JP2007180234A - 発光光源及び照明器具 - Google Patents

発光光源及び照明器具 Download PDF

Info

Publication number
JP2007180234A
JP2007180234A JP2005376378A JP2005376378A JP2007180234A JP 2007180234 A JP2007180234 A JP 2007180234A JP 2005376378 A JP2005376378 A JP 2005376378A JP 2005376378 A JP2005376378 A JP 2005376378A JP 2007180234 A JP2007180234 A JP 2007180234A
Authority
JP
Japan
Prior art keywords
light
layer
light emitting
substrate
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005376378A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007180234A5 (enExample
Inventor
Hideo Nagai
秀男 永井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2005376378A priority Critical patent/JP2007180234A/ja
Publication of JP2007180234A publication Critical patent/JP2007180234A/ja
Publication of JP2007180234A5 publication Critical patent/JP2007180234A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP2005376378A 2005-12-27 2005-12-27 発光光源及び照明器具 Pending JP2007180234A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005376378A JP2007180234A (ja) 2005-12-27 2005-12-27 発光光源及び照明器具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005376378A JP2007180234A (ja) 2005-12-27 2005-12-27 発光光源及び照明器具

Publications (2)

Publication Number Publication Date
JP2007180234A true JP2007180234A (ja) 2007-07-12
JP2007180234A5 JP2007180234A5 (enExample) 2008-12-25

Family

ID=38305132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005376378A Pending JP2007180234A (ja) 2005-12-27 2005-12-27 発光光源及び照明器具

Country Status (1)

Country Link
JP (1) JP2007180234A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010147444A (ja) * 2008-12-22 2010-07-01 Panasonic Electric Works Co Ltd 発光装置
JP2010219377A (ja) * 2009-03-18 2010-09-30 Toshiba Corp 半導体発光装置及びその製造方法
WO2011016201A1 (ja) * 2009-08-06 2011-02-10 パナソニック株式会社 発光素子および発光装置
JP2011035029A (ja) * 2009-07-30 2011-02-17 Kyocera Corp 発光装置
JP2011035030A (ja) * 2009-07-30 2011-02-17 Kyocera Corp 発光装置
JP2011512648A (ja) * 2008-03-28 2011-04-21 パナソニック株式会社 樹脂成型品、半導体発光光源、照明装置及び樹脂成型品の製造方法
JP2012038957A (ja) * 2010-08-09 2012-02-23 Toshiba Corp 発光装置
JP2012204349A (ja) * 2011-03-23 2012-10-22 Panasonic Corp 発光装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634010U (enExample) * 1986-06-27 1988-01-12
JPH0617259U (ja) * 1992-08-04 1994-03-04 株式会社小糸製作所 モジュールタイプｌｅｄのモールド構造
JPH0685327A (ja) * 1992-09-01 1994-03-25 Sharp Corp 光半導体装置の製造方法
JP2004140185A (ja) * 2002-10-17 2004-05-13 Matsushita Electric Ind Co Ltd 発光装置
JP2004241644A (ja) * 2003-02-06 2004-08-26 Matsushita Electric Ind Co Ltd カード型ｌｅｄモジュール、その製造方法、照明装置及び表示装置
WO2005029597A1 (ja) * 2003-09-19 2005-03-31 Matsushita Electric Industrial Co., Ltd. 照明装置
WO2005057672A2 (en) * 2003-12-09 2005-06-23 Gelcore, Llc Surface mount light emitting chip package
JP2005235778A (ja) * 2001-08-09 2005-09-02 Matsushita Electric Ind Co Ltd Ｌｅｄ照明装置およびカード型ｌｅｄ照明光源
JP2005537651A (ja) * 2002-08-30 2005-12-08 ゲルコアー リミテッド ライアビリティ カンパニー 効率が向上した被覆ｌｅｄ
JP2006179520A (ja) * 2004-12-20 2006-07-06 Nichia Chem Ind Ltd 半導体装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634010U (enExample) * 1986-06-27 1988-01-12
JPH0617259U (ja) * 1992-08-04 1994-03-04 株式会社小糸製作所 モジュールタイプｌｅｄのモールド構造
JPH0685327A (ja) * 1992-09-01 1994-03-25 Sharp Corp 光半導体装置の製造方法
JP2005235778A (ja) * 2001-08-09 2005-09-02 Matsushita Electric Ind Co Ltd Ｌｅｄ照明装置およびカード型ｌｅｄ照明光源
JP2005537651A (ja) * 2002-08-30 2005-12-08 ゲルコアー リミテッド ライアビリティ カンパニー 効率が向上した被覆ｌｅｄ
JP2004140185A (ja) * 2002-10-17 2004-05-13 Matsushita Electric Ind Co Ltd 発光装置
JP2004241644A (ja) * 2003-02-06 2004-08-26 Matsushita Electric Ind Co Ltd カード型ｌｅｄモジュール、その製造方法、照明装置及び表示装置
WO2005029597A1 (ja) * 2003-09-19 2005-03-31 Matsushita Electric Industrial Co., Ltd. 照明装置
WO2005057672A2 (en) * 2003-12-09 2005-06-23 Gelcore, Llc Surface mount light emitting chip package
JP2006179520A (ja) * 2004-12-20 2006-07-06 Nichia Chem Ind Ltd 半導体装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011512648A (ja) * 2008-03-28 2011-04-21 パナソニック株式会社 樹脂成型品、半導体発光光源、照明装置及び樹脂成型品の製造方法
JP2010147444A (ja) * 2008-12-22 2010-07-01 Panasonic Electric Works Co Ltd 発光装置
JP2010219377A (ja) * 2009-03-18 2010-09-30 Toshiba Corp 半導体発光装置及びその製造方法
JP2011035029A (ja) * 2009-07-30 2011-02-17 Kyocera Corp 発光装置
JP2011035030A (ja) * 2009-07-30 2011-02-17 Kyocera Corp 発光装置
WO2011016201A1 (ja) * 2009-08-06 2011-02-10 パナソニック株式会社 発光素子および発光装置
JPWO2011016201A1 (ja) * 2009-08-06 2013-01-10 パナソニック株式会社 発光素子および発光装置
US8507935B2 (en) 2009-08-06 2013-08-13 Panasonic Corporation Light emitting element and light emitting device
JP2012038957A (ja) * 2010-08-09 2012-02-23 Toshiba Corp 発光装置
US8921870B2 (en) 2010-08-09 2014-12-30 Kabushiki Kaisha Toshiba Light emitting device
JP2012204349A (ja) * 2011-03-23 2012-10-22 Panasonic Corp 発光装置

Similar Documents

Publication Publication Date Title
JP5273486B2 (ja) 照明装置
JP4675906B2 (ja) 発光素子搭載用基板、発光素子収納用パッケージ、発光装置および照明装置
JP4699681B2 (ja) Ｌｅｄモジュール、および照明装置
KR100620844B1 (ko) 발광장치 및 조명장치
TWI420686B (zh) 半導體發光裝置、發光模組及照明裝置
JP4678391B2 (ja) 照明装置
WO2002089221A1 (en) Light emitting device comprising led chip
JP2006086469A (ja) 半導体発光装置、照明モジュール、照明装置及び半導体発光装置の製造方法
JP2008521210A (ja) 発光装置、発光モジュール、表示装置、照明装置及び発光装置の製造方法
JP2006237264A (ja) 発光装置および照明装置
JP5459555B2 (ja) 発光モジュール及び照明装置
JP4116960B2 (ja) 半導体発光装置、発光モジュール、照明装置、および半導体発光装置の製造方法
JP5993497B2 (ja) Ｌｅｄ照明装置
JP2006049814A (ja) 発光装置および照明装置
JP2005039194A (ja) 発光素子収納用パッケージおよび発光装置ならびに照明装置
JP2009141219A (ja) 発光装置
JP4808550B2 (ja) 発光ダイオード光源装置、照明装置、表示装置及び交通信号機
JP2009182085A (ja) 発光装置
JP2007180234A (ja) 発光光源及び照明器具
JP2007294621A (ja) Ｌｅｄ照明装置
JP4948841B2 (ja) 発光装置および照明装置
JP2007180430A (ja) 発光ダイオード装置
JP5484544B2 (ja) 発光装置
JP4601404B2 (ja) 発光装置および照明装置
JP2007266222A (ja) 発光素子搭載用基板、発光素子収納用パッケージ、発光装置および照明装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081112

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20081112

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110420

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110426

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110526

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120306

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120423

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121220

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130208

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130806