JP2007182623A5 - - Google Patents
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- Publication number
- JP2007182623A5 JP2007182623A5 JP2006276055A JP2006276055A JP2007182623A5 JP 2007182623 A5 JP2007182623 A5 JP 2007182623A5 JP 2006276055 A JP2006276055 A JP 2006276055A JP 2006276055 A JP2006276055 A JP 2006276055A JP 2007182623 A5 JP2007182623 A5 JP 2007182623A5
- Authority
- JP
- Japan
- Prior art keywords
- copper thin
- metal
- thin film
- film
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006276055A JP2007182623A (ja) | 2005-12-08 | 2006-10-10 | 金属薄体の製造方法 |
| PCT/JP2006/324525 WO2007066751A1 (ja) | 2005-12-08 | 2006-12-08 | 金属薄体の製造方法 |
| US12/096,519 US20080257746A1 (en) | 2005-12-08 | 2006-12-08 | Method for Producing Metal Thin Body |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005355354 | 2005-12-08 | ||
| JP2006276055A JP2007182623A (ja) | 2005-12-08 | 2006-10-10 | 金属薄体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007182623A JP2007182623A (ja) | 2007-07-19 |
| JP2007182623A5 true JP2007182623A5 (cg-RX-API-DMAC10.html) | 2008-11-20 |
Family
ID=38122896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006276055A Pending JP2007182623A (ja) | 2005-12-08 | 2006-10-10 | 金属薄体の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20080257746A1 (cg-RX-API-DMAC10.html) |
| JP (1) | JP2007182623A (cg-RX-API-DMAC10.html) |
| WO (1) | WO2007066751A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5387034B2 (ja) | 2009-02-20 | 2014-01-15 | 大日本印刷株式会社 | 導電性基板 |
| SG184814A1 (en) * | 2010-04-30 | 2012-11-29 | Jx Nippon Mining & Metals Corp | Laminate for flexible wiring |
| WO2012101984A1 (ja) * | 2011-01-26 | 2012-08-02 | 住友ベークライト株式会社 | プリント配線板およびプリント配線板の製造方法 |
| JP5346965B2 (ja) * | 2011-02-08 | 2013-11-20 | Ｄｏｗａメタルテック株式会社 | 銀めっき材およびその製造方法 |
| JP2014194522A (ja) | 2013-02-26 | 2014-10-09 | Ricoh Co Ltd | 定着ベルト用基材、定着ベルト、定着装置、および、画像形成装置 |
| WO2021002009A1 (ja) * | 2019-07-04 | 2021-01-07 | 住友電気工業株式会社 | プリント配線板及びその製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10039171A1 (de) * | 2000-08-10 | 2002-02-28 | Consortium Elektrochem Ind | Kathode für Elektrolysezellen |
| US20040072423A1 (en) * | 2001-01-12 | 2004-04-15 | Jacob Jorne | Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features |
-
2006
- 2006-10-10 JP JP2006276055A patent/JP2007182623A/ja active Pending
- 2006-12-08 WO PCT/JP2006/324525 patent/WO2007066751A1/ja not_active Ceased
- 2006-12-08 US US12/096,519 patent/US20080257746A1/en not_active Abandoned