JP2007096371A5 - - Google Patents

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Publication number
JP2007096371A5
JP2007096371A5 JP2005278929A JP2005278929A JP2007096371A5 JP 2007096371 A5 JP2007096371 A5 JP 2007096371A5 JP 2005278929 A JP2005278929 A JP 2005278929A JP 2005278929 A JP2005278929 A JP 2005278929A JP 2007096371 A5 JP2007096371 A5 JP 2007096371A5
Authority
JP
Japan
Prior art keywords
pad
mounting
insulating container
recess
outer bottom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005278929A
Other languages
English (en)
Japanese (ja)
Other versions
JP4524659B2 (ja
JP2007096371A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005278929A priority Critical patent/JP4524659B2/ja
Priority claimed from JP2005278929A external-priority patent/JP4524659B2/ja
Publication of JP2007096371A publication Critical patent/JP2007096371A/ja
Publication of JP2007096371A5 publication Critical patent/JP2007096371A5/ja
Application granted granted Critical
Publication of JP4524659B2 publication Critical patent/JP4524659B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005278929A 2005-09-26 2005-09-26 表面実装型圧電モジュール用パッケージ、及び表面実装型圧電モジュール Expired - Fee Related JP4524659B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005278929A JP4524659B2 (ja) 2005-09-26 2005-09-26 表面実装型圧電モジュール用パッケージ、及び表面実装型圧電モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005278929A JP4524659B2 (ja) 2005-09-26 2005-09-26 表面実装型圧電モジュール用パッケージ、及び表面実装型圧電モジュール

Publications (3)

Publication Number Publication Date
JP2007096371A JP2007096371A (ja) 2007-04-12
JP2007096371A5 true JP2007096371A5 (cg-RX-API-DMAC7.html) 2008-04-17
JP4524659B2 JP4524659B2 (ja) 2010-08-18

Family

ID=37981591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005278929A Expired - Fee Related JP4524659B2 (ja) 2005-09-26 2005-09-26 表面実装型圧電モジュール用パッケージ、及び表面実装型圧電モジュール

Country Status (1)

Country Link
JP (1) JP4524659B2 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4525597B2 (ja) * 2006-01-12 2010-08-18 エプソントヨコム株式会社 表面実装型圧電デバイス、及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03162676A (ja) * 1989-08-28 1991-07-12 Mitsubishi Electric Corp 液体封止半導体装置
JP2002329839A (ja) * 2001-02-27 2002-11-15 Toyo Commun Equip Co Ltd 表面実装用電子部品、その製造方法、及びシート状母材
JP2003046251A (ja) * 2001-07-27 2003-02-14 Kyocera Corp 電子部品
JP4091868B2 (ja) * 2003-03-27 2008-05-28 京セラ株式会社 表面実装型温度補償水晶発振器
JP2004357019A (ja) * 2003-05-29 2004-12-16 Seiko Epson Corp 圧電発振器

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