JP2007208302A5 - - Google Patents

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Publication number
JP2007208302A5
JP2007208302A5 JP2007128741A JP2007128741A JP2007208302A5 JP 2007208302 A5 JP2007208302 A5 JP 2007208302A5 JP 2007128741 A JP2007128741 A JP 2007128741A JP 2007128741 A JP2007128741 A JP 2007128741A JP 2007208302 A5 JP2007208302 A5 JP 2007208302A5
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JP
Japan
Prior art keywords
plasma processing
plasma
frequency power
applying
substrate
Prior art date
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Granted
Application number
JP2007128741A
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English (en)
Japanese (ja)
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JP4642809B2 (ja
JP2007208302A (ja
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Priority to JP2007128741A priority Critical patent/JP4642809B2/ja
Priority claimed from JP2007128741A external-priority patent/JP4642809B2/ja
Publication of JP2007208302A publication Critical patent/JP2007208302A/ja
Publication of JP2007208302A5 publication Critical patent/JP2007208302A5/ja
Application granted granted Critical
Publication of JP4642809B2 publication Critical patent/JP4642809B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2007128741A 2007-05-15 2007-05-15 プラズマ処理方法及びプラズマ処理装置 Expired - Lifetime JP4642809B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007128741A JP4642809B2 (ja) 2007-05-15 2007-05-15 プラズマ処理方法及びプラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007128741A JP4642809B2 (ja) 2007-05-15 2007-05-15 プラズマ処理方法及びプラズマ処理装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2002256096A Division JP4322484B2 (ja) 2002-08-30 2002-08-30 プラズマ処理方法及びプラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2007208302A JP2007208302A (ja) 2007-08-16
JP2007208302A5 true JP2007208302A5 (cg-RX-API-DMAC7.html) 2010-02-12
JP4642809B2 JP4642809B2 (ja) 2011-03-02

Family

ID=38487431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007128741A Expired - Lifetime JP4642809B2 (ja) 2007-05-15 2007-05-15 プラズマ処理方法及びプラズマ処理装置

Country Status (1)

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JP (1) JP4642809B2 (cg-RX-API-DMAC7.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5317509B2 (ja) * 2008-03-27 2013-10-16 東京エレクトロン株式会社 プラズマ処理装置および方法
JP2010010214A (ja) * 2008-06-24 2010-01-14 Oki Semiconductor Co Ltd 半導体装置の製造方法、半導体製造装置、及び記憶媒体
JP5063520B2 (ja) 2008-08-01 2012-10-31 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
JP5203986B2 (ja) 2009-01-19 2013-06-05 東京エレクトロン株式会社 フォーカスリングの加熱方法、プラズマエッチング方法、プラズマエッチング装置及びコンピュータ記憶媒体
JP5976377B2 (ja) * 2012-04-25 2016-08-23 東京エレクトロン株式会社 被処理基体に対する微粒子付着の制御方法、及び、処理装置
JP6195528B2 (ja) * 2014-02-19 2017-09-13 東京エレクトロン株式会社 プラズマ処理装置及びその運転方法
KR102573194B1 (ko) * 2018-12-11 2023-08-30 어플라이드 머티어리얼스, 인코포레이티드 극저온 정전 척
KR20210006682A (ko) 2019-07-09 2021-01-19 세메스 주식회사 기판 처리 장치
KR102277822B1 (ko) * 2019-07-09 2021-07-14 세메스 주식회사 기판 처리 장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06318552A (ja) * 1993-05-10 1994-11-15 Nissin Electric Co Ltd プラズマ処理方法及び装置
JPH1027780A (ja) * 1996-07-10 1998-01-27 Nec Corp プラズマ処理方法

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