JP2007207847A - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP2007207847A JP2007207847A JP2006022453A JP2006022453A JP2007207847A JP 2007207847 A JP2007207847 A JP 2007207847A JP 2006022453 A JP2006022453 A JP 2006022453A JP 2006022453 A JP2006022453 A JP 2006022453A JP 2007207847 A JP2007207847 A JP 2007207847A
- Authority
- JP
- Japan
- Prior art keywords
- module
- sim
- electronic device
- motherboard
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
- G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
- G06F1/162—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position changing, e.g. reversing, the face orientation of the screen with a two degrees of freedom mechanism, e.g. for folding into tablet PC like position or orienting towards the direction opposite to the user to show to a second user
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
【解決手段】電子機器1は、筐体20とマザーボード7とスタッド71と開口部211と蓋212とを備える。筐体20は、電磁波に対する遮蔽性を有し、本体2の外殻を構成する。マザーボード7は、筐体20に内蔵される。スタッド71は、マザーボード7の下面側に取り付けられ、積層配置される複数の増設モジュール8a,8bを一組のネジ72で共締めすることができる。開口部211は、複数の増設モジュール8a,8bの総実装面積よりも小さく筐体20の底壁21に設ける。蓋212は、電磁波に対する遮蔽性を有し、開口部211を覆う。
【選択図】 図2
Description
Claims (7)
- 電磁波に対する遮蔽性を有し、本体の外殻を構成する筐体と、
前記筐体に内蔵されるマザーボードと、
前記マザーボードの下面側に取り付けられ、積層配置される複数の増設モジュールを一組のネジで共締めすることができるスタッドと、
複数の前記増設モジュールの総実装面積よりも小さく前記筐体の底壁に設けられる開口部と、
電磁波に対する遮蔽性を有し、前記開口部を覆う蓋と
を備えることを特徴とする電子機器。 - 前記増設モジュールは、モデム機能を有したMDCモジュール、および、SIMカードが装着されるSIM搭載モジュールを含み、
前記MDCモジュールを単層で前記スタッドに固定する場合と、
前記SIM搭載モジュールを単層で前記スタッドに固定する場合と、
前記MDCモジュールと前記SIM搭載モジュールとをスペーサを挟んで積層し、前記マザーボード寄りに前記MDCモジュールを配置して前記スタッドに固定する場合と
の少なくとも3つの形態のいずれか1形態に前記増設モジュールが前記マザーボードに実装されることを特徴とする請求項1に記載の電子機器。 - 前記MDCモジュールは、前記マザーボードに対して積層される方向に差し込まれるコネクタで前記マザーボードと接続されることを特徴とする請求項2に記載の電子機器。
- 前記SIM搭載モジュールは、前記マザーボードに対してケーブルで接続されることを特徴とする請求項2に記載の電子機器。
- 前記MDCモジュールに貼付されて葛折に畳まれたラベルが前記SIM搭載モジュールによって押えられることを特徴とする請求項2に記載の電子機器。
- 前記SIM搭載モジュールは、利用者から見て前記筐体の前後方向に沿って抜脱可能に前記SIMカードが装着されることを特徴とする請求項2に記載の電子機器。
- 前記筐体は、前記外殻の内面から前記開口部の縁の外側まで導電層が設けられた合成樹脂で形成され、
前記蓋は、導電性の部材で形成され、
前記開口部の縁で前記導電層と前記蓋とが電気的に接続されることを特徴とする請求項1に記載の電子機器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006022453A JP4282671B2 (ja) | 2006-01-31 | 2006-01-31 | 電子機器 |
US11/657,585 US7580270B2 (en) | 2006-01-31 | 2007-01-25 | Electronic apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006022453A JP4282671B2 (ja) | 2006-01-31 | 2006-01-31 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007207847A true JP2007207847A (ja) | 2007-08-16 |
JP4282671B2 JP4282671B2 (ja) | 2009-06-24 |
Family
ID=38321879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006022453A Expired - Fee Related JP4282671B2 (ja) | 2006-01-31 | 2006-01-31 | 電子機器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7580270B2 (ja) |
JP (1) | JP4282671B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4998417B2 (ja) * | 2008-09-12 | 2012-08-15 | 富士通株式会社 | 電子機器 |
US8687359B2 (en) | 2008-10-13 | 2014-04-01 | Apple Inc. | Portable computer unified top case |
KR20100069969A (ko) * | 2008-12-17 | 2010-06-25 | 삼성전자주식회사 | 휴대용 단말기의 메모리 실장 구조 |
US7903418B2 (en) * | 2009-04-21 | 2011-03-08 | Hewlett-Packard Development Company, L.P. | Thermal mitigation device and method |
JP5699995B2 (ja) * | 2012-07-02 | 2015-04-15 | 株式会社デンソー | 電力変換装置 |
US9538693B2 (en) | 2013-03-15 | 2017-01-03 | A.K. Stamping Company, Inc. | Aluminum EMI / RF shield |
US10542644B2 (en) | 2016-12-14 | 2020-01-21 | A.K. Stamping Company, Inc. | Two-piece solderable shield |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4829432A (en) * | 1987-12-28 | 1989-05-09 | Eastman Kodak Company | Apparatus for shielding an electrical circuit from electromagnetic interference |
DE4320683C2 (de) * | 1992-06-22 | 1995-11-30 | Toshiba Kawasaki Kk | Tragbares Informationsverarbeitungsgerät |
JP3297251B2 (ja) | 1995-06-20 | 2002-07-02 | 株式会社東芝 | 携帯形電子機器 |
JP3725636B2 (ja) * | 1996-11-01 | 2005-12-14 | 株式会社東芝 | 携帯形電子機器 |
JPH11184559A (ja) | 1997-12-24 | 1999-07-09 | Toshiba Corp | 携帯形情報機器 |
US6362974B1 (en) * | 2000-03-20 | 2002-03-26 | Hewlett-Packard Company | Stacked processor construction and a method for producing same |
US7170742B2 (en) * | 2001-09-26 | 2007-01-30 | Lg Electronics Inc. | Peripheral device mounting holder and portable computer including the holder |
JP2004165552A (ja) | 2002-11-15 | 2004-06-10 | Toshiba Corp | 電子機器 |
JP2005190296A (ja) | 2003-12-26 | 2005-07-14 | Toshiba Corp | 電子機器 |
US6942153B1 (en) * | 2004-05-25 | 2005-09-13 | Unitech Electronics Co.,Inc. | Handheld computer |
-
2006
- 2006-01-31 JP JP2006022453A patent/JP4282671B2/ja not_active Expired - Fee Related
-
2007
- 2007-01-25 US US11/657,585 patent/US7580270B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7580270B2 (en) | 2009-08-25 |
JP4282671B2 (ja) | 2009-06-24 |
US20070177345A1 (en) | 2007-08-02 |
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