JP4106225B2 - Storage tray for electronic components - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a storage tray for electronic components and the like, and is used for storing and transporting electronic components such as semiconductor integrated circuits, IC cards, substrates, and liquid crystal panels.
[0002]
[Prior art]
  As an electronic component, for example, a tray used for storing and transporting a semiconductor integrated circuit such as an IC is formed in a substantially dish-shaped container, and a plurality of recesses for accommodating and holding the electronic component are formed at the bottom of the container. Most of them were provided or partitioned by partition walls.
  Further, in order to prevent electrostatic breakdown of the IC, the tray is processed with a conductive material. In addition, when electronic components are stored and held in the tray body and stored and transported, the tray body in which electronic components are usually stored is stacked in multiple stages, such as polystyrene, polypropylene, polyvinyl chloride, and PET resin. The trays that are molded by thermoforming thermoplastic synthetic resin sheets such as vacuum molding are stacked with the electronic components stored and held inside, so the electronic components that are stored and held in the trays stacked in the upper stage There is an inconvenience that the total weight of is added to the lower electronic component.
  Therefore, conventionally, as a tray that is thermoformed as described above, for example, as described in Japanese Utility Model Laid-Open No. 1-73109, a protrusion is formed on a part of the tray main body to stack the upper and lower stages when stacking the trays. Some trays are stacked with the tray supported by the protrusions. Among these, the one shown in FIG. 10 has a substantially L-shaped cross section that protrudes outward so that it can be placed on the upper surface of the flange b provided around the tray main body a that is stacked on the lower inner side of the tray main body a. A protrusion c is formed, and the protrusion shown in FIG. 11 is formed with a protrusion c ′ having a groove d having a substantially V-shaped cross section in the tray body a.
  By the way, when storing and holding electronic parts in the tray, the trays are usually stacked after storing the electronic parts in the tray body a by arranging four trays in two rows and two columns on the front of the operator. Instead of providing the projections c and c 'on a part of the tray main body a as described above, as shown in FIGS. 12 to 14 as other conventional trays, a projection edge is provided on the flange portion of the tray main body. There is something.
  This conventional example has four tray bodies T.₁, T_1,T₂, T₂And a tray T in which the protruding edges S are provided at the same position, and four tray bodies T₁, T_2,T_Three, T_FourThere are different types of trays T in which the protruding edges S are provided at different positions.
  Of these, as shown in FIG.₁, T_1,T₂, T₂From the viewpoint of securing the article storage space k when stacked on each other, for example, the front tray body T₁, T₁In contrast, the rear tray body T₂, T₂Need to be rotated 180 ° for stacking. Further, as shown in FIG. 14, the tray T provided with the protruding edge portions S at different positions is the tray main body T when stacked.₁, T_2,T_Three, T_FourHowever, the mold cost becomes expensive because a dedicated mold is required to mold each tray T. Moreover, since the electronic component storing operation and the tray T stacking operation are performed after confirming the installation position of the projecting edge portion S, it takes a lot of time and labor and causes human error. For this reason, it is difficult to automate the operation using the robot with the tray T having the above structure.
  As described above, when the electronic component is stored depending on whether the protrusion S is provided at the same position on a part of the tray T as shown in FIG. 13 or the protrusion S is provided at a different position as shown in FIG. Or, as a tray for storing other electronic components that overcomes the complexity of different handling of selecting and arranging the orientation of the tray T to be the same direction or rotating 180 ° when the trays T are stacked. For example, there is an invention disclosed in Japanese Patent Laid-Open No. 10-329886 as shown in FIG.
  In the present invention, when the flange b ″ of the tray body a ″ is stacked, a fitting edge c ″ for receiving the lower tray body a ″ is formed below the flange b ″. The upper tray body a ″ is seated on a part of the upper surface of the protruding edge portion d ″ of the lower tray body a ″ to be stacked by forming the protruding edge portion d ″ in part.
[0003]
[Problems to be solved by the invention]
  However, in the conventional tray shown in FIGS. 10 and 11, when the tray main body a is stacked by the protrusions c and c ′ formed on a part of the tray main body a, the tray main body a bites against each other. Since it is only intended to prevent, an article storage space k having a height for storing articles such as electronic parts in a non-contact state is secured between the tray bodies a, a,. It was insufficient for this. Therefore, it is extremely unsuitable for use as a tray for storing and transporting electronic components such as semiconductor integrated circuits, IC cards, boards, and liquid crystal panels that are extremely disliked from being damaged in terms of accuracy and require high quality. there were. In addition, when the tray is formed by thermoforming a thermoplastic synthetic resin sheet such as polystyrene, polypropylene, polyvinyl chloride, or PET resin, such as by vacuum forming, it is stored when the tray bodies a, a ... are stacked. When the weights of all the articles are added to the tray bodies a, a ..., the tray bodies a, a ... can withstand the weight of the articles, and the protrusion c of the tray shown in FIG. 11, the protrusion c 'of the tray main bodies a, a ... receives the weight and the groove d is enlarged, so that the space between the upper and lower tray bodies a, a ... can be maintained. In some cases, the upper tray body a may crush the articles stored in the lower tray body a, or may come into contact with the articles and be damaged by friction.
  Further, for example, in the conventional invention as shown in FIG. 15, when the tray main body a ″ is stacked, the fitting edge c ″ for receiving the flange b ″ of the lower tray main body a ″ is provided at the lower part of the flange b ″. The lower portion of the upper tray body a ″ is seated on a part of the upper surface of the protruding edge portion d ″ of the tray body a ″ to be stacked by forming the protruding edge portion d ″ on a part of the flange portion b ″. Therefore, if the weight of all the articles stored when the tray main body a ″ is stacked is added to the tray main body a ″, the tray main body a ″ is also expanded in the outer peripheral direction and pressed against the weight of the article. As a result, the projecting edge d ″ is also deformed. Accordingly, it becomes impossible to maintain the space between the upper and lower tray bodies a ″, and the upper tray body a ″ crushes the articles stored in the lower tray body a ″ or comes into contact with the articles and causes friction. Could cause damage.
[0004]
  The present invention solves the above-mentioned conventional drawbacks, and reliably and sufficiently secures an article storage space for storing articles in a non-contact state between the upper and lower tray bodies, and the tray body is a thermoplastic synthetic resin sheet. Even if it is molded by thermoforming, even if the weight of all articles is added when the tray body is stacked, the tray body is molded robustly without causing deformation, for example, semiconductor integrated circuit, IC card, substrate, liquid crystal It can be stored and transported properly without scratching or touching electronic parts such as panels, guaranteeing highly accurate, high quality and reliable products, and with a simple structure suitable for mass production. Providing storage trays for electronic components, etc. with low production costs and mold costsAims to doIs.
[0005]
[Means for Solving the Problems]
  The present invention has been made in view of the above problems, and the invention according to claim 1 is that a tray body having a substantially dish shape is formed by thermoforming a thermoplastic synthetic resin sheet such as vacuum forming, and the tray body is formed. Around the outer edge of the body,Provided with a flange, an outer leg having an inclined surface that is open outward and downward so as to be able to be stacked on a tray body disposed in a lower stage is provided on the outer lower side of the flange,The outer legs areThere is a stacking protrusion that is stacked on the upper surface of the buttock of the tray body that is placed on the lower stage from the top surface of theTo the desired heightIn the storage tray for formed electronic components, etc., the overlapping protrusionwhileIn,A vertical groove with a desired depth inwardly intersects the plate surface of the outer leg in the height direction between the top surface of the buttocks and the lower part of the outer leg.ButFormationIsThe longitudinal groove isThe direction of the plate surface of the outer flangeFront andThatThe width of the upper partInstallation lengthNarrower and flutesSaidThe means that the width of the lower part of the front is formed wider than the width of the upper part of the front is adopted.
[0006]
  Further, in the invention described in claim 2 of the present invention, in the invention described in claim 1, the vertical protrusion is formed by forming the longitudinal groove at two or more appropriate positions of the flange provided around the tray body. We adopted the means of characterizing this.
[0007]
  According to a third aspect of the present invention, in any one of the first or second aspect, the longitudinal groove is formed in a substantially plane H shape or a plane I shape with respect to the flange portion. We adopted the means of
[0008]
  The invention according to claim 4 of the present invention is the longitudinal groove according to any one of claim 1, claim 2, or claim 3., The upper and lower sides of the tray body,By forming two or more pieces to one place with respect to the desired collar, overlapping protrusions are formed on the left and right sides of the vertical groove.OppositeAdopted means characterized by being formed.
[0009]
  According to a fifth aspect of the present invention, the longitudinal groove according to any one of the first, second, third, and fourth aspects is provided.,And the overhangThe aboveButtockOf the aboveOn the outer leg,OverallFlat semicircular shapeSeveralThe means of being arranged was adopted.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
  Hereinafter, specific examples of embodiments of the present invention will be described with reference to the drawings.
  FIG. 1 is a plan view showing a storage tray for electronic parts and the like according to the present invention, FIG. 2 is an enlarged front view showing an example of an overlapping protruding portion that also constitutes this embodiment, and FIG. 3 is also surrounded by a circle A in FIG. FIG. 4 is an enlarged front view showing another example of the overlapping projecting portion constituting the present embodiment, and FIG. 5 is an overlapping projecting portion surrounded by a circle B in FIG. FIG. 6 is a horizontal half sectional view showing a state in which the tray main bodies are stacked, FIG. 7 is a vertical half sectional view showing the state in which the tray main bodies are stacked, and FIG. FIG. 9 is a cross-sectional view of a stacking protrusion surrounded by a circle A in FIG. 1 and FIG. 9 is a cross-sectional view of a stacking protrusion surrounded by a circle B in FIG. It is.
[0011]
  In the figure, reference numeral 1 denotes a tray body whose overall shape is formed in a substantially dish shape by thermoforming a thermoplastic synthetic resin sheet, such as vacuum forming. Around the outer edge of the tray body 1, there are flanges 2A, 2B. , 2C, 2D and the outer leg portions 4A, 2B, 2C, 2D are provided with outer leg portions 4 having slopes 3 that are opened downward and outward so that they can be stacked on the tray body 1 disposed in the lower stage. . Although not shown in the drawing, when the tray body 1 is thermoformed using a thermoplastic synthetic resin sheet, the tray body 1 is molded in the mold with the top and bottom reversed.
  Examples of the thermoplastic synthetic resin sheet include polystyrene, polypropylene, polyvinyl chloride, and PET resin.
[0012]
  5 is a height direction between the top surface I of the flanges 2A, 2B, 2C, and 2D and the lower part 4a of the outer leg 4 in the present embodiment as shown in the figure. Z has a longitudinal groove 6 with a desired depth W1.RecessedBy forming on the plate surface of the outer leg 4forInwardly crossing X, YProtrudingThe overlap protrusion 5 is formed on the upper surface of the vertical groove 6 corresponding to the flanges 2A, 2B, 2C, 2D of the tray body 1 arranged in the lower stage, and has a desired depth W2. The article storage space 7 is secured.
[0013]
  The longitudinal groove 6 isThe plate surface of the outer casing 4frontAnd thatThe width L1 of the upper part 6a is the overlap protrusion.It corresponds to the installation length arranged in the plate surface longitudinal direction of 5The width L of the front upper portion 6a of the longitudinal groove 6 is narrower than the thickness N.1Further, the width L2 of the front lower portion 6b is formed wider.
  Further, the longitudinal groove 6 has two or more appropriate portions of the flange portions 2A, 2B, 2C, 2D provided around the tray body 1, and in this embodiment, for example, as shown in FIG. 1, the flange portions 2A, 2B, 2C, Two or more overlapping protrusions 5 are formed by forming each of the four portions in 2D.
  Further, for example, as shown in FIGS. 1 and 3, the vertical groove 6 is formed in a substantially plane H shape or a substantially plane I shape with respect to the flange portions 2A, 2B, 2C, 2D. Further, the longitudinal groove 6 is, as shown in a circle A in FIGS. 1 and 3, for example, in the opposite flange portions 2 </ b> B and 2 </ b> D among the desired flange portions 2 </ b> A, 2 </ b> B, 2 </ b> C, and 2 </ b> D in this embodiment. By forming one for the location, two overlapping protrusions 5 and 5 are formed on the left and right of the vertical groove 6.OppositeIn addition to being formed, the opposite collar 2A, 2CIn FIG. 1 and FIG. 5, the vertical grooves 6 and 6 are sandwiched by forming two or more vertical grooves 6 in one place as shown in a circle B in FIG. 1 and FIG.Intermediate part to be turned and the longitudinal groove 6 , 6'sLeft and rightof,A total of three overlapping protrusions 5, 5, and 5 are formed. The two vertical grooves 6, 6 and the overlapping protrusions 5, 5, 5OverallFlat semicircular shapeSeveralArranged.
[0014]
  In FIG. 1, 9 is a large number of recesses formed in the tray body 1, and these recesses 9 are for storing and holding electronic components. In the illustrated embodiment, a total of 20 are formed in 5 rows and 4 columns. Is done. The shape and depth of the recess 9 can be freely changed in accordance with whether it is a single product, a connected product, or a plate shape according to the external shape of the electronic component to be stored.
  Reference numerals 10a and 10b denote holding protrusions that are appropriately formed on the inner periphery or the inner periphery of the recess 9. The holding protrusions 10a and 10b store and hold electronic components without rattling or dropping off. And are arranged in conformity with the outer shape of the electronic component.
[0015]
  One embodiment of the present invention has the above-described configuration. For example, the overall shape is formed in a substantially dish shape by thermoforming such as vacuum forming using a thermoplastic synthetic resin sheet such as polystyrene, polypropylene, polyvinyl chloride, and PET resin. In order to store electronic components such as a semiconductor integrated circuit, an IC card, a substrate, and a liquid crystal panel in the tray body 1 that has been formed, first, the four tray bodies 1 are arranged in two rows and two columns in front of the operator. The point is similar to a conventional tray. Next, electronic components such as a semiconductor integrated circuit, an IC card, a base, and a liquid crystal panel are accommodated and held in a large number of recesses 9 provided in the tray body 1.
[0016]
  When the electronic components are stored and transported in the tray body 1 after being stored and transported, the tray bodies 1 in which the electronic components are stored in the recesses 9 are stacked in multiple stages.
  At this time, around the outer edge of the tray body 1, there are provided the outer legs 4A, 2B, 2C, 2D and the outer legs 4 having the open slopes 3 below the outer edges of the flanges 2A, 2B, 2C, 2D. Therefore, the outer legs provided on the lower side of the flanges 2A, 2B, 2C, 2D of the tray body 1 arranged in the upper stage on the flange parts 2A, 2B, 2C, 2D of the tray body 1 arranged in the lower stage 4 (see FIGS. 6, 7, 8, and 9).
[0017]
  A vertical groove 6 having a desired depth W1 is formed in the tray body 1 in the height direction Z between the top surface I of the flanges 2A, 2B, 2C, and 2D and the lower portion 4a of the outer leg 4.RecessedBy forming on the plate surface of the outer leg 4forOverlapping projections 5 are formed on the inwardly intersecting X and Y sides.And the vertical groove 6 has the width L1 of the upper part 6a with the plate surface of the outer flange part 4 as the front.HeavyThe width L2 of the front lower portion 6b is formed wider than the width N1 of the front upper portion 6a of the longitudinal groove 6 which is narrower than the thickness N corresponding to the installation length of the projecting portion 5.Therefore, the stacking protrusions 5 and 5 of the tray body 1 arranged in the upper stage are stacked on the upper surfaces of the vertical grooves 6 corresponding to the flanges 2A, 2B, 2C and 2D of the tray body 1 arranged in the lower stage. Therefore, an article storage space 7 having a desired depth W2 is secured between the upper and lower tray bodies 1, 1,.
  The article storage space 7 is high enough to store electronic components such as semiconductor integrated circuits, IC cards, boards, and liquid crystal panels in a non-contact state between the tray bodies 1 and 1 stacked one above the other. become. Therefore, the tray according to the present embodiment is extremely suitable for storing and transporting electronic parts and the like that require high quality because they are extremely disliked from being damaged.
[0018]
  In addition, two or more appropriate portions are provided in the flange portions 2A, 2B, 2C, 2D provided around the tray body 1, and in this embodiment, for example, four portions are provided in the flange portions 2A, 2B, 2C, 2D as shown in FIG. Since the vertical protrusions 6 are formed at least on the left and right sides of the vertical groove 6, respectively, the tray body 1 is reliably stacked as described above. As shown in FIG.₁, T₁, T₂, T₂Like the conventional tray T provided at the same position of the tray body T₁, T₁, T₂, T₂From the viewpoint of securing the article storage space k when stacked on each other, for example, the front tray body T₁, T₁In contrast, the rear tray body T₂, T₂There is no need for the trouble of stacking by rotating 180 degrees. In addition, since the tray body 1 is thermoformed in a state where it is turned upside down with respect to the mold using a thermoplastic synthetic resin sheet, the protruding edges S are respectively formed on the tray body T as shown in FIG.₁, T₂, T_Three, T_FourUnlike the case where the conventional trays T provided at different positions are formed, a dedicated mold is not required to form each tray T. Therefore, the mold cost is cheap. Moreover, in the tray main body 1 of the present embodiment, the electronic component storage work and the tray main body 1 stacking work need not be performed after confirming the installation position of the overlapping protruding portion 5 as in the prior art. It takes a lot of time and effort, and it can be done quickly and reliably, no human error occurs, and automation of work using a robot becomes easy.
[0019]
  The longitudinal groove 6 isSaidSince the flanges 2A, 2B, 2C, and 2D are formed in a substantially plane H shape or a plane I shape, when a thermoplastic synthetic resin sheet is thermoformed upside down with respect to the mold, the mold The mold can be easily peeled off, and molding is easy.
[0020]
  Also, the desired collar 2A, 2B, 2C, 2DInIn this embodiment, in the opposite flange portions 2B and 2D, one vertical groove 6 is formed for one location, so that two overlapping protruding portions 5 and 5 are formed on the left and right sides of the vertical groove 6.OppositeIn addition to being formed, two or more longitudinal grooves 6 in FIG. 1, FIG. 4 and FIG. 5 are formed in the longitudinal grooves 6 and 6 by forming two or more in the opposite flange portions 2A and 2C.The intermediate part sandwiched,Left and right of the longitudinal groove 6,6WithA total of three overlapping protrusions 5, 5, 5 are formed, and the two longitudinal grooves 6, 6 and the overlapping protrusions 5, 5, 5 areOverallSince the planes are arranged in a substantially semicircular shape, with respect to the stacking protrusions 5 provided on the flanges 2A, 2B, 2C, 2D of the tray body 1 arranged at the lower stage when the tray bodies 1, 1. The support of the overlapping protrusions 5 provided on the flanges 2A, 2B, 2C, 2D of the tray body 1 stacked on the upper stage is ensured and stable.
[0021]
  Moreover, as shown in FIGS. 2 and 4, the longitudinal groove 6 has a width L1 of the front upper portion 6a of the overlapping protruding portion 5.Equivalent to installation lengthSince the width L2 of the front lower portion 6b is narrower than the thickness N and wider than the width L1 of the front upper portion 6a of the vertical groove 6, for example, a large number provided in the tray body 1 as shown in FIG. Then, the total weight of the electronic components stored and held in the recesses 9 in which 5 rows and 4 columns are formed in total is thermoformed using a thermoplastic synthetic resin sheet such as polystyrene, polypropylene, polyvinyl chloride, and PET resin. The vertical grooves 6 corresponding to the flanges 2A, 2B, 2C, and 2D of the tray body 1 disposed in the lower stage receive the weight even when added to the tray body 1 formed byBecauseWithout being enlarged or deformed,In addition, the flange 2A on the peripheral surface of the tray body 1 arranged in the lower stage , 2B , 2C , In the vertical groove 6 provided in 2D, the flange 2A around the tray body 1 arranged in the upper stage , 2B , 2C , Without forming the vertical groove 6 formed in 2D,The overlapping protrusions 5, 5; 5, 5, 5 of the tray body 1 disposed on the upper stage are reliably stacked on the upper surface of the overlapping protrusions 5, 5; 5, 5, 5 disposed on both sides of the vertical groove 6. The structure can be firmly supported.
[0022]
  In the embodiment shown in FIG. 1, for example, a desired brim portion 2 that is opposed to one of the brim portions 2 </ b> A, 2 </ b> B, 2 </ b> C, 2 </ b> D provided around the tray body 1.B, 2DIn FIG. 1 and FIG. 2, as one longitudinal groove 6 is formed for one location, two overlapping protrusions 5 and 5 are formed on the left and right sides of the longitudinal groove 6.Opposite1, 4, and 5, two or more, for example, two vertical grooves 6 are formed in one of the opposite flange portions 2 </ b> B and 2 </ b> D to form the vertical grooves 6, 6.ByPinchedAn intermediate part,Left and right of the longitudinal groove 6,6With,A total of three overlapping protrusions 5, 5, 5 are formed, and the two longitudinal grooves 6, 6 and the overlapping protrusions 5, 5, 5 areOverallThe plane is arranged in a semicircular shape,The illustration is an example, and although not shown in the figure, the longitudinal groove 6 is formed by forming one longitudinal groove 6 on one or all of the collar portions 2A, 2B, 2C, 2D. Two overlapping protrusions 5 and 5 may be formed on the left and right, or two or more vertical grooves 6 are formed in one or all of the flange portions 2A, 2B, 2C, and 2D. The longitudinal grooves 6, 6.ByThe intermediate part sandwiched and the left and right of the longitudinal grooves 6, 6.WithA total of three overlapping protrusions 5, 5, 5 may be formed. Moreover, the two vertical grooves 6 and 6 and the overlapping protrusions 5, 5, and 5Overall as shownThey may be arranged in a substantially semicircular plane. Furthermore, the increase / decrease change of the vertical groove 6 and the overlap protrusion 5 can be performed freely.
[0023]
【The invention's effect】
  As described above, the invention according to claim 1 of the present invention forms a tray body having a substantially dish shape as a whole by subjecting a thermoplastic synthetic resin sheet to thermoforming such as vacuum forming. Around the outer edge,Provided with a flange, an outer leg having an inclined surface that is open outward and downward so as to be able to be stacked on a tray body disposed in a lower stage is provided on the outer lower side of the flange,The outer legs areThere is a stacking protrusion that is stacked on the upper surface of the buttock of the tray body that is placed on the lower stage from the top surface of theTo the desired heightIn the storage tray for formed electronic components, etc., the overlapping protrusionwhileIn,A vertical groove with a desired depth inwardly intersects the plate surface of the outer leg in the height direction between the top surface of the buttocks and the lower part of the outer leg.ButFormationIsThe longitudinal groove isThe direction of the plate surface of the outer flangeFront andThatThe width of the upper partInstallation lengthNarrower and flutesSaidSince the width of the lower part of the front is wider than the width of the upper part of the front, even when the tray body is formed by thermoforming a thermoplastic synthetic resin sheet, Even if weight is added, the tray body is formed with a robust structure without causing deformation, so that it is suitable without scratching or touching electronic components such as semiconductor integrated circuits, IC cards, boards, and liquid crystal panels. Can be stored and transported. Therefore, a highly accurate and high quality product such as a highly reliable semiconductor component can be guaranteed, and the structure is simple and suitable for mass production, and the manufacturing cost and mold cost are also low.
[0024]
  Further, in the invention described in claim 2 of the present invention, in the invention described in claim 1, the vertical protrusion is formed by forming the longitudinal groove at two or more appropriate positions of the flange provided around the tray body. Therefore, the tray bodies can be stacked quickly and reliably in a stable and reliable manner without rotating the tray bodies by 180 ° during stacking.
[0025]
  According to a third aspect of the present invention, in any one of the first or second aspect, the longitudinal groove is formed in a substantially plane H shape or a plane I shape with respect to the flange portion. Therefore, when a thermoplastic synthetic resin sheet is thermoformed upside down with respect to the mold, it is easy to remove the mold from the mold, and the molding is easy.
[0026]
  The invention according to claim 4 of the present invention is the longitudinal groove according to any one of claim 1, claim 2, or claim 3., The upper and lower sides of the tray body,By forming two or more pieces to one place with respect to the desired collar, overlapping protrusions are formed on the left and right sides of the vertical groove.OppositeThe tray main body is stacked on the upper surface of the vertical groove corresponding to the flange portion of the tray main body arranged in the lower stage, and the tray main body is stacked up and down. A sufficient space for storing articles of the desired depth can be secured between them. For example, electronic components such as semiconductor integrated circuits, IC cards, boards, and liquid crystal panels can be properly stored without scratching or touching them. Can be transported. Therefore, a highly accurate and high quality product such as a highly reliable semiconductor component can be guaranteed, and the structure is simple and suitable for mass production, and the manufacturing cost and mold cost are also low.
[0027]
  According to a fifth aspect of the present invention, the longitudinal groove according to any one of the first, second, third, and fourth aspects is provided.,And the overhangThe aboveButtockOf the aboveOn the outer leg,OverallFlat semicircular shapeSeveralSince the stack main body is stacked, the stacking protrusions provided on the buttock of the tray body stacked on the upper stage with respect to the stacking protrusions provided on the buttock of the tray main body arranged on the lower stage when the tray main bodies are stacked. Support is ensured.
[Brief description of the drawings]
FIG. 1 is a plan view showing a storage tray for electronic parts and the like according to the present invention.
FIG. 2 is an enlarged front view showing an example of overlapping protrusions that also constitute the embodiment.
FIG. 3 is an enlarged plan view showing an example of an overlapping protruding portion similarly surrounded by a circle A in FIG. 1;
FIG. 4 is an enlarged front view showing another example of the overlapping protrusions that similarly constitute the embodiment.
FIG. 5 is an enlarged plan view showing another example of the overlapping protruding portion similarly surrounded by a circle B in FIG. 1;
FIG. 6 is a horizontal half sectional view showing a state in which the tray main bodies are similarly stacked.
FIG. 7 is a longitudinal half sectional view showing a state in which the tray main bodies are similarly stacked.
FIG. 8 is a cross-sectional view of the overlapping protruding portion surrounded by a circle A in FIG.
FIG. 9 is a cross-sectional view of a stacking protruding portion surrounded by a circle B in FIG.
FIG. 10 is a cross-sectional view in a stacked state showing a conventional tray in which a protrusion having a substantially L-shaped cross section is formed on the tray body.
FIG. 11 is a cross-sectional view in a stacked state showing another example of a conventional tray in which a protrusion having a groove having a substantially V-shaped cross section is formed on the tray body.
FIG. 12 is a cross-sectional view of a stacked state of trays in which another conventional tray is shown and a protruding edge portion is provided on a flange portion of the tray body.
FIG. 13 is a plan view showing a tray which is similarly provided with a protruding edge portion at the same position of the tray main body.
FIG. 14 is a plan view showing a tray in which protruding edge portions are similarly provided at different positions of the tray main body.
FIG. 15 is a cross-sectional view showing a stacked state of a tray in which another example of a conventional tray is shown, and a protruding edge portion on which a stacked upper tray main body is seated is provided on a part of the flange portion.
[Explanation of symbols]
1 Tray body
2A Isobe
2B Isobe
2C Isobe
2D buttock
3 slope
4 Outer legs
4a Bottom
5 Overlapping projections
6 Vertical groove
6a Upper front
6b Lower front
7 Goods storage space
9 recess
L1 width
L2 width
X inward
Y inward
Z height direction

Claims (5)

By forming the thermoplastic synthetic resin sheet by thermoforming such as vacuum forming, a tray body having a substantially dish shape is formed, and a flange is provided around the outer edge of the tray body. the outward and downward is provided outside legs having capable slopes opened outward downwardly stacked tray body disposed in the lower, the outer legs, the top surface of that tray body disposed in the lower part In a storage tray for an electronic component or the like in which overlapping protrusions stacked on the upper surface of the flange are formed at a desired height, the height between the top surface of the flange and the lower portion of the outer leg is between the overlapping protrusions. are formed longitudinal grooves of desired depth inwardly substantially cross to the plate surface of the outer leg in the direction of said longitudinal groove and the front of the plate surface direction of the outer collar portion, a width the overlapping of the upper narrower than the installation length of the projecting portion, and flutes the front upper portion of the width the width of the front bottom wider than Storage tray of electronic components, characterized in that it is made.   2. The storage tray for electronic parts and the like according to claim 1, wherein the vertical protrusions are formed at two or more appropriate portions of a flange provided around the tray body to form the overlapping protrusions.   3. The storage tray for electronic components and the like according to claim 1, wherein the vertical groove is formed in a substantially plane H shape or a plane I shape with respect to the flange portion. The vertical groove is overlapped on the left and right sides with the vertical groove formed by forming two or more of the vertical grooves on one side with respect to a desired collar portion of the upper and lower peripheral edges of the tray body. claim 1, protrusion, characterized in that it is formed to face, claim 2 or storage tray of electronic components according to claim 3,. Said longitudinal groove, and overlapping protrusions in the outer leg of the flange portion, claim 1, characterized in that the plurality is arranged in a generally planar substantially semicircular, claim 2, claim 3. A storage tray for electronic components or the like according to claim 3.

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