JP2007266040A - Joining member and its manufacturing method, joined structural body, and substrate connection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a joining member which is appropriately melted at a specified temperature to appropriately join a wiring substrate with a first substrate and a second substrate such as a seal ring, to provide a method of joining a substrate, to provide a joining member, and to provide a joining structural body wherein the joining member is interposed. <P>SOLUTION: The method of manufacturing a joining member includes a first step to prepare a metallic plate 1 made of alloy containing a first metallic material and a second metallic material having larger ionization than the first metallic material, a second step to immerse the metallic plate 1 in an etching liquid and work it into a specified shape, and a third step to cover the worked metallic plate 1 with a metallic film 2 made of the same metal as the second metallic material. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a method of manufacturing a joining member used when joining a first base and a second base such as a wiring board and a seal ring. Further, the present invention relates to a bonding method of a substrate, a bonding member, and a bonding structure in which the bonding member is interposed.

  Conventionally, electronic parts such as piezoelectric vibrators and semiconductor elements are hermetically sealed in a wiring board for hermetically accommodating these electronic parts to form an electronic device, and as parts of various electronic devices such as mobile phones and computers. used.

  Among the wiring boards that contain such electronic components in an airtight manner, the most reliable one is made of ceramics such as an aluminum oxide sintered body and contains and mounts the electronic components in the center of the upper surface. An insulating base having a concave mounting portion, a plurality of wiring conductors led from the inside of the mounting portion of the insulating base to the outer surface, a frame-shaped metal layer formed on the upper surface of the insulating base so as to surround the mounting portion, Sealing seal ring made of iron-nickel-cobalt alloy or iron-nickel alloy joined to the frame-like metal layer via silver brazing material, and iron-nickel joined to the upper surface of the seal ring by seam welding It is of a type constituted by a lid made of an alloy or an iron-nickel-cobalt alloy.

  In the case of this type of wiring board, the electronic component is mounted on the mounting portion of the insulating base and the electrode of the electronic component and the metallized wiring conductor are electrically connected, and then the lid is placed on the seal ring. A pair of roller electrodes of a seam welder are rolled while contacting the outer peripheral edge of the seam, and a large current for welding is passed between the pair of roller electrodes to directly seam weld the seal ring and the lid. Thus, an electronic device as a product in which electronic components are stored in an airtight manner. This electronic device is used by being mounted on an external electric circuit board by connecting a portion of the wiring conductor led to the outer surface of the insulating base to an external electric circuit.

  As a silver brazing material for joining a seal ring to such a wiring board, a silver brazing preform previously formed in accordance with the joining portion is used in order to efficiently join the wiring board and the seal ring. In addition, a silver brazing preform processed into a frame shape is interposed at the joint between the wiring board and the seal ring, and the wiring board and the seal ring can be satisfactorily joined by melting the silver brazing preform. become able to.

  The small wiring board is manufactured in the form of a so-called multi-cavity wiring board in which a large number of wiring boards are arranged vertically and horizontally. A large number of frame-shaped preforms are obtained by processing a silver brazing metal plate having a relatively large area in order to collectively bond a seal ring to each wiring board of the multi-piece wiring board. Those arranged in the same manner are used.

In addition, as a processing method of a metal plate, a punching process using a die or the like and a processing method by an etching process are known. A silver brazing preform is prepared by preparing a metal plate made of silver brazing, and this metal plate made of silver brazing. It can be manufactured in a predetermined shape by punching or etching with a die or the like.
JP 2005-203669 A

  However, with the recent miniaturization of electronic devices, the width of the joint between the wiring board and the seal ring is becoming narrower, and the width and thickness of the silver solder preform are also becoming smaller. When such a silver solder preform is manufactured by punching, the deformation of individual silver solder preforms and the arrangement of multiple silver solder preforms are easily deformed by the stress at the time of punching. It was no longer possible to place it well in the place. For this reason, when joining a wiring board and a seal ring, the volume dispersion | variation of silver solder generate | occur | produced and it had the problem that it became impossible to join a wiring board and a seal ring favorably. In particular, since it is difficult to correct deformation in a multi-piece wiring board, it is possible to satisfactorily place the silver brazing preform at a predetermined position in the area of each wiring board by such deformation of the silver brazing preform. It was difficult.

  In addition, when the silver brazing preform is manufactured by etching, there is no deformation like punching, but the melting point of the silver brazing changes and it becomes impossible to bond the wiring board and the seal ring better with silver brazing. It had the problem that it might end up. This is because copper is more easily dissolved in the etching solution than silver due to the difference in ionization tendency between silver and copper contained in the silver braze preform, so that copper is washed away in the solution more than silver. It was a thing. In particular, in the case where a silver braze preform having a small width or thickness is manufactured as the electronic device is miniaturized, the influence of copper loss on the entire silver braze preform is large.

  The present invention has been devised in view of the above-mentioned problems of the prior art, and its purpose is to melt well at a predetermined temperature and to connect the first substrate and the second substrate such as a wiring board and a seal ring. An object of the present invention is to provide a method for manufacturing a joining member that can be satisfactorily joined at a predetermined position, a method for joining a substrate using the joining member, a joining member, and a joining structure in which the joining member is interposed.

  The manufacturing method of the joining member of the present invention includes a first step of preparing a metal plate made of an alloy including a first metal material and a second metal material having a higher ionization tendency than the first metal material; A second step of processing the metal plate into a predetermined shape with an etching solution; and a third step of depositing a metal film made of the same metal as the second metal material on the metal plate processed into the predetermined shape. The process is sequentially performed.

  In the method for manufacturing a joining member of the present invention, preferably, the deposited metal film substantially covers an outer surface of a region immersed in an etching solution of the metal plate processed into a predetermined shape. It is characterized by being.

  Moreover, the manufacturing method of the joining member of this invention, Preferably, a said 1st metal material is silver and a said 2nd metal material is copper, It is characterized by the above-mentioned.

  The substrate bonding method of the present invention includes a first metal material and a metal plate which is made of an alloy containing a second metal material having a higher ionization tendency than the first metal material and is processed into a predetermined shape by an etching solution. A joining member comprising a metal film made of the same metal as the second metal material deposited on the metal plate, a first base on which the first metal member is formed, and a second A first step of preparing a second substrate on which a metal member is formed; and a second step of melting the joining member and joining the first metal member and the second metal member. It is characterized by passing sequentially.

  In the substrate bonding method of the present invention, preferably, the metal film substantially covers an outer surface of a region immersed in an etching solution of the metal plate processed into a predetermined shape. To do.

  In the substrate bonding method of the present invention, it is preferable that the first metal material is silver and the second metal material is copper.

  The joining member of the present invention includes a first metal material and a second metal material having a higher ionization tendency than the first metal material, and the volume ratio of the second metal material to the first metal material. Includes a first region having a predetermined volume ratio (hereinafter referred to as a first volume ratio), the first metal material, and the second metal material, and the first metal material is the first metal material. The volume ratio to the metal material is lower than the first volume ratio (hereinafter referred to as the second volume ratio), a second region, and a metal made of a metal film made of the same metal as the second metal material A membrane region is provided.

  In the joining member of the present invention, it is preferable that the metal film substantially covers the entire outer surface of the second region.

  In the joining member of the present invention, preferably, the first metal material is silver, and the second metal material is copper.

  The bonded structure of the present invention includes a first metal member formed on a first base and a second metal member formed on a second base, according to any one of claims 7 to 9. It is characterized by being joined by the joining member.

  In the bonded structure of the present invention, it is preferable that an electronic component is mounted on at least one of the first base and the second base.

  The manufacturing method of the joining member according to the present invention is such that a metal plate made of a first metal material and a second metal material is processed into a predetermined shape by etching, and then the second is applied to the surface of the metal plate processed into the predetermined shape. Since the metal film made of the same metal as that of the metal material is deposited, the second metal material that has been washed away more than the first metal material is supplemented to the metal plate that is well formed in a predetermined shape. When the member is melted, the metal plate and the metal film are melted, and the change in the melting point of the joining member can be suppressed. As a result, the joining member is disposed at a predetermined position of the first base body or the second base body, and the joining member is melted at a predetermined temperature, thereby bringing the first base body and the second base body into a predetermined position. It can be bonded well.

  Further, in the method for manufacturing a joining member according to the present invention, the deposited metal film substantially covers the outer surface of the region immersed in the etching solution of the metal plate processed into a predetermined shape. When the member is melted, the partial deviation between the first metal material region and the second metal material region on the surface of the joining member is reduced to reduce the melting variation of the joining member, so that the joining member is melted. At this time, the metal plate and the metal film are more uniformly melted, and the change in the melting point of the entire joining member can be suppressed more favorably. Thereby, the first base and the second base can be satisfactorily joined at a predetermined position by melting the joining member satisfactorily at a predetermined temperature.

  In the manufacturing method of the joining member of the present invention, the first metal material is silver and the second metal material is copper. Compared to the fact that copper was compensated for as a metal film, when the joining member was melted, the metal plate and the metal film made of copper were melted well, and the melting point of the joining member was changed. The first base and the second base can be satisfactorily bonded to each other at a predetermined position by melting the bonding member at a predetermined temperature. Thus, the present invention is more effective in the combination of silver and copper.

  The substrate bonding method of the present invention includes a first metal material and a metal plate made of an alloy containing a second metal material having a higher ionization tendency than the first metal material, and processed into a predetermined shape with an etching solution; A joining member comprising a metal film made of the same metal as the second metal material deposited on the metal plate, a first base on which the first metal member is formed, and a second metal member Since the first step of preparing the formed second base and the second step of melting the joining member and joining the first metal member and the second metal member are sequentially performed, a predetermined process is performed. Since the metal plate processed into the shape is filled with a metal film made of the same metal as the second metal material that has been washed away more than the first metal material during the etching process, the joining member is placed at a predetermined position. When it is placed and melted, it is joined by a metal plate and a metal film The first metal member and the second metal member can be satisfactorily bonded by melting the material at a predetermined temperature, and the first base and the second base can be satisfactorily bonded at a predetermined position. be able to.

  In the substrate bonding method of the present invention, preferably, the metal film substantially covers the outer surface of the region immersed in the etching solution of the metal plate processed into a predetermined shape. Since the partial variation between the region of the first metal material and the region of the second metal material is reduced and the melting variation of the joining member is reduced, the joining member is joined at the predetermined position for melting. The first metal member and the second metal member can be bonded satisfactorily by uniformly melting the entire member at a predetermined temperature, and the first substrate and the second substrate can be bonded better. Will be able to.

  In the substrate bonding method of the present invention, it is preferable that the first metal material is silver and the second metal material is copper. Since a large amount of copper that has been washed away is compensated as a metal film, when the joining member is melted, the metal plate and the metal film made of copper are well melted at a predetermined temperature, and the first metal member and the second metal film are melted. The metal member can be satisfactorily joined, and the first base and the second base can be satisfactorily joined at a predetermined position.

  The joining member of the present invention includes a first metal material and a second metal material having a higher ionization tendency than the first metal material, and the volume ratio of the second metal material to the first metal material is A first region having a first volume ratio; a first metal material and a second metal material; wherein the volume ratio of the second metal material to the first metal material is greater than the first volume ratio. Since the second region having a low second volume ratio and the metal film region made of the same metal as the second metal material are provided, the volume ratio of the second metal material in the second region is Since the lower portion is compensated by a metal film made of the same metal as the second metal material, the metal plate and the metal film are melted well when the joining member is placed at a predetermined position and melted. , The change of the melting point of the joining member can be suppressed, and the joining member is kept at a predetermined temperature. It is possible to satisfactorily bond the first substrate and the second substrate at a predetermined position by fusion.

  In the joining member of the present invention, preferably, since the metal film substantially covers the entire outer surface of the second region, the first metal material region and the second metal on the surface of the joining member. Since the melting variation of the joining member is reduced by reducing the partial variation with the material region, when the joining member is placed at a predetermined position and melted, the entire joining member is uniformly at a predetermined temperature. Therefore, the first base and the second base can be bonded more favorably at a predetermined position.

  In addition, when the first metal material is a combination of silver and the second metal material is copper, the joining member of the present invention has a particularly large amount of loss when immersed in an etching solution for processing into a predetermined shape. In the combination of these metals having a large difference, the effect of suppressing the change in the melting point of the joining member due to the joining member including the copper thin film is great.

  The joining structure of the present invention is obtained by joining the first metal member formed on the first base and the second metal member formed on the second base by the joining member described in the present invention. Since the joining member can be disposed at a predetermined position and melted satisfactorily at a predetermined temperature, the first metal member and the second metal member are satisfactorily joined at the predetermined position. The bonding between the first substrate and the second substrate can be improved, and a bonded structure with excellent reliability can be obtained.

  In the bonded structure according to the present invention, preferably, an electronic component is mounted on at least one of the first base and the second base. Therefore, the first base and the second base are connected by a bonding member. Since it is bonded well, the bonded structure can be an electronic device with excellent reliability mounted with electronic components. In particular, when an increase in the melting temperature of the joining member can be suppressed, the electronic components are prevented from being damaged due to the increase in the melting temperature in advance.

  Next, the manufacturing method of the joining member of this invention is demonstrated in detail based on attached drawing. FIG. 1 is a cross-sectional view of each process showing an example of an embodiment of a method for manufacturing a joining member of the present invention. In FIG. 1, 1 is a metal plate, 2 is a metal film, 3 is a resist photosensitive film, and 4 is a bonding member.

  The manufacturing method of the joining member of the present invention includes a first step of preparing a metal plate 1 made of an alloy including a first metal material and a second metal material having a higher ionization tendency than the first metal material. A second step of immersing the metal plate 1 in an etching solution and processing the metal plate 1 into a predetermined shape; and depositing a metal film 2 made of the same metal as the second metal material on the metal plate 1 processed into the predetermined shape. The third step is sequentially performed.

  First, as shown in FIG. 1A, a metal plate 1 made of an alloy containing a first metal material and a second metal material is prepared. For example, the metal plate 1 can use silver brazing made of silver and copper such as BAg-8 (silver: 71.0 to 73.0 mass%, copper: balance) as defined in JISZ3261. When the metal plate 1 is made of silver brazing, silver becomes the first metal material and copper becomes the second metal material. Moreover, the metal plate 1 is not limited to what consists of silver and copper, but phosphorous copper solders, such as BCuP-1, BCuP-2, etc. which are prescribed | regulated to JISZ3264, BPd-7, BPd-- which are prescribed | regulated to JISZ3267. 8. An alloy containing a first metal material such as palladium brazing such as BPd-14 and a second metal material having a higher ionization tendency than the first metal material can be used. The metal plate 1 having a thickness of about 0.01 mm to 0.2 mm is appropriately selected depending on the bonding area and shape of the bonding portion of the wiring board or the multi-piece wiring board.

  Next, as shown in FIG. 1B, a resist photosensitive film 3 is deposited on the entire upper and lower surfaces of the metal plate 1. Then, the resist photosensitive film 3 is exposed from the upper surface and the lower surface using a predetermined etching pattern in which only a predetermined portion is exposed, and the resist photosensitive film 3 is deposited on the metal plate 1 in a predetermined pattern. After that, the resist photosensitive film 3 in the unexposed part is removed. As a result, the resist photosensitive film 3 is deposited on the upper and lower surfaces of the metal plate 1 in a pattern having a predetermined shape. The resist photosensitive film 3 is heated and hardened at a temperature of about 100 to 200 ° C. in order to improve durability in an etching process described later.

  The predetermined shape here indicates a shape formed in accordance with the shape of the joint portion. For example, when used as the joining member 4 when joining the wiring board and the seal ring, the predetermined shape is joined. Since the member 4 needs to be formed in a frame shape, the resist photosensitive film 3 is deposited on the surface of the metal plate 1 in a frame shape.

  The resist photosensitive film 3 is made of a photosensitive resin such as propylene glycol monomethyl ether acetate that has high acid resistance and high adhesion to the metal, and is applied to the surface of the metal plate 1 by spinner coating, roll coating, dip coating, or the like. Applied.

  And as shown in FIG.1 (c), the metal plate 1 is immersed in etching liquid (Here, immersion is not only immersed in etching liquid completely. For example, the surface of a metal material using a sprayer etc.) In this case, the portion where the resist photosensitive film 3 is not deposited is dissolved in the etching solution, and the metal plate 1 can be processed into a predetermined shape. In this etching process, a larger amount of the second metal material having a larger ionization tendency than the first metal material is washed away from the metal plate 1. For example, when the metal plate 1 is made of silver and copper, copper has a higher ionization tendency than silver, so that copper is washed away from the metal plate 1 more than silver.

  In addition, the etching liquid used at the time of an etching process is suitably selected according to the material of the metal plate 1 from etching liquids, such as a ferric chloride liquid, a cupric chloride iron liquid, and a ferric nitrate liquid.

  Then, the resist photosensitive film 3 is removed from the metal plate 1 processed into a predetermined shape (FIG. 1D). The resist photosensitive film 3 is removed from the metal plate 1 by using an alkaline solution or the like as a stripping solution. When the resist photosensitive film 3 is made of propylene glycol monomethyl ether acetate, the resist photosensitive film 3 is removed with an aqueous sodium hydroxide solution. It can be removed by dissolving.

And as shown in FIG.1 (e), the joining member 4 is manufactured by depositing and forming the metal film 2 on the metal plate 1 processed into the predetermined shape. For example, when the metal plate 1 is made of silver and copper,
Since copper is washed away more than silver, a copper film may be deposited as the metal film 2.

  In the present invention, the metal film 2 has a thickness of 50% or less of the thickness of the metal plate 1.

  By the above manufacturing method, the second metal material washed away more than the first metal material is filled in the metal plate 1 processed into a predetermined shape by the metal film 2, so that when the joining member 4 is melted, The plate 1 and the metal film 2 are melted, and the change in the melting point of the joining member 4 can be suppressed. As a result, the joining member 4 has a good shape and can be melted at a predetermined temperature of the metal plate 1. Then, the joining member 4 is disposed at a predetermined position of the first base 7 or the second base 8 to be described later, and the joining member 4 is melted at a predetermined temperature, whereby the first base 7 and the second base are obtained. 8 can be satisfactorily bonded to each other at a predetermined position. Further, when the metal plate 1 is made of silver and copper, since the copper that has been washed away more than the silver is compensated for as the metal film 2 in the metal plate 1 processed into a predetermined shape, the joining member 4 is excellent in shape, It is manufactured as a silver solder preform that is melted at a predetermined temperature. When the joining member 4 is melted, the metal plate 1 and the metal film 2 made of copper are melted satisfactorily at a predetermined temperature, and a change in the melting point of the joining member 4 can be suppressed. The base body 7 and the second base body 8 can be satisfactorily bonded to each other at a predetermined position.

  The thickness of the metal film 2 is selected according to the size of the metal plate 1, the amount of the second metal material to be compensated, and the place where the metal plate 2 is deposited. For example, the thickness of the metal plate is about 10 μm to 200 μm. In this case, it is formed on the surface of the metal plate 1 so as to have a thickness of about 1 to 100 μm. The amount of the second metal material to be compensated is, for example, by preparing a metal plate 1 etched into the same conditions and in the same shape, measuring the specific gravity of the metal plate 1, or measuring the first metal in the cross section of the metal plate 1. The distribution of the metal material and the second metal material may be confirmed and appropriately selected.

  In addition, as a method of depositing and forming the metal film 2 on the metal plate 1, a method of depositing the metal film 2 on a predetermined position of the metal plate 1 processed into a predetermined shape by a plating method, or a metal such as a metal foil Examples thereof include a method of bonding the film 2 and a method of depositing the metal film 2 by vapor deposition.

  As a method for depositing and forming the metal film 2 on the metal plate 1 by plating, the metal plate 1 processed into a predetermined shape is immersed in a plating solution for the second metal material, and then electroplating or electroless plating. The metal film 2 may be deposited by the method. For example, when it is desired to deposit a copper film as the metal film 2, the metal plate 1 is immersed in a copper plating solution and subjected to an electrolytic plating method or an electroless plating method, thereby forming a copper plating layer on the surface of the metal plate 1. The metal film 2 is deposited. The metal film 2 may be formed as a plating layer only on a part of the metal plate 1 or may be deposited as a plating layer on the entire surface of the metal plate 1.

  The metal film 2 such as a metal foil is bonded to the metal plate 1 by bonding the metal plate 1 and the metal film 2 such as the metal foil with an adhesive component or the like, or the metal film 2 such as the metal foil on the metal plate 1. A method of pressure bonding by pressing the metal plate 1 and the metal film 2 can be used. For example, when it is desired to deposit a copper film as the metal film 2, a copper plate such as a copper foil may be placed on the metal plate 1 and bonded by the above-described method. The metal film 2 may be bonded to only a part of the metal plate 1 or may be bonded to the entire surface of the metal plate 1.

  The method of depositing the metal film 2 on the metal plate 1 by vapor deposition involves preparing a block made of a second metal material and depositing it on the metal plate 1 as the metal film 2 by vapor deposition such as vacuum vapor deposition. It can be carried out. For example, when it is desired to deposit a copper film as the metal film 2, a block made of copper may be prepared and deposited on the metal plate 1 as a copper film by a vacuum deposition method. The metal film 2 may be deposited on only a part of the metal plate 1 or may be deposited on the entire surface of the metal plate 1.

  In FIG. 1, the step of depositing the metal film 2 on the metal plate 1 is performed after removing the resist photosensitive film 3 from the metal plate 1, but as shown in FIG. After the film 2 is deposited (FIG. 2D), the resist photosensitive film 3 may be removed from the metal plate 1 (FIG. 2E). In FIGS. 2A to 2C, the same procedure as in FIGS. 1A to 1C is performed.

  The deposited metal film 2 may be deposited only on a part of the surface of the metal plate 1 processed into a predetermined shape, but the metal processed into a predetermined shape. It is preferable that the outer surface of the area immersed in the etching solution of the plate 1 is substantially covered. Accordingly, when the bonding member 4 is melted, the partial deviation between the first metal material region and the second metal material region is reduced to reduce the variation in melting of the bonding member 4. And the metal film 2 are evenly melted at a predetermined temperature, and the change in the melting point of the entire joining member 4 can be suppressed more favorably, and a first base 7 and a second base 8 described later are It can be satisfactorily joined at the position.

  Also, a shape in which a large number of joining members 4 having a predetermined shape as shown in FIG. 3 are connected by the connecting portions 5 or a shape having a frame-shaped holding portion 6 on the outer periphery of the joining members 4 as shown in FIG. It does not matter. The connecting portion 5 and the holding portion 6 are formed of the first metal material and the second metal material similarly to the joining member 4 and are manufactured by the same manufacturing method as the joining member 4. In the case of FIG. 3, in the case of a multi-piece substrate in which a plurality of first bases 7 to be described later are arranged, a large number of joining members 4 can be simultaneously placed at predetermined positions of the plurality of first bases 7. In addition, when the joining member 4 is melted at a predetermined temperature, the connecting portion 5 can be similarly melted so that the plurality of joining members 4 can be well separated. Accordingly, the plurality of joining members 4 placed at predetermined positions of the plurality of first bases are simultaneously melted, and the plurality of first bases 7 and the plurality of second bases 8 are efficiently and accurately obtained. Can be joined. Further, in the case of FIG. 4, the plurality of joining members 4 can be satisfactorily held by the frame-shaped holding portion 6 on the outer peripheral portion, so that deformation of the joining member 4 due to handling or the like can be suppressed, The plurality of first base bodies 7 and the plurality of second base bodies 8 can be bonded efficiently and accurately. Further, when the bonding member 4 is melted at a predetermined temperature, the holding portion 6 can be similarly melted and can be well separated from the plurality of bonding members 4.

  Next, the manufacturing method of the joining member of this invention is demonstrated in detail based on attached drawing. FIG. 5 is a cross-sectional view of each step showing an example of the embodiment of the method for bonding substrates according to the present invention. In FIG. 5, 7 is a first substrate, 8 is a second substrate, 9 is a first metal member, and 10 is a second metal member.

  First, as shown in FIG. 5 (a), the bonding member 4, the first base 7 on which the first metal member 9 is formed, and the second base 8 on which the second metal member 10 is formed, Prepare.

  In addition, about the joining member 4, since it has demonstrated in the above-mentioned, description is deleted.

  The first substrate 7 and the second substrate 8 are made of ceramics, metal, or the like. For example, in the case of ceramics, it is formed from ceramics such as aluminum oxide sintered body (alumina ceramics), aluminum nitride sintered body, mullite sintered body, glass ceramic sintered body, etc. In the case of a ligation, a suitable organic binder, solvent, etc. are added to the raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. to form a mud, which is conventionally known as a doctor blade method or a calender roll. A green sheet (ceramic raw sheet) is obtained by forming into a sheet shape by a method or the like, and then, the green sheet is appropriately punched and laminated, and then fired at a high temperature (about 1600 ° C.). Produced.

  When the first substrate 7 or the second substrate 8 is made of a metal material, for example, it can be selected from iron (Fe), copper (Cu), aluminum (Al), other metals, or metal alloys. Good. It is preferable to use the first base body 7 or the second base body 8 made of metal having close thermal expansion coefficients. For example, the first base body 7 is made of an aluminum oxide sintered body. For the second substrate, a copper (Cu) -tungsten (W) alloy, an iron (Fe) -nickel (Ni) alloy, an iron (Fe) -nickel (Ni) -cobalt (Co) alloy, or the like may be used. . Such a first substrate 7 or second substrate 8 can be manufactured by a conventionally known metal processing method such as pressing a metal plate formed by rolling or the like with a metal mold and punching it.

  The first metal member 9 and the second metal member 10 function as bonding surfaces for bonding the first base body 7 and the second base body, and the first base body 7 and the second base body 8. Is made of a metal powder metallization such as tungsten, molybdenum, copper, silver, etc., and the first green body for the first substrate 7 and the second substrate 8 is printed on the ceramic green sheet by a printing means such as a screen printing method. The first substrate 7 and the second substrate 8 are printed by printing a metallized paste for the metal material 9 and the second metal material 10 and firing together with the ceramic green sheets for the first substrate 7 and the second substrate 8. Is formed in a predetermined shape on the surface.

  When the first base body 7 is made of a metal material, the surface of the first base body 7 may be used as the first metal material, or the first base body 7 is formed on the surface of the first base body 7. Different metal materials may be deposited and used as the first metal member 9.

  As for the second base 8, similarly to the first base 7, when the second base 8 is made of a metal material, the surface of the second base 8 may be used as the second metal material 10. Alternatively, a metal material different from that of the second substrate 8 may be formed on the surface of the second substrate 8 and used as the second metal member 10. FIG. 6 shows a case where the second base 8 is made of a metal material, and the surface of the second base 8 is the second metal material 10.

  The first metal member 9 and the second metal member 10 are preferably metal materials that are interdiffused with the bonding member 4 in order to be bonded to the bonding member 4 satisfactorily. When it consists of, it is preferable to adhere | attach the metal material which is easy to mutually diffuse with the joining member 4 on the surface of the 1st metal material 9 and the 2nd metal material. For example, when the first metal material 9 is made of tungsten and the joining member 4 is made of silver and copper, the surface of the surface to be joined of the first metal material 9 may be plated with Ni or the like.

  Thereby, the metal plate 1 processed into a predetermined shape is filled with the metal film 2 made of the same metal as the second metal material that has been washed away more than the first metal material, so that the joining member 4 is melted. When the metal plate 1 and the metal film 2 are melted, the first metal member 9 and the second metal member 10 can be satisfactorily bonded to each other. Can be bonded satisfactorily. Further, when the metal plate 1 is made of silver and copper, the metal plate 1 processed into a predetermined shape is made up of copper that has been washed away more than the silver as the metal film 2, so that the joining member 4 is arranged at a predetermined position. When melting, the metal plate 1 and the metal film 2 made of copper are satisfactorily melted at a predetermined temperature, and the first metal member and the second metal member can be satisfactorily joined. The base body 7 and the second base body 8 can be favorably bonded at a predetermined position.

  Further, a wiring conductor is formed on either the first base 7 or the second base 8. Connected to the wiring conductor are electrode pads to which each electrode of the electronic component is connected through an electrical connection means such as a solder bump, connection pads for connection to an external circuit board through a bonding material such as solder, and the like. Some of them are through conductors.

  Such a wiring conductor is made of metal powder metallization such as tungsten, molybdenum, copper, and silver, and is used for the wiring conductor by printing means such as a screen printing method on the ceramic green sheets for the first base 7 and the second base 8. The metallized paste is printed and fired together with the ceramic green sheets for the first base 7 and the second base 8 to form a predetermined shape on the surface and inside of the first base 7 and the second base 8. .

  Further, on the exposed surface of the wiring conductor formed on the first base body 7 or the second base body 8, the corrosion of the wiring conductor is prevented, the electronic component and the wiring conductor are connected, and the wiring board and the external circuit board are joined. In order to strengthen the thickness, it is preferable to perform plating with Ni, Au or the like.

  Moreover, it is preferable that the metal film 2 substantially covers the outer surface of the region immersed in the etching solution of the metal plate 1 processed into a predetermined shape. As a result, the partial variation between the first metal material region and the second metal material region on the surface of the bonding member 4 is reduced and the melting variation of the bonding member 4 is reduced. When it is placed at a position and melted, the first metal member 9 and the second metal member 10 can be satisfactorily joined by uniformly melting the entire joining member 4 at a predetermined temperature, and the first The base 7 and the second base 8 can be bonded better.

  Next, as shown in FIG. 5B, the joining member 4 is melted at a predetermined temperature to join the first metal member 9 and the second metal member 10. The temperature at the time of joining varies depending on the types and ratios of the first metal material and the second metal material of the joining member 4 and is appropriately selected. For example, when the joining member 4 is made of silver and copper, the ratio of silver is 71.0 to 73.0 mass%, and the balance is copper, the joining member 4 is melted at a temperature of about 780 to 900 ° C., The first base member 7 and the second base member 8 can be joined by joining the first metal member 9 and the second metal member 10 together.

  Moreover, the joining member 4 of the present invention includes a first metal material and a second metal material having a higher ionization tendency than the first metal material, and the volume ratio of the second metal material to the first metal material. Includes a first region having a first volume ratio, a first metal material, and a second metal material, and the volume ratio of the second metal material to the first metal material is equal to the first volume ratio. A second region having a lower second volume ratio, and a metal film region made of the metal film 2 made of the same metal as the second metal material. As a result, the second metal material in the second region is compensated for by the metal film 2 so that when the joining member 4 is placed at a predetermined position and melted, the melting point of the joining member is reduced. The change is suppressed, the joining member 4 can be melted satisfactorily at a predetermined temperature, and the first base 7 and the second base 8 can be satisfactorily joined at a predetermined position. .

  The first region here is a region in which the volume ratio of the second metal material to the first metal material in the metal plate 1 is the same before the etching and after the etching, that is, an etching process. Shows a region in which the volume ratio of the first metal material and the second metal material does not change due to the second metal material. When the second metal material is etched, the second metal material is the first metal material. This shows a region where the volume ratio of the second metal material to the first metal material in the metal plate 1 is lower than the first volume ratio. The metal film region indicates a region where the metal film 2 is deposited. In addition, when the joining member 4 consists of silver and copper, since the copper lost more than silver is compensated as the metal film 2, when joining the joining member 4 to a predetermined position and making it fuse | melt, a joining member is predetermined. Therefore, the first substrate 7 and the second substrate 8 can be bonded satisfactorily at a predetermined position.

Moreover, it is preferable that the metal film 2 substantially covers the entire outer surface of the second region. Thereby, when melting the joining member 4, the melting variation of the joining member 4 is reduced by reducing the partial variation between the region of the first metal material and the region of the second metal material. When the joining member 4 is disposed and melted at a predetermined position, the entire joining member 4 can be evenly melted at a predetermined temperature, and the first base body 7 and the second base body 8 can be better improved. It becomes possible to join.

  The bonded structure of the present invention includes a first base 7 on which the first metal member 9 is formed, a second base 8 on which the second metal member 10 is formed, the first metal member 9 and the first metal member 9. 2 and the metal member 10 of the present invention. Thereby, since the joining member 4 can be melted satisfactorily at a predetermined position, the first metal member 9 and the second metal member 10 can be satisfactorily joined at the predetermined position to form the first base body. 7 and the second substrate 8 can be bonded well, and a bonded structure having excellent reliability can be obtained. Note that the bonding member 4 is processed into a predetermined shape in accordance with the shape of the bonded portion between the first base 7 and the second base 6. For example, when the first base 7 is a wiring board and the second base 8 is a seal ring, the bonding member 4 is formed in a frame shape.

  An electronic component is mounted on at least one of the first base body 7 and the second base body 8. As a result, the first substrate and the second substrate can be bonded satisfactorily, and an electronic device (bonding structure) with excellent electronic components mounted thereon can be obtained.

  The electronic component is a semiconductor element such as an IC chip or an LSI chip, a piezoelectric element such as a crystal vibrator or a piezoelectric vibrator, and various sensors. When the electronic component is a flip-chip type semiconductor element, the electronic component is mounted on the first electrode of the semiconductor element via a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin or the like). When the electronic component is a wire-bonding type semiconductor element, it is made by electrically connecting a wiring conductor formed on either the base body or the second base body. After fixing with a bonding material such as a material, the electrodes of the semiconductor element and the wiring conductor are electrically connected via bonding wires. When the electronic component is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed by a conductive resin, and the electrodes of the piezoelectric element and the wiring conductor are electrically connected.

  And an electronic component is sealed as needed. Sealing is performed by covering the electronic component with a sealing resin such as epoxy resin, or a lid (not shown) made of resin, metal, ceramics, etc., placed so as to cover the electronic component is made of glass, resin, What is necessary is just to carry out by attaching to the package for electronic component accommodation with adhesives, such as a brazing material. For example, in the case of FIG. 5, the electronic component can be hermetically sealed by mounting the electronic component in the space formed by the first base 7 and the second base 8. Thus, it is possible to obtain an electronic device (junction structure) with higher reliability. Further, as shown in FIG. 6, when the first base 7 is made of a wiring board and the second base 8 is made of a seal ring, a lid is welded to the seal ring by a seam weld method or the like. A lid is attached to the second base 8 and the electronic component is hermetically sealed.

  Among such electronic components, if there is a possibility that the function is damaged in a high-temperature environment such as a semiconductor element, the bonding member of the present invention is used to increase the melting temperature of the bonding member. When it can be suppressed, it can be said that the effects of the present invention are better exhibited because the electronic component is previously prevented from being damaged by an increase in the melting temperature.

  The present invention can be variously modified without departing from the scope of the invention. Although the case where the predetermined shape of the joining member 4 is a frame shape has been described above, the joining member 4 includes the first metal material 9 and the second base material 7 of the first base body 7 and the second base body 8. What is necessary is just to manufacture in a predetermined shape according to the shape of a junction part with the metal material 10.

It is sectional drawing of each process which shows an example of embodiment of the manufacturing method of the joining member of this invention. It is sectional drawing of each process which shows an example of embodiment of the manufacturing method of the joining member of this invention. It is a top view which shows the example of embodiment of the joining member of this invention. It is a top view which shows the example of embodiment of the joining member of this invention. It is sectional drawing of each process which shows an example of embodiment of the joining method of the base | substrate of this invention. It is sectional drawing which shows an example of embodiment of the bonding method of the base | substrate of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Metal plate 2 ... Metal film 3 ... Resist photosensitive film 4 ... Joining member 5 ... Connection part 6 ... Holding part 7 ... 1st base | substrate 8 ... 1st 2 bases 9 ... 1st metal member 10 ... 2nd metal member

Claims (11)

A first step of preparing a metal plate made of an alloy including a first metal material and a second metal material having a higher ionization tendency than the first metal material; And a third step of sequentially depositing a metal film made of the same metal as the second metal material on the metal plate processed into a predetermined shape. A method for manufacturing a joining member. 2. The bonding member according to claim 1, wherein the deposited metal film substantially covers an outer surface of a region immersed in an etching solution of the metal plate processed into a predetermined shape. Production method. The method for manufacturing a joining member according to claim 1, wherein the first metal material is silver, and the second metal material is copper. A metal plate made of an alloy containing a first metal material and a second metal material having a higher ionization tendency than the first metal material, processed into a predetermined shape with an etching solution, and attached to the metal plate A joining member comprising a metal film made of the same metal as the second metal material, a first base on which the first metal member is formed, and a second on which the second metal member is formed. A substrate comprising: a first step of preparing a substrate; and a second step of melting the bonding member and bonding the first metal member and the second metal member sequentially. Joining method. 5. The method for bonding substrates according to claim 4, wherein the metal film substantially covers an outer surface of a region immersed in an etching solution of the metal plate processed into a predetermined shape. 6. The method for bonding substrates according to claim 4, wherein the first metal material is silver and the second metal material is copper. A first metal material and a second metal material having a higher ionization tendency than the first metal material, wherein a volume ratio of the second metal material to the first metal material is a predetermined volume ratio (hereinafter referred to as a volume ratio). A first volume ratio), and the first metal material and the second metal material, and the volume ratio of the second metal material to the first metal material is And a second region lower than the first volume ratio (hereinafter referred to as a second volume ratio) and a metal film region made of a metal film made of the same metal as the second metal material. A joining member. The joining member according to claim 7, wherein the metal film substantially covers the entire outer surface of the second region. The joining member according to claim 7, wherein the first metal material is silver, and the second metal material is copper. The first metal member formed on the first base and the second metal member formed on the second base are joined by the joining member according to any one of claims 7 to 9. A featured junction structure. The joining structure according to claim 10, wherein an electronic component is mounted on at least one of the first base and the second base.

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