JP2007186724A5 - - Google Patents

Download PDF

Info

Publication number
JP2007186724A5
JP2007186724A5 JP2006003443A JP2006003443A JP2007186724A5 JP 2007186724 A5 JP2007186724 A5 JP 2007186724A5 JP 2006003443 A JP2006003443 A JP 2006003443A JP 2006003443 A JP2006003443 A JP 2006003443A JP 2007186724 A5 JP2007186724 A5 JP 2007186724A5
Authority
JP
Japan
Prior art keywords
circuit
target
power supply
oscillation
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006003443A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007186724A (ja
JP5016819B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006003443A priority Critical patent/JP5016819B2/ja
Priority claimed from JP2006003443A external-priority patent/JP5016819B2/ja
Publication of JP2007186724A publication Critical patent/JP2007186724A/ja
Publication of JP2007186724A5 publication Critical patent/JP2007186724A5/ja
Application granted granted Critical
Publication of JP5016819B2 publication Critical patent/JP5016819B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006003443A 2006-01-11 2006-01-11 スパッタリング方法及びスパッタリング装置 Active JP5016819B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006003443A JP5016819B2 (ja) 2006-01-11 2006-01-11 スパッタリング方法及びスパッタリング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006003443A JP5016819B2 (ja) 2006-01-11 2006-01-11 スパッタリング方法及びスパッタリング装置

Publications (3)

Publication Number Publication Date
JP2007186724A JP2007186724A (ja) 2007-07-26
JP2007186724A5 true JP2007186724A5 (fr) 2009-02-19
JP5016819B2 JP5016819B2 (ja) 2012-09-05

Family

ID=38342094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006003443A Active JP5016819B2 (ja) 2006-01-11 2006-01-11 スパッタリング方法及びスパッタリング装置

Country Status (1)

Country Link
JP (1) JP5016819B2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI518194B (zh) * 2007-08-20 2016-01-21 Ulvac Inc Sputtering method
JP5500794B2 (ja) * 2008-06-30 2014-05-21 株式会社アルバック 電源装置
JP5429772B2 (ja) * 2008-06-30 2014-02-26 株式会社アルバック 電源装置
DE102013110883B3 (de) * 2013-10-01 2015-01-15 TRUMPF Hüttinger GmbH + Co. KG Vorrichtung und Verfahren zur Überwachung einer Entladung in einem Plasmaprozess
EP2905801B1 (fr) 2014-02-07 2019-05-22 TRUMPF Huettinger Sp. Z o. o. Procédé de surveillance de la décharge dans un traitement au plasma et dispositif de surveillance de décharge dans un plasma
CN114481045A (zh) * 2021-12-22 2022-05-13 昆山浦元真空技术工程有限公司 电弧靶阳极辉光真空镀膜工艺及其所用的设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4326100B4 (de) * 1993-08-04 2006-03-23 Unaxis Deutschland Holding Gmbh Verfahren und Vorrichtung zum Beschichten von Substraten in einer Vakuumkammer, mit einer Einrichtung zur Erkennung und Unterdrückung von unerwünschten Lichtbögen
DE4441206C2 (de) * 1994-11-19 1996-09-26 Leybold Ag Einrichtung für die Unterdrückung von Überschlägen in Kathoden-Zerstäubungseinrichtungen
JP4963023B2 (ja) * 2006-01-11 2012-06-27 株式会社アルバック スパッタリング方法及びスパッタリング装置

Similar Documents

Publication Publication Date Title
JP2007186725A5 (fr)
JP2007186726A5 (fr)
JP2007186724A5 (fr)
KR101181875B1 (ko) 바이폴라 펄스 전원 및 이 바이폴라 펄스 전원을 복수대 병렬 접속하여 구성되는 전원 장치
JP5429772B2 (ja) 電源装置
JP5124344B2 (ja) バイポーラパルス電源及び複数のバイポーラパルス電源からなる電源装置並びに出力方法
JP2009533551A5 (fr)
JP4963023B2 (ja) スパッタリング方法及びスパッタリング装置
JP2009284732A5 (fr)
SE0302045D0 (sv) Work piece processing by pulsed electric discharges in solid-gas plasmas
TW200642224A (en) Ion-generating element, ion generator, and static eliminator
JP5500794B2 (ja) 電源装置
JP5016819B2 (ja) スパッタリング方法及びスパッタリング装置
TWI403601B (zh) A thin film forming method and film forming apparatus
EP1655613A3 (fr) Capteur de courant alternatif de faible puissance et de proximité
JP4320019B2 (ja) スパッタリング装置
JP2010007162A5 (fr)
JP5186281B2 (ja) バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置
JP2006241522A5 (fr)
JP2006241521A5 (fr)
JP2006241520A5 (fr)
FR2926395B1 (fr) Source pulsee d'electrons, procede d'alimentation electrique pour source pulsee d'electrons et procede de commande d'une source pulsee d'electrons
JP4889280B2 (ja) スパッタリング装置
TW200624598A (en) Electrical discharge surface treatment device
Choi et al. A sputtering technique of magnesium oxide thin film in oxide mode for plasma display panel