JP2007221416A5 - - Google Patents

Claims (9)

A substrate, a comb electrode provided on the upper surface of the substrate, and a protective film that covers the comb electrode and has a concavo-convex shape on the top surface,
When the rotation angle in the Z-axis direction around the X axis is D °,
0 ° ≦ D ° ≦ 25 °
A lithium niobate substrate cut from the Y plate of
The pitch width per pitch of the comb-shaped electrodes is p, the width per electrode finger constituting the comb-shaped electrodes is p1, the width between the electrode fingers is p2, and from the substrate surface to the top of the comb-shaped electrodes When the thickness of the comb electrode defined by the height of h is h,
h / (2 × p) ≧ 4.5% (however, p1 + p2 = p is satisfied)
Is an electronic component. 2. The electronic component according to claim 1, wherein the protective film has a concavo-convex shape so as to suppress spurious frequencies on a lower frequency side than a resonance frequency. The electronic component according to claim 1, wherein the comb-shaped electrode is made of aluminum or an alloy containing aluminum as a main component. The pitch width per pitch of the irregular shape of the protective film L, the width of the convex portions per pitch of the uneven shape of the protective film L1, the width of the recess L2, the pitch per one pitch of the comb-shaped electrode When the width is p, the width per electrode finger constituting the comb electrode is p1, and the width between the electrode fingers is p2,
L1 ≦ p1 and L2 ≧ p2
The electronic component according to claim 1, wherein p1 + p2 = p and L1 + L2 = L are satisfied. The electronic component according to claim 1, wherein the substrate is a bonded substrate of a lithium niobate substrate and a silicon substrate. When the thickness of the protective film defined by the height from the substrate surface to the recess of the protective film is t,
t / (2 × p) ≦ 30%
The electronic component according to claim 1, wherein The electronic component according to claim 1, wherein the protective film is silicon dioxide. The pitch width per pitch of the concavo-convex shape of the protective film is L, the width of the convex portion per pitch of the concavo-convex shape of the protective film is L1, the width of the concave portion is L2, and the pitch width per pitch of the comb-shaped electrode P, the width per electrode finger constituting the comb electrode is p1, and the width between the electrode fingers is p2,
L1 ≦ p1 and L2 ≧ p2
2. The method of manufacturing an electronic component according to claim 1, wherein a bias sputtering method is used as a method of obtaining a shape satisfying a relationship of (where p1 + p2 = p and L1 + L2 = L are satisfied). An electronic apparatus having at least one antenna and an electric circuit electrically connected to the antenna, wherein the electric circuit includes a plurality of electronic components, and at least one of the plurality of electronic components is defined in claim 1. The electronic device which is an electronic component as described in.