JP2007202144A - 薄膜アンテナの製造方法 - Google Patents

薄膜アンテナの製造方法 Download PDF

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Publication number
JP2007202144A
JP2007202144A JP2007007424A JP2007007424A JP2007202144A JP 2007202144 A JP2007202144 A JP 2007202144A JP 2007007424 A JP2007007424 A JP 2007007424A JP 2007007424 A JP2007007424 A JP 2007007424A JP 2007202144 A JP2007202144 A JP 2007202144A
Authority
JP
Japan
Prior art keywords
thin film
manufacturing
organic material
substrate
material layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007007424A
Other languages
English (en)
Japanese (ja)
Inventor
Kun-Ta Lu
呂昆達
Hsin-Chun Lu
盧信沖
Han-Lun Lin
林漢倫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Wave Co Ltd
Original Assignee
Air Wave Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Wave Co Ltd filed Critical Air Wave Co Ltd
Publication of JP2007202144A publication Critical patent/JP2007202144A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2007007424A 2006-01-27 2007-01-16 薄膜アンテナの製造方法 Pending JP2007202144A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95103698A TWI302764B (en) 2006-01-27 2006-01-27 Method of manufacturing thin film antenna

Publications (1)

Publication Number Publication Date
JP2007202144A true JP2007202144A (ja) 2007-08-09

Family

ID=38282409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007007424A Pending JP2007202144A (ja) 2006-01-27 2007-01-16 薄膜アンテナの製造方法

Country Status (3)

Country Link
JP (1) JP2007202144A (zh)
DE (1) DE102007004088A1 (zh)
TW (1) TWI302764B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009096553A (ja) * 2007-10-15 2009-05-07 Taiwan Lamination Industries Inc 無線ｉｃタグ付き包装部材とその製造方法
JP2009124673A (ja) * 2007-10-01 2009-06-04 Toray Ind Inc 平面アンテナ及びその製造方法
KR101086637B1 (ko) 2010-12-29 2011-11-24 (주)대영케이티엑스 수압전사를 이용한 안테나 제조방법
JP2013247177A (ja) * 2012-05-24 2013-12-09 Goo Chemical Co Ltd リフトオフ法用レジスト剤

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009266134A (ja) * 2008-04-29 2009-11-12 Shinwa Kogyo Kk 非接触カード又はタグ用アンテナの製造方法並びに非接触カード又はタグ用アンテナ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009124673A (ja) * 2007-10-01 2009-06-04 Toray Ind Inc 平面アンテナ及びその製造方法
JP2009096553A (ja) * 2007-10-15 2009-05-07 Taiwan Lamination Industries Inc 無線ｉｃタグ付き包装部材とその製造方法
KR101086637B1 (ko) 2010-12-29 2011-11-24 (주)대영케이티엑스 수압전사를 이용한 안테나 제조방법
JP2013247177A (ja) * 2012-05-24 2013-12-09 Goo Chemical Co Ltd リフトオフ法用レジスト剤

Also Published As

Publication number Publication date
TWI302764B (en) 2008-11-01
DE102007004088A1 (de) 2007-08-09
TW200729613A (en) 2007-08-01

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