JP2007189379A5 - - Google Patents

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Publication number
JP2007189379A5
JP2007189379A5 JP2006004481A JP2006004481A JP2007189379A5 JP 2007189379 A5 JP2007189379 A5 JP 2007189379A5 JP 2006004481 A JP2006004481 A JP 2006004481A JP 2006004481 A JP2006004481 A JP 2006004481A JP 2007189379 A5 JP2007189379 A5 JP 2007189379A5
Authority
JP
Japan
Prior art keywords
component
insulating substrate
mounting pad
piezoelectric device
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006004481A
Other languages
English (en)
Japanese (ja)
Other versions
JP4525597B2 (ja
JP2007189379A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006004481A priority Critical patent/JP4525597B2/ja
Priority claimed from JP2006004481A external-priority patent/JP4525597B2/ja
Publication of JP2007189379A publication Critical patent/JP2007189379A/ja
Publication of JP2007189379A5 publication Critical patent/JP2007189379A5/ja
Application granted granted Critical
Publication of JP4525597B2 publication Critical patent/JP4525597B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2006004481A 2006-01-12 2006-01-12 表面実装型圧電デバイス、及びその製造方法 Expired - Fee Related JP4525597B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006004481A JP4525597B2 (ja) 2006-01-12 2006-01-12 表面実装型圧電デバイス、及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006004481A JP4525597B2 (ja) 2006-01-12 2006-01-12 表面実装型圧電デバイス、及びその製造方法

Publications (3)

Publication Number Publication Date
JP2007189379A JP2007189379A (ja) 2007-07-26
JP2007189379A5 true JP2007189379A5 (cg-RX-API-DMAC7.html) 2008-02-28
JP4525597B2 JP4525597B2 (ja) 2010-08-18

Family

ID=38344261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006004481A Expired - Fee Related JP4525597B2 (ja) 2006-01-12 2006-01-12 表面実装型圧電デバイス、及びその製造方法

Country Status (1)

Country Link
JP (1) JP4525597B2 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5220584B2 (ja) * 2008-12-27 2013-06-26 京セラクリスタルデバイス株式会社 圧電発振器及びその製造方法
CN111224635B (zh) * 2018-11-27 2024-01-19 京瓷株式会社 压电器件以及电子设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03162676A (ja) * 1989-08-28 1991-07-12 Mitsubishi Electric Corp 液体封止半導体装置
JP2003218178A (ja) * 2002-01-25 2003-07-31 Matsushita Electric Ind Co Ltd 半導体装置および半導体チップ
JP4204873B2 (ja) * 2003-01-22 2009-01-07 東京電波株式会社 圧電発振器の製造方法
JP4091868B2 (ja) * 2003-03-27 2008-05-28 京セラ株式会社 表面実装型温度補償水晶発振器
JP2004304447A (ja) * 2003-03-31 2004-10-28 Kyocera Kinseki Corp 半導体ウエハとそのウエハを用いた圧電発振器の製造方法
JP4524659B2 (ja) * 2005-09-26 2010-08-18 エプソントヨコム株式会社 表面実装型圧電モジュール用パッケージ、及び表面実装型圧電モジュール

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