JP2007220911A - 半導体装置製造用接着シート、及びそれを用いた半導体装置の製造方法 - Google Patents
半導体装置製造用接着シート、及びそれを用いた半導体装置の製造方法 Download PDFInfo
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Abstract
【解決手段】 本発明の半導体装置製造用接着シートは、半導体素子を被着体上に接着させる半導体装置製造用接着シートであって、少なくとも熱可塑性樹脂及び架橋剤を含み構成され、かつ、100℃の温水に対する溶解度が10重量%以下であり、ゲル分率が50重量%以上であることを特徴とする。
【選択図】 図1
Description
即ち、本発明の半導体装置製造用接着シートによれば、100℃の温水に対する溶解度を10重量%以下にし、かつ、ゲル分率を50重量%以上にするので、例えばダイシング時の冷却水や洗浄水により溶解したり、ダイシングブレードとの摩擦により熱溶融するのを防止する。その結果、樹脂封止の際に半導体素子に割れやヒビが生じるのを防止し、高信頼性の半導体装置を歩留まり良く製造することが可能になる。
本発明の実施の形態について、以下に説明する。本実施の形態に係る半導体装置製造用接着シート(以下、「接着シート」と言う)は、半導体素子を被着体上に接着させる際に使用されるものであって、少なくとも熱可塑性樹脂及び架橋剤を含み構成される。また、接着シートの100℃の温水に対する溶解度は10重量%以下であり、好ましくは5重量%以下、より好ましくは3重量%以下である。前記溶解度が10重量%を超えると、接着シートがダイシング時の冷却水に溶解する量が大きくなり、接着シートの大きさが半導体チップより小さくなる。
本発明に形態2に係る半導体装置の製造方法について、図2を参照しながら説明する。図2は、本実施の形態に係る半導体装置の製造方法を説明する為の工程図である。
本実施の形態3に係る半導体装置の製造方法について、図3を参照しながら説明する。図3は、本実施の形態に係る半導体装置の製造方法を説明する為の工程図である。
本実施の形態4に係る半導体装置の製造方法について、図4を参照しながら説明する。図4は、本実施の形態に係る半導体装置の製造方法を説明する為の工程図である。
本実施の形態5に係る半導体装置の製造方法について、図5を参照しながら説明する。図5は、本実施の形態に係る半導体装置の製造方法を説明する為の工程図である。
本実施の形態6に係る半導体装置の製造方法について、図6及び図7を参照しながら説明する。図6は、本実施の形態に係る半導体装置の製造方法を説明する為の工程図である。図7は、本実施の形態に係る半導体装置の製造方法により得られた半導体装置の概略を示す断面図である。
本実施の形態7に係る半導体装置の製造方法について、図8を参照しながら説明する。図8は、本実施の形態に係る半導体装置の製造方法を説明する為の工程図である。
前記被着体上に半導体チップ(半導体素子)を3次元実装する場合、半導体チップの回路が形成される面側には、バッファーコート膜が形成されている。当該バッファーコート膜としては、例えば窒化珪素膜やポリイミド樹脂等の耐熱樹脂からなるものが挙げられる。
アクリル酸エチル−メチルメタクリレートを主成分とするアクリル酸エステル系ポリマー(根上工業(株)製、商品名;パラクロンW−197CM、数平均分子量80万)100部に対して、多官能イソシアネート系架橋剤3部、エポキシ樹脂(ジャパンエポキシレジン(株)製、商品名;エピコート1004)23部、フェノール樹脂(三井化学(株)製、商品名;ミレックスXLC−LL)6部をメチルエチルケトンに溶解させ、濃度20重量%の接着剤組成物の溶液を調製した。
本実施例2に於いては、実施例1にて使用したアクリル酸エステル系ポリマーに替えて、ブチルアクリレートを主成分としたポリマー(根上工業(株)製、商品名;パラクロンSN−710、数平均分子量110万)を用いたこと以外は、前記実施例1と同様にして、本実施例2に係る接着シート(厚さ25μm)を作製した。
アクリル酸エチルーメチルメタクリレートを主成分とするアクリル酸エステル系ポリマー(根上工業(株)製、商品名;パラクロンW−197CM)100部に対して、エポキシ樹脂(ジャパンエポキシレジン(株)製、商品名;エピコート1004)23部、フェノール樹脂(三井化学(株)製、商品名;ミレックスXIC−11)6部をメチルエチルケトンに溶解させ、濃度20重量%の接着剤組成物の溶液を調整した。
本比較例2に於いては、前記比較例1にて使用したアクリル酸エステル系ポリマーに替えて、ブチルアクリレートを主成分としたポリマー(根上工業(株)製、商品名;パラクロンSN−710)を用いた以外は、比較例1と同様にして、比較例2に係る接着シート(厚さ25μm)作製した。
前記実施例及び比較例に於いて作製した接着シートについて、温水(100℃)に対する溶解度を次の通りに測定した。即ち、各々の接着シートを100mm×125mmの試験片にした。
A=(C−B)÷C×100
A:溶解度(wt%)
B:試験片の乾燥重量(g)
C:試験片の初期重量(g)
前記実施例及び比較例に於いて作製した接着シートについて、ゲル分率を次の通りに測定した。即ち、各々の接着シートを100mm×125mmの試験片にした。次に、これらの試験片を23℃、65%RH雰囲気下に2時間放置し、各初期重量を測定した。
前記実施例及び比較例で得られた接着シートを用いて、次の方法でダイシング・ダイボンドフィルムを作製した。
アクリル酸ブチル70部、アクリル酸エチル30部及びアクリル酸5部を酢酸エチル中で常法により共重合して重量平均分子量80万、濃度30重量%のアクリル系ポリマーの溶液を得た。当該アクリル系ポリマーの溶液に、光重合性化合物としてジペンタエリスリトールモノヒドロキシペンタアクリレート20部及び光重合開始剤としてα−ヒドロキシシクロヘキシルフェニルケトン1部を配合した。これらをトルエンに均一に溶解して、濃度25重量%の放射線硬化型アクリル系粘着剤の溶液を作製した。
厚さが60μmのポリエチレンフィルムからなる支持基材上に、前記放射線硬化型アクリル系粘着剤の溶液を塗布、乾燥して、厚さが20μmの粘着剤層を形成した。
前記に於いて作製した各ダイシング・ダイボンドフィルムのダイシングは、ディスコ社製ダイサーDFD651を用いて行った。このとき、ダイシングは10mm×10mmの大きさの半導体チップが得られる様に、冷却水を用いて行った。得られた接着シート付き半導体チップに於いて、半導体チップの面積と接着シートの面積の大きさを比較した。尚、ダイシング条件は、下記の通りとした。
ダイシング装置:ディスコ社製ダイサーDFD651
ダイシング速度:50mm/sec
ダイシングブレード:ディスコ社製205O−SE27HECC
ダイシングブレード回転数:40000rpm
接着シート切り込み深さ:85μm
半導体チップのサイズ:10mm×10mm
12 接着シート(半導体装置製造用接着シート)
13 半導体チップ(半導体素子)
14 接着シート
16 ボンディングワイヤー
21 スペーサ
31 接着シート(半導体装置製造用接着シート)
32 半導体チップ(半導体素子)
33 ダイシングシート
41 接着シート(半導体装置製造用接着シート)
42 コア材料
Claims (7)
- 半導体素子を被着体上に接着させる半導体装置製造用接着シートであって、
少なくとも熱可塑性樹脂及び架橋剤を含み構成され、かつ、100℃の温水に対する溶解度が10重量%以下であり、ゲル分率が50重量%以上であることを特徴とする半導体装置製造用接着シート。 - 前記請求項1に記載の半導体装置製造用接着シートであって、
前記熱可塑性樹脂が、数平均分子量40万〜300万のアクリル樹脂であることを特徴とする半導体装置製造用接着シート。 - 前記請求項1又は2に記載の半導体装置製造用接着シートであって、
前記熱可塑性樹脂の含有量は、接着シートを構成する有機樹脂成分100重量部に対し、20〜90重量部であることを特徴とする半導体装置製造用接着シート。 - 前記請求項1〜3の何れか1項に記載の半導体装置製造用接着シートであって、
前記架橋剤の含有量は、接着シートを構成する有機樹脂成分100重量部に対し、0.05〜7重量部であることを特徴とする半導体装置製造用接着シート。 - 前記請求項1〜4の何れか1項に記載の半導体装置製造用接着シートであって、
前記接着シートが更に熱硬化性樹脂を含み構成されることを特徴とする半導体装置製造用接着シート。 - 前記請求項5に記載の半導体装置製造用接着シートであって、
前記熱硬化性樹脂がエポキシ樹脂及びフェノール樹脂の少なくとも何れか一方であることを特徴とする半導体装置製造用接着シート。 - 前記請求項1〜6の何れか1項に記載の半導体装置製造用接着シートを用いたことを特徴とする半導体装置の製造方法。
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JPH0586346A (ja) * | 1991-09-25 | 1993-04-06 | Nitto Denko Corp | マスキング用感圧性接着剤とその接着フイルム |
JPH1046127A (ja) * | 1996-08-07 | 1998-02-17 | Soken Chem & Eng Co Ltd | 耐水・耐溶剤性粘着剤および粘着シート |
JP2000169806A (ja) * | 1998-12-09 | 2000-06-20 | Nitto Denko Corp | マスキング用感圧性接着フィルム |
JP2004186429A (ja) * | 2002-12-03 | 2004-07-02 | Furukawa Electric Co Ltd:The | 粘接着テープ |
WO2005004216A1 (ja) * | 2003-07-08 | 2005-01-13 | Lintec Corporation | ダイシング・ダイボンド用粘接着シートおよび半導体装置の製造方法 |
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JPH0586346A (ja) * | 1991-09-25 | 1993-04-06 | Nitto Denko Corp | マスキング用感圧性接着剤とその接着フイルム |
JPH1046127A (ja) * | 1996-08-07 | 1998-02-17 | Soken Chem & Eng Co Ltd | 耐水・耐溶剤性粘着剤および粘着シート |
JP2000169806A (ja) * | 1998-12-09 | 2000-06-20 | Nitto Denko Corp | マスキング用感圧性接着フィルム |
JP2004186429A (ja) * | 2002-12-03 | 2004-07-02 | Furukawa Electric Co Ltd:The | 粘接着テープ |
WO2005004216A1 (ja) * | 2003-07-08 | 2005-01-13 | Lintec Corporation | ダイシング・ダイボンド用粘接着シートおよび半導体装置の製造方法 |
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