JP2001253436A - Semi conductor device manufacturing method, and tray used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the efficiency of the storing/taking-out works of a semi conductor device in/from a tray, and the performance of the tray. SOLUTION: The tray comprises a face side pocket 1a and a back side pocket 1e which form a pair of rectangular apertures 1b, 1f corresponding to the contour shape of a QFN 2 on a face side 1n and a back side 1p, and stores the QFN 2, and a piece member 1j which is arranged in the face side pocket 1a and the back side pocket 1e, respectively, provided with a face side support portion 1k and a back side support portion 1l which are integratedly formed, and movably supported toward the aperture 1b on the face side 1n and the aperture 1f on the back side 1p, and the QFN 2 can be stored by either the face side pocket 1a or the back side pocket 1e of the tray.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing technique, and more particularly to a technique which is effective when applied to improving the performance of a stacked tray for accommodating a small semiconductor device.

[0002]

2. Description of the Related Art The technology described below studies the present invention,
Upon completion, they were examined by the inventor, and the outline is as follows.

A semiconductor device (semiconductor package) is transported between each step of a semiconductor manufacturing process, or is used as a container for storing a semiconductor device used for shipping.
A plate-shaped container called a tray is known.

[0004] In this tray, a plurality of pockets (storage portions) for storing each semiconductor device are formed in a matrix, and each semiconductor device is stored in each pocket.

[0005] In the tray, it is necessary to consider the storability and the protection of the stored items, so that a guide height (pocket depth) equal to or higher than the height of the semiconductor device to be stored is required.

Further, there is a case where a function of accommodating both the front and back surfaces of the tray is required, and therefore it is necessary to satisfy a guide height equal to or greater than that of the semiconductor device in the front and back pockets.

[0007] The semiconductor device can be housed on either of the front and back surfaces, and a stacked tray is described in, for example, Japanese Patent Publication No. 2852872, which discloses that the semiconductor device has a rectangular shape. In this case, a structure is introduced in which the front surface guides four corners of the semiconductor device and the back surface guides a part of the semiconductor device excluding the four corners.

[0008]

However, in the tray having the structure described in Japanese Patent Publication No. 2852872, a QFN (Quad Flat Non-leaded Package) or a CSP
When a small semiconductor device such as a (Chip Scale Package) is housed, the size of the fitting portion (engaging portion) on the front and back surfaces for stacking the trays becomes extremely small.

As a result, there is a problem that a small semiconductor device cannot be held within a required accuracy range.

Here, when the fitting portion guides the outer periphery of the semiconductor device, a necessary guide distance on the front surface side + a required guide distance on the back surface + interference prevention distance of each other + manufacturing tolerance = housed goods (semiconductor device) This is the outer peripheral distance.

[0011] Therefore, as the size of the semiconductor device to be housed becomes smaller, the ratio of the manufacturing tolerance increases, and the ratio of the interference prevention distance also increases.

As a result, the ratio left in the guides on the front and back surfaces is extremely small. As a result, there is a problem in that a sufficient guide cannot be formed in a tray for storing a small semiconductor device.

It is an object of the present invention to provide a method of manufacturing a semiconductor device for improving the efficiency and performance of a storage / removal operation and a tray used for the same.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0015]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, in the method of manufacturing a semiconductor device according to the present invention, a pair of openings corresponding to the outer shape of the semiconductor device are formed on the front side and the back side opposite thereto, and are respectively connected to the openings. A plurality of storage portions on the front side and the back side, and a front side support portion and a back side support portion arranged in the front side and the back side storage portion, respectively, and facing the opening portions on the front side and the back side. A step of preparing a tray having a movably supported piece member; a step of mounting the semiconductor device on the front side support part or the back side support part of the piece member; The semiconductor device is positioned while being guided by the opening of the tray, and the semiconductor device is supported and lowered by the front-side support portion or the back-side support portion to lower the tray. And a step of housing the semiconductor device in the receiving portion of the front side or back side.

According to the present invention, when the semiconductor device is stored in the tray, the semiconductor device is stored through the opening of the storage portion provided on the front and back surfaces and the piece member is lowered by the weight of the semiconductor device. Since the semiconductor device can be guided to the storage section, the semiconductor device can be stored in the storage section without requiring high positioning accuracy when the semiconductor device is arranged on the storage section.

Therefore, it is possible to ease the positional accuracy when the semiconductor device is placed on the storage portion on the front surface side or the rear surface side of the tray, and as a result, the positional accuracy can be roughly managed, so that the semiconductor device on the tray can be roughly controlled. The efficiency of the operation when the device is stored can be improved.

In the tray according to the present invention, a pair of openings corresponding to the external shape of the semiconductor device are formed on the front side and the back side opposite to the front side. A plurality of storage portions on the front side and the back side connected to the front side and the back side side, and a front side support portion and a back side support portion which are respectively arranged in the front side and the back side storage portion and are integrally formed, and A piece member movably supported toward an opening on the back side, wherein the semiconductor device is supported by one of the front side support portion and the back side support portion, and the semiconductor device is accommodated therein. Sometimes, the inclined surface for guiding the semiconductor device is formed inwardly from the opening on the front side and the back side of each of the storage portions.

[0020]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments, members having the same functions are denoted by the same reference numerals, and the repeated description thereof will be omitted.

FIG. 1 is a sectional view showing an example of the basic structure of a tray according to an embodiment of the present invention. FIG. 2 is a view showing the structure of the tray shown in FIG. 1 in a stacked state. Sectional view facing upward, (b) is a sectional view facing upward on the back side,
3 is a plan view showing an example of the structure on the front surface side of the tray according to the embodiment of the present invention, FIG. 4 is a plan view showing the structure on the back surface side of the tray shown in FIG. 3, and FIG. 5 is an embodiment of the present invention. QF which is an example of a semiconductor device used in the method of manufacturing a semiconductor device according to the present invention.
6A is a plan view, FIG. 6B is a side view, FIG. 6 is a QF shown in FIG. 5 using the tray shown in FIG.
FIG. 7A is a diagram illustrating an example of a state in which N is stored, and FIG.
FIG. 7B is a plan view showing the front side pocket through N, FIG. 7B is an enlarged partial sectional view, FIG. 7C is a bottom view showing the rear side pocket, and FIG. FIG. 8 is an enlarged partial cross-sectional view showing a state in which trays are stacked with the front side facing upward. FIG. 8 is an enlarged partial cross-sectional view showing a state in which QFNs are stored in the tray shown in FIG. 3 and the trays are stacked with the rear side facing upward. FIGS. 9A and 9B are views showing an example of a method of mounting a QFN in a method of manufacturing a semiconductor device according to the present invention, and FIG.
FIG. 7B is a conceptual diagram in which N is taken out of a pocket and mounted on a mounting board, and FIG. 7B is a conceptual diagram in which QFN is stored in a pocket.

The tray 1 according to the present embodiment is a laminated plate-shaped one in which semiconductor devices (also referred to as semiconductor packages) are arranged and stored in a matrix.

First, the basic configuration of the tray 1 according to the present embodiment will be described with reference to FIGS.

1 and 2 show only one front side pocket (front side storage section) 1a and back side pocket (back side storage section) 1e of a plurality of pockets formed in the tray 1. And the front side 1n of the tray 1 is set to the upper side, and the back side 1p is set to the lower side.

Further, as an example of the semiconductor device stored in the tray 1, a semiconductor chip 3 is incorporated in a main body 2a as shown in FIGS. 5 (a) and 5 (b).
A surface mount type in which a plurality of leads 2b are arranged on the surface on the mounting side of the main body 2a, and is small (for example, an outer diameter of 4 mm × 4 mm).
mm and a thickness of 1 mm or less).

The tray 1 has a pair of rectangular openings 1b and 1f corresponding to the outer shape of the QFN 2 formed on the front side 1n and the rear side 1p opposite to the front side 1n. Front side pocket 1a connected to the portion 1b and the back side pocket 1e connected to the opening 1f, and the front side pocket 1a and the back side pocket 1e
And a surface-side support portion 1k and a back-side support portion 11 formed integrally with each other, and are movably supported toward an opening 1b on the front side 1n and an opening 1f on the back side 1p. The QFN 2 is supported by one of the front side support portion 1k and the back side support portion 11 and the inclined surfaces 1d and 1h for guiding the QFN 2 when the QFN 2 is stored are formed on the front side. It is formed inward from the openings 1b and 1f of the pocket 1a and the back side pocket 1e.

That is, the front side pocket 1a is made of QFN
2 has a rectangular opening 1b of a shape corresponding to the main body 2a, and an inner wall 1c connected inward from the opening 1b is a slight inclined surface 1d.

Similarly, the back pocket 1e is made of QFN2.
Has a rectangular opening 1f having a shape corresponding to the main body 2a, and an inner wall 1g connected inward from the opening 1f is a slight inclined surface 1d.

The bottom of each of the front side pocket 1a and the back side pocket 1e is formed by a common frame supporting portion 1i with respect to the front and back surfaces.

The bridge member 1j is provided with a front side pocket 1a.
Front side support portion 1k and rear side pocket 1e
And a connecting portion 1m for integrally connecting the front side supporting portion 1k and the back side supporting portion 11 to each other. As shown in FIG. The piece support part 1 of the tray 1 so that it can move freely
It is a movable piece supported by i.

At this time, the connecting portion 1m of the piece member 1j is supported so as to have a slight frictional force with the piece supporting portion 1i.

Thus, when the piece member 1j supports the QFN 2, the piece member 1j descends at a gentle speed due to the frictional force with the piece supporting portion 1i.

The front side support portion 1k serves as a stopper for the piece member 1j when it is moved down or up.
Further, a projection 1q is provided on the back side support portion 1l, and the projection 1q abuts on the piece support portion 1i to stop the movement of the piece member 1j.

FIG. 2A shows the tray 1 shown in FIG.
2 are stacked, and the front side 1n is directed upward. FIG. 2B shows a state in which this state is reversed and the rear side 1p is directed upward.

That is, since the tray 1 of the present embodiment is of a stacked type and has a movable piece member 1j which is movable up and down (front and back sides), the tray 1 is turned upside down in the stacked state. However, it has a function that can maintain the stored state of the QFN 2 as it is.

Subsequently, FIGS. 1 and 2 will be described with reference to FIGS.
The structure of an application example of the tray 1 using the basic structure shown in FIG.

Here, as shown in FIGS. 3 and 4,
A tray 1 that can store 10 × 25 = 250 QFNs 2 on one side will be described. However, the number of semiconductor devices that can be stored is not limited to 250, and may be 250 or less or 250 or more.

As shown in FIG. 3, the front side 1n of the tray 1
6A, 250 front side pockets 1a shown in FIG. 6A are formed, while the rear side pocket 1e shown in FIG. Are formed.

The front side pocket 1a has a QFN2
A square opening 1b corresponding to and slightly larger than the square main body 2a of FIG.
As shown in (b), the inner wall 1c connected from the opening 1b to the inside of the front side pocket 1a has a slight inclined surface 1d. When the QFN 2 is stored in the front side pocket 1a, the inclined wall 1c is used. The outer periphery of the QFN2 is guided by the surface 1d to position the QFN2 and to guide the QFN2 inward.

Similarly, the QFN is also provided in the back side pocket 1e.
A square opening 1f corresponding to and slightly larger than the square main body 2a of FIG. 2 is formed, and as shown in FIG. The inner wall 1g connected to the inside has a slight inclined surface 1h, and when the QFN2 is stored in the back side pocket 1e, the outer periphery of the QFN2 is guided by the inclined surface 1h to position the QFN2. We guide toward.

That is, in the tray 1 of the present embodiment,
The entire outer periphery of the main body 2a of the QFN 2 is used for guiding.

The piece member 1j is provided with a front side pocket 1a.
Front side support portion 1k and rear side pocket 1e
And a connecting portion 1m for integrally connecting the front side supporting portion 1k and the back side supporting portion 11 to each other, as shown in FIG. 6 (b). It is supported by the frame supporting portion 1i of the tray 1 so as to be movable toward the side 1p, and at this time, the connecting portion 1m
Are supported so as to have a slight frictional force with the piece support portion 1i.

Thus, when the piece member 1j supports the QFN 2, the piece member 1j descends at a gentle speed due to the frictional force with the piece supporting portion 1i.

In the tray 1 shown in FIGS. 3 and 4, the stopper function of the piece member 1j when the tray member 1j is moved down or up is provided by the front side support portion 1k and the back side support portion 1k.
1 and the outer peripheral ends of the front-side support portion 1k and the back-side support portion 1l are connected to the frame support portion 1 of the tray 1.
The movement of the piece member 1j is stopped by abutting on i.

In the tray 1, the front side pocket 1a
6B, the depth of the back side pocket 1e, the thickness of the piece supporting portion 1i, and the length of the piece member 1j are as shown in FIG. 6B.

That is, the length of the piece member 1j + the thickness of the QFN2 is equal to the depth of the front side pocket 1a + the rear side pocket 1
e + the thickness of the piece supporting portion 1i is slightly smaller than the thickness of the front side pocket 1a, and the depth of the front side pocket 1a is slightly larger than the thickness of the front side supporting portion 1k + the thickness of the QFN2. Is the thickness of the back side supporting portion 1l + Q
The relationship is such that the thickness is slightly larger than the thickness of FN2.

As a result, as shown in FIG.
In the tray 1 in a stacked state with n facing upward, the QFN
2 is a front side pocket 1a and a front side supporting portion 1 of a piece member 1j.
As shown in FIG. 8, in the state where the frame member 1j is turned upside down, the frame member 1j slowly descends while the upper and lower QFNs 2 are sandwiched by the frame member 1j, and the QFN2 is turned upside down. The QFN 2 is moved from the side pocket 1a to the back side pocket 1e. As a result, the QFN 2 is supported by the back side pocket 1e of the other tray 1 by the back side supporting portion 11 of the piece member 1j without dropping the QFN 2.

Therefore, according to the tray 1 of the present embodiment, even if the QFN2 is a small semiconductor device, it can be supported on any of the front and back surfaces, and the QFN2 is dropped in a stacked state. It is possible to reverse the front and back of the tray 1 without any need.

Next, a method of manufacturing the semiconductor device according to the present embodiment will be described.

In the present embodiment, as a method of manufacturing the semiconductor device, a method of stacking QFNs 2 using a tray 1, a method of transporting the semiconductor devices, and a method of mounting the semiconductor devices on a mounting board will be described.

First, at least two trays 1 shown in FIGS. 3, 4 and 6 to 8 are prepared.

Here, a case where the QFN 2 is stored in the front pocket 1a of the tray 1 will be described.

Therefore, the piece member 1j is raised to move the piece member 1 near the opening 1b of the front side pocket 1a of the tray 1.
The front-side support portion 1k of j is arranged.

Further, the opening 1b of the front side pocket 1a
After arranging the QFN2 thereon, the QFN2 is placed on the front-side support portion 1k of the bridge member 1j.

Subsequently, the opening 1b of the front side pocket 1a
QF by the inclined surface 1d formed inward from
While guiding the outer periphery of the main body portion 2a of N2, it is positioned, and the front side support portion 1k of the piece member 1j is used for positioning.
The FN2 is supported, and the piece member 1j is lowered by the weight of the QFN2 (here, the weight of the piece member 1j and the weight of the QFN2) to store the QFN2 in the front surface side pocket 1a of the tray 1.

Thereafter, a plurality of trays 1 each containing the QFN 2 in the front pocket 1a are stacked as shown in FIG.

Thus, a plurality of trays 1 can be stacked.

Next, transport of the QFN 2 (semiconductor device) using the tray 1 will be described.

For example, when transporting the QFN 2 using the tray 1 between desired steps of the semiconductor manufacturing process, first, the QFN 2 is placed in the front pocket 1 a of each tray 1.
2 are stored by the above method, and then a plurality of trays 1 are stored.
Are stacked and arranged in multiple stages as shown in FIG.

Then, the plurality of trays 1 in the stacked state are transported between semiconductor manufacturing processes by an automatic transport vehicle or the like.

Next, a method of transferring the QFN 2 from the stacked tray 1 to the mounting substrate 6 and mounting the same will be described.

First, as shown in FIG. 9A, for example,
The piece member 1j supporting the QFN2 is pushed up by the rod 5 of the cylinder 4, and thereafter, the surface of the main body 2a of the QFN2 is sucked by the suction collet 7 or the like as holding means of the QFN2, and the suction collet 7 is raised. Then, the QFN 2 is taken out from the front side pocket 1a and transferred to a predetermined location on the mounting board 6 such as a printed wiring board.

Subsequently, the QFN2
And QFN2 by, for example, solder reflow.
Are electrically connected to the mounting substrate 6, thereby mounting the QFN 2 on the mounting substrate 6.

On the contrary, when the QFN 2 is stored in the front side pocket 1a of the tray 1 using the suction collet 7 or the like, the piece member 1j is pushed up in advance using the cylinder 4 or the like, and then the suction member 1j is sucked. The suction by the collet 7 is stopped, and the QFN 2 is placed on the front support 1k of the bridge member 1j.

Subsequently, as shown in FIG. 9B, when the rod 5 of the cylinder 4 is lowered, the piece member 1j is also slowly lowered due to its own weight and the weight of the QFN2.

At this time, the opening 1b of the front side pocket 1a
QF by the inclined surface 1d formed inward from
While guiding the outer periphery of the main body portion 2a of N2, the QFN2 in which this is positioned is housed in the front side pocket 1a.

According to the method of manufacturing a semiconductor device of the present embodiment and the tray used therein, the following operational effects can be obtained.

That is, when the QFN 2 is stored in the tray 1, the weight of the piece member 1j and the weight of the QFN 2 are adjusted through the opening portions 1b and 1f of the front side pocket 1a and the back side pocket 1e provided on the front and back surfaces. Lower only the weight and Q
FN2 is replaced with the front side pocket 1a or the back side pocket 1e.
Therefore, when arranging the QFN 2 on the front side pocket 1a or the back side pocket 1e, the QFN 2 can be placed in the front side pocket 1a or the back side pocket 1e without requiring high positioning accuracy. Can be.

Therefore, it is possible to relax the positional accuracy when the QFN 2 is arranged on the front pocket 1a or the rear pocket 1e of the tray 1, and as a result, the positional accuracy can be roughly managed. QFN
(2) The work efficiency at the time of storage can be improved.

As a result, the tray 1 corresponding to a small-sized semiconductor device such as the QFN 2 can be obtained. The tray 1 of the present embodiment as shown in FIG. 4 can be realized.

Further, when the frame member 1j is lowered on the tray 1, the frame member 1j is lowered only by its own weight and the weight of the QFN2, so that the frame member 1j can be lowered slowly. When storing a semiconductor device such as a QFP (Quad Flat Package) having outer leads, the stress applied to the outer leads can be reduced.

As a result, it is possible to prevent the outer leads from being bent when the tray is stored, thereby improving the performance of the tray 1 and the quality of such a semiconductor device.

Each opening 1 is formed on both the front and back sides.
The outer circumference of the QFN 2 can be guided by the b, 1f and the inclined surface 1d of the front side pocket 1a or the inclined surface 1h of the back side pocket 1e. As a result, the storage position accuracy of the QFN 2 when the tray is stored can be improved.

Thus, when the appearance inspection of the QFN 2 is performed, the inspection can be performed with the QFN 2 stored in the tray 1.

Therefore, the time for moving the QFN 2 to the appearance inspection apparatus can be omitted, and as a result, the throughput of the appearance inspection can be improved.

In the tray 1, the frame member 1j is
Since it can be moved by the weight of N2, when the tray 1 is turned upside down at the time of visual inspection of the QFN2, the piece member 1j can support the QFN2 arranged on the opposite surface.

Therefore, the tray 1 can be turned upside down as it is in the stacked tray 1,
As a result, the appearance of the semiconductor device such as the QFN 2 can be inspected by turning over the tray 1 in the stacked storage state.

Although the invention made by the inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the embodiments of the present invention, and does not depart from the gist of the invention. It is needless to say that various changes can be made.

For example, in the above embodiment, the case where the semiconductor device is the QFN 2 has been described. However, as in the tray 1 of another embodiment shown in FIG. 10, the semiconductor device is a BGA (Ball Grid Array) 8. BGA is attached to the ends of the front side support portion 1k and the back side support portion 11 of the piece member 1j.
By providing a package supporting portion 1r for supporting the outer periphery of the body portion 8a except for the solder bumps 8b, which are external terminals on the mounting surface side, a tray 1 capable of storing the BGA 8 is provided.
It can be.

If the semiconductor device is of a surface mount type, for example, a CS device other than QFN2 or BGA8 may be used.
P (Chip Scale Package), QFP or SOP (Smal
l Outline Package).

In the above-described embodiment, the front side 1n of the tray 1 is set to the upper side, and the back side 1p is set to the lower side.
p may be upward.

Further, in the above-described embodiment and the other embodiments, the case where the number of stacked trays 1 is two is described when the trays 1 are stacked. However, the number of stacked trays 1 is particularly limited. It is not a thing and may be any number of stages.

[0083]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1). When the semiconductor device is stored in the tray, the piece member can be guided into the storage portion through the opening of the storage portion provided on the front and back surfaces and while the piece member is lowered by the weight of the semiconductor device. When arranging a semiconductor device on a unit, the semiconductor device can be housed in the storage unit without requiring high positioning accuracy. Therefore, since the positional accuracy when the semiconductor device is arranged on the storage portion on the front side or the back side of the tray can be roughly managed,
The efficiency of the operation when the semiconductor device is stored in the tray can be improved. Accordingly, it is possible to realize a tray that is compatible with a small-sized semiconductor device, is a dual-purpose type, is a stacked type, and can perform sufficient guiding.

(2). When the bridge member is lowered, it is lowered by the weight of the semiconductor device, so that the bridge member can be lowered slowly.
When storing a semiconductor device such as P, the stress applied to the outer leads can be reduced. This can prevent lead bending that occurs when the tray is stored,
As a result, the performance of the tray can be improved and the quality of the semiconductor device can be improved.

(3). Since the outer periphery of the semiconductor device can be guided by the opening and the inclined surface of the storage portion on both the front and back sides, the storage position accuracy of the semiconductor device when the tray is stored can be improved. Thus, when performing the appearance inspection of the semiconductor device, the inspection can be performed while the semiconductor device is stored in the tray. Therefore, the time for moving the semiconductor device to the appearance inspection apparatus can be omitted, and as a result, the throughput of the appearance inspection can be improved.

(4). Since the piece member is movable by the weight of the semiconductor device in the tray, the piece member can support the semiconductor device arranged on the opposite surface when the tray is turned upside down, for example, during a visual inspection of the semiconductor device. Therefore, the appearance of the semiconductor device can be inspected by turning over the tray in the stacked and housed state.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of a basic structure of a tray according to an embodiment of the present invention.

2 (a) and 2 (b) are diagrams showing the structure of the tray shown in FIG. 1 in a stacked state, wherein FIG. 2 (a) is a cross-sectional view with the front side facing upward, and FIG. FIG.

FIG. 3 is a plan view illustrating an example of a structure on a front surface side of the tray according to the embodiment of the present invention.

FIG. 4 is a plan view showing a structure on the back side of the tray shown in FIG. 3;

FIGS. 5A and 5B are QFs as an example of a semiconductor device used in a method of manufacturing a semiconductor device according to an embodiment of the present invention;
It is a figure which shows the structure of N, (a) is a top view, (b) is a side view.

6 (a), (b), and (c) are views showing an example of a state in which the QFN shown in FIG. 5 is stored by the tray shown in FIG. 3, and FIG. FIG. 2 is a plan view showing a pocket, FIG. 2B is an enlarged partial sectional view, and FIG. 2C is a bottom view showing a back side pocket.

7 is an enlarged partial cross-sectional view showing a state in which QFNs are stored in the tray shown in FIG. 3 and the trays are stacked with the front side facing upward.

8 is an enlarged partial cross-sectional view showing a state in which QFNs are stored in the tray shown in FIG. 3 and the trays are stacked with their back sides facing upward.

FIGS. 9A and 9B are diagrams illustrating an example of a method of mounting a QFN in a method of manufacturing a semiconductor device according to the present invention;
(A) is a conceptual diagram of taking out a QFN from a pocket and mounting it on a mounting board, and (b) is a conceptual diagram of storing a QFN in a pocket.

FIG. 10 is a cross-sectional view illustrating a stacked state of trays according to another embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1 tray 1a front side pocket (front side storage section) 1b opening 1c inner wall 1d inclined surface 1e back side pocket (rear side storage section) 1f opening 1g inner wall 1h inclined surface 1i piece support section 1j piece member 1k front side Support section 1l Back side support section 1m Connecting section 1n Front side 1p Back side 1q Projection section 1r Package support section 2 QFN (semiconductor device) 2a Body section 2b Lead 3 Semiconductor chip 4 Cylinder 5 Rod 6 Mounting board 7 Suction collet (holding means) 8) BGA (semiconductor device) 8a Main body 8b Solder bump

Continued on the front page F term (reference) 3E006 AA03 BA01 CA01 DA03 DB05 3E062 AA03 AB10 FA01 FB02 FC10 3E096 AA09 BA08 BB03 CA06 CB02 CC02 DA25 DB10 DC02 FA10 FA11 FA26 FA28 GA13

Claims (5)

[Claims] A pair of openings corresponding to an outer shape of a semiconductor device are formed on a front side and a back side opposite to the front side, and a plurality of storage parts on a front side and a back side respectively connected to the openings. And a piece member including a front side support part and a back side support part respectively disposed in the front side and the back side storage part and movably supported toward the opening part on the front side and the back side. Preparing a tray having: a step of placing the semiconductor device on the front side support portion or the back side support portion of the piece member; and guiding the semiconductor device through the opening on the front side or the back side. And the semiconductor device is supported and lowered by the front side support portion or the back side support portion, and the semiconductor device is lowered into the storage portion on the front side or back side of the tray. The method of manufacturing a semiconductor device characterized by a step of housing the body device. 2. A plurality of storage portions on the front side and the back side respectively connected to the openings, and a pair of openings corresponding to the outer shape of the semiconductor device are formed on the front side and the back side opposite thereto. And a piece member including a front side support part and a back side support part respectively disposed in the front side and the back side storage part and movably supported toward the opening part on the front side and the back side. Preparing a tray having: a step of arranging the front-side support portion or the back-side support portion of the piece member near an opening of the storage portion on the front side or the back side; Mounting the semiconductor device on the front side support portion or the back side support portion, and guiding the semiconductor device by an inclined surface formed inward from the opening of the storage portion on the front side and the back side. The semiconductor device is supported by the front-side support portion or the back-side support portion while the piece member is lowered by the weight of the semiconductor device to store the tray on the front side or the back side. Accommodating the semiconductor device in a section. 3. A pair of openings corresponding to the outer shape of the semiconductor device are formed on the front side and the back side opposite to the front side, and are respectively connected to the openings on the front side and the back side. And a piece member including a front side support part and a back side support part respectively disposed in the front side and the back side storage part and movably supported toward the opening part on the front side and the back side. Preparing at least two trays of a stacked type having; and arranging the front-side support portion or the back-side support portion of the piece member near an opening of the storage portion on the front side or the back side; Mounting the semiconductor device on the front side support portion or the back side support portion of the piece member; and on an inclined surface formed inward from the opening of the storage portion on the front side and the back side. Yo Positioning the semiconductor device while guiding it, supporting the semiconductor device by the front-side support portion or the back-side support portion, lowering the piece member by the weight of the semiconductor device, A step of accommodating the semiconductor device in an accommodating portion on the front side or the back side; and laminating at least two trays accommodating the semiconductor device in the accommodating section on the front side or the back side, respectively. Device manufacturing method. 4. A pair of openings corresponding to the outer shape of the semiconductor device are formed on the front side and the back side opposite to the front side and are respectively connected to the openings on the front side and the back side. And a piece member including a front side support part and a back side support part respectively disposed in the front side and the back side storage part and movably supported toward the opening part on the front side and the back side. Preparing a tray having: a step of arranging the front-side support portion or the back-side support portion of the piece member near an opening of the storage portion on the front side or the back side; Mounting the semiconductor device on the front side support portion or the back side support portion, and guiding the semiconductor device by an inclined surface formed inward from the opening of the storage portion on the front side and the back side. The semiconductor device is supported by the front-side support portion or the back-side support portion while the piece member is lowered by the weight of the semiconductor device to store the tray on the front side or the back side. Housing the semiconductor device in a portion, raising the piece member supporting the semiconductor device, and arranging the semiconductor device in the vicinity of the opening of the housing portion on the front side or the back side; holding means Holding the semiconductor device and taking out the semiconductor device from the storage portion on the front surface side or the back surface side, and thereafter, transferring the semiconductor device to a mounting board and mounting the semiconductor device on the mounting board. A method for manufacturing a semiconductor device, comprising: 5. A stacked tray capable of storing a surface-mounted semiconductor device, wherein a pair of openings corresponding to the outer shape of the semiconductor device are formed on a front side and a back side opposite to the opening. A plurality of storage portions on the front side and the back side that respectively receive the semiconductor device and are respectively connected to the openings; and a front side support that is disposed and integrally formed in the storage portions on the front side and the back side, respectively. And a piece member movably supported toward the opening on the front side and the back side, and one of the front side supporting section and the back side supporting section. By supporting the semiconductor device, an inclined surface for guiding the semiconductor device when the semiconductor device is stored is formed inward from the opening on the front side and the back side of each of the storage portions. Tray.