JP6830329B2 - Inspection equipment and inspection method - Google Patents

Description

The present invention relates to an inspection device and an inspection method for inspecting an inspected object based on the light applied to the inspected object.

In the inspection device, for example, as described in the following patent document, when light is irradiated to the object to be inspected from both side illumination and epi-illumination, the light reflected by the object to be inspected is used. The object to be inspected is imaged based on the image, and the object to be inspected is inspected based on the image obtained by the imaging.

Patent Document 1: Japanese Unexamined Patent Publication No. 2004-349346

According to the inspection device described in the above patent document, it is possible to inspect the object to be inspected to some extent. However, depending on the shape of the object to be inspected, it may not be possible to properly image a predetermined position of the object to be inspected. Specifically, for example, when the object to be inspected is a suction nozzle and both side illumination and epi-illumination are radiated toward the suction nozzle as described in the above patent document. , When imaging based on the light reflected on the lower end surface of the suction nozzle (hereinafter, may be referred to as "total irradiation imaging") is performed, the image on the outer edge side or inner edge side of the lower end surface of the suction nozzle is It becomes clear. On the other hand, the image of the lower end surface of the suction nozzle is generally unclear. Therefore, when the suction nozzle is inspected using the image at the time of full irradiation imaging, it is possible to appropriately determine the adhesion of foreign matter such as dust and solder to the outer edge side or the inner edge side of the lower end surface of the suction nozzle. However, there is a risk that it may not be possible to properly determine whether foreign matter adheres to the lower end surface of the suction nozzle or the lower end surface of the suction nozzle is chipped. The present invention has been made in view of such circumstances, and an object of the present invention is to appropriately inspect an inspected object regardless of the shape of the inspected object and the like.

In order to solve the above problems, the inspection device described in the present application is an inspection device for inspecting the inspected object based on the light applied to the inspected object, and the inspection device is the inspected object. The epi-illumination that irradiates an object with light, the side-illumination that irradiates the object to be inspected, and the light that is reflected by the object to be inspected when illuminated from at least one of the epi-illumination and the side-illumination. The image pickup device is provided with an image pickup device that images the object to be inspected based on the above, and the image pickup device is based on the light reflected by the object to be inspected when the image pickup device is irradiated from both the epi-illumination and the side illumination. Full irradiation imaging, which is an image of the object to be inspected, and epi-illumination, which is an image of the object to be inspected based on the light reflected by the object to be inspected when it is not irradiated from the side illumination and is irradiated from the epi-illumination. At least of irradiation imaging and side-illuminated imaging which is an imaging of the object to be inspected based on the light reflected by the object to be inspected when it is not irradiated from the epi-illumination and is irradiated from the side-illuminated illumination. It is characterized by performing two imaging.

In order to solve the above problems, the inspection methods described in the present application include epi-illumination that irradiates the object to be inspected with light, side-illumination that irradiates the object to be inspected, and epi-illumination and the side-illumination. An inspection method for inspecting an object to be inspected by using an inspection device including an imaging device that images the object to be inspected based on the light reflected by the object to be inspected when irradiated from at least one of the above. Therefore, when the inspection method is irradiated from both the epi-illumination and the side-illumination, the full-irradiation imaging, which is the imaging of the inspected object based on the light reflected by the inspected object, and the above-mentioned The epi-illumination imaging, which is an image of the object to be inspected based on the light reflected by the object to be inspected when it is irradiated from the epi-illumination without being irradiated from the side-illuminated illumination, and the epi-illumination image without being irradiated from the epi-illumination. An imaging step in which at least two of the side-illuminated imaging, which is the imaging of the object to be inspected based on the light reflected by the object to be inspected when irradiated from the side-illuminated illumination, are performed by the imaging device. It is characterized by including an inspection step of inspecting the object to be inspected based on the images obtained by the at least two imaging performed in the imaging step.

In order to solve the above problems, the inspection device described in the present application is an inspection device for inspecting the inspected object based on the light applied to the inspected object, and the inspection device is the inspected object. When the object is irradiated from at least one of the first illumination that irradiates the object, the second illumination that irradiates the object to be inspected, and the first illumination and the second illumination, the object is reflected by the object to be inspected. An image pickup device that images the object to be inspected based on the light is provided, and when the image pickup device is irradiated from both the first illumination and the second illumination, the light reflected by the object to be inspected. Full irradiation imaging, which is an image of the object to be inspected based on the above, and the object to be inspected based on the light reflected by the object to be inspected when it is not irradiated from the second illumination and is irradiated from the first illumination. The first irradiation image, which is an imaging, and the second irradiation, which is an imaging of the object to be inspected based on the light reflected by the object to be inspected when it is not irradiated from the first illumination and is irradiated from the second illumination. It is characterized by performing at least two imaging of the imaging.

In the inspection apparatus described in the present application, full irradiation imaging and epi-irradiation imaging, which is imaging of an inspected object based on the light reflected by the inspected object when irradiated from epi-illumination without being irradiated from side-illuminated illumination, , At least two of the side-illuminated imaging, which is the imaging of the object to be inspected based on the light reflected by the object to be inspected, are performed when the object is not irradiated from the epi-illumination but is irradiated from the side-illuminated illumination. In addition, full irradiation imaging, which is an image of the object to be inspected based on the light reflected by the object to be inspected when irradiated from the first and second illuminations, and full irradiation imaging, which is not emitted from the second illumination, is performed from the first illumination. The first irradiation image, which is an image of the object to be inspected based on the light reflected by the object to be inspected when irradiated, and the object to be inspected when it is not irradiated from the first illumination and is irradiated from the second illumination. At least two of the second irradiation imaging, which is the imaging of the object to be inspected based on the reflected light, are performed. As described above, in the inspection apparatus described in the present application, at least two types of lighting patterns for illuminating the object to be inspected are prepared, and the subject is covered based on the images captured by the two or more types of lighting patterns. The inspection object is inspected. As a result, it becomes possible to inspect the inspected object according to the advantages and disadvantages of each lighting pattern, and it becomes possible to appropriately inspect the inspected object.

It is a perspective view which shows the electronic component mounting apparatus. It is a perspective view which shows the suction nozzle. It is a perspective view which shows the nozzle management device. It is the schematic which shows the image pickup apparatus of this invention. It is a figure which shows the image from the lower side of the suction nozzle in a normal state. It is a figure which shows the image from the lower side of the suction nozzle in the state which the foreign matter adhered to the outer edge side of the lower end surface. It is a figure which shows the image from the lower side of the suction nozzle with the foreign matter attached to the lower end surface. It is a figure which shows the image from the lower side of the suction nozzle in the state where the lower end surface is chipped. It is a figure which shows the image from the viewpoint from the side of the suction nozzle. To carry out the invention

Hereinafter, examples of the present invention will be described in detail as embodiments for carrying out the present invention with reference to the drawings.

<Structure of Electronic Component Mounting Device> FIG. 1 shows an electronic component mounting device (hereinafter, may be abbreviated as “mounting device”) 10. The mounting device 10 has one system base 12 and two electronic component mounting machines (hereinafter, may be abbreviated as “mounting machine”) 14 adjacent to the system base 12. The direction in which the mounting machines 14 are lined up is referred to as the X-axis direction, and the horizontal direction perpendicular to that direction is referred to as the Y-axis direction.

Each mounting machine 14 mainly includes a mounting machine main body 20, a transport device 22, a mounting head moving device (hereinafter, may be abbreviated as “moving device”) 24, a mounting head 26, a supply device 28, and a nozzle station 30. ing. The mounting machine main body 20 is composed of a frame portion 32 and a beam portion 34 mounted on the frame portion 32.

The conveyor device 22 includes two conveyor devices 40 and 42. The two conveyor devices 40 and 42 are arranged in the frame portion 32 so as to be parallel to each other and extend in the X-axis direction. Each of the two conveyor devices 40, 42 conveys the circuit board supported by the respective conveyor devices 40, 42 by an electromagnetic motor (not shown) in the X-axis direction. Further, the circuit board is fixedly held by a board holding device (not shown) at a predetermined position.

The moving device 24 is an XY robot type moving device. The moving device 24 includes an electromagnetic motor (not shown) that slides the slider 50 in the X-axis direction and an electromagnetic motor (not shown) that slides the slider 50 in the Y-axis direction. A mounting head 26 is attached to the slider 50, and the mounting head 26 is moved to an arbitrary position on the frame portion 32 by the operation of two electromagnetic motors.

The mounting head 26 mounts an electronic component on a circuit board. A suction nozzle 60 is provided on the lower end surface of the mounting head 26. As shown in FIG. 2, the suction nozzle 60 is composed of a body cylinder 64, a flange portion 66, a suction pipe 68, and a hook pin 70. The body cylinder 64 has a cylindrical shape, and the flange portion 66 is fixed so as to project over the outer peripheral surface of the body cylinder 64. The suction pipe 68 has a thin pipe shape, and is held in the body cylinder 64 so as to be movable in the axial direction in a state of extending downward from the lower end portion of the body cylinder 64. The hook pin 70 is provided at the upper end of the body cylinder 64 so as to extend in the radial direction of the body cylinder 64. The suction nozzle 60 is detachably attached to the mounting head 26 with a single touch using the hook pin 70. Further, the mounting head 26 has a built-in spring (not shown), and the spring applies an elastic force to the suction tube 68 of the suction nozzle 60 mounted on the mounting head 26. As a result, the suction pipe 68 is urged in a direction extending downward from the lower end of the body cylinder 64 by the elastic force of the spring built in the mounting head 26.

Further, the suction nozzle 60 communicates with a positive / negative pressure supply device (not shown) via a negative pressure air and a positive pressure air passage. Each suction nozzle 60 sucks and holds the electronic component by a negative pressure, and releases the held electronic component by a positive pressure. Further, the mounting head 26 has a nozzle elevating device (not shown) for elevating and lowering the suction nozzle 60. The nozzle elevating device causes the mounting head 26 to change the vertical position of the electronic component to be held.

The feeder 28 is a feeder type feeder, and is arranged at the front end of the frame portion 32 as shown in FIG. The feeder 28 has a tape feeder 72. The tape feeder 72 houses the taped parts in a wound state. The taped component is a taped electronic component. Then, the tape feeder 72 sends out the taped parts by a sending device (not shown). As a result, the feeder-type supply device 28 supplies the electronic components at the supply position by sending out the taped components.

The nozzle station 30 has a nozzle tray 77 that accommodates a plurality of suction nozzles 60. In the nozzle station 30, the suction nozzle 60 attached to the mounting head 26 and the suction nozzle 60 housed in the nozzle tray 77 are replaced as needed. Further, the nozzle tray 77 can be attached to and detached from the nozzle station 30, and the suction nozzle 60 housed in the nozzle tray 77 can be collected, the suction nozzle 60 can be replenished to the nozzle tray 77, and the like can be performed outside the mounting machine 14. It is possible.

<Mounting work by the mounting machine> With the above-described configuration, the mounting machine 14 can perform mounting work on the circuit board held by the transport device 22 by the mounting head 26. Specifically, the circuit board is conveyed to a working position by a command of a control device (not shown) of the mounting machine 14, and is fixedly held by the board holding device at that position. Further, the tape feeder 72 sends out the taped component and supplies the electronic component at the supply position according to the command of the control device. Then, the mounting head 26 moves above the supply position of the electronic component, and the suction nozzle 60 sucks and holds the electronic component. Subsequently, the mounting head 26 moves above the circuit board and mounts the held electronic component on the circuit board.

<Inspection of suction nozzle> As described above, in the mounting machine 14, the electronic component supplied by the tape feeder 72 is sucked and held by the suction nozzle 60, and the electronic component is mounted on the circuit board. Therefore, if there is a problem with the suction nozzle 60, it is not possible to perform an appropriate mounting operation. In consideration of such a situation, the nozzle tray 77 is removed from the nozzle station 30 of the mounting machine 14, and the nozzle management device inspects the suction nozzle 60 housed in the nozzle tray 77.

Specifically, as shown in FIG. 3, the nozzle management device 78 generally has a rectangular parallelepiped shape, and the nozzle tray 77 is housed in the nozzle management device 78 or the nozzle tray 77 is stored from the nozzle management device 78 in the front. A drawer 79 for taking out is provided. Then, the suction nozzle 60 housed in the nozzle management device 78 is managed and inspected in the nozzle management device 78. At the time of inspection of the suction nozzle 60, the suction nozzle 60 is imaged, and based on the imaging data, the state of the suction tube 68 of the suction nozzle 60 and the amount of protrusion of the suction tube 68 from the body cylinder 64 are inspected. Will be done. As shown in FIG. 4, the image pickup device 80 that takes an image of the suction nozzle 60 includes three reflectors 82, 84, 86, a lower lighting device 88, a side lighting device 90, and two light-shielding blocks 92. , 94 and a camera 96.

In the nozzle management device 78, the suction nozzle 60 to be inspected is gripped by the nozzle gripper 100. Then, the suction nozzle 60 gripped by the nozzle gripper 100 is imaged by the image pickup device 80. The first reflector 82 of the three reflectors 82, 84, 86 is arranged below the suction nozzle 60 gripped by the nozzle gripper 100 in a state of being inclined at about 45 degrees. The reflectance of the first reflector 82 is 50%, and the transmittance is 50%.

The second reflector 84 of the three reflectors 82, 84, 86 is tilted to the side of the first reflector 82 in the same direction as the first reflector 82 by about 45 degrees. It is arranged by. The reflectance of the second reflector 84 is 30%, and the transmittance is 70%. Further, the third reflector 86 of the three reflectors 82, 84, 86 was tilted above the second reflector 84 in the same direction as the second reflector 84 at about 45 degrees. It is arranged in a state. The reflectance of the third reflector 86 is 100%, and the transmittance is 0%.

Further, the lower illumination device 88 includes a side illumination 102 and an epi-illumination 104. The side-illuminated illumination 102 is arranged between the first reflector 82 and the suction nozzle 60 gripped by the nozzle gripper 100 in a state of generally forming an annular shape and facing upward. The axis of the suction nozzle 60 gripped by the nozzle gripper 100 and the center of the annular side illumination 102 substantially coincide with each other in the vertical direction. Further, the epi-illumination 104 is arranged below the first reflector 82 in a state of facing upward. As a result, the side illumination 102 irradiates light from diagonally below toward the suction nozzle 60 gripped by the nozzle gripper 100, and the epi-illumination 104 is the inner diameter of the first reflector 82 and the side illumination 102. Light is radiated from directly below toward the suction nozzle 60 gripped by the nozzle gripper 100 through the portion.

The light emitted from both the side illumination 102 and the epi-illumination 104 is reflected by the lower end surface of the suction tube 68 of the suction nozzle 60 gripped by the nozzle gripper 100, and the optical path (of the two dotted lines 106). Along the path between them), it enters the first reflector 82. Then, 50% of the light incident on the first reflector 82 is reflected by the first reflector 82, and the light path (the path between the two dotted lines 108) is reflected by the first reflector 82. It is incident on the reflector 84 of 2. This is because the reflectance of the first reflecting mirror 82 is 50%. Further, the camera 96 is arranged on an extension line of the light incident on the second reflecting mirror 84. Therefore, 70% of the light incident on the second reflecting mirror 84 passes through the second reflecting mirror 84 and follows an optical path (a path between the two dotted lines 110). It is incident on the camera 96.

The camera 96 has a lens 112 and an image sensor 114, and the light incident on the camera 96 is detected by the image sensor 114 via the lens 112. By the way, the light detected by the image sensor 114 is 35% (0.5 × 0.7 = 0.) Of the amount of light reflected by the lower end surface of the suction tube 68 of the suction nozzle 60 gripped by the nozzle gripper 100. It is the light corresponding to 35). As a result, as shown in FIG. 5, an image of the lower end surface of the suction pipe 68 of the suction nozzle 60 can be obtained. Since the light detected by the image sensor 114 is the light reflected by the lower end surface of the suction tube 68, the lower end surface of the suction tube 68 is shown in white in the image. In this way, by photographing the lower end surface of the suction tube 68 with the camera 96, it is possible to inspect the state of the suction tube 68 of the suction nozzle 60.

Specifically, for example, when a foreign matter such as solder is attached to the outer edge side of the tip of the suction pipe 68, when the lower end surface of the suction pipe 68 is imaged by the camera 96, the image shown in FIG. 6 is obtained. can get. In this image, a protruding portion is shown on the outer edge side of the lower end surface of the suction pipe 68, and it is determined by this protruding portion that foreign matter is attached to the tip end portion of the suction pipe 68. Further, even if foreign matter is attached to the inner edge side of the tip end portion of the suction tube 68, naturally, the image captured by the camera 96 shows the protruding portion on the inner edge side of the lower end surface of the suction tube 68. Therefore, it is determined that foreign matter is attached to the tip of the suction pipe 68.

In this way, when the lower end surface of the suction tube 68 is imaged according to the procedure described above, that is, when both the side illumination 102 and the epi-illumination 104 are irradiated toward the adsorption nozzle 60. When imaging based on the light reflected on the lower end surface of the suction tube 68 of the suction nozzle 60 (hereinafter, may be referred to as “total irradiation imaging”) is performed, the outer edge side of the tip of the suction tube 68 Alternatively, it is possible to appropriately determine the suction nozzle 60 to which foreign matter is attached to the inner edge side. However, if foreign matter adheres to the lower end surface of the suction tube 68, the presence or absence of foreign matter may not be appropriately determined from the image at the time of full irradiation imaging. Further, when the lower end surface of the suction tube 68 is missing, it may not be possible to appropriately determine whether or not the lower end surface of the suction tube 68 is missing from the image at the time of full irradiation imaging. That is, when an abnormality occurs on the lower end surface of the suction tube 68, there is a possibility that the abnormality on the lower end surface of the suction tube 68 cannot be appropriately determined from the image at the time of full irradiation imaging.

Specifically, for example, the image of the suction nozzle 60 in which foreign matter is attached to the lower end surface of the suction tube 68 or the suction nozzle 60 in which a part of the lower end surface of the suction tube 68 is missing at the time of full irradiation imaging is shown in FIG. The image shown in 5 is obtained. That is, if foreign matter adheres to the lower end surface of the suction tube 68, or if a part of the lower end surface of the suction tube 68 is missing, the foreign matter adheres to the suction tube in the image at the time of full irradiation imaging. The chipping of the tip of 68 cannot be detected.

On the other hand, when only the epi-illumination 104 is irradiated toward the suction nozzle 60 without irradiating the side-illumination 102, an image based on the light reflected on the lower end surface of the suction tube 68 of the suction nozzle 60 (hereinafter, When "photographed by epi-illumination" is performed), the state of the lower end surface of the suction tube 68 is appropriately imaged. Specifically, for example, when a foreign substance adheres to the lower end surface of the suction tube 68, only the epi-illumination 104 is irradiated toward the suction nozzle 60, and the camera 96 images the lower end surface of the suction tube 68. The image shown in FIG. 7 is obtained. In this image, a black portion is present on the lower end surface of the suction pipe 68, and it is determined that foreign matter is attached to the lower end surface of the suction pipe 68 by that portion. Further, for example, when a part of the lower end surface of the suction tube 68 is missing, only the epi-illumination 104 is irradiated toward the suction nozzle 60, and the lower end surface of the suction tube 68 is imaged by the camera 96. The image shown in 8 is obtained. In this image, it is determined that a part of the lower end surface of the suction pipe 68 is missing, and that the defect causes a part of the lower end surface of the suction pipe 68 to be missing.

However, at the time of epi-irradiation imaging, there is a possibility that foreign matter adhering to the outer edge side or the inner edge side of the tip portion of the suction tube 68 cannot be appropriately imaged. That is, the image at the time of epi-irradiation imaging of the suction nozzle 60 in which foreign matter is attached to the outer edge side or the inner edge side of the tip end portion of the suction tube 68 is the image shown in FIG. That is, when foreign matter is attached to the outer edge side or the inner edge side of the tip of the suction tube 68, the adhesion of the foreign matter cannot be detected in the image at the time of epi-irradiation imaging.

In view of this, the image pickup apparatus 80 performs full-irradiation imaging and epi-irradiation imaging, and based on the image at the time of full-irradiation imaging and the image at the time of epi-irradiation imaging, the tip of the suction tube 68 The condition is inspected. Therefore, when foreign matter adheres to the outer edge side or the inner edge side of the tip end portion of the suction tube 68, the adhesion of the foreign matter is detected from the image at the time of full irradiation imaging. If foreign matter is attached to the lower end surface of the suction tube 68, or if the tip of the suction tube 68 is missing, the foreign matter is attached or the suction tube 68 is based on the image at the time of epi-irradiation imaging. A chipped tip is detected. This makes it possible to appropriately inspect the state of the tip portion of the suction pipe 68.

The shutter speed when full-irradiation imaging is performed is slower than the shutter speed when epi-irradiation imaging is performed. That is, the exposure time when full-irradiation imaging is performed is longer than the exposure time when epi-irradiation imaging is performed. Therefore, during full-illumination imaging, the image sensor 114 can detect a large amount of light emitted from both the side-illuminated illumination 102 and the epi-illuminated illumination 104, and is adsorbed in the image during full-illuminated imaging. The outline of the image of the lower end surface of the tube 68 becomes clear. This makes it possible to more appropriately detect foreign matter adhering to the outer edge side or the inner edge side of the tip end portion of the suction pipe 68. On the other hand, during epi-irradiation imaging, the amount of light detected by the image sensor 114 decreases, but as the amount of light detected decreases, the unevenness of the lower end surface of the suction tube 68 in the image during epi-irradiation imaging becomes clear. Become. This makes it possible to more appropriately detect foreign matter adhering to the lower end surface of the suction pipe 68 or chipping of the tip end portion of the suction pipe 68.

Further, the nozzle management device 78 not only inspects the suction nozzle 60 but also cleans the suction nozzle 60, and the suction nozzle 60 after cleaning is dried and stored in the nozzle management device 78. Therefore, the image pickup apparatus 80 may inspect whether or not water droplets remain in the suction nozzle 60 to be stored. The water droplets remaining on the suction nozzle 60 often remain on the lower end surface of the suction pipe 68 or on the outer edge side and inner edge side of the tip end portion of the suction pipe 68. Therefore, according to the image pickup apparatus 80, it is possible to appropriately detect the water droplets remaining in the suction nozzle 60.

Further, when the tip of the suction tube 68 of the suction nozzle 60 is imaged from the side, the tip of the suction tube 68 is irradiated from the side by the side illumination device 90. Specifically, the side lighting device 90 is a backlight type lighting device, and as shown in FIG. 4, the suction nozzle 60 gripped by the nozzle gripper 100 is irradiated with light from the side, and the irradiation is performed. The light is arranged so as to enter the third reflector 86. Further, the first light-shielding block 92 of the two light-shielding blocks 92, 94 is arranged between the side lighting device 90 and the suction nozzle 60 gripped by the nozzle gripper 100, and a third light-shielding block 92 is arranged. A second light-shielding block 94 out of the two light-shielding blocks 92 and 94 is arranged between the reflector 86 and the suction nozzle 60 gripped by the nozzle gripper 100.

Slits 120 and 122 are formed in each of the first light-shielding block 92 and the second light-shielding block 94, and the two slits 120 and 122 are directed in the irradiation direction of light from the side lighting device 90. Are in agreement. Therefore, the side illumination device 90 irradiates the suction nozzle 60 gripped by the nozzle gripper 100 with light from between the slits 120 of the first light-shielding block 92, and the irradiated light is the second light. It enters the third reflector 86 from between the slits 122 of the light-shielding block 94. At this time, the light emitted from the side illumination device 90 is incident on the third reflector 86 along the optical path (the path between the two dotted lines 124).

Then, 100% of the light incident on the third reflector 86 is reflected by the third reflector 86, and is reflected along the optical path (path between the two dotted lines 126). It is incident on the reflector 84 of 2. This is because the reflectance of the third reflector 86 is 100%. Next, 30% of the light incident on the second reflector 84 is reflected by the second reflector 84, and along the optical path (the path between the two dotted lines 128), It is incident on the camera 96. The light detected by the image sensor 114 is light corresponding to 30% (1.0 × 0.3 = 0.3) of the amount of light emitted from the side illumination device 90. As a result, as shown in FIG. 9, an image from the side of the suction pipe 68 of the suction nozzle 60 can be obtained. Since the light detected by the image sensor 114 is the light that has passed between the slits 122, the inside of the slit 122 is shown in white in the image. Further, since the light passing through the slit 122 is partially blocked by the suction tube 68, the image of the suction tube 68 is shown in black.

By the above-described procedure, the suction pipe 68 of the suction nozzle 60 is imaged from the side, so that the amount of protrusion of the suction pipe 68 from the body cylinder 64 is inspected. Specifically, the position of the tip of the suction tube 68 is detected based on the image. Then, based on the position of the tip of the suction pipe 68, the amount of protrusion of the suction pipe 68 from the body cylinder 64 is calculated, and it is determined whether or not the amount of protrusion of the suction pipe 68 is an appropriate amount.

As described above, in the image pickup apparatus 80, it is possible to take an image of the lower end surface of the suction nozzle 60 and an image of the side surface by one camera 96. This eliminates the need to use two cameras, one for imaging on the lower end surface of the suction nozzle 60 and the other for imaging on the side surface, and it is possible to reduce the cost of the imaging device.

By the way, in the above embodiment, the suction nozzle 60 is an example of the object to be inspected. The image pickup apparatus 80 is an example of an inspection apparatus. The camera 96 is an example of an imaging device. The side-illuminated illumination 102 is an example of the side-illuminated illumination and the second illumination. The epi-illumination 104 is an example of epi-illumination and the first illumination. Further, the epi-irradiation illumination is an example of the first irradiation illumination.

The present invention is not limited to the above examples, and can be carried out in various embodiments with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, full-illumination imaging and epi-illumination imaging are performed, but in addition to the combination of full-illumination imaging and epi-illumination imaging, the side without irradiating epi-illumination 104. When only the irradiation illumination 102 is irradiated toward the adsorption nozzle 60, an image based on the light reflected on the lower end surface of the adsorption tube 68 of the adsorption nozzle 60 (hereinafter, may be referred to as “side irradiation irradiation imaging”). ), Full-illumination imaging, and epi-illumination imaging, which is a combination of at least two imagings. That is, three imagings of full-illumination imaging, epi-illumination imaging, and side-illumination imaging, two imaging of full-illumination imaging and side-illumination imaging, and two imaging of epi-illumination imaging and side-illumination imaging, respectively. It is possible to do. As a result, it is possible to inspect the suction nozzle 60 according to the advantages and disadvantages of each imaging, and it is possible to appropriately inspect the suction nozzle 60. The side irradiation illumination is an example of the second irradiation illumination.

Further, in the above embodiment, the shutter speed at the time of full-illumination imaging is slower than the shutter speed at the time of epi-illumination imaging, but the shutter speed at the time of full-illumination imaging is made faster than the shutter speed at the time of epi-illumination imaging. Also, the shutter speed at the time of full irradiation imaging and the shutter speed at the time of epi-illumination imaging may be the same.

Further, in the above embodiment, the inspection device of the present invention is adopted as a device for inspecting the suction nozzle 60, but the inspection of the present invention is used as a device for inspecting various members other than the suction nozzle 60. It is possible to adopt the device.

60: Adsorption nozzle (object to be inspected) 80: Imaging device (inspection device) 96: Camera (imaging device) 102: Side-illuminated lighting 104: Epi-illumination

Claims (4)

An inspection device for inspecting the object to be inspected based on the light applied to the object to be inspected.
The inspection device
Epi-illumination that irradiates the object to be inspected with light,
Side illumination that irradiates the object to be inspected with light,
Lateral lighting that irradiates light from the side toward the object to be inspected,
An imaging device that captures an image of the object to be inspected based on the light reflected by the object to be inspected when irradiated from at least one of the epi-illumination and the side-illumination.
A reflector provided in the imaging device and reflecting the lateral illumination,
A first light-shielding body arranged between the object to be inspected and the side illumination and having a slit formed therein.
A second light-shielding body disposed between the object to be inspected and the reflector and having a slit formed therein is provided.
When the image pickup apparatus is irradiated from both the epi-illumination and the side-illumination, the full-illumination imaging, which is the imaging of the object to be inspected based on the light reflected by the object to be inspected, and the side-illumination The epi-illumination image, which is an image of the object to be inspected based on the light reflected by the object to be inspected when it is irradiated from the epi-illumination, and the side-illumination, which is not emitted from the epi-illumination. At least two of the side-illuminated imaging, which is the imaging of the object to be inspected based on the light reflected by the object to be inspected when irradiated from, are performed by the imaging apparatus.
Further, the light to be inspected is irradiated from the side illumination through the slits of the first light-shielding body, and the light incident on the reflector through the slits of the second light-shielding body and is incident on the image pickup apparatus. An inspection apparatus based on which lateral imaging, which is an imaging of the object to be inspected, is performed by the imaging apparatus. The image pickup device
The inspection apparatus according to claim 1, wherein all imaging of the total irradiation imaging, the epi-irradiation irradiation imaging, and the side irradiation irradiation imaging is performed. The imaging device is one of the total irradiation imaging, the epi-illumination imaging, and the side-illumination imaging, and the full-irradiation imaging, the epi-illumination imaging, and the side-illumination imaging. The inspection apparatus according to claim 1 or 2, wherein the shutter speed at the time of the first imaging and the shutter speed at the time of the other imaging are changed when performing the imaging of the above and another imaging. .. The epi-illumination that irradiates the object to be inspected with light, the side-illumination that irradiates the object to be inspected with light, the lateral illumination that irradiates the object to be inspected from the side, the epi-illumination and the above. An image pickup device that images the object to be inspected based on the light reflected by the object to be inspected when irradiated from at least one of the side illuminations, and a reflection provided in the image pickup device that reflects the side illumination. A slit is formed by being arranged between the mirror, the first light-shielding body which is arranged between the object to be inspected and the side illumination and has a slit formed, and the object to be inspected and the reflecting mirror. It is an inspection method for inspecting the object to be inspected by using the inspection device provided with the second light-shielding body, and the inspection method is irradiated from both the epi-illumination and the side-illumination. At that time, when the subject is fully irradiated, which is an image of the subject based on the light reflected by the subject, and when the subject is not irradiated from the side illumination but is irradiated from the epi-illumination, the subject is used to image the subject. The epi-illumination imaging, which is an image of the object to be inspected based on the reflected light, and the inspection, which is based on the light reflected by the object to be inspected when it is not irradiated from the epi-illumination and is irradiated from the side-illuminated illumination. At least two of the side-illuminated imaging, which is the imaging of an object, are captured by the first imaging step performed by the imaging device and further, from between the side illumination and the slit of the first light-shielding body. Lateral imaging, which is an imaging of the object to be inspected based on the light that irradiates the inspection object with light and enters the reflector through the slits of the second light-shielding body and is incident on the imaging device , is performed by the imaging device. An inspection method comprising a second imaging step, and an inspection step of inspecting the object to be inspected based on images obtained by at least three imaging performed in the imaging step.