JP2007186799A - Copper or copper-based alloy with excellent press-workability and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a copper-based alloy with excellent press-workability out of which a small-sized connector, switch, and relay are stamped into pre-determined shapes by high-speed press forming process, and a manufacturing method therefor. <P>SOLUTION: The copper-based alloy excellent in press-workability and its manufacturing method are characterized in that the total of diffracted intensities of ä111} and ä222} is twice or more of the diffracted intensity of ä200} in surface X-ray diffraction of materials. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to copper or a copper-based alloy excellent in press workability and a method for producing the same,
More specifically, the present invention relates to a copper-based alloy excellent in press workability constituting a consumer product, for example, a semiconductor lead frame master, an information / communication narrow-pitch connector master and a small relay master, and a manufacturing method thereof. .

With the high-density mounting of home appliances, information communication devices, and automotive parts, connectors, switches, relays, and the like have been miniaturized, and the materials constituting them tend to be thinner and thinner.
These parts are usually stamped by a high-speed press using a mold, and after pressing, the material is subjected to shear deformation by a punch of the mold.
Due to the occurrence of cracks from the cutting edge, fracture deformation occurs, and the die is punched into a predetermined shape.

However, as the number of press shots increases, wear of the die punch blade edge advances, and as a result, crack generation from the blade edge becomes uneven, the fracture shape is disturbed, specifically, the shear band and fracture The step of the band becomes large, large burrs are generated, and large waste of material generated by fracture is generated, so that a predetermined product shape cannot be maintained.

Conventionally, measures to improve the mold life have been dealt with by improving the material of the punch, improving the lubricity by press lubricant, and setting the clearance suitable for each copper base alloy. Could not be realized.

As a result of diligent research to solve the above-mentioned problems of the prior art, a small connector that is punched into a predetermined shape by high-speed press molding using a mold,
In materials for switches, relays, etc., it was found that excellent press workability is an important characteristic problem that should solve the problem.
That is, it has been found that a copper-based alloy having excellent press workability can be obtained by controlling the crystal orientation of the material, and therefore the present invention proposes the alloy and its manufacturing method.

The present invention relates to a copper or copper-based alloy material, in particular, an RD surface (cross section perpendicular to the rolling direction of the plate material; hereinafter referred to as RD surface) and a TD surface (cross section parallel to the rolling direction of the plate material).
Hereinafter, it is referred to as a TD surface. The copper-based alloy material with improved press workability and a method for manufacturing the same are provided by performing X-ray diffraction focusing on the above) and controlling the strength in a specific direction among the obtained crystal orientations. Here, the X-ray diffraction intensity indicates, for example, the integrated intensity of the crystal orientation of the material measured by the X-ray diffraction method.

Ｉ｛１１１｝は｛１１１｝の回折強度、Ｉ｛２２２｝は｛２２２｝の回折強度、
Ｉ｛２００｝は｛２００｝の回折強度である。 That is, the present invention is 1. Copper or a copper-based alloy excellent in press workability, wherein S ≧ 2 in the X-ray diffraction intensity of the cross section of the material.
However,

I {111} is the diffraction intensity of {111}, I {222} is the diffraction intensity of {222},
I {200} is the diffraction intensity of {200}.

ここで、Ｓ_ＲＤは材料の加工方向に垂直な断面のＸ線回折強度について、Ｓ_ＴＤは
材料の加工方向に平行な断面のＸ線回折強度について測定した値で、Ｉ｛１１
１｝は｛１１１｝の回折強度、Ｉ｛２２２｝は｛２２２｝の回折強度、Ｉ｛２０
０｝は｛２００｝の回折強度である。 2. S _RD ≧ 2 in the X-ray diffraction intensity of the cross section perpendicular to the processing direction of the material, and S _TD ≧ 4 in the X-ray diffraction intensity of the cross section parallel to the processing direction of the material, and S _RD × S _TD ≧ 16
A copper or copper base alloy excellent in press workability, characterized by being. However,

Here, S _RD is a value measured for the X-ray diffraction intensity of a cross section perpendicular to the processing direction of the material, and S _TD is a value measured for the X-ray diffraction intensity of a cross section parallel to the processing direction of the material, I {11
1} is the diffraction intensity of {111}, I {222} is the diffraction intensity of {222}, and I {20
0} is the diffraction intensity of {200}.

ここで、Ｓ_ＲＤは材料の加工方向に垂直な断面のＸ線回折強度について、Ｓ_ＴＤは
材料の加工方向に平行な断面のＸ線回折強度について測定した値で、Ｉ｛１１
１｝は｛１１１｝の回折強度、Ｉ｛２２２｝は｛２２２｝の回折強度、Ｉ｛２０
０｝は｛２００｝の回折強度である。 3. A copper-based alloy comprising 0.01 to 35 wt% of one or more selected from Sn, Ni, P, Si, Zn, Fe, Mg, and Al in a total amount of 0.01 to 35 wt%, the balance being Cu and inevitable impurities, S in the X-ray diffraction intensity of the cross section perpendicular to the processing direction of the material
_RD ≧ 2 and the X-ray diffraction intensity of the cross section parallel to the processing direction of the material, S _TD ≧ 4,
A copper or copper-based alloy having excellent press workability, wherein S _RD × S _TD ≧ 16.
However,

Here, S _RD is a value measured for the X-ray diffraction intensity of a cross section perpendicular to the processing direction of the material, and S _TD is a value measured for the X-ray diffraction intensity of a cross section parallel to the processing direction of the material, I {11
1} is the diffraction intensity of {111}, I {222} is the diffraction intensity of {222}, and I {20
0} is the diffraction intensity of {200}.

ここで、Ｓ_ＲＤは材料の加工方向に垂直な断面のＸ線回折強度について、Ｓ_ＴＤは
材料の加工方向に平行な断面のＸ線回折強度について測定した値で、Ｉ｛１１
１｝は｛１１１｝の回折強度、Ｉ｛２２２｝は｛２２２｝の回折強度、Ｉ｛２０
０｝は｛２００｝の回折強度である。 4. An ingot of a copper-based alloy containing one or more selected from Sn, Ni, P, Si, Zn, Fe, Mg, and Al in a total amount of 0.01 to 35 wt%, and the balance being Cu and inevitable impurities Or by subjecting a material having a predetermined plate thickness by repeating hot rolling and heat treatment to a heat treatment at a temperature of 350 to 750 ° C., the X-ray diffraction intensity of the cross section perpendicular to the material processing direction is 1 ≦ S _RD ≦ 3 and the X-ray diffraction intensity of the cross section parallel to the processing direction of the material is set to 1 ≦ S _TD ≦ 3.
By combining cold rolling at 0% or more or 50% or more and low-temperature annealing at a temperature lower than the recrystallization temperature, in the X-ray diffraction intensity of the cross section perpendicular to the processing direction of the material, S _RD ≧
2 and the X-ray diffraction intensity of the cross section parallel to the processing direction of the material, S _TD ≧ 4, and S _RD
XS _TD ≧ 16 Copper or copper-based alloy excellent in press workability.
However,

Here, S _RD is a value measured for the X-ray diffraction intensity of a cross section perpendicular to the processing direction of the material, and S _TD is a value measured for the X-ray diffraction intensity of a cross section parallel to the processing direction of the material, I {11
1} is the diffraction intensity of {111}, I {222} is the diffraction intensity of {222}, and I {20
0} is the diffraction intensity of {200}.

The contents of the present invention will be specifically described below.
The present invention performs X-ray diffraction on copper or a copper-based alloy, focusing particularly on a cross section perpendicular to the processing direction of the material and controlling the intensity of a specific orientation among the obtained crystal orientations. This improves press workability.

First of all, it is important to align the crystal orientation to a certain orientation in order to make the crack generation from the blade uniform when the material undergoes shear deformation during press working. The shape of the press cross section is better when aligned with {111}. On the other hand, if there are many other surfaces, especially {200} surfaces in the cross section,
The extension direction of cracks generated when shear deformation occurs is 2 with respect to the press direction.
The angle becomes 0 ° or more, and as a result, the wear of the cutting edge is promoted, and a large residue of material generated by breakage adheres to the cutting edge and promotes the wear of the cutting edge. Therefore, the smaller the {200} plane, the better the cross-sectional shape of the press, and the wear of the cutting edge can be suppressed.

なるパラメーターＳを導入し、ＲＤ面について測定したＳをＳ_ＲＤ、ＴＤ面につ
いて測定したＳをＳ_ＴＤとすると、Ｓ_ＲＤ≧２ かつ Ｓ_ＴＤ≧４で、かつ Ｓ_ＲＤ×Ｓ_ＴＤ
≧１６のときは、プレスで打抜いた端子の形状が良好であった。 A cross section perpendicular to the processing direction of the material is expressed as an RD plane, and a parallel cross section is expressed as a TD plane. RD
X-ray diffraction of the surface and TD surface, and {111} diffraction intensity I {111}, {2
22} diffraction intensity I {222}, {200} diffraction intensity I {200},

S _RD and S _TD ≧ 4, and S _RD × S _TD , where S _RD is S _RD and S _TD is S measured for the _RD surface, and S _{TD is} S _TD
When ≧ 16, the shape of the terminal punched out by the press was good.

on the other hand,
When S _RD ≧ 2 and S _TD ≧ 4 and S _RD × S _TD <16,
When S _RD ≧ 2 and S _TD <4 and S _RD × S _TD <16,
When S _RD ≧ 2 and S _TD <4 and S _RD × S _TD ≧ 16,
When S _RD <2 and S _TD ≧ 4 and S _RD × S _TD <16,
When S _RD <2 and S _TD ≧ 4 and S _RD × S _TD ≧ 16,
When S _RD <2 and S _TD <4 and S _RD × S _TD <16,
As the number of press shots increased, wear of the blade edge advanced, and the shape of the punched terminal deteriorated.

The material of the present invention can be manufactured through the following steps. That is, the first step is a step in which a predetermined amount of each component is blended and dissolved, and an ingot having a predetermined composition is cast from the obtained liquid. This step can be applied by a melting method in the air, a melting method in a reducing atmosphere, or a vacuum melting method.

The second step is a step of subjecting the obtained ingot to a heat treatment.
This is a process for reducing the segregation generated during casting by heat treatment at a temperature of 0 ° C. or higher, and is an important process for making the crystal orientation of the material uniform.

The third step is a rough rolling step, and the rolling rate is preferably 50% or more. This step is an important step for recrystallization in the next fifth step. When the rolling rate is less than 50%, the recrystallized grains become non-uniform, and as a result, the crystal orientation is non-uniform. In the subsequent process, it becomes difficult to orient the crystal orientation of the material cross section to {111}. This process can be applied to both cold rolling and warm rolling.

The fourth step is a heat treatment step for making the crystal grain size of the material uniform and fine,
In order to orient the crystal orientation of the cross section of the material to {111} after the fifth step, this is a step for making a non-orientation state once. The heat treatment temperature is 350 to 750 ° C. When the temperature is less than 350 ° C., the above heat treatment effect cannot be sufficiently exhibited,
When the temperature exceeds 750 ° C., the crystal grain size becomes coarse, and the desired press workability cannot be obtained no matter how the subsequent steps are devised. In particular, 1 ≦ S _RD <3, 1 ≦ S _TD <3
It is necessary to be.

The fifth step is a cold rolling step, and the sixth step is a low temperature annealing step. What is important in the fifth step is that when this step is the final rolling step, the rolling rate is 30% or more. In this step, the degree of aggregation of the crystal orientation {111} of the material cross section is increased, and the degree of aggregation of the crystal orientation {200} of the material cross section is suppressed. When the rolling processing rate is less than 30%, since the processing strain to be input is small, it is difficult to orient the crystal orientation of the material cross section to {111}. Preferably it is 50% or more, more preferably 80% or more.

The sixth step is a step of removing excessive processing strain generated in the fifth step by heat treatment, and can improve the bending workability of the material. The heat treatment temperature in this step is less than the recrystallization temperature of each material, preferably the heat treatment temperature is 200 to 400 ° C.
Examples of the copper-based alloy related to the present invention include Cu-Ni-Sn-P alloys, Cu
-Sn-P alloy, Cu-Ni-Si alloy, Cu-Mg-P alloy, Cu-Z
Examples thereof include copper-based alloys such as n-Sn-Fe alloys.

The component range of the copper-based alloy according to the present invention is Sn, Ni, P, Si, Zn, Fe, M.
g, including one or two or more selected from Al in a total amount of 0.01 to 35 wt%,
The reason why it is defined that it consists of the balance Cu and inevitable impurities is to maintain the balance of the electrical conductivity, tensile strength, spring limit value and bending workability of the material, and to further improve the press workability.

When the total amount of one or more selected from Sn, Ni, P, Si, Zn, Fe, Mg, and Al is less than 0.01 wt%, the electrical conductivity increases, but the tensile strength and spring limit It is difficult to obtain properties such as value and press workability and heat resistance. Further, when the rolling process rate is increased to improve the tensile strength, spring limit value, and press workability, the bending workability deteriorates. On the other hand, when the total amount of one or more selected from Sn, Ni, P, Si, Zn, Fe, Mg, and Al exceeds 35 wt%, the tensile strength and the spring limit value increase. Further, the conductivity is lowered, and the bending workability is deteriorated again.

Therefore, Sn, Ni, P, S about the component range of the copper-based alloy according to the present invention.
The total amount of one or more selected from i, Zn, Fe, Mg, and Al is 0.
It was defined as a copper-based alloy containing 01 to 35 wt% and comprising the balance Cu and inevitable impurities. Note that elements other than the additive elements defined in the present invention, such as Ag, Au, Bi,
Co, Cr, In, Mn, La, Pd, Pb, Sb, Se, Te, Ti, Y, Z
If the total amount of one or more selected from the elements of r is 5 wt% or less,
Even if it is added to the additive element defined in the present invention, the obtained effect is not inhibited.

  Next, embodiments of the present invention will be described by way of examples.

As described above, according to the present invention, connectors and switches excellent in press workability,
Copper-based alloys for relays can be obtained, and due to the thinning and thinning of materials and the improvement of die life of presses due to the recent high-density mounting of home appliances, information communication equipment and automotive parts, The cost can be greatly reduced.

Example 1
Copper base alloys Nos. 1 to 16 whose chemical component values (wt%) are shown in Table 1 were melted in an Ar atmosphere using a high frequency melting furnace and cast into a 40 × 40 × 150 (mm) ingot. After cutting out a test piece of 10 ^t × 40 ^w × 40 ^l (mm) from the obtained ingots of No. 1 to No. 16 and carrying out a homogenization heat treatment at 850 ° C. for 1 h (second step),
No. 1 to 3, No. 9 and 10 are rolled from 10 mm to 2.0 mm by cold rolling, and No. 4 to 8 and No. 11 to 16 are rolled from 10 to 5 mm by hot rolling. After that, the sheet thickness was rolled from 5 mm to 2.0 mm by cold rolling (third step).

Next, among No. 1 to 16 obtained test pieces, No. 1 to 11 and No. 13 were subjected to heat treatment at 500 ° C. × 1 h, and No. 12 and No. 14 to 16 were A heat treatment at 600 ° C. × 1 h was performed (fourth step). X-ray diffraction was performed on the RD surface and TD surface of the obtained test piece, and _SRD and _STD were measured.
The measurement conditions for the X-ray diffraction intensity are as follows.
Tube: Cu, tube voltage: 40 KV, tube current: 30 mA, sampling width: 0.0
02 ° using chromometer, sample holder: AL
As a result, No.1-11 and No.13 are
Although 1 ≦ S _RD <3 and 1 ≦ S _TD <3 were satisfied, No. 12 and No. 14 to 16 were
1 ≦ S _RD <3 and 1 ≦ S _TD <3 were not satisfied.
Note that the X-ray diffraction measurement conditions are not limited to the above conditions, and are appropriately changed according to the type of the sample.

For No. 1 to 16 thus obtained, cold rolling (fifth step) and optionally heat treatment (fourth step) were carried out, and for No. 1 to 8 and No. 12, heat treatment was performed. (Fourth step) No. 9 so that the rolling rate after 30% or more.
-11 and Nos. 13 to 16 have a rolling rate of 3 after the heat treatment (fourth step).
Rolling was performed so that the thickness was less than 0%, and a sheet thickness of 0.20 mm was finished.

Finally, a heat treatment (sixth step) at 300 ° C. × 1 h was performed to obtain a sample for evaluation.
S _RD , S _TD , S _RD × S _TD were measured for the samples thus obtained. In addition, terminal samples were continuously pressed for these samples,
The press work was stopped when the burr height of the material exceeded 25 μm, and the number of shots so far was set as the maximum number of shots.

From the results in Table 1, the following is clear.
No. 1-8 alloys according to the present invention have S _RD ≧ 2 and S _TD ≧ 4 and S _RD × S _TD
≧ 16 is satisfied, the maximum number of press shots exceeds 2 million shots,
It is a copper-based alloy material with excellent press workability.

On the other hand, No. 12 which does not satisfy 1 ≦ S _RD <3, 1 ≦ S _TD <3 in the fourth step is
S _TD ≧ 2 and S _RD × S _TD ≧ 16 were not satisfied, and burrs on the RD surface became 30 μm after 1.5 million shots. Among No. 9 to 11 and No. 13 in which the rolling process rate is less than 30% in the fifth step, No. 9 and 10 are S _TD ≧ 4 and S _RD × S _TD ≧ 1.
No. 6 is not satisfied, and when the maximum number of shots is exceeded, the burr on the TD surface exceeds 25 μm, and Nos. 11 and 13 are all of S _RD ≧ 2, S _TD ≧ 4, S _RD × S _TD ≧ 16 Is not satisfied, and burrs on the RD and TD surfaces are 2 before less than 1 million shots.
It exceeded 5 μm.

Of No. 14 to No. 16 in which No. 14 to No. 16 are satisfied in the fourth step, which does not satisfy 1 ≦ S _RD <3 and 1 ≦ S _RD <3, and the rolling process rate is less than 30% in the fifth step. And 15
Does not satisfy S _TD ≧ 2 and S _RD × S _TD ≧ 16, and when 1 million shots were reached, the burr on the RD surface exceeded 25 μm. In addition, No. 16 is S _TD ≧ 4
Is not satisfied, the burr on the TD surface exceeds 25 μm in about 1 million shots,
Material residue stuck between the punch and die, making it impossible to continue pressing.

Example 2
Invention alloy No. 4 shown in Table 1 of Example 1 and commercially available phosphor bronze alloy (C519
1 Quality H: 6.5 wt% Sn, 0.2 wt% P, balance Cu) and copper base alloy (C702)
5 Grade H: 3.2 wt% NI, 0.70 wt% SI, 0.15 wt% Mg, balance Cu), Vickers hardness, tensile strength, spring limit, conductivity, press workability and bending workability were evaluated. .

Vickers hardness, tensile strength, spring limit value, and conductivity measurement are JIS Z
2244, JIS Z 2241, JIS H 3130, JIS H 050
5 was carried out. The press workability was evaluated by measuring the maximum number of press shots in the same manner as in Example 1. Bending workability is 90 ° W bending test (JIS H
3110), the inner bending radius R is 0.08 mm, the ratio R / t of the bending radius R and the thickness t
0.4 for those with a good convex surface at the center, and △ for wrinkles
Those with marks and cracks were evaluated as x marks. The results are shown in Table 2.

From the results shown in Table 2, the copper-based alloy of the present invention has a Vickers hardness, tensile strength, spring limit value, as compared with conventional copper-based alloys C5191, C7025 for typical connectors, switches, and relays. It turns out that it is excellent in the balance of electrical conductivity, press workability, and bending workability.
As described above, the present invention has obtained copper or a copper-based alloy for connectors, switches, and relays excellent in press workability, and has achieved high-density mounting of recent home appliances, information communication equipment, and automotive parts. Accordingly, the present invention provides a copper or copper-based alloy that can realize a significant cost reduction by reducing the thickness of the material, making the wire thinner, and improving the press die life.

Claims (5)

A copper or copper-based alloy excellent in press workability, wherein S ≧ 2 in the X-ray diffraction intensity of the cross section of the material.
However,

I {111} is the diffraction intensity of {111}, I {222} is the diffraction intensity of {222},
I {200} is the diffraction intensity of {200}. S _RD in X-ray diffraction intensity of a cross-section perpendicular to the working direction of the material
≧ 2 and the X-ray diffraction intensity of the cross section parallel to the processing direction of the material is S _TD ≧ 4, and S _RD
XS _TD ≧ 16 Copper or copper-based alloy excellent in press workability.
However,

Here, S _RD is a value measured for the X-ray diffraction intensity of a cross section perpendicular to the processing direction of the material, and S _TD is a value measured for the X-ray diffraction intensity of a cross section parallel to the processing direction of the material, I {11
1} is the diffraction intensity of {111}, I {222} is the diffraction intensity of {222}, and I {20
0} is the diffraction intensity of {200}. A copper-based alloy containing one or more selected from Sn, Ni, P, Si, Zn, Fe, Mg, and Al in a total amount of 0.01 to 35 wt%, and the balance being Cu and inevitable impurities, and material S _RD ≧ 2 in the X-ray diffraction intensity of the cross section perpendicular to the processing direction, and S _{TD in} the X-ray diffraction intensity of the cross section parallel to the processing direction of the material.
≧ 4 and S _RD × S _TD ≧ 16 A copper or copper-based alloy having excellent press workability.
However,

Here, S _RD is a value measured for the X-ray diffraction intensity of a cross section perpendicular to the processing direction of the material, and S _TD is a value measured for the X-ray diffraction intensity of a cross section parallel to the processing direction of the material, I {11
1} is the diffraction intensity of {111}, I {222} is the diffraction intensity of {222}, and I {20
0} is the diffraction intensity of {200}. Rolling an ingot of a copper-based alloy containing one or more selected from Sn, Ni, P, Si, Zn, Fe, Mg, and Al in a total amount of 0.01 to 35 wt%, and the balance Cu and inevitable impurities Alternatively, a material having a predetermined plate thickness by repeating hot rolling and heat treatment is subjected to heat treatment at a temperature of 350 to 750 ° C., and the X-ray diffraction intensity of the cross section perpendicular to the processing direction of the material is 1 ≦ S _RD ≦ 3 and the X-ray diffraction intensity of the cross section parallel to the processing direction of the material, 1 ≦ S _TD ≦ 3, and then cold rolling with a rolling rate of 30% or more or 50% or more and low temperature annealing below the recrystallization temperature. In combination, S _RD ≧ 2 in the X-ray diffraction intensity of the cross section perpendicular to the processing direction of the material and S _TD ≧ 4 in the X-ray diffraction intensity of the cross section parallel to the processing direction of the material,
A copper or copper-based alloy having excellent press workability, wherein S _RD × S _TD ≧ 16.
However,

Here, S _RD is a value measured for the X-ray diffraction intensity of a cross section perpendicular to the processing direction of the material, and S _TD is a value measured for the X-ray diffraction intensity of a cross section parallel to the processing direction of the material, I {11
1} is the diffraction intensity of {111}, I {222} is the diffraction intensity of {222}, and I {20
0} is the diffraction intensity of {200}. Rolling an ingot of a copper-based alloy containing one or more selected from Sn, Ni, P, Si, Zn, Fe, Mg, and Al in a total amount of 0.01 to 35 wt%, and the balance Cu and inevitable impurities Alternatively, a material having a predetermined plate thickness by repeating hot rolling and heat treatment is subjected to heat treatment at a temperature of 350 to 750 ° C., and the X-ray diffraction intensity of the cross section perpendicular to the processing direction of the material is 1 ≦ S _RD ≦ 3 and the X-ray diffraction intensity of the cross section parallel to the processing direction of the material, 1 ≦ S _TD ≦ 3, and then cold rolling with a rolling rate of 30% or more or 50% or more and low temperature annealing below the recrystallization temperature. In combination, S _RD ≧ 2 in the X-ray diffraction intensity of the cross section perpendicular to the processing direction of the material, and S _TD ≧ 4 in the X-ray diffraction intensity of the cross section parallel to the processing direction of the material, and S _RD × S _TD ≧ This is 16 A method for producing copper or a copper-based alloy having excellent press workability.
However,

Here, S _RD is a value measured for the X-ray diffraction intensity of a cross section perpendicular to the processing direction of the material, S _TD is a value measured for an X-ray diffraction intensity of a cross section parallel to the processing direction of the material, and I {111} is {111} }, I {222} is the diffraction intensity of {222}, and I {200} is the diffraction intensity of {200}.