JP2007214307A - 電子デバイス - Google Patents

電子デバイス Download PDF

Info

Publication number
JP2007214307A
JP2007214307A JP2006031950A JP2006031950A JP2007214307A JP 2007214307 A JP2007214307 A JP 2007214307A JP 2006031950 A JP2006031950 A JP 2006031950A JP 2006031950 A JP2006031950 A JP 2006031950A JP 2007214307 A JP2007214307 A JP 2007214307A
Authority
JP
Japan
Prior art keywords
substrate
sealing material
electronic component
bonding
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006031950A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007214307A5 (enExample
Inventor
Yuugo Koyama
裕吾 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyazaki Epson Corp
Original Assignee
Epson Toyocom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epson Toyocom Corp filed Critical Epson Toyocom Corp
Priority to JP2006031950A priority Critical patent/JP2007214307A/ja
Publication of JP2007214307A publication Critical patent/JP2007214307A/ja
Publication of JP2007214307A5 publication Critical patent/JP2007214307A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2006031950A 2006-02-09 2006-02-09 電子デバイス Withdrawn JP2007214307A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006031950A JP2007214307A (ja) 2006-02-09 2006-02-09 電子デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006031950A JP2007214307A (ja) 2006-02-09 2006-02-09 電子デバイス

Publications (2)

Publication Number Publication Date
JP2007214307A true JP2007214307A (ja) 2007-08-23
JP2007214307A5 JP2007214307A5 (enExample) 2009-02-26

Family

ID=38492476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006031950A Withdrawn JP2007214307A (ja) 2006-02-09 2006-02-09 電子デバイス

Country Status (1)

Country Link
JP (1) JP2007214307A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283650A (ja) * 2009-06-05 2010-12-16 Daishinku Corp 圧電発振器
US8080921B2 (en) 2008-03-10 2011-12-20 Epson Toyocom Corporation Reduced-height piezoelectric device having a piezoelectric resonator and electronic component
US8547182B2 (en) 2010-10-08 2013-10-01 Nihon Dempa Kogyo Co., Ltd. Oven controlled crystal oscillator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8080921B2 (en) 2008-03-10 2011-12-20 Epson Toyocom Corporation Reduced-height piezoelectric device having a piezoelectric resonator and electronic component
JP2010283650A (ja) * 2009-06-05 2010-12-16 Daishinku Corp 圧電発振器
US8547182B2 (en) 2010-10-08 2013-10-01 Nihon Dempa Kogyo Co., Ltd. Oven controlled crystal oscillator

Similar Documents

Publication Publication Date Title
JP4795602B2 (ja) 発振器
US8941445B2 (en) Piezoelectric module
US7745978B2 (en) Quartz crystal device
JP2010050778A (ja) 圧電デバイス
JP2005143042A (ja) 圧電デバイス
JPWO2020122179A1 (ja) 圧電振動デバイス
JP5101201B2 (ja) 圧電発振器
CN102201796A (zh) 封装件、电子装置、以及电子装置的制造方法
JP5171148B2 (ja) 圧電発振器
JP2007214307A (ja) 電子デバイス
JP2005094514A (ja) 表面実装型パッケージ及びこれを用いた圧電デバイス
JP5097929B2 (ja) 電子部品の製造方法
JP2007235544A (ja) 圧電振動デバイスおよびその製造方法
JP4172774B2 (ja) 表面実装型圧電発振器
JP2007189282A (ja) 圧電デバイスとその製造方法
JP2001053546A (ja) 圧電発振器の構造
JP6601288B2 (ja) 圧電発振器
JP2007201616A (ja) 表面実装型圧電発振器、及びその製造方法
JP4704819B2 (ja) 圧電デバイスの製造方法
JP2000315918A (ja) 水晶発振器
JP7243015B2 (ja) 電子部品および電子部品の接合構造
JP4645393B2 (ja) 表面実装型圧電発振器、及び電子部品ユニット
JP2008011125A (ja) 弾性表面波デバイス
JP2007235707A (ja) 圧電デバイス
JP2008141413A (ja) 圧電発振器及びその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090109

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090109

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090630

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20100115