JP2006253210A - Substrate holding device, substrate processing apparatus and method of processing substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate holding device which can prevent the breakage and treatment fault of a substrate in the case of rotation, and to provide a substrate processing apparatus and a method of processing the substrate. <P>SOLUTION: A spin chuck which rotates a substrate W held in a horizontal position has a spin base of a hollow structure, and a plurality of retention members provided on the spin base. The retention member 600a has a shaft 605 attached rotatably in a spin base 700. A plate 606 is fixed on the upper part of the shaft 605, and a horizontal supporting pin 603 projects upwards in the approximate center of the plate 606. Two holding pins 601 and 602 project upwards in the part shifted from the horizontal supporting pin 603. Both the two holding pins 601 and 602 are brought into contact with the periphery part of the substrate W, the periphery part of the substrate W is pushed in the direction which directs to the center of the spin chuck 501, and the substrate W is held. The holding pins 601 and 602 are separated at a predetermined distance from one another. Thereby, a clearance 609 exists between the holding pins 601 and 602. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate holding apparatus that holds a substrate, and a substrate processing apparatus and a substrate processing method for performing various processes on a substrate.

  Conventionally, in order to perform various processes on substrates such as semiconductor wafers, photomask glass substrates, liquid crystal display glass substrates, plasma display glass substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, etc. A substrate processing apparatus is used.

  There are substrate processing apparatuses that perform various processes on a rotating substrate by rotating the substrate. Various processes include a process of discharging or applying a processing solution such as a cleaning solution, a rinsing solution, a developing solution, or a resist solution to the substrate.

  Such a substrate processing apparatus includes a spin chuck for holding and rotating a single substrate horizontally. The spin chuck includes a spin base that is rotated around a rotation axis along the vertical direction, and a plurality of holding members provided on the spin base. The holding member has a plurality of holding pins for holding the substrate in contact with the peripheral edge (end surface) of the substrate.

  Here, the substrate may be provided with a notch portion for specifying the plane orientation. When the holding pin fits into the notch portion during rotation of the substrate and the holding pin contacts the inner wall surface of the notch portion, stress concentrates on the inner wall surface of the notch portion.

  Stress concentration on the inner wall surface of the notch portion causes damage to the substrate. When the substrate is damaged during the rotation, fragments of the substrate are scattered in the substrate processing apparatus. When the fragments of the substrate are scattered in the substrate processing apparatus, various components in the substrate processing apparatus are damaged, and a great deal of time is required for the restoration work.

  Thus, a substrate processing apparatus that can satisfactorily hold a substrate having a notch has been proposed (see, for example, Patent Document 1).

In the substrate processing apparatus of Patent Document 1, the contact surface of the holding pin with the substrate is formed with a large radius of curvature. Thereby, even if it is a case where a holding pin is located in a notch part, it is prevented that a holding pin fits into a notch part. This prevents the substrate from being damaged due to stress concentration on the inner wall surface of the notch portion.
JP 2003-60013 A

  By the way, the factor which damages a board | substrate at the time of rotation is not restricted to the stress concentration to the inner wall surface of a notch part. Another factor that damages the substrate during rotation is residual stress and strain on the substrate.

  There is also a reclaimed wafer that is processed again from the beginning due to the occurrence of a processing defect or the like, although a semiconductor pattern has been once formed on a substrate to be processed. This reclaimed wafer is manufactured by scraping both surfaces of a substrate on which a semiconductor pattern including a defective portion is formed and polishing the surface. For this reason, the regenerated wafer remains with stress and strain generated during processing such as polishing. Thereby, the recycled wafer is easily damaged. Therefore, when processing the reclaimed wafer, it is necessary to reduce stress and strain newly applied to the reclaimed wafer as much as possible by rotating the reclaimed wafer.

  Therefore, in the substrate processing apparatus, it is preferable that the stress applied to the substrate is dispersed by the holding pins. Thereby, local stress concentration on the substrate is prevented, and damage to the substrate (particularly, the recycled wafer) is prevented.

  However, in reality, since the substrate has a notch portion, the center of the substrate outer circumference circle does not coincide with the center of gravity of the substrate, and the substrate is rarely a perfect circle, so the substrate rotates by the spin chuck. Rotates in an eccentric state with respect to the shaft. Thereby, the substrate receives a large stress from some of the plurality of holding pins. In this case, local stress concentration on the substrate is caused by some of the holding pins.

  The present inventor considered that the local stress concentration on the substrate is dispersed by increasing the contact area of the holding pins with the substrate as follows.

  FIG. 7 is a diagram for explaining the contact area between the holding pins and the substrate and the stress applied to the substrate. In FIG. 7, the expanded sectional view in the horizontal direction of the contact part of a holding pin and a board | substrate is shown.

  In this holding pin 950, a contact surface 950 </ b> S with the substrate W is formed along the peripheral edge (end surface) of the substrate W. This increases the area of the contact portion between the holding pin 950 and the substrate W. As a result, the stress applied to the substrate W by the holding pins 950 is dispersed within the contact surface 950S as indicated by the arrow CN.

  However, the holding pins 950 in FIG. 7 are in contact with the substrate W along the peripheral edge of the substrate W. Accordingly, when the holding pin 950 of FIG. 7 is used, the processing liquid may stay in the contact portion between the substrate W and the holding pin 950 or the airflow around the substrate W may be disturbed when the substrate W is processed. In this case, processing defects such as generation of particles and generation of stains on the surface of the substrate W are likely to occur.

  An object of the present invention is to provide a substrate holding device, a substrate processing apparatus, and a substrate processing method capable of preventing damage and processing failure of a substrate during rotation.

  A substrate holding device according to a first aspect of the present invention is a substrate holding device that rotates while holding a substrate substantially horizontally, and is in contact with a rotating member that is driven to rotate in a substantially horizontal posture and a peripheral portion of the substrate. A plurality of holding members movably provided on the rotating member between a substrate holding position for holding the substrate in a substantially horizontal direction and a substrate opening position spaced apart from the peripheral edge of the substrate, each of the plurality of holding members And a support part movably provided on the rotating member, and a plurality of contact parts provided on the support part so as to be able to contact the peripheral edge of the substrate at the substrate holding position. A gap is formed.

  In this substrate holding apparatus, the plurality of holding members provided on the rotating member move between the substrate holding position and the substrate opening position. When the plurality of holding members move to the substrate holding position due to the movement of the support portions of the holding members, the plurality of contact portions of each holding member abut on the peripheral edge of the substrate. Accordingly, the substrate is held in a substantially horizontal direction by the plurality of contact portions of the plurality of holding members.

  With the plurality of holding members positioned at the substrate holding position, the rotating member is driven to rotate, whereby the substrate is rotated in a substantially horizontal posture together with the rotating member. When the support portions of the respective holding members move, when the plurality of holding members move to the substrate opening position, the contact portions of the respective holding members are separated from the peripheral edge portion of the substrate. Thereby, the substrate is opened.

  In this case, since gaps are provided between the plurality of contact portions of each holding member, when a stress is applied to the substrate by a specific holding member during rotation of the substrate, the stress is applied to the plurality of contact portions of the substrate. Dispersed in the contact part. Thereby, local stress concentration of the substrate is reduced at the contact portion between the substrate and the holding member, and damage to the substrate is prevented.

  In addition, when processing using a processing liquid is performed on the rotating substrate, the processing liquid supplied onto the substrate is discharged outward through the gaps between the plurality of contact portions. Therefore, the processing liquid is prevented from staying on the substrate, and the processing failure of the substrate during rotation is prevented.

  Furthermore, it becomes possible for the airflow from the center portion of the substrate to the outside to pass through the gaps between the plurality of contact portions. Thereby, the turbulence of the airflow caused by the plurality of holding members is reduced, and processing defects of the substrate during rotation are prevented.

  The support portion is attached to the rotating member so as to be rotatable around a rotation axis in a substantially vertical direction, and each of the plurality of abutting portions is in contact with the peripheral portion of the substrate as the support portion rotates. You may provide eccentrically with respect to a rotating shaft.

  As described above, since each of the plurality of abutting portions is provided eccentrically with respect to the rotation axis of the support portion, the plurality of holding members are moved between the substrate holding position and the substrate opening position by rotating the support portion. Can be easily moved.

  An urging means for urging the plurality of holding members in the direction of the substrate holding position may be further provided. In this case, the plurality of holding members are urged in the direction of the substrate holding position by the urging means. This ensures that the substrate is held by the plurality of holding members.

  A holding member moving mechanism for moving the plurality of holding members integrally between the substrate holding position and the substrate opening position may be further provided. In this case, the plurality of holding members are integrally moved between the substrate holding position and the substrate opening position by the holding member moving mechanism. Thereby, the center position of a board | substrate can be made to correspond with the rotation center of a rotation member. This prevents the substrate from rotating in an eccentric state.

  The length of the gap between the plurality of contact portions in the direction along the peripheral edge of the substrate may be substantially equal to the length of each of the plurality of contact portions in the direction along the peripheral edge of the substrate. In this case, the stress can be sufficiently dispersed without increasing the size of the holding member, and the processing liquid supplied onto the substrate can be sufficiently discharged through the gaps between the plurality of contact portions, It becomes possible to allow the airflow from the center of the substrate to the outside to sufficiently pass through the gaps between the plurality of contact portions.

  The length of the gap between the plurality of contact portions in the direction along the peripheral edge of the substrate may be 2 mm to 5 mm. In this case, the stress can be sufficiently dispersed without increasing the size of the holding member, and the processing liquid supplied onto the substrate can be sufficiently discharged through the gaps between the plurality of contact portions, The air flow from the center of the substrate to the outside can be sufficiently passed through the gaps between the plurality of contact portions.

  Each of the plurality of contact portions may have a convex curved surface that contacts the substrate at the substrate holding position. In this case, the processing liquid supplied onto the substrate is likely to be discharged outward along the curved surfaces of the plurality of contact portions.

  A substrate processing apparatus according to a second aspect of the invention is a substrate holding apparatus according to the first aspect of the invention, a rotation driving means for driving the substrate holding apparatus to rotate about a substantially vertical axis, and a substrate held by the substrate holding means. And a processing means for supplying a processing liquid to the substrate and performing a predetermined processing.

  In the substrate processing apparatus, the substrate holding device is rotationally driven around a substantially vertical axis by the rotation driving means in a state where the substrate is held by the substrate holding device according to the first aspect of the invention. The substrate held by the substrate holding device is supplied with a processing liquid by the processing means and subjected to a predetermined processing.

  By using the substrate holding device according to the first invention, local stress concentration of the substrate is reduced at the contact portion between the substrate and the holding member, and the substrate is prevented from being damaged. In addition, when processing using a processing liquid is performed on a rotating substrate, the processing liquid is prevented from staying on the substrate, and processing defects of the substrate during rotation are prevented. Furthermore, the turbulence of the airflow due to the plurality of holding members is reduced, and the processing failure of the substrate during rotation is prevented.

  A substrate processing method according to a third invention includes a step of holding a substrate using the substrate holding device according to the first invention, and a step of rotating the substrate held by the substrate holding device about an axis in a substantially vertical direction. And a step of supplying a processing liquid to the substrate rotated by the substrate holding means and performing a predetermined process.

  In this substrate processing method, the substrate is held by the substrate holding device according to the first aspect of the invention, and the substrate holding device is rotationally driven around an axis in the substantially vertical direction. In addition, a processing liquid is supplied to the substrate rotated by the substrate holding device to perform a predetermined process.

  By using the substrate holding device according to the first invention, local stress concentration of the substrate is reduced at the contact portion between the substrate and the holding member, and the substrate is prevented from being damaged. In addition, when processing using a processing liquid is performed on a rotating substrate, the processing liquid is prevented from staying on the substrate, and processing defects of the substrate during rotation are prevented. Furthermore, the turbulence of the airflow due to the plurality of holding members is reduced, and the processing failure of the substrate during rotation is prevented.

  According to the substrate holding device, the substrate processing apparatus, and the substrate processing method according to the present invention, the local stress concentration of the substrate is reduced at the contact portion between the substrate and the holding member, and the substrate is prevented from being damaged. In addition, when processing using a processing liquid is performed on a rotating substrate, the processing liquid is prevented from staying on the substrate, and processing defects of the substrate during rotation are prevented. Furthermore, the turbulence of the airflow due to the plurality of holding members is reduced, and the processing failure of the substrate during rotation is prevented.

  A substrate holding device, a substrate processing apparatus, and a substrate processing method according to an embodiment of the present invention will be described. In the following description, the substrate refers to a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a glass substrate for a plasma display, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, and the like.

  FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. As shown in FIG. 1, the substrate processing apparatus 100 has processing areas A and B, and a transfer area C between the processing areas A and B.

  In the processing area A, a control unit 4, fluid box units 2a and 2b, and rotation processing units 5a and 5b are arranged.

  Each of the fluid box portions 2a and 2b in FIG. 1 includes pipes, joints, valves, flow meters, regulators, pumps for supplying cleaning liquid to the rotation processing portions 5a and 5b and draining liquid from the rotation processing portions 5a and 5b. Houses fluid-related equipment such as temperature controllers and processing liquid storage tanks.

  In the rotation processing units 5a and 5b, the cleaning process and the drying process are performed by rotating the substrate W. As the cleaning liquid for the cleaning process, chemical liquids such as BHF (buffered hydrofluoric acid), hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, oxalic acid and ammonia are used. As the rinse liquid, an organic solvent such as IPA (isopropyl alcohol) or pure water, carbonated water, hydrogen water, electrolytic ion water, or the like is used. In the rotation processing units 5a and 5b, development processing, resist coating processing, and the like may be performed.

  The rotation processing units 5a and 5b are provided with a spin chuck for holding and rotating a single substrate W horizontally. The spin chuck includes a spin base that is rotated around a rotation axis along the vertical direction, and a plurality of holding members provided on the spin base. The holding member has a plurality of holding pins for holding the substrate W in contact with the peripheral edge (end surface) of the substrate W. Details will be described later.

  In the processing area B, fluid box portions 2c and 2d and rotation processing portions 5c and 5d are arranged. Each of the fluid box portions 2c and 2d and the rotation processing portions 5c and 5d has the same configuration as the fluid box portions 2a and 2b and the rotation processing portions 5a and 5b, and the rotation processing portions 5c and 5d are the rotation processing portion 5a. , 5b.

  Hereinafter, the rotation processing units 5a, 5b, 5c, and 5d are collectively referred to as processing units. In the transfer area C, a substrate transfer robot CR is provided.

  An indexer ID for carrying in and out the substrate W is arranged on one end side of the processing areas A and B, and the indexer robot IR is provided inside the indexer ID. The carrier 1 that stores the substrate W is placed on the indexer ID. In the present embodiment, a FOUP (Front Opening Unified Pod) that accommodates the substrate W in a sealed state is used as the carrier 1. However, the present invention is not limited to this, and a SMIF (Standard Mechanical Inter Face) pod is used. OC (Open Cassette) or the like may be used.

  The indexer robot IR with the indexer ID moves in the direction of the arrow U, takes out the substrate W from the carrier 1 and passes it to the substrate transport robot CR, and conversely receives the substrate W subjected to a series of processing from the substrate transport robot CR. Return to carrier 1.

  The substrate transfer robot CR transfers the substrate W delivered from the indexer robot IR to the designated processing unit, or transfers the substrate W received from the processing unit to another processing unit or the indexer robot IR.

  In the present embodiment, after the cleaning process and the drying process are performed on the substrate W in any of the rotation processing units 5a to 5d, the substrate W is unloaded from the rotation processing units 5a to 5d by the substrate transport robot CR, and the indexer It is carried into the carrier 1 via the robot IR.

  The control unit 4 includes a computer including a CPU (Central Processing Unit) and the like. The operation of each processing unit in the processing areas A and B, the operation of the substrate transfer robot CR in the transfer area C, the indexer robot IR of the indexer ID, and the fluid The operation of the box portions 2a to 2d is controlled.

  FIG. 2 is a diagram for explaining the configuration of the rotation processing units 5a to 5d of the substrate processing apparatus 100 according to the embodiment of the present invention.

  As shown in FIG. 2, the processing units 5 a, 5 b, 5 c, 5 d hold the substrate W horizontally and rotate a spin chuck 501 for rotating the substrate W around a vertical rotation axis passing through the center of the substrate W. Prepare. The spin chuck 501 is fixed to the upper end of the rotation shaft 503 rotated by the chuck rotation drive mechanism 508. The substrate W rotates while being held horizontally by the spin chuck 501 during the cleaning process and the drying process.

  A rotation motor 511 is provided outside the spin chuck 501. A rotation shaft 512 is connected to the rotation motor 511. In addition, an arm 513 is connected to the rotation shaft 512 so as to extend in the horizontal direction, and a nozzle 510 is provided at the tip of the arm 513.

  The rotation shaft 503 of the spin chuck 501 is a hollow shaft. A processing liquid supply pipe 504 is inserted into the rotary shaft 503. A cleaning liquid for cleaning the lower surface of the substrate W is supplied to the processing liquid supply pipe 504. The processing liquid supply pipe 504 extends to a position close to the lower surface of the substrate W held by the spin chuck 501. A lower surface nozzle 505 that discharges the cleaning liquid toward the center of the lower surface of the substrate W is provided at the tip of the processing liquid supply pipe 504.

  The spin chuck 501 is accommodated in the processing cup 502. A cylindrical partition wall 509 is provided inside the processing cup 502. Further, a recovery liquid space 506 for recovering the cleaning liquid used for the cleaning process of the substrate W is formed between the processing cup 502 and the partition wall 509. A recovery pipe 507 for reusing the recovered cleaning liquid is connected to the recovery liquid space 506.

  The cleaning liquid is discharged from both the nozzle 510 and the lower surface nozzle 505. Thereby, the upper surface and the lower surface of the substrate W can be cleaned.

  Here, details of the structure and operation of the spin chuck 501 of FIG. 2 will be described. As described above, the spin chuck 501 includes a spin base having a hollow structure and a holding member that is provided on the spin base and holds the substrate W.

  3 and 4 are views for explaining the structure and operation of the spin chuck 501 of FIG.

  A top view of the spin chuck 501 is shown in FIG. In FIG. 3A, the substrate W held by the spin chuck 501 is indicated by a dotted line.

  As shown in FIG. 3A, on the upper surface of the spin base 700, three holding members 600a, 600b, and 600c are arranged at equal intervals in the vicinity of the peripheral edge thereof.

  Of the three holding members 600a to 600c, the holding member 600a is different in shape from the other two holding members 600b and 600c and includes a lever portion 604. Accordingly, the holding member 600a has a shape that is longer than the holding members 600b and 600c by the length of the lever portion 604. Details will be described later.

  Each of the three holding members 600 a to 600 c includes a plurality of holding pins 601 and 602 and a horizontal support pin 603. The substrate W is supported horizontally on the three horizontal support pins 603 of the holding members 600a to 600c. Further, the side surfaces of the holding pins 601 and 602 of the holding members 600 a to 600 c are in contact with the peripheral edge (end surface) of the substrate W. Thereby, the substrate W is fixed horizontally on the spin base 700.

  A discharge port of the lower surface nozzle 505 is disposed at the center of the spin base 700 so as to face the lower surface of the substrate W.

  3B is a cross-sectional view of the spin chuck 501 taken along the line S-S in FIG. 3A, and FIG. 4A is a top view of the spin chuck 501 when viewed through the spin base 700. FIG. It is shown. In FIG. 4A, the spin base 700 is indicated by a broken line.

  As shown in FIG. 3B, the spin base 700 has a hollow structure. Each of the holding members 600 a to 600 c has a shaft portion 605 extending downward, and the shaft portion 605 is rotatably attached to the spin base 700.

  Here, the center of the shaft portion 605 coincides with the center of the horizontal support pin 603. Accordingly, each of the holding members 600 a to 600 c can be rotated around the horizontal support pin 603.

  As shown in FIGS. 3B and 4A, the spin base 700 has a built-in interlocking link mechanism 710 corresponding to each of the holding members 600a to 600c.

  The interlocking link mechanism 710 includes a first connecting member 701, a second connecting member 702, a third connecting member 703, a fourth connecting member 704, and a spring member 705.

  As shown in FIG. 4A, the first connecting member 701 has a square shape in the horizontal direction. A hole is formed in a substantially central portion of the first connecting member 701. The shaft portion 605 (FIG. 3B) of the holding members 600a to 600c is inserted into the hole portion. The first connecting member 701 is fixed to the shaft portion 605. Thereby, the holding members 600a to 600c and the first connecting member 701 can be rotated integrally around the shaft portion 605.

  One end of the first connecting member 701 is rotatably connected to one end of the second connecting member 702. The other end of the second connecting member 702 is rotatably connected to one end of the third connecting member 703.

  The other end of the third connecting member 703 is connected to be fixed to one end of the fourth connecting member 704. Here, the rotation shaft P <b> 1 is provided so as to penetrate the connecting portion between the third connecting member 703 and the fourth connecting member 704.

  The rotation axis P <b> 1 is erected at a predetermined location in the spin base 700. Thereby, both the 3rd connection member 703 and the 4th connection member 704 can be rotated centering on the rotating shaft P1.

  The other end of the fourth connecting member 704 is rotatably connected to a predetermined portion of the ring 706.

  A spring member 705 is stretched between a predetermined portion of the ring 706 and a predetermined portion in the spin base 700. 3B and 4A, one end of the spring member 705 is connected to the connection portion between the ring 706 and the fourth connection member 704, and the other end portion of the spring member 705 is in the spin base 700. Are connected to a shaft P2 erected at a predetermined position. As a result, the ring 706 is urged counterclockwise by the spring member 705.

  FIG. 4B shows an operation state of the interlocking link mechanism 710. As shown in FIG. 4B, when the substrate W is held by the spin chuck 501, first, the lever 604 of the holding member 600a is moved in the direction of the arrow M1 (spin chuck 501) by a drive mechanism (not shown). In the direction toward the center).

  As a result, the holding pins 601 and 602 of the holding member 600a are opened. As a result, the first connecting member 701 rotates clockwise, the second connecting member 702 moves in the direction of the arrow M2, and the third connecting member 703 and the fourth connecting member 704 move the rotation axis P1. It rotates counterclockwise as the center. Accordingly, the ring 706 rotates in the direction of the arrow M3 (clockwise direction) against the biasing force of the spring member 705.

  As a result, the interlocking link mechanism 710 corresponding to the other holding members 600 b and 600 c interlocks with the rotation of the ring 706. Thus, the holding pins 601 and 602 of the holding members 600b and 600c are simultaneously opened by the action of the interlocking link mechanism 710 corresponding to the holding members 600b and 600c.

  In this state, the substrate W is placed on the horizontal support pins 603 of the holding members 600a to 600c. When the pressing of the lever portion 604 of the holding member 600a by the drive mechanism is released, the ring 706 rotates in the direction opposite to the arrow M3 (counterclockwise direction) by the elastic force of the spring member 705. Accordingly, the holding pins 601 and 602 of the holding members 600a to 600c are closed by the operation of the interlocking link mechanism 710. Thereby, the substrate W is held by the spin chuck 501.

  As described above, in the present embodiment, the placement of the substrate W on the spin chuck 501 and the removal of the substrate W from the spin chuck 501 are easily performed by operating the lever portion 604 of the holding member 600a.

  When the substrate W is held by the spin chuck 501, the holding pins 601 and 602 of the holding members 600 a to 600 c are simultaneously closed by the action of the interlocking link mechanism 710, so that the rotation center of the spin base 700 is substantially rotated. Can be matched to the center. This prevents the substrate W from being rotated in an eccentric state.

  FIG. 5A shows an external perspective view of the holding member 600a of FIG. 3, and FIG. 5B shows a side view of the holding member 600a when the holding member 600a is viewed from the direction Q (horizontal direction). It is shown. In FIG. 5A and FIG. 5B, the substrate W held by the holding member 600a is indicated by a dotted line.

  As shown in FIGS. 5A and 5B, the holding member 600 a includes a shaft portion 605 that is rotatably attached to the spin base 700. A flat plate portion 606 is fixed to the upper portion of the shaft portion 605. A horizontal support pin 603 is formed at a substantially central portion of the flat plate portion 606 so as to protrude upward. Further, the two holding pins 601 and 602 are formed so as to protrude upward at positions shifted from the horizontal support pins 603. As described above, the two holding pins 601 and 602 are both in contact with the peripheral edge of the substrate W, and press the peripheral edge of the substrate W toward the center of the spin chuck 501 to hold the substrate W.

  As shown in FIG. 5B, the head of the horizontal support pin 603 is formed in a substantially conical shape, and the tip is processed into a hemispherical shape. As a result, the horizontal support pins 603 are in point contact with the vicinity of the peripheral edge of the lower surface of the substrate W. Thereby, the horizontal support pins 603 support the substrate W from the lower surface side.

  5A and 5B, the structure of the holding member 600a is described, but the other holding members 600b and 600c have the same structure as the holding member 600a except that the lever portion 604 is not provided. .

  The holding pins 601 and 602 protruding on the flat plate portion 606 are separated from each other by a predetermined distance. Thereby, a gap 609 exists between the holding pins 601 and 602. Details of the holding pins 601 and 602 and the gap 609 formed therebetween will be described.

  FIG. 6 is an enlarged top view showing a state in which the holding member 600a of FIG.

  When the substrate W is held by the spin chuck 501, the peripheral edge (end) of the substrate W comes into contact with the contact surfaces 601 t and 602 t of the holding pins 601 and 602. Similarly, in the holding members 600b and 600c (not shown), the peripheral edge portion of the substrate W comes into contact with the contact surfaces 601t and 602t of the holding pins 601 and 602, respectively. As described above, when the substrate W is held by the spin chuck 501, the peripheral portion of the substrate W comes into contact with the six holding pins 601 and 602.

  As shown in FIG. 6, each of the contact surfaces 601t and 602t of the holding pins 601 and 602 has a curved shape that is convex with respect to the center of the spin chuck 501 and has a predetermined radius of curvature RR (for example, 10 mm). Have. Accordingly, the contact surfaces 601t and 602t of the holding pins 601 and 602 are in point contact with the peripheral edge of the substrate W having a radius RW (for example, 150 mm).

  As described above, the gap 609 exists between the holding pins 601 and 602 of the holding member 600a. The lengths of the holding pins 601 and 602 in the circumferential direction of the substrate W are set within a range of about 2 mm to about 5 mm, for example. Further, the interval U of the gap 609 in the circumferential direction of the substrate W is set within a range of about 2 mm to about 5 mm, for example.

  The interval U of the gap 609 is set according to the length of the holding pin 601 or the holding pin 602 in the circumferential direction of the substrate W. For example, when the length of the holding pin 601 or the holding pin 602 in the circumferential direction of the substrate W is 5 mm, the interval U of the gap 609 is set to about 5 mm. When the length of the holding pin 601 or the holding pin 602 in the circumferential direction of the substrate W is 2 mm, the interval U of the gap 609 is set to about 2 mm.

  In the above configuration, the gap U of the gap 609 is very small compared to the length of the peripheral edge of the substrate W having the radius RW. Thereby, when a stress is applied to the substrate W by a specific holding member during the rotation of the substrate W, the stress is distributed to the contact portion between the holding pin 601 and the substrate W and the contact portion between the holding pin 602 and the substrate W. Is done.

  That is, in this example, since the two holding pins 601 and 602 are formed at intervals U in each of the plurality of holding members 600a to 600c, the stress applied to the substrate W by the two holding pins 601 and 602 of each holding member. Are dispersed in two places, and the stress concentrated on the substrate W at each contact portion is reduced to ½ compared to the case where there is only one holding pin.

  Thus, in the spin chuck 501 according to the present embodiment, the stress applied to the substrate W by the specific holding member is dispersed by the plurality of holding pins. Thereby, damage to the substrate due to stress concentration on the substrate W at the contact portion between the substrate W and the holding pin is prevented.

  Furthermore, as described above, the holding members 600a to 600c have the two holding pins 601 and 602. As a result, a notch portion is formed in the substrate W, and even when one of the holding pins 601 and 602 is positioned in the notch portion, the other holding pin abuts on the peripheral edge portion of the substrate W, so that it is held on the inner wall surface of the notch portion. The pin is prevented from fitting. As a result, damage to the substrate W due to stress concentration on the inner wall surface of the notch portion is prevented.

  As described above, in the holding members 600a to 600c, the gap 609 is formed between the two holding pins 601 and 602. Accordingly, the cleaning liquid supplied onto the substrate W is discharged to the outside through the gap 609 between the holding pins 601 and 602 during the cleaning process of the substrate W and the drying process of the substrate W. Therefore, the cleaning liquid is prevented from staying on the substrate W.

  In particular, the contact surfaces 601 t and 602 t of the holding pins 601 and 602 have curved surfaces that are convex with respect to the substrate W. Thus, the cleaning liquid supplied onto the substrate W is easily discharged outward along the contact surfaces 601t and 602t of the holding pins 601 and 602.

  Further, the airflow from the center of the substrate W to the outside can pass through the gap 609 between the holding pins 601 and 602. Thereby, the turbulence of the airflow by the holding pins 601 and 602 is reduced.

  Therefore, according to the spin chuck 501 according to the present embodiment, processing defects such as generation of particles and generation of stains on the surface of the substrate W are prevented, and processing of the substrate W with high reliability is realized.

  In the above description, the three holding members 600a to 600c are provided in the spin chuck 501. However, the number of holding members provided in the spin chuck 501 may be three or more, for example, six at regular angular intervals. A holding member may be provided.

  In the above description, the two holding pins 601 and 602 are formed on each of the holding members 600a to 600c. However, the holding members 600a to 600c may have a plurality of holding pins as long as the number is 3. There may be more than one.

  As described above, in this embodiment, the spin chuck 501 corresponds to the substrate holding device, the spin base 700 corresponds to the rotating member, and the positions of the holding members 600a to 600c when the holding pins 601 and 602 are closed are the substrate holding positions. The positions of the holding members 600a to 600c when the holding pins 601 and 602 open correspond to the substrate opening position, the holding members 600a, 600b, and 600c correspond to a plurality of holding members, and the flat plate portion 606 serves as a support portion. The holding pins 601 and 602 correspond to a plurality of contact portions, and the gap 609 corresponds to a gap.

  Further, the spring member 705 corresponds to an urging means, the interlocking link mechanism 710 corresponds to a holding member moving mechanism, the contact surfaces 601t and 602t correspond to convex curved surfaces, and the rotation shaft 503 and the chuck rotation drive mechanism 508 are provided. The processing liquid supply pipe 504, the lower surface nozzle 505, the nozzle 510, the rotation motor 511, the rotation shaft 512, and the arm 513 correspond to the processing means, and the rotation processing units 5a and 5b of the substrate processing apparatus 100 correspond to the rotation driving unit. , 5c, 5d correspond to the substrate processing apparatus.

  A substrate holding device and a substrate scattering prevention method according to the present invention include a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a glass substrate for a plasma display, a substrate for an optical disk, a substrate for a magnetic disk, and a magnetooptical disk. It can be effectively used for manufacturing a substrate such as a substrate.

1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. It is a figure for demonstrating the structure of the rotation process part of the substrate processing apparatus which concerns on one embodiment of this invention. It is a figure for demonstrating the structure and operation | movement of a spin chuck of FIG. It is a figure for demonstrating the structure and operation | movement of a spin chuck of FIG. It is the external appearance perspective view and side view of the holding member of FIG. FIG. 4 is an enlarged top view showing a state in which a holding member in FIG. 3 holds a substrate W. It is a figure for demonstrating the contact area of a holding pin and a board | substrate, and the stress added to a board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 4 Control part 5a, 5b, 5c, 5d Rotation processing part 100 Substrate processing apparatus 501 Spin chuck 503 Rotating shaft 504 Processing liquid supply pipe 505 Lower surface nozzle 508 Chuck rotating drive mechanism 510 Nozzle 511 Rotating motor 512 Rotating shaft 513 Arm 600a, 600b, 600c Holding member 601, 602 Holding pin 601t, 602t Contact surface 606 Flat plate portion 609 Clearance 700 Spin base 705 Spring member 710 Interlocking link mechanism

Claims (9)

A substrate holding device that rotates while holding the substrate substantially horizontally,
A rotating member that is rotationally driven in a substantially horizontal posture;
A plurality of holding members provided on the rotating member so as to be movable between a substrate holding position that contacts the peripheral edge of the substrate and holds the substrate in a substantially horizontal direction and a substrate open position that is separated from the peripheral edge of the substrate. With members,
Each of the plurality of holding members is
A support portion movably provided on the rotating member;
A plurality of contact portions provided on the support portion so as to be capable of contacting the peripheral edge of the substrate at the substrate holding position;
A substrate holding apparatus, wherein a gap is formed between the plurality of contact portions. The support portion is attached to the rotating member so as to be rotatable around a rotation axis in a substantially vertical direction,
2. Each of the plurality of abutting portions is provided eccentrically with respect to a rotation axis of the support portion so as to abut on a peripheral edge portion of the substrate as the support portion rotates. The board | substrate holding apparatus of description. The substrate holding apparatus according to claim 1, further comprising an urging unit that urges the plurality of holding members toward the substrate holding position. The substrate holding apparatus according to claim 1, further comprising a holding member moving mechanism that integrally moves the plurality of holding members between the substrate holding position and the substrate opening position. The length of the gap between the plurality of contact portions in the direction along the peripheral edge of the substrate is substantially equal to the length of each of the plurality of contact portions in the direction along the peripheral edge of the substrate. The substrate holding device according to claim 1. 6. The substrate holding apparatus according to claim 1, wherein a length of a gap between the plurality of contact portions in a direction along the peripheral edge of the substrate is 2 mm to 5 mm. The substrate holding apparatus according to claim 1, wherein each of the plurality of contact portions has a convex curved surface that contacts the substrate at the substrate holding position. A substrate holding device according to any one of claims 1 to 7,
Rotation driving means for rotating the substrate holding device about a substantially vertical axis;
A substrate processing apparatus comprising: a processing unit that supplies a processing liquid to the substrate held by the substrate holding unit to perform a predetermined process. Holding the substrate using the substrate holding apparatus according to claim 1;
Rotating the substrate held by the substrate holding device about a substantially vertical axis;
And a step of supplying a processing liquid to the substrate rotated by the substrate holding means and performing a predetermined process.

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