JP2007264270A - Photosetting conductive composition, baked product pattern and plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photosetting composition excellent in conductivity. <P>SOLUTION: The photosetting composition comprises (A) a thermosetting component, (B) conductive powders, (C) an organic binder, (D) a photopolymerizable monomer and (E) a photopolymerization initiator, wherein the thermosetting component (A) is blended in an amount of 0.1-100 pts.mass based on 100 pts.mass of the organic binder (C). <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an alkali developing type photocurable conductive composition useful for forming a fine electrode circuit on a glass substrate of a plasma display panel (hereinafter abbreviated as PDP) or a ceramic substrate for an electric circuit wiring board. The present invention relates to a product, an electrode formed using the product, a fired product pattern in which an electric circuit is formed, and a plasma display panel having the fired product pattern.

  As a method of forming a pattern layer of a conductor on a substrate, a paste material in which a metal powder is mixed with a non-photosensitive organic binder, for example, a dry conductive paste, is applied onto the substrate using a printing technique such as screen printing. There is a method of patterning.

However, in the patterning method using such a printing technique, although workability is improved at a low cost, it is difficult to form a conductor pattern having a line width of 100 μm or less in an industrially stable manner.
Therefore, recently, a method for forming a conductor pattern using a photocurable conductive composition and utilizing a photolithography technique has been proposed (see Patent Document 1).
However, in the case of a photocurable conductive composition, since conductive powder is sintered by firing to obtain conductivity, the conductivity of the fired product obtained after firing is considered from the true resistance value of the conductive metal used. There was a problem that the resistance value would be twice or more.
JP 2003-162049 A (Claims)

The present invention has been made in order to solve such problems of the prior art, and a main object of the present invention is to provide a photocurable conductive composition having excellent conductivity of a fired product.
Another object of the present invention is to provide an electrode formed using the photocurable conductive composition and a fired product pattern excellent in conductivity formed with an electric circuit.
Furthermore, another object of the present invention is to provide a plasma display panel having an electrode formed by using the photocurable conductive composition and a fired product pattern having an excellent electrical conductivity in which an electric circuit is formed.

In order to achieve the above object, the basic first aspect of the photocurable conductive composition of the present invention includes (A) a thermosetting component, (B) a conductive powder, (C) an organic binder, (D A photocurable conductive composition for firing containing a) a photopolymerizable monomer, and (E) a photopolymerization initiator, wherein the blending amount of (A) thermosetting component is (C) 100 parts by mass of the organic binder. And 0.1 to 100 parts by mass.
Such a photocurable conductive composition of the present invention may be in the form of a paste or may be in the form of a dry film previously formed into a film.
Moreover, according to this invention, the electrode formed using such a photocurable conductive composition, and the baked material pattern which formed the electrical circuit are provided.
Furthermore, according to the present invention, there is provided a plasma display panel having an electrode formed using such a photocurable composition and a fired product pattern on which an electric circuit is formed.

According to the photocurable conductive composition of the present invention, a fired product pattern having a low specific resistance value can be formed, and an increase in resistance value can be suppressed even if the pattern film thickness is reduced. As a result, according to the present invention, it is possible to reduce the thickness of the conductor pattern, which is extremely useful for reducing the manufacturing cost of a member having the conductor pattern.
In addition, as a result of being able to reduce the thickness of the conductor, it is extremely advantageous in terms of resolution for a photocurable conductive composition having poor deep-part curability, and further high-definition patterns can be formed.

As a result of intensive research aimed at realizing the above object, the inventors have found that when a thermosetting component is added to the photocurable conductive composition, a fired product pattern having a low resistance value and excellent conductivity can be formed. It was.
Usually, it is common knowledge that a thermosetting component having poor baking properties is not blended with a baking type conductive composition from the viewpoint of baking properties. However, the inventor has found that by limiting the blending amount of the thermosetting component in the composition, generation of blisters and increase in resistance value due to poor baking properties can be suppressed.
The reason why a fired product pattern having a low resistance value and excellent conductivity can be formed is as follows: (1) thermosetting shrinkage of the thermosetting component, (2) firing shrinkage in the process of burning the cured product, and (3 ) It seems that the change in the burning temperature has some influence on the sintering of the conductive powder. As a result, according to the present invention, a photocurable conductive composition capable of forming a fired product pattern having a low resistance value and excellent conductivity can be provided.
In addition, a fired product pattern using such a photocurable conductive composition of the present invention is extremely useful with high definition and low electrical resistance.

  In such a photocurable conductive composition of the present invention, the thermosetting component (A) includes epoxy resin, phenol resin, melamine resin, alkyd resin, polyurethane resin, polyester resin, acrylic resin, polyimide resin, oxetane. Examples thereof include compounds and modified resins thereof, and these can be used alone or in combination of two or more.

  Among these thermosetting components, a compound having an oxirane ring can be suitably used. For example, bisphenol A type, hydrogenated bisphenol A type, bisphenol F type, bisphenol S type, phenol novolac type, cresol novolak Type, bisphenol A novolak type, biphenol type, bixylenol type, trisphenolmethane type, N-glycidyl type, α-triglycidyl isocyanate, β-triglycidyl isocyanurate, alicyclic epoxy, etc. Although it is mentioned, it is not limited to a specific thing, These can be used individually or in combination of 2 or more types.

The blending ratio of these thermosetting components (A) is suitably from 0.1 to 100 parts by weight, preferably from 10 to 90 parts by weight, per 100 parts by weight of the organic binder. When the blending amount of these thermosetting components is less than 0.1 parts by mass, it is difficult to obtain a sufficiently low specific resistance value. On the other hand, when it exceeds 100 parts by mass, blisters are likely to be generated and the resistance value is likely to increase in the firing process. It is not preferable.
In the present specification, the blister refers to a phenomenon in which organic components in the coating film are gasified in the baking step to lift the coating film and cause the baking coating to bulge.

Any conductive powder (B) may be used as long as it imparts conductivity in the composition. Examples of such conductive powder include simple substances such as Ag, Au, Pt, Pd, Ni, Cu, Al, Sn, Pb, Zn, Fe, Ir, Os, Rh, W, Mo, Ru, and alloys thereof. The oxide thereof, tin oxide (SnO ₂ ), indium oxide (In ₂ O ₃ ), ITO (Indium Tin Oxide), or the like can be used. As the shape of the conductive powder, various shapes such as a spherical shape, a flake shape, and a dentlite shape can be used. In particular, it is preferable to use a spherical shape in consideration of optical characteristics and dispersibility.

Such conductive powder has an average particle size of 0.05 to 4 μm, preferably 0.1 to 2 μm. This is because if the average particle size is less than 0.05 μm, the light transmittance is poor and pattern formation becomes difficult. On the other hand, if the average particle diameter exceeds 4 μm, line linearity cannot be obtained.
The blending amount of such conductive powder is 50 to 90% by mass in the composition excluding the solvent. When the blending amount of the conductive powder is less than the above range, sufficient conductivity of the conductor pattern cannot be obtained. On the other hand, when the amount exceeds the above range, the adhesion with the base material is deteriorated, which is not preferable. .

Next, the organic binder (C) has a carboxyl group-containing resin, specifically, a carboxyl group-containing photosensitive resin having an ethylenically unsaturated double bond and an ethylenically unsaturated double bond. Any carboxyl group-containing resin can be used.
These carboxyl group-containing photosensitive resins and carboxyl group-containing resins may be used alone or in combination, but in any case, they may be blended in a proportion of 1 to 20% by mass of the total amount of the composition. preferable. When the blending amount of these polymers is less than the above range, the distribution of the resin in the film to be formed tends to be non-uniform, and it is difficult to obtain sufficient photocurability and photocuring depth, and patterning by selective exposure and development. It becomes difficult. On the other hand, when the amount is larger than the above range, it is not preferable because the pattern is distorted or the line width is easily shrunk during firing.

  The carboxyl group-containing photosensitive resin and the carboxyl group-containing resin each have a weight average molecular weight of 1,000 to 100,000, preferably 5,000 to 70,000, and an acid value of 50 to 250 mgKOH / It is preferable that it is g. Furthermore, in the case of a carboxyl group-containing photosensitive resin, those having a double bond equivalent of 350 to 2,000 g / equivalent, preferably 400 to 1,500 g / equivalent can be suitably used. When the weight average molecular weight of the resin is less than 1,000, it adversely affects the adhesion of the film during development. On the other hand, when it exceeds 100,000, development failure tends to occur, which is not preferable. When the acid value is less than 50 mg KOH / g, the solubility in an alkaline aqueous solution is insufficient and the development is likely to be poor. On the other hand, when the acid value exceeds 250 mg KOH / g, the adhesion of the film is deteriorated during development or the photocured part ( This is not preferable because dissolution of the exposed portion) occurs. Furthermore, in the case of a carboxyl group-containing photosensitive resin, if the double bond equivalent of the photosensitive resin is less than 350 g / equivalent, a residue tends to remain during firing, whereas if it exceeds 2,000 g / equivalent, This is not preferable because the work margin is narrow and a high exposure amount is required during photocuring.

  In the present invention, the photopolymerizable monomer (D) is used for promoting the photocurability of the composition and improving the developability. Examples of the photopolymerizable monomer (D) include 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, polyurethane diacrylate, trimethylolpropane triacrylate, penta Erythritol triacrylate, pentaerythritol tetraacrylate, trimethylolpropane ethylene oxide modified triacrylate, trimethylolpropane propylene oxide modified triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and each methacrylate corresponding to the above acrylate; phthalic acid , Adipic acid, maleic acid, octopus Examples include mono-, di-, tri- or higher polyesters of polybasic acids such as acids, succinic acid, trimellitic acid, terephthalic acid, and hydroxyalkyl (meth) acrylate, but are limited to specific ones. These are not intended, and these can be used alone or in combination of two or more. Among these photopolymerizable monomers, polyfunctional monomers having two or more acryloyl groups or methacryloyl groups in one molecule are preferable.

  The amount of such photopolymerizable monomer (D) is suitably 20 to 120 parts by mass per 100 parts by mass of the organic binder (carboxyl group-containing photosensitive resin and / or carboxyl group-containing resin) (C). . When the blending amount of the photopolymerizable monomer (D) is less than the above range, it is difficult to obtain sufficient photocurability of the composition. On the other hand, when the amount exceeds the above range, the surface is larger than the deep part of the film. Since the photo-curing of the part is accelerated, uneven curing is likely to occur.

Specific examples of the photopolymerization initiator (E) include benzoin and benzoin alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2, Acetophenones such as 2-diethoxy-2-phenylacetophenone and 1,1-dichloroacetophenone; 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2- Dimethylamino-1- (4-morpholinophenyl) -butanone-1,2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1 -Aminoacetophenones such as butanone; 2-methyla Anthraquinones such as traquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone, 1-chloroanthraquinone; 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropylthioxanthone, etc. Thioxanthones; ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; benzophenones such as benzophenone; or xanthones; (2,6-dimethoxybenzoyl) -2,4,4-pentylphosphine oxide, bis (2,4,4) 6-trimethylbenzoyl) -phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, ethyl-2,4,6-trimethylbenzoylphenylphosphine Phosphine oxide such as preparative; various peroxides and the like can be used alone or in combination of two or more of these conventionally known photopolymerization initiator.
The blending ratio of these photopolymerization initiators (E) is suitably 1 to 30 parts by mass per 100 parts by mass of the organic binder (carboxyl group-containing photosensitive resin and / or carboxyl group-containing resin) (B), Preferably, it is 5-20 mass parts.

The photopolymerization initiator (E) is composed of N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, triethanolamine. It can be used in combination with one or more photosensitizers such as tertiary amines.
Furthermore, when a deeper photocuring depth is required, a titanocene photopolymerization initiator such as Irgacure 784 manufactured by Ciba Specialty Chemicals, which starts radical polymerization in the visible region, and leuco dyes are cured as necessary. It can be used in combination as an auxiliary agent.

In the photocurable conductive composition of the present invention, a glass powder (F) having a softening point of 400 to 600 ° C. is blended in a quantitative ratio that does not impair the characteristics of the photocurable conductive composition of the present invention, if necessary. Can do.
The glass powder can be blended at a ratio of 50 parts by mass or less, preferably 10 parts by mass or less per 100 parts by mass of the conductive powder (B) in order to improve the adhesion with the conductor circuit after firing. The reason is that if the blending amount is larger than the above range, sufficient conduction cannot be obtained after firing, which is not preferable. As this glass powder, that whose glass transition point (Tg) is 300-500 degreeC and whose glass softening point (Ts) is 400-600 degreeC is preferable. When the softening point of the glass powder is lower than 400 ° C., the organic binder is likely to be encapsulated, and the remaining organic binder is decomposed, so that blisters are easily generated in the composition. From the viewpoint of resolution, it is preferable to use glass powder having an average particle size of 10 μm or less, preferably 3 μm or less.

  As the glass powder, an amorphous frit mainly composed of lead oxide, bismuth oxide, zinc oxide or the like can be preferably used.

  In the present invention, when a large amount of inorganic powder is blended in the photocurable conductive composition, the storage stability of the resulting composition is poor, and the coating workability tends to be poor due to gelation and fluidity deterioration. Therefore, in the composition of the present invention, in order to improve the storage stability of the composition, a compound having an effect of complexing or forming a salt with a metal or oxide powder which is a component of the inorganic powder is added as a stabilizer. be able to. Stabilizers include various inorganic acids such as nitric acid, sulfuric acid, hydrochloric acid, and boric acid; various types such as formic acid, acetic acid, acetoacetic acid, citric acid, stearic acid, maleic acid, fumaric acid, phthalic acid, benzenesulfonic acid, and sulfamic acid Organic acids: phosphoric acid, phosphorous acid, hypophosphorous acid, methyl phosphate, ethyl phosphate, butyl phosphate, phenyl phosphate, ethyl phosphite, diphenyl phosphite, mono (2-methacryloyloxyethyl) acid Acids, such as various phosphoric acid compounds (inorganic phosphoric acid, organic phosphoric acid), such as a phosphate, are mentioned, It can use individually or in combination of 2 or more types.

  In the present invention, the composition is made into a paste by diluting, enabling an easy coating process, then drying to form a film, and blending an appropriate amount of an organic solvent to enable contact exposure. Can do. Specifically, ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene; cellosolve, methyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, di Glycol ethers such as propylene glycol monomethyl ether, dipropylene glycol monoethyl ether, triethylene glycol monoethyl ether; ethyl acetate, butyl acetate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate , Esters such as 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate; Alcohols such as ethanol, propanol, ethylene glycol, propylene glycol, and terpineol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha, 2,2,4 -Trimethyl- 1, 3-pentanediol monoisobutyrate etc. are mentioned, These can be used individually or in combination of 2 or more types.

  The photocurable conductive composition of the present invention can contain a thermosetting catalyst such as an epoxy resin in addition to the above components. Examples of the thermosetting catalyst include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1- Imidazole derivatives such as (2-cyanoethyl) -2-ethyl-4-methylimidazole; imidazoline derivatives such as 2-ethylimidazoline; dicyandiamide, benzyldimethylamine, 4- (dimethylamino) -N, N-dimethylbenzylamine, 4 -Amine compounds such as -methoxy-N, N-dimethylbenzylamine and 4-methyl-N, N-dimethylbenzylamine; hydrazine compounds such as adipic hydrazide and sebacic acid hydrazide; phosphorus compounds such as triphenylphosphine It is, but not limited thereto as long as it promotes the curing reaction of the thermosetting component, may be used alone, or two or more thereof.

  Guanamine, acetoguanamine, benzoguanamine, melamine, 2,4-diamino-6-methacryloyloxyethyl-S-triazine, 2-vinyl-4,6-diamino-S-triazine, 2 S-triazine derivatives such as -vinyl-4,6-diamino-S-triazine / isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-S-triazine / isocyanuric acid adduct can also be used, Preferably, a compound that also functions as an adhesion-imparting agent can be used in combination with the thermosetting catalyst.

  The photo-curable conductive composition of the present invention is also used for the purpose of improving properties such as adhesion and hardness, and if necessary, barium sulfate, barium titanate, silicon oxide powder, amorphous silica, talc, clay, kaolin. In addition, known inorganic fillers such as magnesium carbonate, calcium carbonate, aluminum oxide, aluminum hydroxide, glass fiber, carbon fiber, and mica powder can be blended.

  Furthermore, if necessary, known and conventional thermal polymerization inhibitors such as hydroquinone, hydroquinone monomethyl ether, tert-butylcatechol, pyrogallol and phenothiazine, known conventional thickeners such as fine silica, organic bentonite and montmorillonite, silicone type, Additives such as anti-foaming agents and / or leveling agents such as fluorine-based and polymer-based, commonly used adhesion imparting agents such as imidazole-based, thiazole-based, triazole-based, and silane coupling agents, and dispersion aids Can be blended.

  The photocurable conductive composition of the present invention may be laminated on a substrate when it is previously formed into a film, but in the case of a paste-like composition, a screen printing method, a bar coater, a blade coater, etc. The coating method is applied to a substrate, for example, a glass substrate serving as a front substrate of a PDP, and then in order to obtain a touch-drying property, for example, in a hot air circulation drying furnace, a far infrared drying furnace, etc. Dry about a minute to evaporate the organic solvent to obtain a tack-free coating. Thereafter, selective exposure, development, and baking are performed to form an electrode circuit having a predetermined pattern.

As the exposure step, contact exposure and non-contact exposure using a negative mask having a predetermined exposure pattern are possible. As the exposure light source, a halogen lamp, a high-pressure mercury lamp, a laser beam, a metal halide lamp, an electrodeless lamp, or the like is used. The exposure amount is preferably about 50 to 1000 mJ / cm ² .

  As the development process, a spray method, an immersion method, or the like is used. Developers include aqueous alkali metal solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate and sodium silicate, and aqueous amine solutions such as monoethanolamine, diethanolamine and triethanolamine, especially about 1.5% by mass or less. A dilute alkaline aqueous solution having a concentration of 1 is preferably used, as long as the carboxyl group of the carboxyl group-containing resin in the composition is saponified and the uncured part (unexposed part) is removed. It is not limited to. Moreover, it is preferable to wash with water in order to remove an unnecessary developer after development.

In the baking step, the substrate after development is subjected to heat treatment at about 500 to 620 ° C. in air or in a nitrogen atmosphere to form a desired pattern.
The film thickness of the pattern after firing is preferably 1 to 6 μm. When the fired film thickness is thinner than the above range, pattern disconnection, pinholes and the like are likely to occur, and it is difficult to obtain sufficient conduction. If the thickness exceeds the above range, pattern formation becomes difficult, which is not preferable.

  EXAMPLES Hereinafter, although this invention is demonstrated concretely based on an Example, it cannot be overemphasized that this invention is not limited to the following Example. In the following, “parts” are all parts by mass unless otherwise specified.

  Using the thermosetting component, the organic binder, and the conductive powder shown in Table 1 below, Composition Examples 1 to 8 and Comparative Composition Examples 1 and 2 were blended at the composition ratio shown below, and stirred with a stirrer. Thereafter, paste was formed by kneading with a three-roll mill.

As an organic binder, a carboxyl group-containing resin PB-383 (Tg = 63 ° C., acid value = 176 mgKOH / g, weight average molecular weight = 26,000) manufactured by Mitsubishi Rayon Co., Ltd. was used as 2,2,4-trimethyl-1,3. -What was melt | dissolved in the pentanediol monoisobutyrate and made solid content 40 wt% was used.
As the conductive powder, a silver powder having an average particle size of 1.7 μm was used.

(Composition Example 1)
Organic binder 250.0 parts Trimethylolpropane triacrylate 90.0 parts 2-Methyl-1- [4- (methylthio) phenyl]-
2-morpholinopropan-1-one 15.0 parts Silver powder 500.0 parts Thermosetting component (A-1) 16.0 parts Phosphate ester 2.0 parts Antifoam / leveling agent (XL490-50: Ito Oil) 6.0 parts)

(Composition Example 2)
The component composition was the same as that of Composition Example 1 except that the amount of the thermosetting component (A-1) was 40.0 parts.

(Composition Example 3)
It was set as the component composition similar to the composition example 1 except having set the compounding quantity of the thermosetting component (A-1) to 80.0 parts.

(Composition Example 4)
The component composition was the same as that of Composition Example 2 except that the thermosetting component (A-1) was replaced with the thermosetting component (A-2).

(Composition Example 5)
The component composition was the same as that of Composition Example 2 except that the thermosetting component (A-1) was replaced with the thermosetting component (A-3).

(Composition Example 6)
The component composition was the same as that of Composition Example 2 except that the thermosetting component (A-1) was replaced with the thermosetting component (A-4).

(Composition Example 7)
The component composition was the same as that of Composition Example 2 except that the thermosetting component (A-1) was replaced with the thermosetting component (A-5).

(Composition Example 8)
The component composition was the same as that of Composition Example 2 except that the thermosetting component (A-1) was replaced with the thermosetting component (A-6).

(Comparative composition example 1)
It was set as the component composition similar to the composition example 1 except remove | excluding a thermosetting component (A-1).

(Comparative composition example 2)
The component composition was the same as that of Composition Example 1 except that the amount of the thermosetting component (A-1) was 120 parts.

  About each paste of composition example 1-8 obtained by doing in this way and comparative composition example 1-2, the film thickness after baking, the measurement of a resistance value, a specific resistance value, and blister evaluation were performed. The evaluation method is as follows.

On the glass substrate, the evaluation paste was applied to the entire surface using a 100 mesh polyester screen, and then dried at 90 ° C. for 25 minutes in a hot air circulating drying oven to form a film having good touch drying properties. . Then, using the negative mask capable of forming a line pattern dimensions 4 mm × 100 mm, after the accumulated amount of the composition was exposed so as to _{^{800mJ / cm 2, 0.5wt% Na}} 2 CO 3 aqueous solution temperature 30 ° C. Development was carried out using and washed with water. Finally, the temperature was raised at 5 ° C./min in an air atmosphere and baked at 560 ° C. for 5 minutes to prepare a test piece.

Film thickness:
The film thickness was measured with a surface roughness meter (SE-30H manufactured by Kosaka Laboratory Ltd.) using the above test piece.

Resistance value:
The resistance value was measured with a tester (HIOKI 3540 mΩ HITESTER) using the test piece.

Specific resistance value:
The specific resistance value was calculated from the obtained film thickness and resistance value according to the following formula.
Specific resistance value ρ (Ω · cm) =
Film thickness (cm) x pattern width (cm) x resistance value R (Ω) / thickness l (cm)

Blister:
The fired product pattern was visually evaluated for the presence of blisters.

These evaluation results are shown in Table 2.

  As is apparent from the results shown in Tables 2 and 3, it was found that the paste according to the composition of the present invention can form a pattern having a sufficiently low specific resistance value as compared with the paste of the comparative composition example. Therefore, according to the present invention, the conductor pattern can be thinned. In addition, when the thermosetting component is increased, blisters are generated, and when there is no thermosetting component, the specific resistance value tends to be high.

In addition, about the said paste for evaluation, although the line shape after image development, the line shape after baking, and line resistance were evaluated, all did not have a problem. The substrates used for these evaluations were coated on the entire surface of a glass substrate with an evaluation paste using a 200-mesh polyester screen, and then dried in a hot air circulation oven at 90 ° C. for 25 minutes to dry the touch. A film having good properties was formed. Then, after the integrated quantity of light on the composition using a negative film as a line / space = 100/100 [mu] m was exposed to a 500 mJ / cm ^2, the 0.5wt% _Na 2 CO ₃ aqueous solution temperature 30 ° C. It was used for development and washed with water. Finally, the temperature was raised at 5 ° C./min in an air atmosphere and baked at 600 ° C. for 5 minutes to produce a substrate.

For these substrates, the pattern that has been completed until development is observed with a microscope, and the lines are evaluated for irregularity and distortion, and for the line shape after firing, the pattern that has been completed until firing is observed with a microscope. However, the lines were evaluated for irregularity and no distortions, but none of them was a problem.

Claims (6)

A photocurable composition for firing comprising (A) a thermosetting component, (B) a conductive powder, (C) an organic binder, (D) a photopolymerizable monomer, and (E) a photopolymerization initiator. (A) The compounding quantity of a thermosetting component is 0.1-100 mass parts with respect to 100 mass parts of (C) organic binder, The photocurable conductive composition characterized by the above-mentioned. The composition according to claim 1, wherein the thermosetting component (A) is a compound having an oxirane ring. The composition according to claim 1, wherein the conductive powder (B) is a silver powder. The electrode formed using the photocurable conductive composition of any one of the said Claims 1 thru | or 3. The baked product pattern which formed the electric circuit using the photocurable conductive composition of any one of the said Claims 1 thru | or 3. The plasma display panel which has the baked material pattern which formed the electrode or the electric circuit using the photocurable conductive composition of any one of the said Claims 1 thru | or 3.