JP2007186724A5 - - Google Patents
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- Publication number
- JP2007186724A5 JP2007186724A5 JP2006003443A JP2006003443A JP2007186724A5 JP 2007186724 A5 JP2007186724 A5 JP 2007186724A5 JP 2006003443 A JP2006003443 A JP 2006003443A JP 2006003443 A JP2006003443 A JP 2006003443A JP 2007186724 A5 JP2007186724 A5 JP 2007186724A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- target
- power supply
- oscillation
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000010355 oscillation Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006003443A JP5016819B2 (ja) | 2006-01-11 | 2006-01-11 | スパッタリング方法及びスパッタリング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006003443A JP5016819B2 (ja) | 2006-01-11 | 2006-01-11 | スパッタリング方法及びスパッタリング装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007186724A JP2007186724A (ja) | 2007-07-26 |
| JP2007186724A5 true JP2007186724A5 (enrdf_load_stackoverflow) | 2009-02-19 |
| JP5016819B2 JP5016819B2 (ja) | 2012-09-05 |
Family
ID=38342094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006003443A Active JP5016819B2 (ja) | 2006-01-11 | 2006-01-11 | スパッタリング方法及びスパッタリング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5016819B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101784694B (zh) * | 2007-08-20 | 2012-08-29 | 株式会社爱发科 | 溅射方法 |
| JP5500794B2 (ja) * | 2008-06-30 | 2014-05-21 | 株式会社アルバック | 電源装置 |
| JP5429772B2 (ja) * | 2008-06-30 | 2014-02-26 | 株式会社アルバック | 電源装置 |
| DE102013110883B3 (de) * | 2013-10-01 | 2015-01-15 | TRUMPF Hüttinger GmbH + Co. KG | Vorrichtung und Verfahren zur Überwachung einer Entladung in einem Plasmaprozess |
| EP2905801B1 (en) | 2014-02-07 | 2019-05-22 | TRUMPF Huettinger Sp. Z o. o. | Method of monitoring the discharge in a plasma process and monitoring device for monitoring the discharge in a plasma |
| CN114481045A (zh) * | 2021-12-22 | 2022-05-13 | 昆山浦元真空技术工程有限公司 | 电弧靶阳极辉光真空镀膜工艺及其所用的设备 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4326100B4 (de) * | 1993-08-04 | 2006-03-23 | Unaxis Deutschland Holding Gmbh | Verfahren und Vorrichtung zum Beschichten von Substraten in einer Vakuumkammer, mit einer Einrichtung zur Erkennung und Unterdrückung von unerwünschten Lichtbögen |
| DE4441206C2 (de) * | 1994-11-19 | 1996-09-26 | Leybold Ag | Einrichtung für die Unterdrückung von Überschlägen in Kathoden-Zerstäubungseinrichtungen |
| JP4963023B2 (ja) * | 2006-01-11 | 2012-06-27 | 株式会社アルバック | スパッタリング方法及びスパッタリング装置 |
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2006
- 2006-01-11 JP JP2006003443A patent/JP5016819B2/ja active Active