JP2007199455A - Pattern correction apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To quickly and surely harden an application material applied to a defect part of a pattern. <P>SOLUTION: A pattern correction apparatus is provided with: a stage 1 forming aperture parts 10 of a prescribed shape on its upper surface to horizontally hold a TFT liquid crystal substrate 7 on which a pattern is formed; an observing optical system 2 arranged on the upper part of the stage 1 and horizontally and vertically moving in a three-dimensional direction to perform the enlarged observation of a defect part of the pattern of the TFT liquid crystal substrate 7; and heating means 6A, 6B arranged in the aperture parts 10 of the stage 1, raised from stand-by positions and brought into face-contact with the rear face of the TFT liquid crystal substrate 7 to heat and harden a correction material applied to the defect part of the pattern. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a pattern correction apparatus that applies a correction material to a defect portion of a pattern formed on a substrate to correct the defect. Specifically, the correction material applied to the defect portion of the pattern can be reliably cured in a short time. It relates to a possible pattern correction device.

A conventional pattern correction apparatus includes an XY table on which a substrate can be placed and moved in the X-axis direction and the Y-axis direction, an observation optical system for observing the uneven pattern formed on the substrate, and the uneven pattern on the substrate The coating needle that moves up and down at the position of the defective portion and fills the defective portion with the correction material, and a laser oscillator for curing the correction material filled in the defective portion, and observe the defective portion with the observation optical system While moving the applicator needle with the correction material attached to the tip portion up and down, the defect portion is filled with the correction material, the laser oscillator is continuously oscillated, and the continuous oscillation laser is filled into the correction material filled in the defect portion. Irradiation is performed, and the correction material is baked and cured (for example, see Patent Document 1).
JP 2005-310396 A

  However, in such a conventional pattern correction apparatus, since a continuous wave laser is used for baking the correction material, the heat energy can be concentrated locally and baking can be performed in a short time of about 5 seconds. However, the heat energy cannot be applied uniformly to the correction material. For this reason, only the surface of the correction material is cured, and a curing failure may occur.

  As a method for firing the correction material, there is a method of irradiating the correction material with the continuous wave laser and heating it, and a method of irradiating and heating infrared rays using an infrared lamp, or a method of heating by blowing hot air. . However, the heating method using an infrared lamp has a problem that the baking time is as long as 60 seconds or more due to poor heat transfer efficiency, and the pattern correction process requires a long time. In addition, the heating method using hot air has a firing time of about 20 seconds, which is approximately the middle of the heating method using the continuous wave laser and the infrared lamp. However, since hot air is blown on the substrate, dust is scattered and foreign substances are likely to adhere to the substrate. There is a problem.

  In view of the above, an object of the present invention is to provide a pattern correction apparatus that can deal with such problems and can reliably cure a correction material applied to a defective portion of a pattern in a short time.

  In order to achieve the above object, a pattern correction apparatus according to the present invention includes an opening having a predetermined shape on an upper surface, a stage that holds a substrate on which a pattern is formed horizontally, a stage disposed above the stage, and a horizontal An observation optical system that moves in a vertical three-dimensional direction and observes the defect portion of the pattern of the substrate held on the stage in an enlarged manner, and is arranged in the opening of the stage, and rises from a standby position to the stage. And a heating unit that makes surface contact with the back surface of the held substrate and heats and cures the correction material applied to the defective portion of the pattern.

  With such a configuration, a substrate on which a pattern is formed is held horizontally by a stage having an opening of a predetermined shape on the upper surface, and is moved in a horizontal / vertical three-dimensional direction by an observation optical system disposed above the stage. Then, the defect portion of the pattern of the substrate held on the stage is enlarged and observed, and the heating means disposed in the opening of the stage is lifted from the standby position and brought into surface contact with the back surface of the substrate held on the stage. The correction material applied to the defective part is heated and cured.

  In addition, the stage includes a plurality of unit stages that are long in one direction arranged at a predetermined interval so that the upper surface forms the same plane, and an opening is formed between adjacent unit stages, and the substrate is arranged in the unit stage alignment direction. The structure is movable, and the heating means is disposed in the opening between the adjacent unit stages, moves horizontally in the longitudinal direction of the unit stage, and rises at the position of the defective portion of the pattern. It is a thing. Thereby, a plurality of unit stages formed long in one direction are arranged at predetermined intervals so that the upper surface forms the same plane, the substrate is held by a stage having an opening between adjacent unit stages, and the unit stage arrangement direction The substrate is moved, and the heating means respectively disposed in the openings between the adjacent unit stages are moved horizontally in the longitudinal direction of the unit stage in synchronization with the movement of the observation optical system in the horizontal direction. Raise at the position.

  Further, the stage is formed with a plurality of suction holes for sucking gas on the upper surface thereof so that the substrate can be sucked and held. Thus, a plurality of suction holes for sucking gas are formed on the upper surface, and the substrate is sucked and held on the stage.

  The stage has a plurality of injection holes for injecting gas and a plurality of suction holes for inhaling gas on the upper surface thereof, and the injection and suction of the gas are balanced to make the substrate a predetermined It can be held on the upper surface of the stage through an air gap. Accordingly, gas injection and suction are balanced on a stage in which a plurality of injection holes for injecting gas on the upper surface and a plurality of suction holes for inhaling gas are formed, and the substrate is placed through a predetermined air gap. Hold on top of stage.

  According to the invention of the pattern correction apparatus according to the first aspect, the heating means can be brought into surface contact with the back surface of the substrate, and the correction material applied to the defective portion of the pattern can be heated and cured from the back surface of the substrate. Therefore, the heat transfer efficiency with respect to the correction material applied to the defective portion of the pattern is increased, and the correction material can be reliably cured in a short time.

  According to the invention of claim 2, since the heating means moves in synchronization with the horizontal movement of the observation optical system and rises at the position of the pattern defect portion and comes into surface contact with the substrate, it is applied to the defect portion of the pattern. It is possible to reliably heat the corrected material. Furthermore, since the substrate is structured to be movable in the direction in which the unit stages are arranged, the substrate is moved when heating the correction material applied to the defective portion even if the position of the defective portion is on the unit stage. The defective part can be moved onto the heating means. Therefore, any part of the defect on the substrate can be corrected.

  Further, according to the invention of claim 3, since the substrate can be sucked and held, the heating means can be brought into close contact with the substrate when the heating means is brought into surface contact with the back surface of the substrate. Therefore, the heat transfer efficiency with respect to the correction material applied to the defective portion of the pattern can be further increased, and the correction material can be reliably cured in a shorter time.

  According to the fourth aspect of the invention, since the substrate can be held on the upper surface of the stage through a predetermined air gap, the substrate and the stage rub against the substrate when the substrate moves on the upper surface of the stage. There is no risk of scratching. Moreover, when curing the correction material applied to the defective part of the pattern, if only suction is used, the substrate can be adsorbed to the stage, and the heat transfer efficiency to the correction material can be further increased. Can be reliably cured in a shorter time.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is a front view showing an embodiment of a pattern correction apparatus according to the present invention. This pattern correction apparatus corrects by applying a correction material to a defective portion of a pattern formed on a substrate. The pattern correction apparatus is a stage 1, an observation optical system 2, an illumination optical system 3, a laser optical system 4, and a coating. A device 5 and heating means 6A and 6B are provided. Hereinafter, a case where the substrate is, for example, the TFT liquid crystal substrate 7 will be described.

  The stage 1 holds the TFT liquid crystal substrate 7 horizontally, and is formed by arranging a plurality of unit stages 8 formed long in one direction in parallel at a predetermined interval so that the upper surface forms the same plane. As shown in FIG. 2, side stages 9 that are long in the direction in which the unit stages 8 are arranged are arranged at both ends in the direction orthogonal to the direction in which the unit stages 8 are arranged. And an opening 10 surrounded by the adjacent unit stages 8. Further, as shown in FIG. 2, for example, a large number of conveying rollers 11 are arranged on the side of the side stage 9, and the TFT liquid crystal substrate 7 is moved in the directions indicated by arrows A and B in FIG. It has a possible structure. In this case, the transport roller 11 is formed so as to elastically sink downward by the action of an external force. The side stage 9 may be omitted, and in this case, the opening 10 is formed between the adjacent unit stages 8.

  As shown in FIG. 2, the unit stage 8 and the side stage 9 are formed with a plurality of injection holes 12 for injecting gas and a plurality of suction holes 13 for inhaling gas on the upper surface thereof. The TFT liquid crystal substrate 7 can be held on the upper surface of the stage 1 through a predetermined air gap by balancing the jetting and the suction. Each unit stage 8 and side stage 9 includes a substrate support 14, a supply pipe 15, and an exhaust pipe 16, as shown in FIG.

  The substrate support 14 includes a rectangular parallelepiped sintered body 18 having a large number of fine pores continuous in the vertical direction inside a rectangular parallelepiped box 17 having an open top. The upper portion of the box body 17 is closed so that a portion 19 is formed. A large number of holes in the sintered body 18 are used as the injection holes 12 and penetrates the sintered body 18 in the vertical direction. The suction hole 13 is formed by making a hole to be formed. In this case, the unit stage 8 has a large number of suction holes 13 formed in, for example, three rows along the longitudinal direction of the sintered body 18 as shown in FIG.

  At least one supply pipe 15 is provided at the bottom of the box 17 of the substrate support 14. The supply pipe 15 supplies compressed gas, for example, clean air, to the numerous injection holes 12, one end of which is connected to the hollow portion 19 of the box body 17, and the other end of which is not shown. It is connected to the.

  A single exhaust pipe 16 is connected to the suction hole 13 formed in the sintered body 18 of the substrate support 14. The exhaust pipe 16 exhausts the gas sucked through the numerous suction holes 13, and one end portion branches as a branch pipe 16 a in accordance with the number of the suction holes 13, and the respective end portions thereof are suction holes 13. The other end is connected to an intake blower (not shown).

  An observation optical system 2 is provided above the stage 1 as shown in FIG. This observation optical system 2 captures an image of a pattern formed on the TFT liquid crystal substrate 7 and detects, for example, a defective portion such as a disconnection of a wiring pattern, and has an observation CCD camera 20 that images and observes the pattern. Then, the two half mirrors 21a and 21b and the imaging lens 22 are disposed in the optical system mechanism unit 23, provided at the lower end of the optical system mechanism unit 23, and moved in a direction parallel to the surface of the TFT liquid crystal substrate 7. The lens holder 24 which is made possible is provided with five objective lenses 25a, 25b, 25c, 25d and 25e having a low magnification to a high magnification in a detachable state.

  Here, the half mirror 21a is for superimposing the optical path of the observation optical system 23 and the optical path of a laser optical system 45 described later on the same optical path, and the half mirror 21b is the optical path of the observation optical system 23 and described later. This is for superimposing the optical path of the illumination optical system 3 on the same optical path.

  The imaging lens 22 forms an image of the wiring pattern formed on the TFT liquid crystal substrate 7 and its defective portion on the light receiving surface of the observation CCD camera 20 in cooperation with any one of the objective lenses 25a to 25e. The objective lenses 25a to 25e are for enlarging the wiring pattern image, and the five objective lenses 25a to 25e constitute an objective lens group. The objective lenses 25a to 25e in the objective lens group are selected by moving the lens holder 24 in the X and Y axis directions (see FIG. 2) by motors 26A and 26B driven by control means (not shown). Thus, the optical axes of the selected objective lenses 25a to 25e and the optical axis of the optical path of the observation optical system 2 are made to coincide with each other, and images with different magnifications can be acquired.

  In addition to the motors 26A and 26B, the moving means in the X and Y axis directions include a ball screw 27 (see FIG. 1) for converting the rotational operation of the motors 26A and 26B into the linear motion of the lens holder 24, and It is configured with an omitted guide rail. An objective lens 25e having a coating device 5 to be described later on the outer surface has the same focal point as the other objective lenses 25a to 25d, and the working distance of the objective lens 25e is the working distance of the other objective lenses 25a to 25d. Since the length is longer, an interval is provided in which the dispenser nozzle 28 can freely move between the lower surface of the objective lens 25e and the surface of the TFT liquid crystal substrate 7.

  When observing a defective portion using the objective lenses 25a to 25e, the Z-axis moving means is controlled by the control means so that the image planes of the objective lenses 25a to 25e coincide with the surface of the TFT liquid crystal substrate 7. The optical system mechanism unit 23 is moved up and down. In this case, as a matter of course, the positional relationship in the Z-axis direction between the image forming surface of the objective lens 25e and the image forming surfaces of the other objective lenses 25a to 25d is the same as the surface of the TFT liquid crystal substrate 7. The other objective lenses 25a to 25d are in positions where they do not come into contact with the substrate.

  An illumination optical system 3 is provided in common with the optical path of the observation optical system 2. The illumination optical system 3 illuminates the surface of the TFT liquid crystal substrate 7 and enables the pattern CCD camera 20 to take an image of the pattern. A reflection mirror 29 for reflecting the illumination light inward and a field lens 30 for uniformly illuminating the observation region by the observation CCD camera 20, and the objective lens (in FIG. 1, the objective lens in FIG. 1) The optical path from the lens 25e) to the surface of the TFT liquid crystal substrate 7 is the same as the optical path of the observation optical system 2.

  A laser optical system 4 is provided in common with the optical path of the observation optical system 2. The laser optical system 4 is for forming a contact hole in a protective film formed on the wiring pattern of the TFT liquid crystal substrate 7, for example, and a pulse laser light source 31 having a wavelength of, for example, 532 nm or 355 nm is used as an optical system mechanism unit. 23, the slit 32 is disposed in the optical system mechanism unit 23, and extends from the half mirror 21a through the objective lens (object lens 25e in FIG. 1) to the color filter substrate 7 surface. The optical path is the same as the optical path of the observation optical system 2.

  A coating device 5 is detachably provided on the outer surface of the objective lens 25e. The coating device 5 discharges an appropriate amount of correction material to the defective portion, and as shown in FIG. 1, a container 33 for storing the correction material, and a dispenser nozzle attached to the container 33 and discharging an appropriate amount of correction material. 28. The tip of the dispenser nozzle 28 is positioned near the focal position on the optical axis of the objective lens 25e.

  Air can be supplied to the container 33 through a piping tube (not shown). For example, a correction material for Ag paste is supplied from the dispenser nozzle 28 of the container 33 to the wiring pattern by the positive pressure of the air introduced into the container 33. An appropriate amount can be discharged to the defective portion.

  In the opening 10 between the unit stages 8 adjacent to each other in the stage 1, heating means 6A and 6B are disposed, respectively. These heating means 6A and 6B are raised from the standby position and come into surface contact with the back surface of the TFT liquid crystal substrate 7 to heat and cure the correction material applied to the defective portion of the pattern. is there. When the observation optical system 2 moves horizontally, it moves horizontally in the Y-axis direction (longitudinal direction of the unit stage 8) in synchronization with the movement in the Y-axis direction, and rises at the position of the defective portion of the pattern. It has a structure. Specifically, the heating means 6A and 6B move by being pulled by a belt on a rail laid in the Y-axis direction in the opening 10, for example, and moved up and down by a lifting mechanism that combines a motor and a gear, for example. The sensor is configured as described above, and includes a sensor that detects contact with the back surface of the TFT liquid crystal substrate 7 and a sensor that detects a standby position.

Next, the operation of the pattern correction apparatus configured as described above will be described.
First, the TFT liquid crystal substrate 7 is placed on the stage 1, and the TFT liquid crystal substrate 7 is balanced by the balance between the gas injection from the injection holes 12 formed on the upper surface of the stage 1 and the gas suction into the suction holes 13. Is held on the upper surface of the stage 1 through a predetermined air gap. When the pattern correction device is activated by operating a switch (not shown), an illumination lamp (not shown) is turned on to illuminate the surface of the TFT liquid crystal substrate 7.

  Next, the motor 26B is driven to move the lens holder 24 in the X-axis direction, and any one of the low-magnification objective lenses 25a to 25c is selected. Further, in order to make the optical axis of the selected objective lenses 25a to 25c coincide with the optical axis of the optical path of the observation optical system 2, the lens holder 24 is moved in the Y-axis direction by the motor 26A as necessary. At the same time, the observation optical system 2 is moved in the X-axis and Y-axis directions based on the position coordinate data of the defect portion of the pattern measured and stored in advance, and the defect portion is in the visual field of the selected objective lenses 25a to 25c. Is made to fit. At this time, the heating means 6A and 6B heated to about 300 ° C. to 350 ° C. move horizontally between the adjacent unit stages 8 in the Y axis direction in synchronization with the movement of the observation optical system 2 in the Y axis direction.

  Next, the objective lens 25a is selected so that the wiring pattern is picked up by the observation CCD camera 20, the image processing is performed based on the picked-up image, and simultaneously the optical system mechanism unit 23 is moved up and down to make the image clear. Adjust the position of the image plane of ˜25c.

  When a defective portion is detected in this way, the image of the defective portion is positioned at the center of the observation area of the observation CCD camera 20. At this time, the defective portion coincides with the optical axis of the selected objective lenses 25a to 25c.

  When the defective portion is positioned at the center of the observation area of the observation CCD camera 20, the motor 26B is driven to move the lens holder 24 and select, for example, the objective lens 25d having a high magnification. At the same time, focus adjustment is performed in the same manner as described above using the image captured by the observation CCD camera 20. Furthermore, the observation optical system 2 is moved so that the defect portion is positioned at the center of the observation area of the observation CCD camera 20.

Hereinafter, the pattern correction operation will be described with reference to FIGS.
First, as shown in FIG. 4A or FIG. 5A, contact holes 38A and 38A are formed on the protective film 36 of the wiring pattern 34 on both sides of the TFT liquid crystal substrate 7 with, for example, the defect portion 35 on the wiring pattern 34 interposed therebetween. A position for forming 38B (see FIG. 5B) is set. This position setting is performed, for example, by clicking predetermined two points P1 and P2 on the wiring pattern 34 on the monitor screen of the control computer and storing the respective position coordinates.

  Next, the position coordinates of the points P1 and P2 are read, the observation optical system 2 is moved in the X and Y axis directions, and the optical axis of the objective lens 25d is sequentially positioned on the points P1 and P2. Then, with the observation optical system 2 positioned at points P1 and P2, respectively, the pulse laser light source 31 shown in FIG. 1 emits a pulse laser 37 (see FIG. 4B) and irradiates the points P1 and P2. . At this time, the pulse laser 37 is trimmed and shaped by the slit 32 to form contact holes 38A and 38B reaching the surface of the wiring pattern 34 from the surface of the protective film 36.

  When the contact holes 38A and 38B are thus formed, the position coordinates of the point P1 are read again, the observation optical system 2 is moved, and the optical axis of the objective lens 25d is positioned at the point P1. In this state, the motor 26B is driven to move the lens holder 24 in the same manner as described above, and for example, the objective lens 25e having the same magnification as the objective lens 25d and having the coating device 5 on the outer surface is selected. . In this case, since the imaging surface of the objective lens 25e is positioned above the imaging surfaces of the other objective lenses 25a to 25d, the optical system mechanism is selected when the objective lens 25e is selected. The part 23 is moved downward to lower the objective lens 25e. Then, the focus adjustment is performed so that the imaging surface of the objective lens 25e coincides with the surface of the TFT liquid crystal substrate 7 while measuring the sharpness of the captured image of the contact hole 38A by the observation CCD camera 20. Thereby, the front-end | tip part 28a of the dispenser nozzle 28 of the said coating device 5 is positioned in the contact hole 38A.

  Next, as shown in FIG. 4C or FIG. 5C, an Ag paste 39 as a correction material is discharged from the tip 28b of the dispenser nozzle 28 of the coating device 5 to fill the contact hole 38A. . Further, while the Ag paste 39 is being discharged from the dispenser nozzle 28, the observation optical system 2 is moved in the direction of the arrow C shown in FIG. 4 (d) or FIG. 5 (d) based on the position coordinates of the points P1 and P2. As shown in FIG. 4, a line of Ag paste 39 is drawn from the contact hole 38A to the contact hole 38B. Then, the movement of the observation optical system 2 is stopped at the position of the point P2, and the Ag paste 39 is filled in the contact hole 38B. As a result, as shown in FIG. 5D, the defective portion 35 is connected by the Ag paste 39.

  When the application of the Ag paste 39 to the defective portion 35 is completed, the position of the observation optical system 2 in the X-axis direction is read by an encoder provided in the drive mechanism of the observation optical system 2, and the position data and pre-stored heating means The position data in the X-axis direction of the center positions of 6A and 6B are compared, and for example, the heating means 6A having the shortest distance is selected. Then, the transport roller 11 shown in FIG. 2 is driven, and as shown in FIG. 6A, the TFT liquid crystal substrate 7 is positioned so that the defective portion 35 is positioned in the heating area AR of the selected heating means 6A. For example, it is moved in the direction of arrow A. When the position of the defect portion 35 is in the heating area AR of any one of the heating means 6A and 6B, the TFT liquid crystal substrate 7 stops on the spot and is not moved.

  When the defective portion 35 is positioned in the heating area AR of the selected heating means 6A, the gas injection of the stage 1 is stopped, and the TFT liquid crystal substrate 7 is adsorbed in the direction of arrow D as shown in FIG. And fixed to the stage 1. Further, the heating means 6A rises from the standby position and comes into surface contact with the back surface of the TFT liquid crystal substrate 7. Then, heat of about 300 ° C. is applied for about 10 seconds, and the Ag paste 39 applied on the defective portion 35 shown in FIG. 4D or FIG. 5D is baked. In this way, the correction of the defective portion 35 of the pattern is completed.

  The pattern correcting device of the present invention is not limited to the one used for correcting the defective portion 35 of the wiring pattern 34 of the TFT liquid crystal substrate 7, and any device can be used as long as it corrects the defective portion of the pattern formed on the substrate. It can also be applied to.

  The stage 1 is not limited to the unit stage 8 formed long in one direction and arranged in parallel at a predetermined interval so that the upper surface forms the same plane. The stage 1 has an opening 10 in the center and has a frame shape. The heating means holds the edge of the substrate on which the pattern is formed, and the heating means is formed so that the upper surface thereof is approximately the same size as the opening 10 of the stage 1 and rises from the standby position to face the back surface of the substrate. The correction material that contacts and is applied to the defective portion 35 may be heated and cured. Thereby, after application | coating of the correction material with respect to all the defective parts 35 is complete | finished, it can harden | cure collectively and a pattern correction process time can be shortened more.

  Furthermore, the stage 1 is formed in a frame shape having an opening 10 at the center, holds the edge of the substrate on which the pattern is formed, and the heating means has an upper surface formed in a predetermined size. One TFT is arranged facing the lower side of the image pickup means, moves in the two-dimensional direction horizontally in the opening 10 of the stage 1 in synchronization with the movement of the image pickup means, rises at the position of the pattern defect portion 35, and is turned on. The correction material applied to the defect portion 35 may be heated and cured by surface contact with the back surface of the liquid crystal substrate 7. Thereby, even if the heating surface of a heating means is small, the correction material apply | coated to the defect part 35 can be heated reliably.

It is a front view which shows embodiment of the pattern correction apparatus by this invention. It is a top view which shows the example of 1 structure of the stage and heating means in the said embodiment. It is the OO sectional view taken on the line of FIG. It is a perspective view explaining the pattern correction by the said pattern correction apparatus. It is a longitudinal cross-sectional view explaining the pattern correction by the said pattern correction apparatus. In the said embodiment, it is explanatory drawing which shows the state which the defect part of a board | substrate is moved to a heating means, and a heating means raises after that, and heats a defect part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Stage 2 ... Observation optical system 6A, 6B ... Heating means 7 ... TFT liquid crystal substrate 8 ... Unit stage 12 ... Injection hole 13 ... Suction hole 10 ... Opening part 35 ... Defect part 39 ... Ag paste (correcting material)

Claims (4)

A stage that has an opening of a predetermined shape on the upper surface and holds the substrate on which the pattern is formed horizontally,
An observation optical system that is arranged above the stage and moves in a horizontal and vertical three-dimensional direction and magnifies and observes a defective portion of a pattern of the substrate held on the stage;
A heating means disposed in the opening of the stage, rising from a standby position and in surface contact with the back surface of the substrate held on the stage, and heating and curing the correction material applied to the defective portion of the pattern; ,
A pattern correction apparatus comprising: A plurality of unit stages that are long in one direction are arranged at predetermined intervals so that the upper surface forms the same plane, and an opening is formed between adjacent unit stages, and the substrate can be moved in the direction in which the unit stages are arranged. Structure,
The heating means is disposed in the opening between the adjacent unit stages, moves horizontally in the longitudinal direction of the unit stage, and rises at the position of the defective portion of the pattern.
The pattern correction apparatus according to claim 1.   The pattern correction apparatus according to claim 2, wherein the unit stage is formed with a plurality of suction holes for sucking a gas on an upper surface thereof so as to suck and hold the substrate. The unit stage has a plurality of injection holes for injecting gas on its upper surface and a plurality of suction holes for sucking the gas, and balances the injection and suction of the gas so that the substrate has a predetermined air. The pattern correction apparatus according to claim 2, wherein the pattern correction apparatus can be held on the upper surface of the stage through a gap.

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