CN215707919U

CN215707919U - Tray

Info

Publication number: CN215707919U
Application number: CN202121485495.3U
Authority: CN
Inventors: 边兵兵; 焦洁; 郭瑞亮; 曾昭孔
Original assignee: Suzhou Tongfu Chaowei Semiconductor Co ltd
Current assignee: Suzhou Tongfu Chaowei Semiconductor Co ltd
Priority date: 2021-06-30
Filing date: 2021-06-30
Publication date: 2022-02-01
Anticipated expiration: 2031-06-30

Abstract

The application discloses a tray, which comprises a rigid substrate and accommodating grooves, wherein the accommodating grooves comprise a first accommodating groove and a second accommodating groove which are respectively arranged on two opposite sides of the rigid substrate, the tray can be arranged in a stacked manner, and the first accommodating groove of the tray positioned on the lower layer and the second accommodating groove of the tray connected to the upper layer are matched to form a cavity for accommodating articles; the first accommodating groove comprises a first frame body perpendicular to the rigid substrate, the second accommodating groove comprises a second frame body perpendicular to the rigid substrate, and at least the inner wall surface of the first frame body facing the first accommodating groove and the inner wall surface of the second frame body facing the second accommodating groove are made of flexible materials. This application is through the cooperation of rigid substrate and flexible storage tank internal face for the tray has intensity and shock-absorbing capacity concurrently, and flexible material's hardness is less, can provide sufficient cushion effect for the chip, and the rigid substrate has enough big mechanical strength, has effectively improved the barrier propterty of tray.

Description

Tray

Technical Field

The present application relates generally to the field of semiconductor technology, and more particularly to a tray.

Background

The tray is used as an indispensable carrier in the chip packaging, testing and mounting processes, and is accompanied with the whole chip manufacturing process.

Since the chip is very easy to damage or lose efficacy, the packaging protection of the chip is very high in requirement. The existing tray is mostly formed by injection molding of modified engineering plastics, is hard in material and easy to damage a chip, and is easy to fall scraps to pollute the chip; the other plastic sucking tray is not easy to fall scraps, but cannot meet the requirement of stable use in a high-temperature baking process at the temperature of over 80 ℃, and has an unstable structure.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned defects or shortcomings in the prior art, it is desirable to provide a tray, so as to enhance the protection effect of the tray on the chips and avoid the damage of the chips during the transportation process.

Preferably, the tray includes:

a rigid substrate; and

the accommodating grooves comprise a first accommodating groove and a second accommodating groove which are respectively arranged on two opposite sides of the rigid substrate, the trays can be arranged in a stacked mode, and the first accommodating groove of the tray positioned on the lower layer and the second accommodating groove of the tray connected to the upper layer are matched to form a cavity for accommodating articles;

the first accommodating groove comprises a first frame body perpendicular to the rigid substrate, the second accommodating groove comprises a second frame body perpendicular to the rigid substrate, and at least the inner wall surface of the first frame body facing the first accommodating groove and the inner wall surface of the second frame body facing the second accommodating groove are made of flexible materials.

Preferably, the first accommodating groove further comprises a plurality of first retaining walls connected to the first frame body and circumferentially arranged around the first accommodating groove at intervals, and the top surfaces of the first retaining walls are higher than the top surface of the first frame body;

the second accommodating groove further comprises a plurality of second retaining walls which are connected to the second frame body and are circumferentially arranged around the second accommodating groove at intervals, and the top surfaces of the second retaining walls are higher than the top surface of the second frame body;

when the trays are stacked, the first retaining wall of the tray positioned at the lower layer can be embedded with the second retaining wall of the connected tray at the upper layer.

Preferably, the first frame body and the second frame body are rectangular frames;

the first retaining wall is formed in an L-shaped protrusion on the top corner of the second frame body, and the second retaining wall is formed in a linear protrusion on the top surface of the first frame body.

the first retaining wall is formed on the rigid substrate and extends upwards along the outer wall surface of the first frame body, and the cross section of the first retaining wall is of a straight-line structure; the second barricade is formed rigid substrate is last and upwards extend along the outer corner of second framework, the cross section of second barricade is L type structure.

Preferably, the rigid substrate and the accommodating groove are of a split structure.

Preferably, the first receiving groove and the second receiving groove have bottom plates, and the first frame and the second frame are disposed around the bottom plates respectively.

Preferably, one of the rigid substrate and the accommodating groove is provided with a fixing column, the other is provided with a fixing hole, and the rigid substrate and the accommodating groove are connected through the matching of the fixing column and the fixing hole.

Preferably, the rigid substrate and the accommodating groove are of an integrated structure formed by a double-material injection molding process.

Preferably, the area of the rigid substrate provided with the accommodating groove is a hollow structure.

Preferably, the number of the first accommodating grooves and the number of the second accommodating grooves are multiple, and the first accommodating grooves and the second accommodating grooves are distributed on the rigid substrate in an array manner.

The beneficial effect of this application:

this application is through the cooperation of rigid substrate and flexible storage tank internal face for the tray has intensity and shock-absorbing capacity concurrently, and wherein, flexible material's hardness is less, can provide sufficient cushion effect for the chip, and the rigid substrate has enough big mechanical strength, thereby has effectively improved the barrier propterty of tray to the chip.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

FIG. 1 is a front view of a tray according to one embodiment of the present application;

FIG. 2 is an exploded view of the tray shown in FIG. 1;

fig. 3 is a front view of a first receiving groove according to an embodiment of the present disclosure;

fig. 4 is a front view of a second receiving groove according to an embodiment of the present disclosure;

FIG. 5 is a front view of the two trays shown in FIG. 1 after stacking;

FIG. 6 is a cross-sectional view of the two trays shown in FIG. 5 after stacking;

FIG. 7 is an enlarged view of a portion of FIG. 6;

fig. 8 is a front view of a first receiving groove according to another embodiment of the present disclosure;

fig. 9 is a top view of a second receiving groove according to another embodiment of the present application;

FIG. 10 is a front view of a rigid substrate according to one embodiment of the present application;

fig. 11 is a bottom view of the first receiving groove shown in fig. 3 (having a first fixing pillar);

fig. 12 is a side view of the first receiving groove shown in fig. 11;

fig. 13 is a bottom view of the second receiving groove shown in fig. 4 (with a second fixing post);

fig. 14 is a side view of the second receiving groove shown in fig. 13;

FIG. 15 is a front view of a rigid substrate according to another embodiment of the present application;

FIG. 16 is a front view of a tray according to another embodiment of the present application;

FIG. 17 is a front view of the two trays shown in FIG. 16 after stacking;

FIG. 18 is a cross-sectional view of the two trays shown in FIG. 17 after stacking;

fig. 19 is a partially enlarged view of fig. 18.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

It should be noted that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in an orientation or positional relationship indicated in the drawings for convenience and simplicity of description only, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting.

It should be noted that in the description of the present application, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

It should be noted that unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and include, for example, fixed or removable connections or integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Referring to fig. 1 to 7, a tray according to a preferred embodiment of the present application is shown, where the tray includes a rigid substrate 1 and receiving grooves, the receiving grooves include a first receiving groove 2 and a second receiving groove 3 respectively disposed on two opposite sides of the rigid substrate 1, the tray may be stacked, and the first receiving groove 2 of the tray located at a lower layer and the second receiving groove 3 of the tray located at a connected upper layer cooperate to form a cavity 4 for receiving an article;

the first receiving groove 2 includes a first frame 21 perpendicular to the rigid substrate 1, the second receiving groove 3 includes a second frame 31 perpendicular to the rigid substrate 1, and at least an inner wall surface 210 of the first frame 21 facing the first receiving groove 2 and an inner wall surface 310 of the second frame 31 facing the second receiving groove 3 are made of a flexible material.

In this embodiment, the rigid substrate 1 has an upper surface 11 and a lower surface 12 opposite to each other, the first receiving groove 2 may be disposed on the upper surface 11 of the rigid substrate 1, the second receiving groove 3 is correspondingly disposed on the lower surface 12 of the rigid substrate 1, and the outlines and disposed positions of the first receiving groove 2 and the second receiving groove 3 correspond to each other, that is, the first receiving groove 2 and the second receiving groove 3 have corresponding shapes and sizes, when a plurality of trays of the same specification are stacked in a vertical direction, in each two adjacent trays, the first receiving groove 2 of one tray and the second receiving groove 3 of the other tray enclose a receiving space in which an article to be packaged is carried, wherein the first frame body 21 and the second frame body 31 constitute a side wall of the cavity 4, and the rigid substrates 1 of the two trays constitute a top and a bottom of the cavity 4, respectively;

the packaged articles can be high-precision articles which are easy to damage in the transferring process, such as chips, liquid crystal display panels, display modules, printed circuit boards and the like;

further preferably, the packaged article is a chip, when the chip is placed in the cavity 4 formed as described above, the bottom of the chip and the bottom of the cavity 4, the top of the chip and the top of the cavity 4 have a certain gap, and do not contact each other, only the peripheral edge of the chip contacts the side wall of the cavity 4, and the side wall of the cavity 4 abuts against and supports the chip, so as to exert fixing and limiting effects on the chip in a direction parallel to the rigid substrate 1; the bottom and the top of the chip are kept at a certain distance from the tray, so that physical scratches and pollution on the front surface of the chip can be effectively avoided, the phenomenon of uneven height among pins due to local collapse of the pins when the suction head touches the induction chip and the phenomenon of short circuit among adjacent pins or incapability of normally finishing pin adsorption due to the fact that the pins are stuck to the bottom of the cavity 4 can be avoided, and the yield and the performance of the device are improved; the leads of the chip include, but are not limited to, solder balls, pins, metal contacts, and the like.

When the chip is located in the cavity 4, the edge of the chip can contact the inner wall of the flexible or elastic cavity, so that sufficient buffer force can be provided for the chip, and damage or pollution caused by collision or friction between the chip and the side wall of the cavity can be avoided; the rigid substrate 1 has enough mechanical strength, so that the tray is stable in structure and can meet the requirement of stable operation of the tray on equipment; the tray of this application is not only soft but also hard promptly, has intensity and elasticity concurrently, has both had higher stability, has sufficient buffer capacity again to effectively improve the barrier propterty of tray to the chip.

In the present embodiment, the rigid substrate 1 may be formed by injection molding of a hard material having sufficient mechanical strength, such as ABS, MPPO/PPE, or PAS; flexible materials include, but are not limited to, TPU, TPEE, TPV, TPO, and the like; the hardness range of the flexible material is preferably 50-100A, and the modified elastomer material with the temperature resistance level of 60-150 ℃ can be selected according to the process requirements of the chip, so that the tray can meet the requirements of stable use in a high-temperature environment.

Further, in some preferred embodiments of the present application, the first receiving groove 2 further includes a plurality of first retaining walls 22 connected to the first frame 21 and circumferentially spaced around the first receiving groove 2, and top surfaces of the first retaining walls 22 are higher than top surfaces 211 of the first frame 21; the second receiving groove 3 further includes a plurality of second blocking walls 32 connected to the second frame 31 and circumferentially arranged around the second receiving groove 3 at intervals, and a top surface of the second blocking wall 32 is higher than a top surface 311 of the second frame 31; when the trays are stacked, the first retaining wall 21 of the tray at the lower layer can be embedded with the second retaining wall 31 of the connected tray at the upper layer; the first receiving groove 2 and the second receiving groove 3 are engaged to form a cavity 4 by engaging the first retaining wall 21 with the second retaining wall 31.

Further, referring to fig. 3 and 4, there are shown the structures of the first retaining wall 21 and the second retaining wall 31 of a preferred embodiment of the present application, where the first frame body 21 and the second frame body 31 are rectangular frames, the first retaining wall 22 is an L-shaped protrusion formed on a top corner of the first frame body 21, and the second retaining wall 32 is a straight protrusion formed on a top surface of the second frame body 31.

Specifically, the first frame 21 has four side walls, the first retaining walls 22 are L-shaped bosses formed on the top surfaces corresponding to the respective top corners and extending upward, and first recesses 23 are formed between the respective first retaining walls 21; the second frame 31 also has four sidewalls, the second retaining walls 32 are bosses formed on top surfaces of the sidewalls and extending upward, wherein the length and width of the second retaining walls 32 are respectively smaller than those of the sidewalls of the second frame 31, and second recesses 33 are formed between the second retaining walls 32; after two pallets are stacked, the first retaining wall 22 of the pallet on the lower layer is inserted into the second concave part 33 of the pallet on the upper layer, the second retaining wall 32 of the pallet on the upper layer is inserted into the first concave part 23 of the pallet on the lower layer, and the first frame body 21, the first retaining wall 22, the second frame body 31, the second retaining wall 32 and the rigid base plate 1 jointly enclose to form a cavity 4 for accommodating articles; in this embodiment, the vertical projections of the first receiving groove 2 and the second receiving groove 3 on the rigid substrate 1 are overlapped.

Further, referring to fig. 8 and 9, there are shown structures of a first retaining wall 22 and a second retaining wall 32 according to another preferred embodiment of the present application, where the first frame body 21 and the second frame body 31 are rectangular frames; the first retaining wall 22 is formed on the rigid substrate 1 and extends upwards along the outer wall surface (the wall of the frame relative to the inner wall surface) of the first frame 21, and the cross section of the first retaining wall 22 is in a straight structure; the second retaining wall 32 is formed on the rigid substrate 1 and extends upward along an outer corner of the second frame 31, and a cross section of the second retaining wall 32 is of an L-shaped structure.

Specifically, the first frame 21 has four side walls, the first retaining wall 22 is a plate-shaped structure with a straight cross section, one end of the first retaining wall is connected to the rigid substrate 1, the other end of the first retaining wall extends upward along a direction perpendicular to the rigid substrate 1 and is higher than the side wall of the first frame 21, and the side wall facing the first frame 21 is connected to the outer wall surface of the first frame 21, wherein one first retaining wall 22 is connected to the outer side wall of each side wall of the first frame 21, and the length of the first retaining wall 22 is smaller than that of the side wall of the first frame 21, so that a first concave portion 23 extending from one side wall of the first frame 21 to the other side wall via a corner is formed between the first retaining walls 21; the second frame 31 also has four side walls, the second retaining wall 32 is a plate-shaped structure with an L-shaped cross section, one end of the second retaining wall is connected to the rigid substrate 1, the other end of the second retaining wall extends upward along a direction perpendicular to the rigid substrate 1 and is higher than the side wall of the second frame 31, and the side wall facing the second frame 31 is connected to an outer corner of the second frame 31, wherein the second retaining wall 32 is distributed at each corner of the second frame 31, so that a second concave portion 33 distributed along the second frame 31 is formed between each second retaining wall 32; after two pallets are stacked, the part of the first retaining wall 22 of the pallet positioned at the lower layer higher than the first frame body 21 is inserted into the second sunken part 33 of the pallet positioned at the upper layer, the part of the second retaining wall 32 of the pallet positioned at the upper layer higher than the second frame body 31 is inserted into the first sunken part 23 of the pallet positioned at the lower layer, the top surface 211 of the first frame body 21 is abutted with the top surface 311 of the second frame body 31, and the first frame body 21, the second frame body 31 and the rigid substrate 1 jointly enclose to form a cavity 4 for accommodating articles; or the part of the first retaining wall 22 of the tray positioned at the lower layer higher than the first frame body 21 is partially inserted into the second concave part 33 of the tray positioned at the upper layer, the part of the second retaining wall 32 of the tray positioned at the upper layer higher than the second frame body 31 is partially inserted into the first concave part 23 of the tray positioned at the lower layer, and the first frame body 21, the first retaining wall 22, the second frame body 31, the second retaining wall 32 and the rigid substrate 1 together enclose a cavity 4 for accommodating articles (the structure after stacking the trays according to the embodiment and the structure of the cavity are shown in fig. 17-19); in this embodiment, the first frame and the second frame are superimposed on each other in a perpendicular projection on the rigid substrate.

Further, in some preferred embodiments of the present application, as shown in fig. 2, the rigid substrate 1 and the accommodating groove are of a split structure.

Specifically, the rigid substrate 1, the first receiving groove 2, and the second receiving groove 3 are configured as separate members, each of which is separately molded by a suitable process such as injection molding, and then the first receiving groove 2 and the second receiving groove 3 are connected to opposite sides of the rigid substrate 1 by any suitable means, such as by fasteners, welding, fusion, adhesives, or the like.

Further, in some preferred embodiments of the present application, the first receiving groove 2 and the second receiving groove 3 each have a bottom plate, and the first frame body 21 and the second frame body 31 are respectively disposed around the bottom plate.

Specifically, the first receiving groove 2 includes a first frame body 21 and a first bottom plate 24, which may be integrally injection-molded from a flexible material, and the first frame body 21 includes a top edge and a bottom edge which are oppositely arranged, and a left edge and a right edge which are oppositely arranged between the top edge and the bottom edge, so as to enclose the first bottom plate 24 therein; similarly, the second receiving groove 3 includes a second frame 31 and a second bottom plate 34, which may be integrally injection-molded from a flexible material, wherein the second frame 31 includes a top edge and a bottom edge oppositely disposed, and a left edge and a right edge oppositely disposed between the top edge and the bottom edge, so as to enclose the second bottom plate 34 therein; the first and

second bottom plates

24, 34 may be attached to opposite sides of the rigid substrate 1 by any suitable means, such as by fasteners, welding, adhesives, etc., thereby providing the first and second receiving

grooves

2, 3 on both sides of the rigid substrate 1; after the two trays are stacked, the first frame 21, the first bottom plate 24, the second frame 31 and the second bottom plate 34 together enclose a cavity 4.

Further, in some preferred embodiments of the present application, a fixing column is disposed on one of the rigid substrate 1 and the accommodating groove, and a fixing hole is disposed on the other of the rigid substrate 1 and the accommodating groove, and the rigid substrate 1 and the accommodating groove are connected by the fixing column and the fixing hole being matched with each other.

In particular, in one embodiment, as shown in fig. 10, a plurality of fixing holes 13 are provided on the rigid substrate 1, as shown in fig. 11 and 12, at the bottom of the first receiving groove 2, specifically, at the bottom of the first bottom plate 24, there are a plurality of first fixing posts 25, as shown in fig. 13 and 14, a plurality of second fixing posts 35 are disposed at the bottom of the second receiving groove 3, specifically, at the bottom of the second bottom plate 34, and the distribution positions of the first fixing posts 25 and the second fixing posts 35 are staggered from each other, for example, as shown in fig. 11 to 14, 4 first fixing columns 25 are distributed at four corners of the first bottom plate 24, 4 second fixing columns 35 are distributed at the middle positions of the vertical projections of the sidewalls of the second frame 31 on the second bottom plate 34, and the first fixing columns 25 and the second fixing columns 35 are respectively inserted into the fixing holes 13 of the rigid substrate 1, so as to connect the first accommodating grooves 2 and the second accommodating grooves 3 with the rigid substrate 1; the first fixing posts 25 and the second fixing posts 35 may be integrally formed with the first receiving grooves 2 and the second receiving grooves 3, or may be formed as separate elements made of hard materials and connected to the first bottom plate 24 and the second bottom plate 34 by a suitable method.

In another embodiment, a plurality of fixing posts perpendicular to the rigid substrate 1 are respectively disposed on two opposite sides of the rigid substrate 1, and a plurality of fixing holes are respectively disposed at the bottoms of the first bottom plate 24 and the second bottom plate 34, and the fixing posts are inserted into the fixing holes of the first receiving groove 2 and the second receiving groove 3, so as to connect the first receiving groove 2 and the second receiving groove 3 with the rigid substrate 1.

Further, in some preferred embodiments of the present application, referring to fig. 15-19, the rigid base, 1 and the receiving groove are formed as an integral structure by a two-material injection molding process.

Specifically, as shown in fig. 15, a hard material is injected into an injection mold to form the rigid substrate 1, and then a flexible material is injected into the injection mold twice to form the first frame 21 and the second frame on the opposite sides of the rigid substrate 1, thereby forming the tray structure of the present application (fig. 16).

In some more preferred embodiments, a rigid substrate having a first receiving groove substrate structure and a second receiving groove substrate structure is formed by injecting a hard material into an injection mold, and then a flexible material is injected again to cover the inner surface of the first frame facing the first receiving groove and the inner surface of the second frame facing the second receiving groove, so that a tray in which only the inner wall surface of the first frame facing the first receiving groove and the inner wall surface of the second frame facing the second receiving groove are made of the flexible material is formed, and thus the tray has higher mechanical strength and better stability.

Further, in some preferred embodiments of the present application, as shown in fig. 15, an area of the rigid substrate 1 where the accommodating groove is formed is a hollow structure.

Specifically, as shown in fig. 15 and 16, the rigid substrate 1 surrounded by the first frame 21 has a plurality of cutouts 14, so that the weight of the pallet can be reduced.

Further, in some preferred embodiments of the present application, the number of the first receiving grooves 2 and the number of the second receiving grooves 3 are both multiple, and the first receiving grooves 2 and the second receiving grooves 3 are distributed in an array on the rigid substrate 1.

The number and arrangement of the first accommodating grooves 2 and the second accommodating grooves 3 are determined according to the sizes of the accommodating grooves, and the first accommodating grooves and the second accommodating grooves can be distributed in a matrix with equal distance or unequal distance; when the first receiving grooves 2, the second receiving grooves 3 and the rigid substrate 1 are of a split structure, the plurality of first receiving grooves 2 may be separate elements, each first receiving groove 2 is connected to the upper surface of the rigid substrate 1, or the plurality of first receiving grooves 2 may be of an integrated structure, and are integrally connected to the upper surface of the rigid substrate 1, which is the same for the second receiving grooves, and the description is omitted here.

Further, as shown in fig. 10, a frame 15 is provided around the rigid substrate 1, and a gripping edge 16 extending outward is provided at an edge of the frame 15, so as to meet the requirement of automation; and the contours of the upper surface and the lower surface of the frame 15 correspond to each other, so that the trays can be stacked conveniently.

The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims

1. A pallet, comprising:

a rigid substrate; and

2. The tray according to claim 1, wherein the first receiving groove further comprises a plurality of first retaining walls connected to the first frame body and circumferentially spaced around the first receiving groove, the top surfaces of the first retaining walls being higher than the top surfaces of the first frame body;

3. A pallet according to claim 2, wherein said first and second frames are rectangular frames;

4. A pallet according to claim 2, wherein said first and second frames are rectangular frames;

5. The tray of claim 1, wherein the rigid base and the receiving slot are of a split configuration.

6. The tray of claim 5, wherein the first receiving slot and the second receiving slot each have a floor, and the first frame and the second frame each are disposed around the floor.

7. The tray according to claim 6, wherein a fixing post is disposed on one of the rigid substrate and the accommodating groove, and a fixing hole is disposed on the other of the rigid substrate and the accommodating groove, and the rigid substrate and the accommodating groove are connected by the fixing post and the fixing hole.

8. The tray of claim 1, wherein the rigid base and the receiving channel are a unitary structure formed using a two-piece injection molding process.

9. The tray according to claim 8, wherein the area of the rigid substrate where the receiving groove is formed is a hollow structure.

10. The tray of claim 1, wherein the number of the first receiving grooves and the second receiving grooves is plural, and the first receiving grooves and the second receiving grooves are distributed in an array on the rigid substrate.