JP2007246170A - Storing tray for semiconductor package and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To keep a semiconductor package safely by buffering sway even if the semiconductor package is particularly swayed with respect to a storing tray for the semiconductor package used for storing and moving the semiconductor package. <P>SOLUTION: The storing tray for the semiconductor package is provided which is characterized in that it comprises a body 110 of a first material of a flat plate shape, a plurality of mounting holes 114 are formed so as to penetrate the body 110, a pocket 120 of a second material which is mounted so as to surround the inside face of the mounting hole 114 and which provides a space capable of storing the semiconductor package, and a space for injection molten passage which is formed at least between a pair of the mounting holes 114 and used to guide the second material to the mounting hole 114. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a semiconductor package storage tray used for storing / moving a semiconductor package, and more particularly, to a semiconductor package storage tray that can be stored safely by being buffered even if the semiconductor package is shaken, and a manufacturing method thereof.

In general, a semiconductor package container is used for packaging for delivery to a user after completion of movement between processes of the semiconductor package, assembly, and electrical inspection.
As such semiconductor package containers, there are tubes and trays. Tubes are mainly used for surface insertion type, J-lead type semiconductor packages, while trays are , Gullwing type, Ball grid array type (BGA type) and Chip scale package type (CSP type) semiconductor package Recently, as semiconductor packages are becoming smaller and thinner, there is an increasing need for trays rather than tubes.

In particular, in the case of CSP and Wafer Level CSP (WLCSP), whose development has been accelerated in recent years, sealing using a molding resin such as a conventional Epoxy Molding Compound (EMC). It is manufactured in a wafer state without a process.
Usually, when CSP and WLCSP (hereinafter referred to as CSP) and WLCSP are included, a part of a silicon-made semiconductor element is exposed to the outside, so that CSP is very vulnerable to external impacts. There is. That is, the silicon material has brittleness that is easily broken even by a weak impact from the outside.

Also, a relatively large and heavy type semiconductor package such as BGA may be subjected to an impact due to a drop during transportation of the tray. As a result, the BOL external terminal of the BGA There is a problem that it is deformed or dropped and damaged.
On the other hand, although the entire tray can be formed of a soft material with low hardness, such a soft material tray is deformed and cannot be laminated when subjected to a baking process or the like at a high temperature of 150 ° C. or higher, There is a problem that it is impossible to ship using equipment during the process.

  In order to solve such problems, a technique is disclosed in which a pocket for storing a semiconductor package is made of a soft material unlike other portions of the tray (see, for example, Patent Document 1 and Patent Document 2). .) In particular, a pocket made of a soft material can be assembled and manufactured, or the pocket and other parts can be manufactured at the same time by a double molding method using different materials.

Korean Patent Application Publication No. 2001-008962 Korean Patent Application Publication No. 2001-0098728

  However, conventional storage trays for semiconductor packages are difficult to assemble soft material pockets on other parts of hard material trays, which reduces productivity and doubles pockets and other parts of the tray with different materials. Manufacturing by the molding method also has the problem that the mold becomes complicated and the production cost increases.

The present invention has been devised in order to solve the above-described problems of the prior art, and a semiconductor which is fixed in one piece at the same time as a pocket made of a soft material in a body made of different materials in advance. It is an object to provide a storage tray for a package and a manufacturing method thereof.
Another object of the present invention is to provide a storage tray for a package that can increase the bonding force between the main body and the pocket and prevent deformation of the pocket, which is a soft material, and a method for manufacturing the same.
Another object of the present invention is to provide a storage tray for a semiconductor package that can store a large number of semiconductor packages in a limited space, and a manufacturing method thereof.

  In order to solve the above problems, the present invention is mounted so as to surround a flat plate-shaped first material main body, a plurality of mounting holes formed so as to penetrate the main body, and an inner surface of the mounting hole, A semiconductor comprising: a pocket made of a second material that provides a space for housing a semiconductor package; and a space for an injection runner that is formed between at least a pair of mounting holes and guides the second material to the mounting holes. Provide storage tray for packages.

In the above invention, the main body may further include at least one protrusion protruding from the upper and lower surfaces around the mounting hole and covered by the pocket.
Moreover, the mounting hole may have a quadrangular shape and the corners may be partially expanded.
Further, the injection runner space may be at least one slot that is positioned between at least a pair of pockets and is formed to penetrate the main body.

Also, a plurality of rows of mounting holes made up of a plurality of mounting holes may be formed, and a slot may be provided between a pair of mounting hole rows.
Further, the slot may further include a bent portion adjacent to the mounting hole.

Moreover, the space for pouring runners is located between at least a pair of pockets, and may be formed between the main body and molds inserted into the upper and lower surfaces of the main body.
Moreover, the space for pouring runners may be formed only in one side among the upper and lower surfaces of a main body.

In addition, at least two pockets may be connected to each other by a runway space.
The main body may be made of a hard material, and the pocket may be made of a softer material than that of the main body.

The pocket is a thermoplastic elastic body (Thermoplastic) made of rubber and thermoplastic resin.
Elastomer (TPE) may be used.
Further, the pocket may include an assembly portion that engages so as to surround a predetermined area of the inner periphery and upper and lower surfaces of the mounting hole, and a guide portion that protrudes to accommodate the semiconductor package on the upper and lower surfaces of the assembly portion. .
Further, the guide portion of the pocket may have an inclined surface so that the package can be seated.

  In addition, the present invention is obtained in a body molding stage in which a body is injection-molded with a raw material of a first material so that a plurality of rows formed in a plurality of mounting holes are arranged in a plurality of rows, and the body molding stage. A pocket in which a main body is inserted between a pair of molds, and a raw material of the second material is injected into a space between the main body and the mold through a runner space formed between mounting holes, and a pocket is injection molded. A method for manufacturing a semiconductor storage tray is provided.

In the above invention, the molding step of the main body may include a process in which at least one protrusion is injection-molded simultaneously with the mounting hole so as to protrude from the upper and lower surfaces around the mounting hole.
In addition, the body molding step may include a process in which at least one slot formed between the mounting holes and penetrating the body is injection-molded simultaneously with the mounting holes.

Further, the pocket forming step may include a process of fitting the mold so as to cover the mounting hole and the protrusion.
The pocket forming step includes a first process in which the second raw material is injected into the runner injection space between the mold and the slot, and the second raw material injected in the first process is in the mold, the main body, and the mounting hole. It is good also as including the 2nd process inject | poured into the space between.

Further, the pocket forming step may further include a third step of removing the second raw material remaining in the slot when the pocket is injection-molded after the second step.
The pocket forming stage includes a first process in which the second raw material is injected into the runner injection space between the mold and one surface of the main body, and the second raw material injected in the first process is the mold and the main body. And a process of being injected into the space between the mounting holes.

  According to the semiconductor package storage tray and the method of manufacturing the same according to the present invention, a plurality of mounting holes and a plurality of slots are formed. Because the pockets that the molten metal is poured into and the semiconductor package is integrally formed by insert molding, it is possible to store the semiconductor package safely against impacts with the soft material pocket, and the soft material pocket is hard Since it can be manufactured integrally with the main body of the material and at the same time mechanically fixed to each other, there is an advantage that the production process can be simplified.

  Further, the semiconductor package storage tray and the manufacturing method thereof according to the present invention can not only collect and recycle the soft material left so as to be connected to each pocket in each slot formed in the main body, The mold can also have a simple configuration, and there is an advantage that the production cost can be reduced.

  The semiconductor package storage tray according to the present invention and a method for manufacturing the same are a method of injecting and injecting a material in which rubber and a thermoplastic resin are blended in a state where a main body made of a thermoplastic resin is engaged with a pair of molds. Since it is manufactured by insert molding, fusion occurs at the interface between these dissimilar materials, and a firm mechanical engagement can be secured between the tray body and the pocket.

  In addition, the semiconductor package storage tray and the manufacturing method thereof according to the present invention produce a flat plate-shaped main body having a plurality of slots. There is an advantage that it is possible to prevent the occurrence of distortion and to stably store the semiconductor package for a long time.

  Further, the semiconductor package storage tray according to the present invention and the manufacturing method thereof are provided with a mounting hole in the main body, auxiliary holes extended from these mounting holes, and protrusions protruding from the upper and lower surfaces around the mounting hole. Since the inner surface and upper and lower surfaces of the hole and the auxiliary hole are surrounded so as to cover the protrusion, the pocket can be more firmly connected to the main body, and the soft material pocket can be connected to the more rigid material main body. The portion is supported, and deformation due to heat treatment or the like can be reduced.

  In addition, the semiconductor package storage tray and the manufacturing method thereof according to the present invention can form a pocket raw material between the mold and one side of the body if the mold is engaged with the body in order to insert the pocket into the body at a time. Therefore, it is not necessary to form a separate runner space such as a slit or a hole between the mounting holes of the main body. The semiconductor devices can be arranged precisely and can accommodate a large number of semiconductor packages in a limited space.

Hereinafter, a semiconductor package storage tray and a manufacturing method thereof according to a first embodiment of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a plan view showing a first embodiment of a storage tray for a semiconductor package according to the present invention, FIG. 2 is a longitudinal sectional view taken along line AA in FIG. 1, and FIG. FIG. 4 and FIG. 5 are perspective views showing respective components of the semiconductor package storage tray of FIG.

  The semiconductor package storage tray according to the first embodiment of the present invention includes a main body 110 in which a plurality of mounting holes 114 and a plurality of slots 116 are formed in a rectangular flat plate as shown in FIGS. And a pocket 120 formed by insert molding by inserting a soft material into each mounting hole 114 through each slot 116 in a state where the main body 110 is inserted into a pair of molds in the vertical direction. The pocket 120 allows the semiconductor package to be safely stored against impact when the semiconductor package is received.

  Specifically, the main body 110 is injection-molded with a plastic such as MPPO (Modified Polyphenylene Oxide) which is relatively hard compared to the pocket 120 or a plastic such as PP (polypropylene) which is a hard material. Preferably, the handle 112 is formed on both sides thereof, and the mounting holes 114 are formed in a lattice shape in the center at predetermined intervals in the row direction and the column direction.

  Here, the mounting holes 114 are divided into a first region 114A in which the mounting holes 114 are arranged in a row and a second region 114B in which the mounting holes 114 are also arranged in a row at a predetermined interval in the row direction. A slot 116 is formed between the first and second regions 114A and 114B of each mounting hole so as to be elongated in the column direction. One slot 116 is adjacent to each mounting hole 114 on both sides. Bent portions 116a that are bent on both side surfaces may be formed.

  In particular, the first and second regions 114A and 114B and one slot 116 of each mounting hole mesh with the pair of molds A and B in the vertical direction to form one runner, and insert molding is performed to each pocket 120. In order to achieve this, a pair of molds are engaged with the mounting holes 114 to form the same shape as the pockets 120. A recess communicating with the two slots 116 is formed inside.

  Of course, it is preferable that a plurality of first and second regions 114A and 114B of the mounting holes and the slots 116 therebetween are formed in the main body 110 at a predetermined interval. A unit in which the two mounting holes 114 are arranged in a row can be formed, but a plurality of such units can be formed.

  Further, the main body 110 has a plurality of stacked portions 111a and 111b protruding from the outer peripheral edge by the height of the pocket 120 in the vertical direction. Engage and stack.

Next, the pocket 120 is manufactured by insert molding with a soft material into each mounting hole 114 of the main body, and at the same time, is fixed integrally, but a thermoplastic elastomer (Thermoplastic Elastomer: TPE) made of rubber and thermoplastic resin. It is preferable to manufacture with a soft material.
More specifically, the pocket 120 is mechanically engaged so as to cover a predetermined area on the inner periphery and upper and lower surfaces of each mounting hole 114, and protrudes vertically from the upper and lower surfaces of the assembly portion 122 to project the semiconductor package. It consists of guide parts 124a and 124b for guiding storage.

  At this time, the assembly part 122 can reduce the material by forming the through hole 122h in the center thereof, but variously configured to further reduce the contact surface with each mounting hole 114 from the development of the technology. be able to.

  A plurality of guide portions 124 a and 124 b are formed in a lattice shape on the inner periphery of the upper and lower surfaces of the assembly portion 122, but the upper guide portion 124 a formed on the upper surface of the assembly portion 122 and the lower surface of the assembly portion 122. The lower guide portions 124b formed in the above are formed so as not to cross each other, and can be supported more stably.

In particular, the upper guide part 124a has an inclined surface 124a 'so that the package can be safely seated in the storage space, and various shapes such as a ball, a pin, and a rectangular shape protruding from the lower surface of the semiconductor package. The contact terminal is accommodated in a storage space formed of a soft material. In this case, since each pocket 120 is formed of a soft material, even if the electrical contact terminal as described above directly contacts the surface of each pocket 120, the pocket 120 is not damaged.
Here, the upper and lower guide portions 124a and 124b are formed to have a height lower than that of the stacked portions 111a and 111b, thereby preventing crossing each other.

6A to 6D are longitudinal sectional views showing a method for manufacturing the semiconductor package storage tray of the first embodiment of FIG. 1 according to the present invention.
Hereinafter, the manufacturing process of the semiconductor package storage tray according to the first embodiment configured as described above will be described.

  After the main body 110 is manufactured such that the mounting holes 114 and the slots 116 are formed by injection molding of a hard plastic as described above, a pair of gold is formed in the vertical direction of the main body 110 as shown in FIG. 6A. Although the molds are engaged with each other, one slot 116 and each mounting hole 114 arranged in a line on both sides thereof are engaged with a pair of molds A and B to form one runner.

  Here, the pair of molds A and B are respectively formed with recesses A1 and B1 that mesh with the mounting holes 114 of the main body 110 to form the same shape as the pockets 120. The recesses A1 and B1 are configured to communicate with one slot 116, and one mold A is formed with an injection flow path A2 into which molten metal is injected so as to communicate with the slot 116.

Next, after the main body 110 is inserted between the pair of molds A and B, as shown in FIG. 6B, the thermoplastic elastic body (Thermoplastic made of rubber and thermoplastic resin through the injection flow path A2).
Elastomer (TPE) is injected and injected, but the molten metal injected through the injection flow path A2 flows from the center of the slot 116 into the mounting holes 114 and the recesses A1 and A2 of the molds.

  At this time, since each mounting hole 114 and one slot 116 are formed close to each other, it is not necessary to form a complicated flow path connecting from the slot 116 to the recesses A1 and B1 of each mold. The design can be simplified.

  Next, when the pair of molds A and B are removed from the main body 110 after the thermoplastic elastic body has hardened over time, the pockets 120 are inserted into the mounting holes 114 of the main body 110 as shown in FIG. 6C. Injection molded.

  At this time, when the main body 110 is made of engineering plastic, which is a kind of thermoplastic resin, and the pocket 120 is also made of a thermoplastic elastic body including a thermoplastic resin, the main body 110 and the pocket 110 are formed during the injection molding of the pocket 120. A predetermined fusion occurs with one surface of the abutting pocket 120, and as a result, the effect that the mechanical engagement of the pocket 120 with the mounting hole 114 of the body can be further enhanced. . In any case, at the same time that each pocket 120 is manufactured, it is mechanically engaged and fixed in each mounting hole 120, so that a separate assembly process can be omitted and the production process can be simplified. it can.

  Of course, the thermoplastic elastic body is cured in each mounting hole 114 of the main body 110 to form the pocket 120, but the thermoplastic elastic body is also cured and remains in the slot 116. As shown in FIG. 6D, the thermoplastic elastic body solidified in the slot 116 and remaining can be separated and recycled.

FIG. 7 is a plan view showing a second embodiment of the storage tray for a semiconductor package according to the present invention, and FIGS. 8 to 10 are views each showing a part of FIG.
In the second embodiment of the semiconductor package storage tray according to the present invention, as shown in FIGS. 7 to 10, a plurality of mounting holes 214 and a plurality of protrusions 216A and 216B are formed inside a rectangular flat plate. A soft material is introduced into each mounting hole 214 through a main body 210 and a runner space formed between the mounting holes 214 in a state where the main body 210 is engaged with a pair of molds in the vertical direction. The pocket 220 is formed by insert molding, and a semiconductor package is accommodated in the pocket 220 and can be safely stored against impact.

Specifically, the main body 210 is relatively hard material compared to the pocket 220, such as MPPO (Modified
It is preferable to be injection-molded with a plastic such as Poly Penyline Oxide or a plastic such as PP (polypropylene) which is a hard material, but the laminated part protrudes by the vertical height of the pocket 220 along its outer periphery. A plurality of main bodies 210 are stacked so that the stacked portions 211A and 211B are engaged with each other in the vertical direction so as to include 211A and 211B, and handles 212 are formed on both sides thereof.

  At this time, the mounting holes 214 are formed in a lattice pattern at predetermined intervals in the row direction and the column direction in the center of the main body 210, but the mounting holes 214 may be densely formed in a rectangular shape, which will be described later. The runner space into which the raw material is poured to form the pocket 220 to be formed is not separately formed in the main body 210 but can be realized by engaging the main body 210 and the mold.

  Further, even if the mounting hole 214 is formed in a rectangular shape, the mounting hole 214 includes a plurality of auxiliary holes 214A whose corners are partially expanded, and the pocket 220 is fitted to the mounting hole 214 and the auxiliary hole 214A. The coupling force can be increased in the lateral direction by the vertical direction or the lateral direction. For example, the auxiliary hole 214A may be extended diagonally from the three corners of the mounting hole 214, or may be separately formed at a point spaced a predetermined distance from one corner.

  The mounting hole 214 includes at least one protrusion 216A and 216B protruding upward and downward along the outer periphery, and the pocket 220 surrounds the inner surface of the mounting hole 214 and simultaneously covers the protrusions 216A and 216B. Although it is molded, the thermal deformation of the pocket 220 can be reduced by supporting the pocket 220 made of a soft material by the protrusions 216A and 216B of the main body 210 made of a hard material during the heat treatment of the storage tray for the semiconductor package. . For example, the protrusions 216A and 216B can be formed so as to protrude from the upper and lower surfaces of the mounting hole 214, respectively.

Next, the pocket 220 is manufactured by insert molding with a soft material in each mounting hole 214 of the main body 210, and at the same time, is fixed integrally, but a thermoplastic elastic body (Thermoplastic made of rubber and thermoplastic resin).
Elastomer (TPE) is preferably made of a soft material, and the pocket 220 is formed of a soft material, so that various types of electrical contact terminals such as balls, pins, and squares can be directly formed in the pocket 220. Even if it contacts, it can prevent being damaged.

  At this time, the pocket 220 protrudes in the vertical direction on the assembly portion 222 that engages so as to surround a predetermined area on the inner periphery and the upper and lower surfaces of each mounting hole 214, and accommodates the semiconductor package. It consists of guide parts 224A and 224B for guiding. Here, the assembly portion 222 can save material by forming the through hole 222h in the center thereof, but variously configured to further reduce the contact surface with each mounting hole 214 by the development of technology. be able to.

  In addition, a plurality of guide portions 224A and 224B are formed in a lattice shape on the inner periphery of the upper and lower surfaces of the assembly portion 222. However, the upper guide portion 224A formed on the upper surface of the assembly portion 222 and The formed lower guide portions 224B are formed so as not to cross each other and support more stably, and the heights of the upper and lower guide portions 224A, 224B of the pocket 220 are the stacked portions 211A of the main body 210, It is formed lower than the height of 211B to prevent crossing each other.

  In particular, in the pocket 220, raw material is injected through a runner space formed by engaging one of the mold and the upper and lower surfaces of the main body 210, and at least two of them are simultaneously injection-molded. The raw material injected through the road space is hardened and a pocket extension 226 is formed between the pockets 220.

  As described above, even if the pocket extension 226 is formed between the pockets 220 on one surface of the main body 210, the space between the mounting holes 214 is fine and does not have to be removed, reducing the loss of raw materials and simultaneously reducing the work process. The mounting hole 214 may be densely formed in the main body 210, which provides better space utilization.

  11A to 11C are longitudinal sectional views showing a method for manufacturing a semiconductor package storage tray according to the second embodiment of FIG. According to the manufacturing process of the second embodiment of the semiconductor package storage tray configured as described above, the auxiliary holes 214A and the protrusions are formed in the mounting holes 214 and the periphery thereof by injection molding with the hard plastic as described above. After manufacturing the main body 210 so that the parts 216A and 216B are formed, a pair of molds A and B are engaged in the vertical direction of the main body 210 as shown in FIG. 6A. One runner is formed by engaging with a pair of molds A and B.

  Here, the upper mold A engages with the upper surface of the main body 210, and the lower mold B engages with the lower surface of the main body 210, but the upper and lower molds A and B are provided inside the mounting holes of the main body 210. Recesses A1 and B1 that can be engaged with 214 to form the same shape as each pocket 220 are formed, respectively, and an injection flow path A2 for injecting molten metal into one of the molds A and B, and A runner space A3 that connects the recesses A1 and B1 and the injection channel A2 is formed. Of course, the recesses A1 and B1 of the molds A and B are installed so as to cover the protrusions 216A and 216B of the main body 210, and the runner space A3 is engaged with one mold A and one surface of the main body 210. It is formed in a state, and is configured to connect the recesses A1 and the like with one mold A.

Next, after the main body 210 is inserted between the pair of molds A and B, as shown in FIG. 6B, the thermoplastic elastic body (Thermoplastic made of rubber and thermoplastic resin through the injection flow path A2 is used.
Elastomer (TPE) is injected and injected, and the molten metal injected through the injection flow path A2 flows into the mounting holes 214 and the recesses A1 and A2 of the molds around the runner space A3. At this time, the molten metal is filled between the main body 210 and the recesses A1 and B1 of the molds A and B, and the runner space A3, but covers all the protrusions 216A and 216B of the main body 210 and attaches the main body 210. The hole 214 and the auxiliary hole 214 </ b> A are filled so as to surround a part of the inner side surface and the upper and lower surfaces, and partly remain on the upper surface of the main body 210.

  The runner space A3 is formed between the molds A and B and the upper surface of the main body 210, and it is not necessary to form the runner space A3 separately in the main body 210. Can be arranged.

  Next, when the pair of molds A and B are removed from the main body 210 after the thermoplastic elastic body has hardened over time, the pockets 220 are inserted into the mounting holes 214 of the main body 210 as shown in FIG. 6C. Injection molded.

  At this time, if the main body 210 is made of engineering plastic, which is a kind of thermoplastic resin, and the pocket 220 is also made of a thermoplastic elastic body containing a thermoplastic resin, the main body 210 and the A predetermined fusion occurs with one surface of the pocket 220 abutting against the pocket 220, and as a result, the pocket 120 is engaged so as to surround a part of the inner surface of the mounting hole 214 and the upper and lower surfaces of the main body 210, An additional effect that the engagement becomes even stronger can be obtained. In any case, at the same time as each pocket 220 is manufactured, it is fixed so as to be mechanically engaged with each mounting hole 220, so that a separate assembly process can be omitted, and the production process is simplified.

  Of course, the thermoplastic elastic body is also cured in each mounting hole 214 of the main body 210 to form the pocket 220, while the thermoplastic elastic body is also cured between the pockets 220 to leave the pocket extension 226. Since the extension 226 is formed only at a relatively narrow interval, it need not be removed.

  At this time, since the pocket 220 is installed so as to surround a part of the inner surface and the upper and lower surfaces of the mounting hole 214 and the auxiliary hole 214A of the main body 210, the pocket 220 is removed from the main body 210 in the vertical direction or the side direction. In addition to preventing this, the bonding force can be further increased, and all the pockets 220 are installed so as to cover the projections 216A and 216B of the main body 210, so that the semiconductor package is stored in the semiconductor package storage tray. After the heat treatment, the pocket 220 made of a softer material is supported by the protrusions 216A and 216B of the main body 210 made of a more rigid material even when heat-treated, thereby preventing the pocket 220 from being deformed.

  The semiconductor package storage tray and the manufacturing method thereof according to the present invention include a mounting hole in the main body, an auxiliary hole extending from the mounting hole, and a protruding portion protruding from the upper and lower surfaces thereof, and the pocket serving as the mounting hole. Since the inner surface and upper and lower surfaces of the auxiliary hole are surrounded so as to cover the protrusion, the pocket can be more firmly connected to the main body, and the soft material pocket can be connected to the protrusion of the more rigid material. Can be supported, and deformation due to heat treatment or the like can be reduced.

  In addition, the semiconductor package storage tray and the manufacturing method thereof according to the present invention are such that when the mold is engaged with the main body in order to insert-mold the pocket into the main body, the raw material of the pocket is formed between the mold and one surface of the main body. Since it is injected along the runner space, it is not necessary to form a separate runner space, such as slits or holes, between the mounting holes in the main body. More semiconductor packages can be accommodated in a limited space.

  The present invention has been described in detail with reference to the embodiments and the accompanying drawings. However, the scope of the present invention is not limited by the above embodiments and drawings, and the scope of the present invention is described in the claims. Limited only by content.

It is a top view which shows 1st Embodiment of the storage tray for semiconductor packages by this invention. It is sectional drawing by the AA line of FIG. It is a cross-sectional perspective view by the BB line of FIG. It is a perspective view which shows an example of the main body of the storage tray for semiconductor packages in FIG. It is a perspective view which shows an example of the pocket of the storage tray for semiconductor packages in FIG. It is a longitudinal cross-sectional view which shows the 1st manufacturing process of the manufacturing method of the storage tray for semiconductor packages of FIG. It is a longitudinal cross-sectional view which shows the 2nd manufacturing process of the manufacturing method of the storage tray for semiconductor packages of FIG. It is a longitudinal cross-sectional view which shows the 3rd manufacturing process of the manufacturing method of the storage tray for semiconductor packages of FIG. It is a longitudinal cross-sectional view which shows the 4th manufacturing process of the manufacturing method of the storage tray for semiconductor packages of FIG. It is a top view which shows 2nd Embodiment of the storage tray for semiconductor packages by this invention. It is a figure which shows the important part of FIG. It is sectional drawing by CC line of FIG. It is a perspective view which shows an example of the main body of the storage tray for semiconductor packages in FIG. FIG. 8 is a longitudinal sectional view showing a first manufacturing process of the manufacturing method of the semiconductor package storage tray of FIG. 7; It is a longitudinal cross-sectional view which shows the 2nd manufacturing process of the manufacturing method of the storage tray for semiconductor packages of FIG. It is a longitudinal cross-sectional view which shows the 3rd manufacturing process of the manufacturing method of the storage tray for semiconductor packages of FIG.

Explanation of symbols

110 Main body 112 Handle 114 Mounting hole 116 Slot 120 Pocket 122 Assembly part 124a, 124b Guide part

Claims (20)

A flat plate-shaped first material body;
A plurality of mounting holes formed so as to penetrate the main body;
A pocket made of a second material which is mounted so as to surround the inner surface of the mounting hole and which provides a space capable of accommodating a semiconductor package;
A storage tray for a semiconductor package, comprising: a pouring runner space formed between at least a pair of mounting holes and guiding the second material to the mounting holes.   The semiconductor package storage tray according to claim 1, wherein the main body further includes at least one protrusion protruding from an upper surface and a lower surface around the mounting hole and covered by a pocket.   2. The storage tray for a semiconductor package according to claim 1, wherein the mounting hole has a quadrangular shape and a corner portion is partially expanded.   2. The semiconductor package according to claim 1, wherein the injection runner space is at least one slot positioned between at least a pair of pockets and penetrating the main body. Storage tray.   5. The package for a semiconductor package according to claim 4, wherein a plurality of rows of mounting holes formed of a plurality of mounting holes are formed, and the slot is formed between a pair of mounting holes. tray.   The semiconductor package storage tray according to claim 4, wherein the slot further includes a bent portion adjacent to the mounting hole.   2. The semiconductor package according to claim 1, wherein the injection runner space is located between at least a pair of pockets and is formed between a main body and a mold inserted into the upper and lower surfaces of the main body. Storage tray.   8. The semiconductor package storage tray according to claim 7, wherein the pouring runner space is formed on only one of the upper and lower surfaces of the main body.   9. The storage tray for a semiconductor package according to claim 8, wherein at least two of the pockets are connected to each other by an injection runner space.   2. The storage tray for a semiconductor package according to claim 1, wherein the main body is made of a hard material, and the pocket is made of a softer material than the material of the main body.   11. The storage tray for a semiconductor package according to claim 10, wherein the pocket is made of a thermoplastic elastomer (TPE) made of rubber and a thermoplastic resin.   The pocket includes an assembly portion that engages so as to surround a predetermined area of the inner periphery and upper and lower surfaces of the mounting hole, and a guide portion that protrudes to accommodate the semiconductor package on the upper and lower surfaces of the assembly portion. The storage tray for a semiconductor package according to claim 1.   13. The storage tray for a semiconductor package according to claim 12, wherein the guide portion of the pocket has an inclined surface so that the package is seated. A body molding step in which the body is injection-molded with the raw material of the first material so that the rows formed in the plurality of mounting holes are arranged in a plurality of rows;
The main body obtained in the main body molding step is inserted between a pair of molds, and the raw material of the second material is injected into the space between the main body and the mold through the runner space formed between the mounting holes. And a pocket forming step for injection-molding the pocket.   15. The semiconductor storage according to claim 14, wherein the body molding step includes a step of injection molding at least one protrusion at the same time as the mounting hole so as to protrude from the upper and lower surfaces around the mounting hole. Tray production method.   15. The method according to claim 14, wherein the body molding step includes a process in which at least one slot formed between the mounting holes and formed through the body is injection-molded simultaneously with the mounting holes. The semiconductor storage tray manufacturing method of description.   The method of manufacturing a semiconductor storage tray according to claim 15, wherein the pocket forming step includes a step of engaging the mold so as to cover the mounting hole and the protrusion.   The pocket forming step includes a first process in which the second raw material is injected into the runner injection space between the mold and the slot, and the second raw material injected in the first process is in the mold, the main body, and the mounting hole. The method for manufacturing a semiconductor storage tray according to claim 16, further comprising: a second process injected into a space between the two.   The method of claim 18, wherein the pocket forming step further includes a third step of removing the second raw material remaining in the slot when the pocket is injection-molded after the second step. Method.   The pocket forming step includes a first process in which the second raw material is injected into a runner injection space between the mold and one surface of the main body, and the second raw material injected in the first process is the mold, the main body, and the mounting. The method for manufacturing a semiconductor storage tray according to claim 14, further comprising a step of injecting into a space between the holes.

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