing apparatus 101, 102, 103, 104, 105, 202, 203, 204, 302, 31a, 31b Plate material 120F Connection frame 201 Fluid Box top 301 box-type plate member 310 a plurality of belt-shaped members 503 nozzles TP-sided tape W substrate

Claims (5)

A substrate processing apparatus having a plurality of processing units for performing predetermined processing on a substrate,
A frame formed by combining a plurality of frame members so as to partition a plurality of processing spaces;
A plurality of partition members attached to the frame so as to partition the plurality of processing spaces;
Provided in each of a plurality of processing spaces partitioned by the plurality of partition members, and comprising processing means for processing the substrate,
A substrate processing apparatus, wherein each processing unit includes a plurality of partition members surrounding each processing space and processing means in each processing space. The substrate processing apparatus according to claim 1, wherein adjacent processing units are partitioned by a common partition member. A method of manufacturing a substrate processing apparatus having a plurality of processing units for performing predetermined processing on a substrate,
Producing a frame by combining a plurality of frame members so as to partition a plurality of processing spaces;
Attaching a plurality of partition members to the frame so as to partition the plurality of processing spaces;
Each of the plurality of processing spaces partitioned by the plurality of partition members is provided with processing means for performing processing on the substrate, thereby being configured by a plurality of partition members surrounding each processing space and processing means in each of the plurality of processing spaces. And a step of producing each processing unit. A method for manufacturing a substrate processing apparatus, comprising: The step of attaching the plurality of partition members to the frame body,
The method for manufacturing a substrate processing apparatus according to claim 3, further comprising a step of temporarily attaching the plurality of partition members to the frame body via a predetermined joining member. The step of manufacturing each processing unit includes:
After the step of temporarily affixing the partition member to the frame body, the method includes a step of fixing a plurality of partition members to the frame body by welding a plurality of partition members surrounding each processing space. A method for manufacturing a substrate processing apparatus according to claim 5.

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