JP2007258506A5 - - Google Patents

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Publication number
JP2007258506A5
JP2007258506A5 JP2006081995A JP2006081995A JP2007258506A5 JP 2007258506 A5 JP2007258506 A5 JP 2007258506A5 JP 2006081995 A JP2006081995 A JP 2006081995A JP 2006081995 A JP2006081995 A JP 2006081995A JP 2007258506 A5 JP2007258506 A5 JP 2007258506A5
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JP
Japan
Prior art keywords
thermal conductive
high thermal
wiring board
printed wiring
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006081995A
Other languages
English (en)
Japanese (ja)
Other versions
JP4540630B2 (ja
JP2007258506A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006081995A priority Critical patent/JP4540630B2/ja
Priority claimed from JP2006081995A external-priority patent/JP4540630B2/ja
Publication of JP2007258506A publication Critical patent/JP2007258506A/ja
Publication of JP2007258506A5 publication Critical patent/JP2007258506A5/ja
Application granted granted Critical
Publication of JP4540630B2 publication Critical patent/JP4540630B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006081995A 2006-03-24 2006-03-24 高熱伝導プリント配線板 Expired - Fee Related JP4540630B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006081995A JP4540630B2 (ja) 2006-03-24 2006-03-24 高熱伝導プリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006081995A JP4540630B2 (ja) 2006-03-24 2006-03-24 高熱伝導プリント配線板

Publications (3)

Publication Number Publication Date
JP2007258506A JP2007258506A (ja) 2007-10-04
JP2007258506A5 true JP2007258506A5 (enrdf_load_stackoverflow) 2007-12-27
JP4540630B2 JP4540630B2 (ja) 2010-09-08

Family

ID=38632432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006081995A Expired - Fee Related JP4540630B2 (ja) 2006-03-24 2006-03-24 高熱伝導プリント配線板

Country Status (1)

Country Link
JP (1) JP4540630B2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5252221B2 (ja) * 2009-06-02 2013-07-31 オンキヨー株式会社 圧電発振器
US9869520B2 (en) * 2014-07-25 2018-01-16 Toyota Motor Engineering & Manufacturing North America, Inc. Heat transfer management apparatuses having a composite lamina

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04257286A (ja) * 1991-02-08 1992-09-11 Hitachi Cable Ltd 複合プリント配線基板
JPH06125156A (ja) * 1992-10-12 1994-05-06 Nippon Rika Kogyosho:Kk 金属ベース基板
JPH06244511A (ja) * 1993-02-18 1994-09-02 O K Print:Kk プリント配線基板
JPH10173298A (ja) * 1996-12-10 1998-06-26 Murata Mfg Co Ltd 電子機器
JP2001068878A (ja) * 1999-08-31 2001-03-16 Hitachi Ltd 発熱体近傍に金属コアを設置した制御装置
JP2001111237A (ja) * 1999-10-04 2001-04-20 Mitsubishi Electric Corp 多層プリント基板及び電子機器
JP2004153142A (ja) * 2002-10-31 2004-05-27 Kubota Corp 電子回路基板

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