JP2007180512A5 - - Google Patents

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Publication number
JP2007180512A5
JP2007180512A5 JP2006312711A JP2006312711A JP2007180512A5 JP 2007180512 A5 JP2007180512 A5 JP 2007180512A5 JP 2006312711 A JP2006312711 A JP 2006312711A JP 2006312711 A JP2006312711 A JP 2006312711A JP 2007180512 A5 JP2007180512 A5 JP 2007180512A5
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JP
Japan
Prior art keywords
substrate
semiconductor integrated
integrated circuit
insulating layer
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006312711A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007180512A (ja
JP5004562B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006312711A priority Critical patent/JP5004562B2/ja
Priority claimed from JP2006312711A external-priority patent/JP5004562B2/ja
Publication of JP2007180512A publication Critical patent/JP2007180512A/ja
Publication of JP2007180512A5 publication Critical patent/JP2007180512A5/ja
Application granted granted Critical
Publication of JP5004562B2 publication Critical patent/JP5004562B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006312711A 2005-12-02 2006-11-20 半導体装置の作製方法 Expired - Fee Related JP5004562B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006312711A JP5004562B2 (ja) 2005-12-02 2006-11-20 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005348872 2005-12-02
JP2005348872 2005-12-02
JP2006312711A JP5004562B2 (ja) 2005-12-02 2006-11-20 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2007180512A JP2007180512A (ja) 2007-07-12
JP2007180512A5 true JP2007180512A5 (enExample) 2008-11-20
JP5004562B2 JP5004562B2 (ja) 2012-08-22

Family

ID=38305335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006312711A Expired - Fee Related JP5004562B2 (ja) 2005-12-02 2006-11-20 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP5004562B2 (enExample)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08172159A (ja) * 1994-12-16 1996-07-02 Hitachi Ltd 半導体集積回路装置の製造方法、それに用いるウエハ搬送治具および半導体集積回路装置
EP2565924B1 (en) * 2001-07-24 2018-01-10 Samsung Electronics Co., Ltd. Transfer method
JP2004134672A (ja) * 2002-10-11 2004-04-30 Sony Corp 超薄型半導体装置の製造方法および製造装置、並びに超薄型の裏面照射型固体撮像装置の製造方法および製造装置

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